CN220358059U

CN220358059U - Wafer pouring jig

Info

Publication number: CN220358059U
Application number: CN202321893241.4U
Authority: CN
Inventors: 蓝习麟
Original assignee: Wuxi Huayuguang Microelectronics Technology Co ltd
Current assignee: Wuxi Huayuguang Microelectronics Technology Co ltd
Priority date: 2023-07-19
Filing date: 2023-07-19
Publication date: 2024-01-16
Anticipated expiration: 2033-07-19

Abstract

The utility model relates to a wafer box pouring jig, which comprises: a bottom plate; the wafer box comprises two groups of wafer boxes, a wafer cavity formed in the wafer box and a wafer groove formed in the inner side wall of the wafer box, wherein one group of wafer boxes are fixed on the top of the bottom plate, the other group of wafer boxes are adjustably arranged on the top of the bottom plate, and the wafer is inserted into the wafer groove of one group of wafer boxes; and the push rod is movably arranged at the top of the bottom plate and is used for pushing wafers in one group of wafer boxes into wafer grooves of the other group of wafer boxes. The wafer box pouring jig is simple in structure, two groups of wafer boxes needing box pouring are placed on the bottom plate, the wafers in one group of wafer boxes are horizontally pushed into the wafer grooves of the other group of wafer boxes by virtue of the pushing rod, so that the box pouring operation of the wafers is finished, the whole box pouring process is convenient to operate, and the surfaces of the wafers are not damaged.

Description

Wafer pouring jig

Technical Field

The utility model belongs to the technical field of holes of wafer production equipment, and particularly relates to a wafer box pouring jig.

Background

Wafer refers to a silicon wafer used for manufacturing silicon semiconductor circuits, the original material of which is silicon. The high-purity polycrystalline silicon is dissolved and then doped with silicon crystal seed, and then slowly pulled out to form cylindrical monocrystalline silicon. The silicon ingot is ground, polished, and sliced to form a silicon wafer, i.e., a wafer. The method is generally applied to the fields of artificial intelligence, internet of things, biological medicine and the like.

During the process of processing, shaping and polishing, the wafer is contaminated by contact with various organic substances, particles and metals, and it is necessary to remove photoresist, etchant and particles, and therefore, it is necessary to clean the wafer to remove the contaminants.

During the cleaning process, different cleaning agents are required, so that when cleaning is performed in a cleaning tank with the different cleaning agents, the polycrystalline wafer needs to be inverted, i.e. the wafer is transferred from one wafer box to another wafer box. In the prior art, the transfer of the wafer in the wafer box usually needs to be carried out by clamping and transferring through a manipulator, the transfer structure is complex, and when the manipulator grabs a plurality of wafers, the wafer is easy to damage during clamping due to the fact that the wafer is thinner.

Disclosure of Invention

The utility model aims to overcome the defects that the existing wafer box pouring technology is complex in box pouring structure and easy to damage wafers, and provides a wafer box pouring jig.

In order to achieve the above purpose, the utility model adopts the following technical scheme: a wafer pouring jig comprises:

a bottom plate;

the wafer box comprises two groups of wafer boxes, a wafer cavity formed in the wafer box and a wafer groove formed in the inner side wall of the wafer box, wherein one group of wafer boxes are fixed on the top of the bottom plate, the other group of wafer boxes are adjustably arranged on the top of the bottom plate, and the wafer is inserted into the wafer groove of one group of wafer boxes;

and the push rod is movably arranged at the top of the bottom plate and is used for pushing wafers in one group of wafer boxes into wafer grooves of the other group of wafer boxes.

Optimally, the wafer box also comprises a supporting block fixed at the bottom of the bottom plate, a guide component arranged at one side of the bottom plate and connected with the push rod, an outer guide plate fixed at the top of the bottom plate at intervals, and a clamping plate integrally connected at the bottom of the wafer box and matched with the outer guide plate;

after the wafer box is placed on the bottom plate, the clamping plate is clamped between the two groups of outer guide plates.

Optimally, the wafer box further comprises a first fixing plate and a second fixing plate which are fixed at the top of the bottom plate at intervals, a clamping groove formed in the top of the first fixing plate, a limiting groove formed in the top of the second fixing plate and a limiting plate integrally connected to the bottom of the wafer box;

when two groups of wafer boxes are placed on the bottom plate, the limiting plate of one group of wafer boxes is inserted in the clamping groove, and the limiting plate of the other group of wafer boxes is inserted in the limiting groove and can be adjusted in position in the limiting groove.

Preferably, the device further comprises an inner guide groove and an outer guide groove which are formed in the top of the bottom plate, the outer guide plate is fixed in the outer guide groove, and the first fixing plate and the second fixing plate are fixed in the inner guide groove.

Optimally, the guide assembly comprises a fixed block fixed at the bottom of the bottom plate, an inner bearing embedded in the fixed block, an inner shaft rod penetrating through the inner bearing, telescopic blocks and shaft rod connecting blocks fixed at two ends of the inner shaft rod, an outer bearing embedded in the telescopic blocks, an outer shaft rod penetrating through the outer bearing and fixed with the supporting block, and a push rod supporting frame fixed on the shaft rod connecting blocks and used for fixing a push rod.

Optimally, the push rod is made of rubber.

Due to the application of the technical scheme, compared with the prior art, the utility model has the following advantages:

the wafer box pouring jig is simple in structure, two groups of wafer boxes needing box pouring are placed on the bottom plate, the wafers in one group of wafer boxes are horizontally pushed into the wafer grooves of the other group of wafer boxes by virtue of the pushing rod, so that the box pouring operation of the wafers is finished, the whole box pouring process is convenient to operate, and the surfaces of the wafers are not damaged.

Drawings

FIG. 1 is a schematic diagram of the structure of the present utility model;

FIG. 2 is a schematic view of the structure of the bottom part of the present utility model;

FIG. 3 is a schematic view of a partial structure of the present utility model;

FIG. 4 is a schematic view of the structure of the base plate of the present utility model;

FIG. 5 is a schematic view of a wafer cassette of the present utility model;

FIG. 6 is a schematic view of another view of the wafer cassette of the present utility model;

reference numerals illustrate:

1. a bottom plate; 2. a support block; 3. an outer shaft; 4. a telescopic block; 5. an outer bearing; 6. a fixed block; 7. an inner bearing; 8. an inner shaft; 9. a shaft lever connecting block; 10. a push rod support; 11. a push rod; 12. an inner guide groove; 13. an outer guide groove; 14. a first fixing plate; 15. a second fixing plate; 16. an outer guide plate; 17. a clamping groove; 18. a limit groove; 19. a wafer cassette; 20. a wafer cavity; 21. a wafer groove; 22. a clamping plate; 23. and a limiting plate.

Detailed Description

The utility model will be further described with reference to examples of embodiments shown in the drawings.

As shown in fig. 1 and 2, the wafer box-pouring jig of the present utility model is generally used in the processing and polishing processes of wafers to finish the box-pouring operation of the wafers in different wafer boxes. The device comprises a bottom plate 1, a supporting block 2, a guide assembly, a push rod 11, an inner guide groove 12, an outer guide groove 13, a first fixing plate 14, a second fixing plate 15, an outer guide plate 16, a clamping groove 17, a limit groove 18, a wafer box 19, a wafer cavity 20, a wafer groove 21, a clamping plate 22 and a limit plate 23.

The bottom plate 1 is rectangular metal plate, and four corners of bottom plate 1 bottom are fixed with supporting shoe 2, and supporting shoe 2 props bottom plate 1 off the workstation, provides the space for guiding component's installation. The bottom of supporting shoe 2 is provided with the rubber bullet pad, cushions whole tool, avoids taking place to scratch between tool and the workstation. As shown in fig. 4, the top of the base plate 1 is provided with an inner guide groove 12 and an outer guide groove 13 which are parallel to each other, the outer guide groove 13 is used for fixing an outer guide plate 16, and the inner guide groove 12 is used for fixing a first fixing plate 14 and a second fixing plate 15. The clamping groove 17 is formed in the top of the first fixing plate 14, the limiting groove 18 is formed in the top of the second fixing plate 15, the position of one group of wafer boxes 19 is unchanged after the wafer boxes 19 are placed on the bottom plate 1 due to the existence of the clamping groove 17, and the other group of wafer boxes 19 are adjustably arranged on the bottom plate 1 due to the existence of the limiting groove 18.

As shown in fig. 5 and 6, a wafer cavity 20 is formed on the inner side of the wafer box 19, and wafer grooves 21 are formed on the inner side wall of the wafer box 19 from top to bottom at intervals for placing wafers to be reworked. The clamping plate 22 is integrally connected to the bottom of the wafer box 19, and the limiting plate 23 is integrally connected to the bottom of the wafer box 19 and connected to the clamping plate 22 (the clamping plate 22 and the limiting plate 23 form an I shape). When the wafer box 19 is placed on the bottom plate 1, two groups of clamping plates 22 at the bottom of the wafer box 19 are clamped in the outer guide plate 16 on the bottom plate 1, and the wafer box 19 is limited by means of the outer guide plate 16.

The limiting plate 23 at the bottom of one group of wafer boxes 19 is inserted into the clamping groove 17, and the position of the current wafer box 19 relative to the bottom plate 1 is guaranteed not to change by virtue of the cooperation of the limiting plate 23 and the clamping groove 17. The limiting plate 23 at the bottom of the other group of wafer cassettes 19 is inserted into the limiting groove 18, and the other group of wafer cassettes 19 can move within the range of the limiting groove 18 because the length of the limiting groove 18 is larger than the width of the limiting plate 23.

The guiding component is arranged at the bottom of the bottom plate 1 and is used for driving the push rod 11 to move, and then the push rod 11 pushes wafers in one group of wafer boxes 19 into the wafer grooves 21 of the other group of wafer boxes 19, so that the wafer rewinding operation is completed. The guide component can ensure that the push rod 11 does not deviate when moving, and the accuracy of the position of the wafer after the wafer is poured into the box is improved. The guiding component comprises an outer shaft rod 3, a telescopic block 4, an outer bearing 5, a fixed block 6, an inner bearing 7, an inner shaft rod 8, a shaft rod connecting block 9 and a push rod supporting frame 10. The fixed block 6 is fixed at the bottom of the bottom plate 1, the inner bearing 7 is embedded in the fixed block 6, the inner shaft rod 8 penetrates through the inner bearing 7 and can do linear motion along the inner bearing 7 (the inner bearing 7 is a linear bearing).

The telescopic blocks 4 and the shaft rod connecting blocks 9 are respectively fixed at two ends of the inner shaft rod 8, the outer bearing 5 is embedded in the telescopic blocks 4, and the outer shaft rod 3 penetrates through the outer bearing 5 and is fixed between the supporting blocks 2. One side of the push rod supporting frame 10 is fixed with the shaft rod connecting block 9, the push rod 11 is fixed on the other side of the push rod supporting frame 10, an operator pushes the push rod supporting frame 10 and then drives the push rod 11 to move, and wafers in one group of wafer boxes 19 are pushed into the wafer grooves 21 of the other group of wafer boxes 19, so that the wafer box pouring operation is completed (the movement of the push rod 11 is guided by arranging the outer shaft rod 3 and the inner shaft rod 8, the push rod 11 is prevented from shifting when moving, and the box pouring accuracy is improved). The push rod 11 is made of rubber, and when pushing the wafer, the side surface of the wafer is prevented from being damaged (as shown in fig. 3, a semicircular groove is formed in the inner side of the push rod supporting frame 10 and used for fixing the cylindrical push rod 11, and the contact area between the semicircular groove and the push rod 11 can be increased, so that the fixing reliability is improved).

The wafer box pouring process of the wafer box pouring jig is as follows:

firstly, two groups of wafer boxes 19 are placed on a bottom plate 1 (one group of wafer boxes 19 is loaded with wafers, and the other group of wafer boxes 19 is in an empty box state to be inverted), wherein the wafer boxes 19 loaded with the wafers are placed on a first fixed plate 14, and the position of the current wafer boxes 19 relative to the bottom plate 1 is ensured not to change in the box inversion stage by virtue of the cooperation of a limiting plate 23 and a clamping groove 17; the other group of empty wafer boxes 19 to be reworked are placed on the second fixing plate 15, under the effect of the limiting groove 18, the empty wafer boxes 19 can move within the range of the limiting groove 18, an operator pushes the empty wafer boxes 19 inwards until the empty wafer boxes are propped against the inner side of the limiting groove 18, at the moment, the inner side surfaces of the two groups of wafer boxes 19 are combined, the operator pushes the push rod support frame 10 inwards, the push rod support frame 10 drives the push rod 11 to move inwards, the wafers in one group of wafer boxes 19 are pushed into the wafer grooves 21 of the other group of wafer boxes 19, so that the wafer box rewinding operation is finished, after the wafer boxes are reworked, the wafer boxes 19 after the wafer boxes are pushed outwards and propped against the outer sides of the limiting groove 18, the separation work of the two groups of wafer boxes 19 is finished, and the operator can conveniently take down the wafer boxes 19 after the wafer boxes are reworked.

The above embodiments are provided to illustrate the technical concept and features of the present utility model and are intended to enable those skilled in the art to understand the content of the present utility model and implement the same, and are not intended to limit the scope of the present utility model. All equivalent changes or modifications made in accordance with the spirit of the present utility model should be construed to be included in the scope of the present utility model.

Claims

1. Wafer box tool that falls, its characterized in that includes:

a bottom plate (1);

the wafer box (19), a wafer cavity (20) formed in the wafer box (19) and a wafer groove (21) formed in the inner side wall of the wafer box (19), wherein the wafer boxes (19) are arranged in two groups and are opposite to each other, one group of the wafer boxes (19) is fixed on the top of the bottom plate (1), the other group of the wafer boxes (19) is adjustably arranged on the top of the bottom plate (1), and the wafer is inserted into the wafer groove (21) of one group of the wafer boxes (19);

the pushing rod (11) is movably arranged at the top of the bottom plate (1), and the pushing rod (11) is used for pushing wafers in one group of wafer boxes (19) into wafer grooves (21) of the other group of wafer boxes (19).

2. The wafer pouring jig according to claim 1, wherein: the wafer box also comprises a supporting block (2) fixed at the bottom of the bottom plate (1), a guide assembly arranged at one side of the bottom plate (1) and connected with the push rod (11), an outer guide plate (16) fixed at the top of the bottom plate (1) at intervals, and a clamping plate (22) integrally connected at the bottom of the wafer box (19) and matched with the outer guide plate (16);

when the wafer box (19) is placed on the bottom plate (1), the clamping plate (22) is clamped between the two groups of outer guide plates (16).

3. The wafer pouring jig according to claim 2, wherein: the wafer box also comprises a first fixing plate (14) and a second fixing plate (15) which are fixed at the top of the bottom plate (1) at intervals, a clamping groove (17) formed at the top of the first fixing plate (14), a limit groove (18) formed at the top of the second fixing plate (15) and a limit plate (23) integrally connected to the bottom of the wafer box (19);

when two groups of wafer boxes (19) are placed on the bottom plate (1), the limiting plate (23) of one group of wafer boxes (19) is inserted into the clamping groove (17), and the limiting plate (23) of the other group of wafer boxes (19) is inserted into the limiting groove (18) and can be adjusted in position in the limiting groove (18).

4. The wafer pouring jig according to claim 3, wherein: the novel floor board comprises a bottom plate (1), and is characterized by further comprising an inner guide groove (12) and an outer guide groove (13) which are formed in the top of the bottom plate, wherein the outer guide plate (16) is fixed in the outer guide groove (13), and the first fixing plate (14) and the second fixing plate (15) are fixed in the inner guide groove (12).

5. The wafer pouring jig according to claim 2, wherein: the guide assembly comprises a fixed block (6) fixed at the bottom of the bottom plate (1), an inner bearing (7) embedded in the fixed block (6), an inner shaft rod (8) penetrating through the inner bearing (7), telescopic blocks (4) and shaft rod connecting blocks (9) fixed at two ends of the inner shaft rod (8), an outer bearing (5) embedded in the telescopic blocks (4), an outer shaft rod (3) penetrating through the outer bearing (5) and fixed with the supporting block (2) and a push rod supporting frame (10) fixed on the shaft rod connecting blocks (9) and used for fixing a push rod (11).

6. The wafer pouring jig according to claim 1, wherein: the push rod (11) is made of rubber.