CN220456175U - Anti-stripping composite mica tape - Google Patents
Anti-stripping composite mica tape Download PDFInfo
- Publication number
- CN220456175U CN220456175U CN202321755422.0U CN202321755422U CN220456175U CN 220456175 U CN220456175 U CN 220456175U CN 202321755422 U CN202321755422 U CN 202321755422U CN 220456175 U CN220456175 U CN 220456175U
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- China
- Prior art keywords
- layer
- mica paper
- mica
- adhesive layer
- alkali
- Prior art date
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- 239000010445 mica Substances 0.000 title claims abstract description 83
- 229910052618 mica group Inorganic materials 0.000 title claims abstract description 83
- 239000002131 composite material Substances 0.000 title claims abstract description 35
- 239000010410 layer Substances 0.000 claims abstract description 65
- 239000012790 adhesive layer Substances 0.000 claims abstract description 39
- 239000003365 glass fiber Substances 0.000 claims abstract description 29
- 239000004744 fabric Substances 0.000 claims abstract description 26
- 229920006231 aramid fiber Polymers 0.000 claims abstract description 18
- 239000000835 fiber Substances 0.000 claims abstract description 16
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 15
- 239000000758 substrate Substances 0.000 claims abstract description 3
- 239000004593 Epoxy Substances 0.000 claims description 9
- RJDOZRNNYVAULJ-UHFFFAOYSA-L [O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[F-].[F-].[Mg++].[Mg++].[Mg++].[Al+3].[Si+4].[Si+4].[Si+4].[K+] Chemical compound [O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[F-].[F-].[Mg++].[Mg++].[Mg++].[Al+3].[Si+4].[Si+4].[Si+4].[K+] RJDOZRNNYVAULJ-UHFFFAOYSA-L 0.000 claims description 4
- 229910052628 phlogopite Inorganic materials 0.000 claims description 3
- 239000013464 silicone adhesive Substances 0.000 claims description 3
- 239000004760 aramid Substances 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims 1
- 239000011229 interlayer Substances 0.000 abstract description 5
- 239000011810 insulating material Substances 0.000 abstract description 4
- 239000000463 material Substances 0.000 description 10
- 239000011256 inorganic filler Substances 0.000 description 7
- 229910003475 inorganic filler Inorganic materials 0.000 description 7
- 229920002050 silicone resin Polymers 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000003292 glue Substances 0.000 description 4
- 229910052582 BN Inorganic materials 0.000 description 3
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000007731 hot pressing Methods 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- 238000013329 compounding Methods 0.000 description 2
- 239000007822 coupling agent Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000032798 delamination Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000004513 sizing Methods 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 229910052604 silicate mineral Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Insulating Bodies (AREA)
Abstract
The utility model discloses an anti-stripping composite mica tape, which comprises alkali-free glass fiber cloth serving as a composite substrate, wherein an anti-stripping composite structural layer is formed on the surface of one side or two sides of the alkali-free glass fiber cloth; the anti-stripping composite structure layer comprises a basic mica paper layer, wherein an aramid fiber net is formed on the surface of the basic mica paper layer, cross-linked fibers are uniformly coated on the surface of the aramid fiber net, an adhesive layer is formed on the surfaces of the cross-linked fibers and the aramid fiber net, and a reinforcing mica paper layer is pressed on the surface of the adhesive layer. The utility model can give consideration to the physical and electrical properties of the mica paper, and can effectively improve the interlayer peeling resistance of the mica paper, thereby effectively improving the structural stability of the mica paper and prolonging the service life of the mica paper serving as an insulating material.
Description
Technical Field
The utility model relates to a mica paper product technology in an insulating material, in particular to an anti-stripping composite mica tape.
Background
Mica is a naturally occurring layered silicate mineral with excellent physical and electrical properties and properties that retain the above properties at high temperatures. The mica paper is used as a secondary processing product of mica, has main performance of mica, has high electrical strength, low dielectric loss, high surface resistance, high volume resistance and other excellent electrical performance, and heat resistance, water resistance, chemical stability, elasticity, shearing resistance, tensile strength and other physical and chemical properties compared with the traditional metal insulating material, can effectively break through the application range and the application limit of the metal insulating material, and has wide application in electrical equipment such as generators, motors, cables and the like.
In the prior art, in order to ensure the physical strength and the electrical insulation performance of the mica paper, the mica tape with wrapping performance is usually obtained by compounding sizing and alkali-free glass fiber cloth, the mica tape has a certain thickness, and epoxy silicone resin material is adopted as an adhesive and an interface filling material to ensure the integral bonding performance of the paper, and the epoxy silicone resin material has the common problem of low heat conductivity coefficient, so that the heat dissipation effect of the prepared mica paper is poor; the heat conduction coefficient of the system is improved by adding the inorganic filler with high heat conduction into the epoxy silicone resin material, but the mode is easy to generate interface defects in the adhesive system of the adhesive, the interface cohesive force of the mica paper is affected, the mica paper is easy to adhere with alkali-free glass fiber cloth and is not firmly bonded to cause layering phenomenon, interlayer peeling is easy to occur in the long-term use process of the mica paper, the mechanical property and the electrical insulation property of the mica paper are reduced after the interlayer peeling occurs, and the use risk exists.
Disclosure of Invention
The utility model solves the technical problem of providing an anti-stripping composite mica tape so as to solve the defects in the background technology.
The technical problems solved by the utility model are realized by adopting the following technical scheme:
the anti-stripping composite mica tape comprises alkali-free glass fiber cloth serving as a composite substrate, wherein an anti-stripping composite structure layer is formed on one or two side surfaces of the alkali-free glass fiber cloth; the anti-stripping composite structure layer comprises a basic mica paper layer, wherein an aramid fiber net is formed on the surface of the basic mica paper layer, cross-linked fibers are uniformly coated on the surface of the aramid fiber net, an adhesive layer is formed on the surfaces of the cross-linked fibers and the aramid fiber net, and a reinforcing mica paper layer is pressed on the surface of the adhesive layer.
As a further limitation, when the anti-stripping composite mica tape is used for forming the anti-stripping composite structural layer only on one side surface of the alkali-free glass fiber cloth, the reinforcing mica paper layer is directly pressed on the other side surface of the alkali-free glass fiber cloth through the adhesive layer.
As a further limitation, the alkali-free glass fiber cloth has a cloth layer thickness of 0.2 to 0.3mm.
As a further limitation, the forming thickness of the basic mica paper layer is 0.3-0.5 mm, preferably phlogopite paper or synthetic mica paper, and the basic mica paper layer is directly manufactured on the surface of the alkali-free glass fiber cloth by a cylinder mould manufacturing machine.
As a further limitation, the thickness of the reinforcing mica paper layer is 0.15 to 0.2mm.
As a further definition, the crosslinked fibers are chopped glass fibers or chopped aramid fibers;
by way of further limitation, the crosslinked fibers are impregnated fiber materials surface treated with a coupling agent and impregnated with a thermally conductive paste.
As a further definition, the adhesive layer is preferably an epoxy silicone adhesive layer, the adhesive layer having a thickness of less than 0.1mm;
the adhesive layer is dispersed with high heat conduction inorganic filler, the high heat conduction inorganic filler is one or combination of nanoscale aluminum nitride, boron nitride and silicon nitride, and the addition amount is 3-5% of the weight of the sizing material in the adhesive layer.
As a further limitation, the reinforced mica paper layer is pressed on the surface of the adhesive layer outside the adhesive layer through a hot pressing compounding process.
The beneficial effects are that: the anti-stripping composite mica tape disclosed by the utility model can effectively improve the interlayer structural strength of composite mica paper while ensuring the physical and electrical properties of the whole mica tape, improves the adaptability of the mica tape to epoxy silicone resin materials, particularly epoxy silicone resin materials with inorganic fillers dispersed therein, and improves the interlayer structural strength of the mica tape, so that the mica tape has better anti-stripping performance, and can effectively improve the interfacial adhesion of the mica paper, thereby ensuring the bonding and wrapping performance of mica tape products prepared by the mica tape on the surfaces of corresponding devices.
Drawings
FIG. 1 is an enlarged schematic view of a section detail of a preferred embodiment of the utility model.
Wherein: 1. a first reinforcing mica paper layer; 2. a first adhesive layer; 3. a crosslinked fibrous layer; 4. an aramid fiber web; 5. a basal mica paper layer; 6. alkali-free glass fiber cloth; 7. a second adhesive layer; 8. and a second reinforcing mica paper layer.
Detailed Description
The utility model is further described with reference to the following detailed drawings in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the implementation of the utility model easy to understand.
Referring to a preferred embodiment of the stripping-resistant composite mica tape of fig. 1, in the embodiment, the stripping-resistant composite mica tape comprises a basic mica paper layer 5 serving as a main structural layer and alkali-free glass fiber cloth 6, wherein the thickness of the cloth layer of the alkali-free glass fiber cloth 6 is 0.23mm, the basic mica paper layer 5 is directly manufactured on the surface of the alkali-free glass fiber cloth 6 by taking mica slurry as a raw material through a cylinder mould manufacturing machine, the forming thickness of the basic mica paper layer 5 is 0.4mm, and the forming mode of the basic mica paper layer 5 and the alkali-free glass fiber cloth 6 are considered to have better structural stability; whereas the base mica paper layer 5 is phlogopite paper in this embodiment in view of the electrical properties after forming.
In this embodiment, the stripping-resistant composite mica tape is formed with a second adhesive layer 7 on the back side of the alkali-free glass fiber cloth 6, and a second reinforcing mica paper layer 8 is formed through the second adhesive layer 7, wherein the second adhesive layer 7 is an epoxy silicone adhesive layer with the thickness of 0.08mm, and the second reinforcing mica paper layer 8 is a synthetic mica paper with the thickness of 0.15 mm.
The base mica paper layer 5 is also used as a part of the anti-stripping composite structure layer of the anti-stripping composite mica tape in the embodiment, an aramid fiber net 4 is formed on the surface of the base mica paper layer 5, the thickness of the aramid fiber net 4 is 0.1mm, the mesh aperture is 1-1.5 mm, a layer of crosslinked fiber is uniformly sprayed on the surface of the aramid fiber net 4 to form a layer of crosslinked fiber layer 3 serving as an interface structure, the crosslinked fiber layer 3 is chopped glass fiber in the embodiment, the chopped glass fiber is modified glass fiber modified by a coupling agent, and the modified glass fiber is subjected to heat conducting slurry dipping treatment to ensure the heat dissipation performance of the formed anti-stripping composite mica tape.
The outside of the crosslinked fiber layer 3 is a first adhesive layer 2, the first adhesive layer 2 and the second adhesive layer 7 are epoxy silicon resin adhesive layers made of the same material, the adhesive layer thickness of the first adhesive layer 2 is 0.7mm, a first reinforcing mica paper layer 1 is formed on the outside, the first reinforcing mica paper layer 1 and the second reinforcing mica paper layer 2 are synthetic mica paper made of the same material and the same thickness in the same batch, and the first adhesive layer 2 and the second adhesive layer 7 are glued and then are adhered to the corresponding adhesive layer surfaces and are formed into a whole after hot pressing.
The first adhesive layer 2 after hot pressing is permeated through the crosslinked fiber layer 3 and the aramid fiber net 4 is adhered with the basic mica paper layer 5, and an enhanced space crosslinked structure is formed at the interface position of the aramid fiber net 4 and the crosslinked fiber layer 3, so that the peeling resistance of the adhesive layer position is improved, the performance arrangement is particularly suitable for the situation that the corresponding first adhesive layer 2 is thinner (the adhesive layer thickness is lower than 0.1 mm), and meanwhile, the better peeling resistance is also kept when the corresponding first adhesive layer 2 is dispersed with the high heat conduction inorganic filler with the mass ratio of less than 7 percent of the weight of the adhesive material.
In the different embodiments, in order to ensure the heat conducting performance of the glue layer in the corresponding first adhesive layer 2, the filled high heat conducting inorganic filler may be nano aluminum nitride, boron nitride or silicon nitride, and one or a combination of the nano aluminum nitride, boron nitride and silicon nitride may be selected, and in consideration of the glue performance and the heat dissipation performance of the glue layer, the addition amount of the high heat conducting inorganic filler should be controlled to be 3-5% of the weight of the glue in the adhesive layer.
While in the present embodiment the delamination-resistant composite structural layer consisting of the base mica paper layer 5, the crosslinked fiber layer 3, the aramid fiber web 4, the first adhesive layer 2 and the first reinforcing mica paper layer 1 is a one-sided molded structure of the alkali-free glass fiber cloth 6, in other embodiments, the combination of the second adhesive layer 7 and the second reinforcing mica paper layer 8 on the other side may be replaced with the above-described delamination-resistant composite structural layer in consideration of the insulation strength requirement and the use performance of the mica paper.
The foregoing has shown and described the basic principles, principal features and advantages of the utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims. The scope of the utility model is defined by the appended claims and equivalents thereof.
Claims (7)
1. The anti-stripping composite mica tape is characterized by comprising alkali-free glass fiber cloth serving as a composite substrate, wherein an anti-stripping composite structure layer is formed on one side or two side surfaces of the alkali-free glass fiber cloth; the anti-stripping composite structure layer comprises a basic mica paper layer, wherein an aramid fiber net is formed on the surface of the basic mica paper layer, cross-linked fibers are uniformly coated on the surface of the aramid fiber net, an adhesive layer is formed on the surfaces of the cross-linked fibers and the aramid fiber net, and a reinforcing mica paper layer is pressed on the surface of the adhesive layer.
2. The composite mica tape according to claim 1, wherein the reinforced mica paper layer is directly laminated on the other surface of the alkali-free glass fiber cloth through an adhesive layer only when the composite structure layer is formed on the one surface of the alkali-free glass fiber cloth.
3. The anti-stripping composite mica tape according to claim 1, wherein the cloth layer thickness of the alkali-free glass fiber cloth is 0.2-0.3 mm.
4. The stripping-resistant composite mica tape according to claim 1, wherein the base mica paper layer is made of phlogopite paper or synthetic mica paper with the molding thickness of 0.3-0.5 mm, and is directly manufactured on the surface of the alkali-free glass fiber cloth through a cylinder mould paper-making machine.
5. The peel resistant composite mica tape of claim 1 wherein the reinforcing mica paper layer has a thickness of 0.15 to 0.2mm.
6. The peel resistant composite mica tape of claim 1 wherein the crosslinked fibers are chopped glass fibers or chopped aramid fibers.
7. The peel resistant composite mica tape of claim 1 wherein the adhesive layer is an epoxy silicone adhesive layer and has an adhesive layer thickness of less than 0.1mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321755422.0U CN220456175U (en) | 2023-07-06 | 2023-07-06 | Anti-stripping composite mica tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321755422.0U CN220456175U (en) | 2023-07-06 | 2023-07-06 | Anti-stripping composite mica tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220456175U true CN220456175U (en) | 2024-02-06 |
Family
ID=89740291
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321755422.0U Active CN220456175U (en) | 2023-07-06 | 2023-07-06 | Anti-stripping composite mica tape |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220456175U (en) |
-
2023
- 2023-07-06 CN CN202321755422.0U patent/CN220456175U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |