CN220341254U

CN220341254U - LED lamp pearl base plate structure

Info

Publication number: CN220341254U
Application number: CN202321967758.3U
Authority: CN
Inventors: 方成应; 石金新; 黄小微
Original assignee: Anhui Hongguan Photoelectric Technology Co ltd
Current assignee: Anhui Hongguan Photoelectric Technology Co ltd
Priority date: 2023-07-25
Filing date: 2023-07-25
Publication date: 2024-01-12
Anticipated expiration: 2033-07-25

Abstract

The utility model relates to the technical field of LED substrates, in particular to an LED lamp bead substrate structure; the first wiring lugs arranged on the bottom plate and used for welding the LED chips and the two second wiring lugs symmetrically arranged on two sides of the corresponding pins of the LED chips enable the pins of the LED chips to be correspondingly welded on the second wiring lugs positioned on the same side of the pins, so that sufficient space is reserved for ensuring relative dispersion among the pins, the welding quality of the LED chips is ensured, the two second wiring lugs and the connecting pieces are integrally formed, the processing technology of the two second wiring lugs and the connecting piece is greatly simplified, and meanwhile, the surfaces of the second wiring lugs and the connecting piece can be used for welding the pins on the LED chips, so that the welding range of the pins of the LED chips is enlarged, and the LED chips with higher power can be installed to produce LEDs with higher power; the problem of current base plate when welding the LED chip of the perpendicular structure of multiple electrode, the welding defective rate is higher is solved.

Description

LED lamp pearl base plate structure

Technical Field

The utility model relates to the technical field of LED substrates, in particular to an LED lamp bead substrate structure.

Background

At present, 3535/5050/5060 and other ceramic high-power LED products mainly use high-power vertical chips, the high-power chips have various structures, and in most cases, the structures of the vertical chips are single-electrode or double-electrode structures, and the positive and negative electrodes of the vertical chips are only required to be welded on positive and negative electrode bonding pads on a substrate correspondingly.

However, although the conventional substrate can be welded only with difficulty for the multi-electrode chip, the plurality of pins are relatively close to each other (as shown in fig. 1) during welding, and the welding failure is easily caused by interference with the other pins during welding, so that the welding failure rate during the welding process is relatively high, and the conventional substrate often cannot meet the welding requirement of the multi-electrode vertical structure chip.

Disclosure of Invention

Aiming at the defects of the prior art, the utility model provides an LED lamp bead substrate structure, which solves the problem of higher welding reject ratio when the conventional substrate is used for welding an LED chip with a multi-electrode vertical structure.

In order to achieve the above purpose, the present utility model provides the following technical solutions:

the LED lamp bead substrate structure comprises an LED chip with a vertical structure and a substrate mechanism for mounting the LED chip.

The substrate mechanism comprises a bottom plate serving as a supporting carrier, the surface of the bottom plate is provided with a first wiring lug used for being electrically connected with the bottom of the LED chip, and the surface of the bottom plate is provided with two second wiring lugs symmetrically distributed on two sides of the LED chip and used for welding pins at the top of the LED chip.

Preferably, the two second connection tabs respectively correspond to a plurality of pin positions on two sides of the LED chip.

Preferably, a connecting piece for conducting electricity is arranged between the two second connecting pieces.

Preferably, the connecting piece and the two second connecting lugs are of an integrated structure.

Preferably, at least one of the first lug plate or the second lug plate is provided with an indication mark for identifying the anode and the cathode.

Preferably, the first lug plate is provided with a mounting mark which is positioned in the middle of the bottom plate and used for indicating the mounting position of the LED chip.

Compared with the prior art, the utility model provides an LED lamp bead substrate structure, which comprises the following components

The beneficial effects are that:

1. the LED chip welding device comprises a base plate, a first lug and two second lugs, wherein the first lugs are arranged on the base plate and used for welding LED chips, the two second lugs are symmetrically arranged on two sides of corresponding pins of the LED chips, the pins of the LED chips can be correspondingly welded on the second lugs which are positioned on the same side of the pins, and therefore sufficient space is reserved for ensuring relative dispersion among the pins, probability of poor welding caused by excessive approaching of the pins in the welding process is reduced, welding quality of the LED chips is guaranteed, and welding qualification rate is improved.

2. The two second wiring lugs and the connecting sheet which are integrally formed greatly simplify the processing technology of the two, and simultaneously, the surfaces of the second wiring lugs and the connecting sheet which are integrally formed can be used for welding pins on the LED chip, so that the welding range of the pins of the LED chip is enlarged, and therefore, the LED chip with higher power can be installed to produce the LED with higher power.

3. The indicating mark and the installation mark arranged on the first wiring piece can assist in guiding a welder to correctly install the LED chip at the corresponding preset position, so that the correctness of the anode and the cathode of the LED chip is ensured, and the lead of the LED chip can be welded onto the second wiring piece or the connecting piece in a qualified manner.

Drawings

The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiments of the application and together with the description serve to explain the application and do not constitute an undue limitation to the application. In the drawings:

FIG. 1 is a schematic diagram of the prior art of the present utility model;

FIG. 2 is a schematic diagram of the present utility model.

In the figure: 1. an LED chip; 2. a substrate mechanism; 21. a bottom plate; 22. a first tab; 23. a second tab; 24. a connecting sheet; 25. an indication mark; 26. and (5) installing a logo.

Detailed Description

The embodiments of the present application will be described in detail below with reference to the accompanying drawings and examples, so that the implementation process of how the technical means are applied to solve the technical problems and achieve the technical effects of the present application can be fully understood and implemented accordingly.

Fig. 2 is a schematic diagram of an embodiment of the present utility model, which is an improvement of a substrate of an existing LED lamp bead by combining the pin distribution characteristics of a multi-electrode vertical structure chip, so that each pin is relatively dispersed during welding, thereby ensuring the welding effect and avoiding poor welding caused by too close pins.

The utility model provides a LED lamp pearl base plate structure, including the LED chip 1 that has vertical structure, vertical structure chip generally adopts the substrate of high thermal conductivity, very big improvement the heat dispersion of chip, simultaneously, vertical structure chip's positive and negative electrode is located the chip upper and lower both sides respectively, the electric current is almost whole vertical flow through the epitaxial layer of LED chip 1, transversely flowing electric current is very little, local high temperature has been avoided, the chip reliability is higher, the upper and lower side of this chip respectively electric connection on the base plate when the installation can, one side of general chip passes through soldering direct welding on the pad, the chip opposite side passes through the lead wire and passes through soldering with other pads to realize electric connection and fixed purpose, base plate mechanism 2 for installing LED chip 1, thereby base plate mechanism 2 is through the welding of the more convenient lead wire of position through reasonable distribution pad, help reducing the welding defective rate, improve the product quality.

The substrate mechanism 2 includes as the bottom plate 21 of support carrier, the bottom plate 21 surface is used for setting up the circuit, its material class is more, the preferred ceramic material that is, its high temperature resistance can be more suitable for copper foil and directly bond its surface under high temperature, have good electrical insulation performance and high heat conduction characteristic, the bottom plate 21 surface is equipped with the first lug 22 that is used for electric connection LED chip 1 bottom, be equipped with two second lugs 23 that symmetric distribution is used for welding LED chip 1 top pin on the bottom plate 21 surface, first lug 22 and second lug 23 are used for respectively electric connection LED chip 1's positive negative pole, can be made for the copper foil, the direct bonding is on bottom plate 21 at high temperature conveniently, and two second lugs 23 symmetry set up in LED chip 1 both sides, a plurality of pins on the convenient LED chip 1 are according to the corresponding welding in position on one of them second lug 23, thereby make the position of each pin can be relatively more dispersed, the convenience is to the pin weld, the mutual and increase welding defect rate when the welding, thereby through the substrate mechanism 2 of above-mentioned, can be more vertical distribution can the chips according to the relative power distribution of LED chip 1, the more than the LED chip can be more easily welded according to the more than the second lug 23, the more than the corresponding power distribution is of LED chip 1, the more convenient for the chip has the welding defect rate, the chip is greatly produced when the more than has the LED chip is more than the more has the electrode has the more distributed LED chip is more has the more than the LED chip is more convenient according to the structure.

As a preferred technical solution of this embodiment, the two second connection tabs 23 respectively correspond to the positions of the plurality of pins on two sides of the LED chip 1, and since the plurality of pins of the LED chip 1 with the multi-electrode vertical structure are generally uniformly distributed on two sides of the LED chip 1, the two second connection tabs 23 are correspondingly distributed on two sides of the LED chip 1, so that the lead wires are more conveniently arranged during welding, the welding positions of the lead wires are adjusted, the lead wires can be kept in a fully dispersed state, thereby avoiding the occurrence of mutual interference during welding, being beneficial to improving the qualification rate of the welding procedure, and avoiding the need of punching holes on the bottom plate 21 and arranging lines to make two.

As the preferred technical scheme of this embodiment, be equipped with the connection piece 24 that is used for electrically conducting between two second lugs 23, when using connection piece 24 to conduct, need not to carry out switching on at the base plate 21 with the extra circuit that arranges, it is relatively more convenient, and connection piece 24 itself also can be used for the welding of the last pin of LED chip 1, when the pin quantity is great, also more convenient further rationally distribute the welding position of a plurality of pins on the LED chip 1, make it keep the state of relative dispersion to weld, avoid the pin mutual interference in the welding process, in order to guarantee welding quality, guarantee the welding qualification rate, when two second lugs 23 can satisfy the welding of a plurality of pins, can reduce the width of connection piece 24 on the basis of guaranteeing the effect of electrically conducting, thereby realize saving the purpose of material cost, thereby can be according to LED chip 1 of different structures, rationally select the size of connection piece 24, realize different functional purposes.

As a preferred technical solution of this embodiment, the connecting piece 24 and the two second connection lugs 23 are of an integral forming structure, so that the three can be integrally made of the same material, for example, by etching or punching the same copper foil, so that the processing is relatively more convenient, the conductive property between the connecting piece 24 and the two second connection lugs 23 is better, the process steps of electrically connecting the connecting piece 24 and the two second connection lugs 23 by welding or other modes are saved, the connecting piece 24 and the two second connection lugs 23 are not required to be separately manufactured, the processing is relatively more convenient, the size of the blanking raw materials can be reasonably selected, one part of the blanked product is the first connection lug 22, and the other part of the blanked product is the integral connecting piece 24 and the second connection lug 23, so that the processing procedure can be further saved, the production efficiency is improved, and the loss of the material is reduced.

As a preferred technical solution of this embodiment, at least one of the first lug 22 or the second lug 23 is provided with an indication mark 25 for identifying the anode and the cathode, and the indication mark 25 can be used for identifying by a worker or a device, so as to avoid the influence of the electrode inversion of the LED chip 1 during welding, and simultaneously, the method is convenient for the subsequent reason of abnormal identification during inspection, and meanwhile, the method is convenient for a customer to quickly know the direction of the anode and the cathode during the maintenance and replacement of the LED chip 1 in the future, so as to ensure the welding accuracy.

As a preferred technical solution of this embodiment, the first wire connecting piece 22 is provided with a mounting identifier 26 located in the middle of the bottom plate 21 and used for indicating the mounting position of the LED chip 1, where the mounting identifier 26 is used for positioning the mounting position of the LED chip 1, and may be an area surrounded by a plurality of scores, grooves or through holes, which are formed on the first wire connecting piece 22, so that a worker or a device can accurately grasp the welding position when welding the LED chip 1, and the distances between a plurality of pins of the LED chip 1 and two corresponding second wire connecting pieces 23 are kept approximately equal, so that each pin can be relatively dispersed and welded to the second wire connecting pieces 23 when the pins are arranged, and therefore, the pin welding quality of the LED chip 1 can be ensured, and the qualification rate of the welding procedure is ensured.

It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a LED lamp pearl base plate structure, includes LED chip (1) that have vertical structure, its characterized in that: the LED lamp also comprises a substrate mechanism (2) for mounting the LED chip (1);

the substrate mechanism (2) comprises a bottom plate (21) serving as a supporting carrier, a first wiring lug (22) used for being electrically connected with the bottom of the LED chip (1) is arranged on the surface of the bottom plate (21), and two second wiring lugs (23) symmetrically distributed on two sides of the LED chip (1) and used for welding pins at the top of the LED chip (1) are arranged on the surface of the bottom plate (21).

2. The LED light bead substrate structure of claim 1, wherein: the two second wiring lugs (23) respectively correspond to a plurality of pin positions on two sides of the LED chip (1).

3. The LED light bead substrate structure of claim 1, wherein: a connecting piece (24) for conducting electricity is arranged between the two second connecting lugs (23).

4. The LED light bead substrate structure of claim 3, wherein: the connecting sheet (24) and the two second wiring sheets (23) are of an integrated structure.

5. The LED light bead substrate structure of claim 1, wherein: at least one of the first lug plate (22) or the second lug plate (23) is provided with an indication mark (25) for identifying the anode and the cathode.

6. The LED light bead substrate structure of claim 1, wherein: the first wiring lug (22) is provided with a mounting mark (26) which is positioned in the middle of the bottom plate (21) and used for indicating the mounting position of the LED chip (1).