CN220315427U - Fixing structure for large-diameter silicon wafer packaging bag - Google Patents
Fixing structure for large-diameter silicon wafer packaging bag Download PDFInfo
- Publication number
- CN220315427U CN220315427U CN202321403161.6U CN202321403161U CN220315427U CN 220315427 U CN220315427 U CN 220315427U CN 202321403161 U CN202321403161 U CN 202321403161U CN 220315427 U CN220315427 U CN 220315427U
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- China
- Prior art keywords
- packaging bag
- edge sealing
- adhesive tape
- silicon wafer
- diameter silicon
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 56
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 39
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 39
- 239000010703 silicon Substances 0.000 title claims abstract description 39
- 238000007789 sealing Methods 0.000 claims abstract description 60
- 239000002390 adhesive tape Substances 0.000 claims abstract description 35
- 238000003825 pressing Methods 0.000 claims abstract description 21
- 238000010030 laminating Methods 0.000 claims abstract description 3
- 230000001360 synchronised effect Effects 0.000 claims description 6
- 238000005096 rolling process Methods 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 description 35
- 238000002360 preparation method Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- Supplying Of Containers To The Packaging Station (AREA)
Abstract
The utility model discloses a large-diameter silicon wafer packaging bag fixing structure, which comprises a packaging station, wherein a wafer box grabbing device, a packaging bag sealing edge guiding device, a packaging bag sealing edge upturning device, a wafer box clamping device and a sealing edge device are arranged corresponding to the packaging station; the edge sealing device comprises an adhesive tape supply device connected to the multi-axis mechanical arm and a sucker module used for adsorbing the adhesive tape and adhering the adhesive tape to the edge, and the sucker module is correspondingly provided with an edge sealing pressing module; the film box grabbing device corresponds to the packaging station to form a film box feeding structure of the external packaging bag; the wrapping bag edge sealing guide device and the wrapping bag edge sealing upturning device correspondingly form an edge sealing and gathering structure; the automatic large-diameter silicon wafer packaging bag edge sealing device is formed by edge sealing and laminating through pressing by the edge sealing pressing module and adsorbing the adhesive tape by the sucking disc module.
Description
Technical Field
The utility model relates to a semiconductor silicon wafer preparation technology and auxiliary equipment for preparing semiconductor silicon wafers, in particular to a large-diameter silicon wafer packaging bag fixing structure.
Background
After the preparation of the large-diameter silicon wafer is completed, the large-diameter silicon wafer needs to be loaded into the wafer box, and after the large-diameter silicon wafer is loaded into the corresponding wafer box, the large-diameter silicon wafer needs to be packaged in the corresponding wafer box so as to be stored or delivered.
At present, the large-diameter silicon wafer packaging bag is packaged corresponding to the wafer box, manual operation is generally adopted, human resources are wasted, the preparation cost of the large-diameter silicon wafer is increased, and meanwhile, the manual packaging efficiency is low, so that the preparation efficiency of the large-diameter silicon wafer is influenced.
Therefore, it is necessary to provide a fixing structure for a large-diameter silicon wafer packaging bag to solve the above-mentioned problems.
Disclosure of Invention
The utility model aims to provide a fixing structure for a large-diameter silicon wafer packaging bag.
The technical proposal is as follows:
the large-diameter silicon wafer packaging bag fixing structure comprises a packaging station, wherein a wafer box grabbing device, a packaging bag sealing edge guiding device, a packaging bag sealing edge upturning device, a wafer box clamping device and a sealing edge device are arranged corresponding to the packaging station;
the edge sealing device comprises an adhesive tape supply device connected to the multi-axis mechanical arm and a sucker module used for adsorbing the adhesive tape and adhering the adhesive tape to the edge, and the sucker module is correspondingly provided with an edge sealing pressing module;
the film box grabbing device corresponds to the packaging station to form a film box feeding structure of the external packaging bag;
the wrapping bag edge sealing guide device and the wrapping bag edge sealing upturning device correspondingly form an edge sealing and gathering structure;
the automatic large-diameter silicon wafer packaging bag edge sealing device is formed by edge sealing and laminating through pressing by the edge sealing pressing module and adsorbing the adhesive tape by the sucking disc module.
Further, the film box grabbing device comprises a grabbing moving part capable of moving in a multi-axis mode, grabbing clamping jaws connected to the grabbing moving part, the grabbing clamping jaws comprise grabbing driving plates, double-side synchronous driving pieces are arranged on the grabbing driving plates, and a group of clamping jaws corresponding to grabbing are formed through driving of the double-side synchronous driving pieces.
Further, the bag edge sealing guide device comprises a guide plate.
Further, the top of the guide plate is curved.
Further, the package bag edge sealing upturning device comprises a rotating piece and an upper turning plate connected with the rotating piece.
Further, the upper turning plate is provided with a rolling bearing to form a turning plate structure for reducing the turning friction on the sealing edge.
Further, the cassette clamping device includes a clamping plate driven by the air cylinder.
Further, the clamping plate is a concave plate body and is matched with the side locating plate of the box side edge locating plate of the packaging bag edge sealing upturning device.
Further, the adhesive tape supply device comprises an adhesive tape supply main body frame, an adhesive tape sleeving wheel, an adhesive tape guiding wheel and an adhesive tape outlet, wherein the adhesive tape sleeving wheel, the adhesive tape guiding wheel and the adhesive tape outlet are arranged on the adhesive tape supply main body frame; and a tape drawing clamping jaw for drawing out the tape is arranged corresponding to the tape outlet.
Further, the suction cup module comprises a suction cup connected to the suction cup lifting driving piece.
Further, the pressing module comprises a pressing plate with a saw-tooth pressing surface.
Compared with the prior art, the automatic large-diameter silicon wafer packaging bag edge sealing equipment disclosed by the utility model has the advantages that the automatic packaging of the wafer box is realized after the large-diameter silicon wafer is loaded into the wafer box, the occupation of manpower resources is reduced, the preparation cost of the large-diameter silicon wafer is reduced, the preparation efficiency of the large-diameter silicon wafer is improved, and the implementation of optimizing the production cost and improving the production efficiency of enterprises is facilitated.
Drawings
Fig. 1 is a schematic structural view of a cassette gripping device of the present utility model.
Fig. 2 is a schematic structural view of the bag edge sealing guide device and the bag edge sealing upturning device of the utility model.
Fig. 3 is a schematic view of the edge banding device of the present utility model.
Fig. 4 is a schematic structural view of the bag edge sealing guide device, the bag edge sealing upturning device and the edge sealing device.
Fig. 5 is a schematic structural view of the tape supply device of the present utility model.
Detailed Description
Examples:
referring to fig. 1 to 5, the embodiment shows a fixing structure for a large-diameter silicon wafer packaging bag, which comprises a packaging station 100, wherein a film box grabbing device 1, a packaging bag edge sealing guiding device 2, a packaging bag edge sealing upturning device 3, a film box clamping device 4 and an edge sealing device 5 are arranged corresponding to the packaging station 100;
the edge sealing device 5 comprises an adhesive tape supply device 6 connected to the multi-axis mechanical arm 50, and a sucker module 7 for adsorbing adhesive tapes and adhering the adhesive tapes by edge sealing, wherein the sucker module is correspondingly provided with an edge sealing pressing module 8;
the film box grabbing device 1 corresponds to the packaging station 100 to form a film box feeding structure of an external package packaging bag;
the wrapping bag edge sealing guide device 2 and the wrapping bag edge sealing upturning device 3 correspondingly form an edge sealing and gathering structure;
the automatic large-diameter silicon wafer packaging bag edge sealing device is formed by pressing through the edge sealing pressing module 8 and adsorbing the adhesive tape through the sucking disc module 7 for edge sealing and bonding.
The film box grabbing device 1 comprises a grabbing moving part 10 capable of moving in a multi-axis manner, grabbing clamping jaws connected to the grabbing moving part 10, wherein the grabbing clamping jaws comprise grabbing driving plates 11, double-side synchronous driving pieces 12 are arranged on the grabbing driving plates 11, and a group of clamping jaws 13 which are correspondingly grabbed are formed through driving of the double-side synchronous driving pieces 12.
The bag edge banding guide 2 includes a guide plate 21.
The top of the guide plate 21 is curved.
The package bag edge banding upturning device 3 comprises a rotating member and an upper turning plate 31 connected with the rotating member.
The upper turning plate 31 is provided with a rolling bearing to form a turning plate structure for reducing the turning friction on the seal edge.
Cassette clamping device 4 includes a clamping plate 40 driven by an air cylinder.
The clamping plate 40 is a concave plate body and is matched with the box side locating plate 32 of the packaging bag edge sealing upturning device 3.
The tape supply device 6 includes a tape supply main body frame 60, a tape housing wheel 61, a tape guide wheel 62, and a tape outlet 63 provided to the tape supply main body frame; and a tape pulling-out jaw for pulling out the tape is provided corresponding to the tape outlet 64.
The suction cup module 7 includes a suction cup 71 connected to the suction cup lifting driving member 70, and the suction cup module is correspondingly provided with an adhesive tape cutter.
The pressing module 8 includes a pressing plate 80 having a serrated pressing surface 81.
Compared with the prior art, the automatic large-diameter silicon wafer packaging bag edge sealing equipment disclosed by the utility model has the advantages that the automatic packaging of the wafer box is realized after the large-diameter silicon wafer is loaded into the wafer box, the occupation of manpower resources is reduced, the preparation cost of the large-diameter silicon wafer is reduced, the preparation efficiency of the large-diameter silicon wafer is improved, and the implementation of optimizing the production cost and improving the production efficiency of enterprises is facilitated.
What has been described above is merely some embodiments of the present utility model. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit of the utility model.
Claims (10)
1. A major diameter silicon chip wrapping bag fixed knot constructs, its characterized in that: the packaging machine comprises a packaging station, wherein a film box grabbing device, a packaging bag edge sealing guide device, a packaging bag edge sealing upturning device, a film box clamping device and an edge sealing device are arranged corresponding to the packaging station;
the edge sealing device comprises an adhesive tape supply device connected to the multi-axis mechanical arm and a sucker module used for adsorbing the adhesive tape and adhering the adhesive tape to the edge, and the sucker module is correspondingly provided with an edge sealing pressing module;
the film box grabbing device corresponds to the packaging station to form a film box feeding structure of the external packaging bag;
the wrapping bag edge sealing guide device and the wrapping bag edge sealing upturning device correspondingly form an edge sealing and gathering structure;
the automatic large-diameter silicon wafer packaging bag edge sealing device is formed by edge sealing and laminating through pressing by the edge sealing pressing module and adsorbing the adhesive tape by the sucking disc module.
2. The large-diameter silicon wafer packaging bag fixing structure according to claim 1, wherein: the film box grabbing device comprises a grabbing moving part capable of moving in a multi-axis manner, grabbing clamping jaws connected to the grabbing moving part, wherein the grabbing clamping jaws comprise grabbing driving plates, double-side synchronous driving pieces are arranged on the grabbing driving plates, and a group of clamping jaws which are correspondingly grabbed are formed through driving of the double-side synchronous driving pieces.
3. The large-diameter silicon wafer packaging bag fixing structure according to claim 2, wherein: the wrapping bag banding guiding device includes the guide board.
4. The large-diameter silicon wafer packaging bag fixing structure according to claim 1, wherein: the top of the guide plate is curved.
5. The large-diameter silicon wafer packaging bag fixing structure according to claim 1, wherein: the edge sealing and upturning device for the packaging bag comprises a rotating piece and an upper turning plate connected to the rotating piece.
6. The large-diameter silicon wafer packaging bag fixing structure according to claim 5, wherein: the upper turning plate is provided with a rolling bearing to form a turning plate structure for reducing the turning friction on the sealing edge.
7. The large-diameter silicon wafer packaging bag fixing structure according to claim 1, wherein: the cassette clamping device includes a clamping plate driven by an air cylinder.
8. The large-diameter silicon wafer packaging bag fixing structure according to claim 7, wherein: the clamping plate is a concave plate body and is matched with a box side locating plate of the packaging bag edge sealing upturning device.
9. The large-diameter silicon wafer packaging bag fixing structure according to claim 1, wherein: the adhesive tape supply device comprises an adhesive tape supply main body frame, an adhesive tape sleeving wheel, an adhesive tape guiding wheel and an adhesive tape outlet, wherein the adhesive tape sleeving wheel, the adhesive tape guiding wheel and the adhesive tape outlet are arranged on the adhesive tape supply main body frame; and a tape drawing clamping jaw for drawing out the tape is arranged corresponding to the tape outlet.
10. The large-diameter silicon wafer packaging bag fixing structure according to claim 1, wherein: the sucker module comprises a sucker connected with the sucker lifting driving piece; the pressing module comprises a pressing plate with a saw-tooth pressing surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321403161.6U CN220315427U (en) | 2023-06-05 | 2023-06-05 | Fixing structure for large-diameter silicon wafer packaging bag |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321403161.6U CN220315427U (en) | 2023-06-05 | 2023-06-05 | Fixing structure for large-diameter silicon wafer packaging bag |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220315427U true CN220315427U (en) | 2024-01-09 |
Family
ID=89408892
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321403161.6U Active CN220315427U (en) | 2023-06-05 | 2023-06-05 | Fixing structure for large-diameter silicon wafer packaging bag |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220315427U (en) |
-
2023
- 2023-06-05 CN CN202321403161.6U patent/CN220315427U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 214200 Dongshen Avenue, Yixing Economic and Technological Development Zone, Wuxi City, Jiangsu Province Patentee after: Zhonghuan Leading Semiconductor Technology Co.,Ltd. Country or region after: China Address before: 214200 Dongshen Avenue, Yixing Economic and Technological Development Zone, Wuxi City, Jiangsu Province Patentee before: Zhonghuan leading semiconductor materials Co.,Ltd. Country or region before: China |
|
| CP03 | Change of name, title or address |