CN220325616U - Multi-channel BiDi optical module and optical fiber communication system - Google Patents

Abstract

The utility model discloses a multichannel BiDi optical module and an optical fiber communication system, wherein the multichannel BiDi optical module comprises a plurality of light emitting components which are sequentially arranged along a first direction; the light emitting assembly provides an emission light beam; the spectroscopes are respectively arranged in one-to-one correspondence with the light emitting assemblies; the spectroscope comprises a first incidence surface facing one side of the light emitting component and a first reflection surface opposite to the first incidence surface; the optical fiber adapters are respectively arranged in one-to-one correspondence with the spectroscopes; the emitted light beam exits through the optical fiber adapter, and the received light beam is received through the optical fiber adapter; the spectroscope and the optical fiber adapter are sequentially arranged along the propagation path of the emitted light beam; the light receiving component is positioned on the reflecting surface side of the spectroscope; the optical fiber adapter, the spectroscope and the light receiving component are arranged in sequence along the propagation path of the received light beam. The technical scheme of the utility model solves the problems that the multichannel BiDi optical module needs to be coiled in a narrow space, and the optical fiber is easy to break and the optical module is invalid.

Description

Multi-channel BiDi optical module and optical fiber communication system

Technical Field

The utility model relates to the technical field of optical communication, in particular to a multi-channel BiDi optical module and an optical fiber communication system.

Background

With the continuous expansion of technical applications such as 5G communication, big data, cloud computing and the like, flow data shows explosive growth. In order to meet the requirement of high-speed transmission of mass data, an optical communication technology is indispensable, and an optical module is used as a tool for realizing photoelectric signal mutual conversion and is a key device for realizing optical communication. With the rapid increase of data traffic, the demand for optical modules is also increasing.

Optical fibers are generally needed in the optical module and between the optical modules, and the optical fibers are needed in various application scenes of the current optical communication technology, so that optical fiber resources are tense, and the cost is increased. In order to meet the requirements of high speed and low cost, a single-fiber bidirectional communication technology is generated, namely, a Bi-directional (Bi-directional) optical module is utilized to enable signal light with two wavelengths in two directions to be transmitted and received in two directions to be transmitted in two directions on one optical fiber, and meanwhile, the transmission of the signal light with one wavelength and the receiving of the signal light with the other wavelength are completed. The BiDi optical modules need to be used in pairs, and the main advantage is that optical fiber resources are saved.

However, the existing BiDi optical module has the following problems: 1. most of the optical fiber is in a single-channel structure, so that expansion is difficult, more BiDi optical modules are needed to complement with the increasing information quantity transmitted by a network, the cost is increased, and the space is not saved; 2. the multichannel BiDi optical module generally adopts a Wavelength Division Multiplexing (WDM) mode, and a transmitting end and a receiving end are required to be connected through optical fibers, so that the optical fibers are required to be designed longer and are provided with a fiber coiling structure because the optical fibers cannot be bent, the space in the optical module is small, the internal design is complicated, the optical fibers are easy to break when the optical fibers are coiled, and the functions of the optical module are invalid.

Disclosure of Invention

The utility model provides a multi-channel BiDi optical module and an optical fiber communication system, which are used for solving the technical problems in the prior art, simplifying the structure of the multi-channel BiDi optical module and improving the reliability of the multi-channel BiDi optical module.

According to an aspect of the present utility model, there is provided a multi-channel BiDi optical module comprising:

a plurality of light emitting components sequentially arranged along a first direction; the light emitting assembly provides an emission light beam;

the spectroscopes are respectively arranged in one-to-one correspondence with the light emitting components; the spectroscope comprises a first incidence surface facing one side of the light emitting component and a first reflection surface opposite to the first incidence surface;

the optical fiber adapters are respectively arranged in one-to-one correspondence with the spectroscopes; the emitted light beam exits through the optical fiber adapter, and the received light beam is received through the optical fiber adapter; the spectroscope and the optical fiber adapter are sequentially arranged along the propagation path of the emitted light beam;

the light receiving component is positioned on the reflecting surface side of the spectroscope; the optical fiber adapter, the spectroscope and the light receiving component are sequentially arranged along the propagation path of the received light beam;

the circuit board is respectively and electrically connected with the light emitting component and the light receiving component;

and the light emitting component, the spectroscope and the light receiving component are all accommodated in the packaging component.

Optionally, the light emitting assembly includes a laser, a first focusing lens, and an isolator sequentially disposed along a propagation path of the emitted light beam.

Optionally, the light receiving component comprises a horizontal deflection mirror, an upper deflection prism, a plurality of second focusing lenses, a lower deflection prism, a plurality of light receivers and a transimpedance amplifier;

the horizontal deflection mirror comprises a second reflecting surface; the second reflecting surface is parallel to and opposite to the first reflecting surface;

each second focusing lens is arranged in one-to-one correspondence with each spectroscope; each light receiver is arranged in one-to-one correspondence with each second focusing lens;

the transimpedance amplifier comprises a plurality of amplifier channels; each amplifier channel is respectively and electrically connected with the output end of each optical receiver in a one-to-one correspondence manner;

the horizontal deflection mirror, the upper deflection prism, the second focusing lens, the lower deflection prism and the light receiver are sequentially arranged along the propagation path of the received light beam, so that the optical axis of the received light beam is parallel to the optical axis of the emitted light beam.

Optionally, the package assembly includes a mounting carrier;

the mounting carrier comprises a bottom plate and a side wall connected with the bottom plate and partially surrounding the bottom plate; the side wall comprises a side wall opening, and a clamping groove is formed in the edge of the side wall opening; a plurality of jacks are arranged at the side wall opposite to the side wall opening;

one side of the circuit board is clamped in the clamping groove, and part of the circuit board is attached to the edge of the bottom plate through optical cement;

the optical fiber adapters are arranged in the jacks in a one-to-one correspondence mode.

Optionally, the mounting carrier further includes a ceramic pad located on the bottom plate, and the ceramic pad is located on a side of the mounting carrier away from the jack;

the laser is fixed on the ceramic cushion block through adhesive; the thickness of the ceramic cushion block is the same as that of the circuit board.

Optionally, the mounting carrier further includes a plurality of pairs of first bosses located on a side of the ceramic cushion block near the jack; the spectroscopes are respectively fixed between the first bosses of each pair in a one-to-one correspondence manner through viscose.

Optionally, at least one glue containing groove is formed in the area where the bottom plate is attached to the circuit board.

According to another aspect of the present utility model, there is provided a fiber optic communication system comprising: a first BiDi optical module and a fiber optic cable assembly;

the first BiDi optical module is the multi-channel BiDi optical module of any one of the above;

the optical fiber cable assembly comprises a plurality of optical fibers and a first plug-in interface; the first plug interface comprises a plurality of first terminals; each first terminal is connected with one end of each optical fiber in a one-to-one correspondence manner;

each optical fiber adapter of the first BiDi optical module is connected with each first terminal in a one-to-one correspondence manner, and each first terminal is connected with each optical fiber adapter of the first BiDi optical module in a pluggable manner.

Optionally, the optical fiber communication system further includes: at least one second BiDi optical module;

the other end of the optical fiber is connected with the second BiDi optical module in a pluggable mode.

Optionally, the fiber optic cable assembly further includes a plurality of LC interfaces; the second BiDi optical modules are single-channel BiDi optical modules, and the other ends of the optical fibers are connected with the second BiDi optical modules in a pluggable mode through the LC interfaces.

Optionally, the optical fiber cable assembly further includes a second interface; the second plug interface comprises a plurality of second terminals; each second terminal is connected with the other end of each optical fiber in one-to-one correspondence;

the second BiDi optical module is any one of the multi-channel BiDi optical modules, and each optical fiber adapter of the second BiDi optical module is connected with each second terminal in a one-to-one correspondence manner.

According to the technical scheme, the multichannel BiDi optical module comprises a plurality of light emitting assemblies, a plurality of spectroscopes, a plurality of optical fiber adapters and a light receiving assembly, wherein the light emitting assemblies, the spectroscopes and the optical fiber adapters are arranged in a one-to-one correspondence mode, and the light receiving assembly is positioned on the reflecting surface side of the spectroscopes, so that emitted light beams provided by the light emitting assemblies can penetrate through the first incident surface of the spectroscopes and then be emitted through the optical fiber adapters, and meanwhile, received light beams received by the optical fiber adapters can be reflected by the second incident surface of the spectroscopes and then be received by the light receiving assembly, and therefore light emission and light reception of the multichannel BiDi optical module are achieved, the problem that the multichannel BiDi optical module needs to be coiled in a narrow space inside the multichannel BiDi optical module, optical fiber breakage is easy to cause, and the failure of the optical module is solved, the structure of the multichannel BiDi optical module is simplified, and meanwhile, the reliability of the multichannel BiDi optical module is improved.

It should be understood that the description in this section is not intended to identify key or critical features of the embodiments of the utility model or to delineate the scope of the utility model. Other features of the present utility model will become apparent from the description that follows.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic structural diagram of a multi-channel BiDi optical module according to an embodiment of the present utility model;

fig. 2 is a schematic structural diagram of another multi-channel BiDi optical module according to an embodiment of the present utility model;

FIG. 3 is an enlarged view of a portion of area A of FIG. 2;

FIG. 4 is an enlarged perspective view of area A of FIG. 2;

fig. 5 is a schematic structural diagram of a circuit board according to the present embodiment;

fig. 6 is a schematic structural view of a mounting carrier according to an embodiment of the present utility model;

FIG. 7 is a schematic view of a boss according to the present utility model;

fig. 8 is an exploded view of a multi-channel BiDi optical module according to an embodiment of the present utility model;

fig. 9 is a schematic structural diagram of an optical fiber communication system according to an embodiment of the present utility model;

fig. 10 is a schematic structural diagram of an optical fiber cable assembly according to an embodiment of the present utility model;

fig. 11 is a schematic structural diagram of another optical fiber communication system according to an embodiment of the present utility model.

Detailed Description

In order that those skilled in the art will better understand the present utility model, a technical solution in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in which it is apparent that the described embodiments are only some embodiments of the present utility model, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present utility model without making any inventive effort, shall fall within the scope of the present utility model.

Fig. 1 is a schematic structural diagram of a multi-channel BiDi optical module according to an embodiment of the present utility model. As shown in fig. 1, a multi-channel BiDi optical module according to an embodiment of the present utility model includes a plurality of optical emission modules 1, a plurality of beam splitters 2, a plurality of optical fiber adapters 3, and an optical receiving module 4; the light emitting assemblies 1 are arranged in sequence along a first direction, and the light emitting assemblies 1 are used for providing emitted light beams; the spectroscopes 2 are respectively arranged in one-to-one correspondence with the light emitting assemblies 1; the spectroscope 2 includes a first incident surface facing one side of the light emitting assembly 1 and a first reflecting surface opposite to the first incident surface; the optical fiber adapters 3 are respectively arranged in one-to-one correspondence with the spectroscopes 2; the emitted light beam exits through the optical fiber adapter 3, and the received light beam is received through the optical fiber adapter 3; the spectroscope 2 and the optical fiber adapter 3 are sequentially arranged along the propagation path of the emitted light beam; the light receiving component 4 is positioned on the reflecting surface side of the spectroscope 2; the optical fiber adapter 3, the spectroscope 2, and the light receiving element 4 are disposed in this order along the propagation path of the received light beam.

Wherein the light emitting assembly 1 is used to provide an emitted light beam, which may, but is not limited to, comprise a laser. The beam splitter 2 is used to transmit the transmitted beam and reflect the received beam, and the beam splitter 2 may be, but is not limited to, a stereo beam splitter or a flat beam splitter, etc., and fig. 1 only illustrates a case where the beam splitter 2 is a flat beam splitter, and does not limit the kinds of the beam splitter 2. The light receiving assembly 4 may include, but is not limited to, an optical receiver. The optical fiber adapter 3 is connected with an optical fiber for transmitting optical signals, the emitted light beams are emitted to the optical fiber through the optical fiber adapter 3, and meanwhile, the received light beams transmitted by the optical fiber are received by the optical fiber adapter 3, reflected by the spectroscope 2 and transmitted to the light receiving component 4.

Specifically, the beam splitter 2 and the optical fiber adapter 3 are sequentially arranged along the propagation path of the emitted light beam, and the first incident surface of the beam splitter 2 faces one side of the light emitting component 1, so that the emitted light beam provided by the light emitting component 1 can penetrate through the beam splitter 2 and then exit through the optical fiber adapter 3; the optical fiber adapter 3, the spectroscope 2 and the light receiving component 4 are sequentially arranged along the propagation path of the received light beam, and the light receiving component 4 is positioned on the reflecting surface side of the spectroscope 2, so that the received light beam received by the optical fiber adapter 3 can be received by the light receiving component 4 after being reflected by the spectroscope 2, thereby realizing the light emission and the light reception of the multichannel BiDi optical module.

It should be noted that, fig. 1 only illustrates a case where the multi-channel BiDi optical module includes 4 light emitting assemblies 1, 4 spectroscopes 2 and 4 optical fiber adapters 3, that is, the multi-channel BiDi optical module provided in this embodiment is a four-channel BiDi optical module, and in this embodiment, the multi-channel BiDi optical module may also be a two-channel BiDi optical module, a six-channel BiDi optical module, or an eight-channel BiDi optical module. On the premise of realizing the core utility model point of the embodiment, the embodiment does not limit the channel number of the multi-channel BiDi optical module.

According to the technical scheme, the multichannel BiDi optical module comprises a plurality of light emitting assemblies, a plurality of spectroscopes, a plurality of optical fiber adapters and a light receiving assembly, wherein the light emitting assemblies, the spectroscopes and the optical fiber adapters are arranged in a one-to-one correspondence mode, and the light receiving assembly is positioned on the reflecting surface side of the spectroscopes, so that emitted light beams provided by the light emitting assemblies can penetrate through the first incident surface of the spectroscopes and then be emitted through the optical fiber adapters, and meanwhile, received light beams received by the optical fiber adapters can be reflected by the first reflecting surface of the spectroscopes and then be received by the light receiving assembly, and therefore light emission and light reception of the multichannel BiDi optical module are achieved, the problem that the multichannel BiDi optical module needs to be coiled in a narrow space inside the multichannel BiDi optical module, optical fiber breakage is easy to cause, and the failure of the optical module is solved, the structure of the multichannel BiDi optical module is simplified, and meanwhile, the reliability of the multichannel BiDi optical module is improved.

Alternatively, fig. 2 is a schematic structural diagram of another multi-channel BiDi optical module according to an embodiment of the present utility model, and referring to fig. 2, the optical emission assembly 1 includes a laser 11, a first focusing lens 12, and an isolator 13 sequentially disposed along a propagation path of an emitted light beam.

The laser 11 is used for emitting an emission light beam, the first focusing lens 12 is used for focusing the emission light beam emitted by the laser 11, and the isolator 13 is used for reducing adverse effects of reflected light on the output and emission light beam of the laser 11 and improving transmission performance.

Specifically, after the emitted light beam emitted by the laser 11 is focused by the first focusing lens 12, the emitted light beam passes through the isolator 13 and then is emitted by the optical fiber adapter 3, so that the focusing effect of the light beam emitted by the optical fiber adapter 3 is improved, and the transmission performance of the optical module is improved.

Alternatively, fig. 3 is a partial enlarged view of a region a in fig. 2, and as shown in combination with reference to fig. 2 and 3, the light receiving assembly 4 includes a horizontal deflection mirror 41, an upper deflection prism 42, a plurality of second focusing lenses 43, a lower deflection prism 44, a plurality of light receivers 45, and a transimpedance amplifier 46; the horizontal deflection mirror 41 includes a second reflecting surface; the second reflecting surface is parallel to and opposite to the first reflecting surface; the second focusing lenses 43 are arranged in one-to-one correspondence with the spectroscopes 2; each light receiver 45 is arranged in one-to-one correspondence with each second focusing lens 43; the transimpedance amplifier 46 includes a plurality of amplifier channels, and each amplifier channel is electrically connected with the output end of each optical receiver 45 in a one-to-one correspondence manner; the horizontal deflecting mirror 41, the upper deflecting prism 42, the second focusing lens 43, the lower deflecting prism 44, and the light receiver 45 are sequentially arranged along the propagation path of the received light beam so that the optical axis of the received light beam is parallel to the optical axis of the emitted light beam.

Specifically, after the received light beam received by the optical fiber adapter 3 is reflected by the beam splitter 2, the received light beam is reflected by the second reflecting surface of the horizontal deflection mirror 41, so that the optical axis of the received light beam is parallel to the optical axis of the emitted light beam; the received light beam is further deflected upwards by the upper deflection prism 42, focused by the second focusing lens 43, and finally deflected downwards by the lower deflection prism 44, and received by the light receiver 45, so that the size of the multi-channel BiDi optical module in the first direction is reduced, and the integration level of the multi-channel BiDi optical module is improved. The output end of each optical receiver 45 is electrically connected to each amplifier channel of the transimpedance amplifier 46 in a one-to-one correspondence, so that the received light beam received by the optical receiver 45 can be converted into a voltage signal by the transimpedance amplifier 46.

It should be noted that, the light receiver 45 is located below the lower deflection prism 44, so that the received light beam can be received by the light receiver 45 after being deflected downward by the lower deflection prism 44. Fig. 4 is an enlarged perspective view of the area a in fig. 2, and the lower deflecting prism 44 is omitted in the enlarged view of the area a shown in fig. 3 and 4 for ease of understanding, so that the light receiver 45 located below the lower deflecting prism 44 can be seen, and further, the propagation path of the received light beam can be seen more clearly with reference to fig. 4.

In an alternative embodiment, the laser 11 and the optical receiver 45 are arranged offset in the direction of the propagation path of the emitted light beam, so as to reduce optical crosstalk between the emitted light beam and the received light beam.

Optionally, with continued reference to fig. 2, the multi-channel BiDi optical module provided in the present embodiment further includes a circuit board 5; the circuit board 5 is electrically connected with the light emitting component 1 and the light receiving component 4, and is used for providing emergent signals for the light emitting component 1 and receiving signals transmitted by the light receiving component 4, so that the function of the multi-channel BiDi optical module is realized.

In an alternative embodiment, fig. 5 is a schematic structural diagram of a circuit board provided in this embodiment, and referring to fig. 2 and fig. 5, the circuit board 5 may include a circuit board body 51, and an electronic component 52 and a chip 53 disposed on the circuit board body 51, where circuit traces are disposed on the circuit board body 51, and the electronic component 52 and the chip 53 implement electrical functions such as power supply, electrical signal transmission, and grounding through the circuit traces. The electronic component 52 may include, but is not limited to, a capacitor, a resistor, a triode, a MOS transistor, etc., and the chip 53 may include, but is not limited to, a microcontroller MCU, a clock data recovery CDR, a power management chip, a data processing chip DSP, etc. The circuit board body 51 is provided with an electric port end 511 and an optical port end 512, and the light emitting component 1 and the light receiving component 4 are positioned on one side of the optical port end 512; the electrical port 511 is provided with a gold finger 5111, and the gold finger 5111 is used for electrically connecting with an external data device, so as to transmit an electrical signal.

With continued reference to fig. 2 and 5, the multi-channel BiDi optical module provided in the present embodiment further includes a package assembly 6; the light emitting component 1, the spectroscope 2 and the light receiving component 4 are all accommodated in the packaging component 6 to realize the sealing of the light emitting component 1, the spectroscope 2 and the light receiving component 4, thereby preventing the multichannel BiDi optical module from being interfered by external light and dust and being beneficial to realizing the functions of the multichannel BiDi optical module.

Optionally, fig. 6 is a schematic structural diagram of a mounting carrier according to an embodiment of the present utility model, and referring to fig. 2 and fig. 6, the package assembly 6 includes a mounting carrier 61; the mounting carrier 61 includes a bottom plate 611 and a side wall 612 connected to the bottom plate 611 and partially surrounding the bottom plate 611; the side wall 612 comprises a side wall opening 6121, and a clamping groove 61211 is formed in the edge of the side wall opening 6121; a plurality of insertion holes 6122 are provided at the side wall 612 opposite to the side wall opening 6121; one side of the circuit board 5 is clamped in the clamping groove 61211, and part of the circuit board 5 is attached to the edge of the bottom plate 611 through optical cement; the fiber adapters 3 are disposed in the insertion holes 6122 in a one-to-one correspondence.

In an alternative embodiment, the optical port end 512 of the circuit board 5 is clamped in the clamping groove 61211, so that the circuit board 5 is electrically connected with the light emitting component 1 and the light receiving component 4 respectively, which is beneficial to simplifying the structure of the multi-channel BiDi optical module and improving the integration level of the multi-channel BiDi optical module.

Optionally, as shown in fig. 6, at least one glue containing groove 6111 is provided in the area where the bottom plate 611 is attached to the circuit board 5, so that when part of the circuit board 5 is attached to the edge of the bottom plate 611 through optical glue, the contact area of the optical glue can be increased, so that the attachment of the circuit board 5 to the bottom plate 611 is more stable, and the circuit board 5 and the bottom plate 611 are prevented from running relatively to affect the stability of the electrical connection between the circuit board 5 and the light emitting assembly 1 and the light receiving assembly 4.

Optionally, fig. 7 is a schematic structural diagram of a boss provided by the present utility model, and referring to fig. 2 and fig. 7, the mounting carrier 61 further includes a ceramic spacer 6112 located on the bottom plate 611, and the ceramic spacer 6112 is located on a side of the mounting carrier 61 away from the jack; the laser 11 is fixed on the ceramic pad 6112 by an adhesive.

Specifically, the laser 11 can be electrically connected with the circuit board 5 through gold-plating wires, and because the circuit board 5 has a certain thickness, when the circuit board 5 is clamped in the clamping groove 61211, the circuit board 5 can be higher than the position of the laser 11 for gold-plating wires, the mounting carrier 61 further comprises a ceramic cushion block 6112 positioned on the bottom plate 611, the laser 11 is fixed on the ceramic cushion block 6112 through viscose, so that the ceramic cushion block 6112 can compensate the height of the laser 11, the position of the laser 11 for gold-plating wires is flush with the circuit board 5, and therefore the reliability of the electrical connection between the laser 11 and the circuit board 5 is ensured, and the reliability of the multichannel BiDi optical module is improved.

Optionally, referring to fig. 2 and 7 in combination, the mounting carrier 61 further includes a plurality of pairs of first bosses 6113 located on a side of the ceramic pad 6112 adjacent to the insertion hole 6122; each spectroscope 2 is fixed between each pair of first bosses 6113 in a one-to-one correspondence manner through viscose, so that the installation position of the spectroscope 2 can be rapidly positioned when the multi-channel BiDi optical module is assembled, the assembly is convenient, and meanwhile, the spectroscope 2 can be fixed to the installation carrier 61, and the stability of an optical path is improved.

In an alternative embodiment, the mounting carrier 61 further includes a second boss 6114 located on one side of the ceramic spacer 6112 near the jack 6122, and the horizontal deflection mirrors 41 are fixed to each pair of second bosses in a one-to-one correspondence manner by using an adhesive, so that the mounting position of the horizontal deflection mirrors 41 can be quickly positioned when the multi-channel BiDi optical module is assembled, the assembly is convenient, and meanwhile, the horizontal deflection mirrors 41 can be fixed to the mounting carrier 61, and the stability of the optical path can be improved.

In an alternative embodiment, referring to fig. 5, the package assembly 6 may further include a sealing cover 62, where the sealing cover 62 covers the light port end 512 and the mounting carrier 61, so that the sealing cover 62 forms a sealing space with the mounting carrier 61 and the light port end 512 of the circuit board 5, thereby sealing the light emitting assembly 1, the beam splitter 2, and the light receiving assembly 4.

In another alternative embodiment, the mounting carrier 61 may be made of a metal material with a higher thermal conductivity and a lower thermal expansion coefficient, for example, a tungsten-copper alloy, which is beneficial for heat dissipation on the one hand, and for ensuring the accuracy of signal transmission of the multi-channel BiDi optical module on the other hand, when the continuous operating temperature of the multi-channel BiDi optical module increases, the mounting carrier 61 deforms less.

In yet another alternative embodiment, fig. 8 is an exploded view of a multi-channel BiDi optical module provided in an embodiment of the present utility model, and referring to fig. 8, the multi-channel BiDi optical module provided in the embodiment further includes a housing assembly 7, where the housing assembly 7 includes an upper housing 71 and a lower housing 72, the upper housing 71 and the lower housing 72 are joined to form a cavity, and the circuit board 5 and the package assembly 6 are both at least partially located in the cavity. A heat conductive siliceous material may be disposed between the mounting carrier 61 and the lower housing 72 to rapidly transfer heat generated from the light emitting element 1, the beam splitter 2 and the light receiving element 4 from the mounting carrier 61 to the housing element 7, thereby further improving heat dissipation efficiency.

Based on the same concept, the embodiment of the present utility model further provides an optical fiber communication system, fig. 9 is a schematic structural diagram of the optical fiber communication system provided by the embodiment of the present utility model, fig. 10 is a schematic structural diagram of an optical fiber cable assembly provided by the embodiment of the present utility model, and referring to fig. 8 to 10, the optical fiber communication system includes at least one first BiDi optical module 01 and an optical fiber cable assembly 02; the first BiDi optical module 01 is a multi-channel BiDi optical module provided in any of the above embodiments; the optical fiber cable assembly 02 includes a plurality of optical fibers 021 and a first interface 022; the first interface 022 includes a plurality of first terminals 0221; each first terminal 0221 is connected with one end of each optical fiber 021 in a one-to-one correspondence manner; the fiber adapters 3 of the first BiDi optical module 01 are connected to the first terminals 0221 in a one-to-one correspondence, and the first terminals 0221 are connected to the fiber adapters 3 of the first BiDi optical module 01 in a pluggable manner.

Since the optical fiber communication system in this embodiment may include the multi-channel BiDi optical module provided in any of the foregoing embodiments, and have the corresponding structures and features of the multi-channel BiDi optical module provided in any of the foregoing embodiments, the beneficial effects of the multi-channel BiDi optical module provided in any of the foregoing embodiments can be achieved, and the same points can be described with reference to the foregoing.

Further, the fiber optic cable assembly may also include a plurality of LC interfaces 023; the other end of each optical fiber is respectively connected with a plurality of second BiDi optical modules (not shown in the figure) in a pluggable manner through each LC interface. In this embodiment, the second BiDi optical module is a single-channel BiDi optical module. Therefore, the first multi-channel BiDi optical module 01 can realize bidirectional communication with a plurality of single-channel BiDi optical modules through the optical fiber cable assembly 02, and optical fiber resources are saved.

In another alternative embodiment, fig. 11 is a schematic structural diagram of yet another optical fiber communication system according to an embodiment of the present utility model. Referring to fig. 11, the optical fiber communication system includes a first BiDi optical module 01, an optical fiber cable assembly 02 'and a second BiDi optical module 01'; in this embodiment, the first BiDi optical module 01 and the second BiDi optical module 01 'have substantially the same configuration as the multi-channel BiDi optical module provided in any of the above embodiments, except that the wavelength of the emission beam of the first BiDi optical module 01 is different from the wavelength of the emission beam of the second BiDi optical module 01'. Further, the two ends of the optical fiber cable assembly 02' are in a symmetrical form, that is, the optical fiber cable assembly further comprises a second plug-in interface 024; the second interface 024 includes a plurality of second terminals (not shown in the figure); each second terminal is connected with the other end of each optical fiber 021 in one-to-one correspondence; the optical fiber adapters 3 of the second BiDi optical module 01 'are respectively connected with the second terminals in a one-to-one correspondence manner, and the second terminals are connected with the optical fiber adapters 3 of the second BiDi optical module 01' in a pluggable manner. So that the first BiDi optical module 01 can perform bidirectional communication with the second BiDi optical module 01 'through the optical fiber cable assembly 02'.

The above embodiments do not limit the scope of the present utility model. It will be apparent to those skilled in the art that various modifications, combinations, sub-combinations and alternatives are possible, depending on design requirements and other factors. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included in the scope of the present utility model.

Claims (11)

1. A multi-channel BiDi optical module comprising:

a plurality of light emitting components sequentially arranged along a first direction; the light emitting assembly provides an emission light beam;

the spectroscopes are respectively arranged in one-to-one correspondence with the light emitting components; the spectroscope comprises a first incidence surface facing one side of the light emitting component and a first reflection surface opposite to the first incidence surface;

the optical fiber adapters are respectively arranged in one-to-one correspondence with the spectroscopes; the emitted light beam exits through the optical fiber adapter, and the received light beam is received through the optical fiber adapter; the spectroscope and the optical fiber adapter are sequentially arranged along the propagation path of the emitted light beam;

the light receiving component is positioned on the reflecting surface side of the spectroscope; the optical fiber adapter, the spectroscope and the light receiving component are sequentially arranged along the propagation path of the received light beam;

the circuit board is respectively and electrically connected with the light emitting component and the light receiving component;

and the light emitting component, the spectroscope and the light receiving component are all accommodated in the packaging component.

2. The multi-channel BiDi optical module of claim 1, wherein the light emitting assembly comprises a laser, a first focusing lens, and an isolator sequentially disposed along a propagation path of the emitted light beam.

3. The multi-channel BiDi optical module of claim 1, wherein the light receiving assembly comprises a horizontal deflection mirror, an upper deflection prism, a plurality of second focusing lenses, a lower deflection prism, a plurality of light receivers and a transimpedance amplifier;

the horizontal deflection mirror comprises a second reflecting surface; the second reflecting surface is parallel to and opposite to the first reflecting surface;

each second focusing lens is arranged in one-to-one correspondence with each spectroscope; each light receiver is arranged in one-to-one correspondence with each second focusing lens;

the transimpedance amplifier comprises a plurality of amplifier channels; each amplifier channel is respectively and electrically connected with the output end of each optical receiver in a one-to-one correspondence manner;

the horizontal deflection mirror, the upper deflection prism, the second focusing lens, the lower deflection prism and the light receiver are sequentially arranged along the propagation path of the received light beam, so that the optical axis of the received light beam is parallel to the optical axis of the emitted light beam.

4. The multi-channel BiDi optical module of claim 2, wherein the package assembly comprises a mounting carrier;

the mounting carrier comprises a bottom plate and a side wall connected with the bottom plate and partially surrounding the bottom plate; the side wall comprises a side wall opening, and a clamping groove is formed in the edge of the side wall opening; a plurality of jacks are arranged at the side wall opposite to the side wall opening;

one side of the circuit board is clamped in the clamping groove, and part of the circuit board is attached to the edge of the bottom plate through optical cement;

the optical fiber adapters are arranged in the jacks in a one-to-one correspondence mode.

5. The multi-channel BiDi optical module of claim 4, wherein the mounting carrier further comprises a ceramic spacer on the bottom plate, and the ceramic spacer is located on a side of the mounting carrier remote from the receptacle;

the laser is fixed on the ceramic cushion block through adhesive; the thickness of the ceramic cushion block is the same as that of the circuit board.

6. The multi-channel BiDi optical module of claim 5, wherein the mounting carrier further comprises a plurality of pairs of first bosses located at one side of the ceramic spacer adjacent to the insertion hole; the spectroscopes are respectively fixed between the first bosses of each pair in a one-to-one correspondence manner through viscose.

7. The multi-channel BiDi optical module of claim 4, wherein the region where the bottom plate is attached to the circuit board is provided with at least one glue groove.

8. An optical fiber communication system, comprising: a first BiDi optical module and a fiber optic cable assembly;

the first BiDi optical module is the multi-channel BiDi optical module of any one of claims 1 to 7;

the optical fiber cable assembly comprises a plurality of optical fibers and a first plug-in interface; the first plug interface comprises a plurality of first terminals; each first terminal is connected with one end of each optical fiber in a one-to-one correspondence manner;

each optical fiber adapter of the first BiDi optical module is connected with each first terminal in a one-to-one correspondence manner, and each first terminal is connected with each optical fiber adapter of the first BiDi optical module in a pluggable manner.

9. The fiber optic communication system of claim 8, further comprising: at least one second BiDi optical module;

the other end of the optical fiber is connected with the second BiDi optical module in a pluggable mode.

10. The fiber optic communication system of claim 9, wherein the fiber optic cable assembly further comprises a plurality of LC interfaces; the second BiDi optical modules are single-channel BiDi optical modules, and the other ends of the optical fibers are connected with the second BiDi optical modules in a pluggable mode through the LC interfaces.

11. The fiber optic communication system of claim 9, wherein the fiber optic cable assembly further comprises a second interface port; the second plug interface comprises a plurality of second terminals; each second terminal is connected with the other end of each optical fiber in one-to-one correspondence;

the second BiDi optical module is identical to the first BiDi optical module; and each optical fiber adapter of the second BiDi optical module is respectively connected with each second terminal in a one-to-one correspondence manner.