CN220307688U - Liquid cooling heat radiation structure of power supply - Google Patents
Liquid cooling heat radiation structure of power supply Download PDFInfo
- Publication number
- CN220307688U CN220307688U CN202321976581.3U CN202321976581U CN220307688U CN 220307688 U CN220307688 U CN 220307688U CN 202321976581 U CN202321976581 U CN 202321976581U CN 220307688 U CN220307688 U CN 220307688U
- Authority
- CN
- China
- Prior art keywords
- heat exchange
- heat
- power supply
- exchange plate
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 21
- 239000007788 liquid Substances 0.000 title claims abstract description 21
- 230000005855 radiation Effects 0.000 title claims abstract description 4
- 230000017525 heat dissipation Effects 0.000 claims abstract description 23
- 239000003507 refrigerant Substances 0.000 claims abstract description 15
- 238000009434 installation Methods 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 abstract description 17
- 238000009422 external insulation Methods 0.000 abstract description 2
- 239000003990 capacitor Substances 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides a liquid cooling heat dissipation structure of a power supply, which comprises a box body with an inner cavity, wherein a circuit board is arranged in the inner cavity, at least one heat exchange plate is vertically arranged on the circuit board, a refrigerant flow passage with a Tesla valve characteristic is arranged in the heat exchange plate, and heat exchange fins are arranged on the side face of the heat exchange plate. The heat radiation structure has the advantages that: the flow rate of the refrigerant in the heat exchange plate can be accelerated through the refrigerant flow channel in the shape of the Tesla valve, so that the heat exchange is accelerated; the radiator can help the heat dissipation of a heating device with larger volume and external insulation, and directly conduct the heat to the heat exchange plate to exchange heat with the refrigerant; the heat exchange fins and the heat exchange net can effectively enlarge the effective heat exchange area of the liquid cooling heat dissipation structure of the power supply; the height of the radiator and the height of the heat exchange net can be adjusted through the sliding grooves between the heat exchange fins, and the radiator is closer to an uninsulated heating device to help the uninsulated heating device to radiate heat.
Description
Technical Field
The utility model relates to the technical field of power supply manufacturing, in particular to a liquid cooling heat dissipation structure of a power supply.
Background
The circuit board in the power supply is generally provided with a primary EMI filter circuit, a secondary EMI filter circuit, a PFC circuit, a high-voltage filter capacitor, a power topology, a low-voltage filter circuit and other components, and the heating values of heating devices such as an inductance coil, a switch tube, a Schottky tube, a high-voltage filter capacitor and the like in the components are large, so that the design of the power supply can consider the heat dissipation problem.
The common power supply can adopt air cooling to dissipate heat, and a radiating fin is arranged for heating devices such as a switch tube, a Schottky tube and the like. However, air cooling heat dissipation easily causes dust accumulation in the power supply, shortens the service life of the power supply, and has poor heat dissipation effect. Some power supplies are internally provided with liquid cooling heat dissipation structures, such as heat exchange tubes arranged on the inner wall of the power supply, and heat dissipation fins are arranged on the heat exchange tubes, but the heat exchange efficiency of the liquid cooling heat dissipation structures is not high. Therefore, it is necessary to design a heat dissipation structure of a fully enclosed power supply with higher heat dissipation efficiency.
Disclosure of Invention
Aiming at the defects of the background technology, the utility model provides a liquid cooling heat dissipation structure of a power supply, which utilizes water to filter dust in air, and has good filtering effect and low use cost. Is convenient for cleaning.
The utility model provides a liquid cooling heat dissipation structure of a power supply, which comprises a box body with an inner cavity, wherein a circuit board is arranged in the inner cavity, at least one heat exchange plate is vertically arranged on the circuit board, a refrigerant flow passage with a Tesla valve characteristic is arranged in the heat exchange plate, and heat exchange fins are arranged on the side face of the heat exchange plate.
Preferably, the liquid cooling heat dissipation structure of the power supply further comprises a radiator which can be arranged at the top of the heating device, and one side of the radiator is detachably arranged on the side face of the heat exchange plate.
Preferably, the heat exchange fins extend vertically, and a vertically extending chute is arranged between the adjacent pair of heat exchange fins;
the installation surface of the radiator is provided with a radiator slide block sliding along the chute.
Preferably, the liquid cooling heat dissipation structure of the power supply further comprises a heat exchange net which can be installed above the heating device, and a hanging piece for hanging the heat exchange plate is arranged on one side of the heat exchange net.
Preferably, the hanging piece is in a shape like a Chinese character 'ji', and comprises two hanging legs which can slide along the sliding grooves, and the two sides of the heat exchange fins are respectively provided with the heat exchange fins with the sliding grooves.
Preferably, the hanging member having a shape of a Chinese character 'ji' has elasticity. The hanging piece is used for holding the heat exchange plate by elasticity to keep the relative height with the heat exchange plate.
Preferably, the circuit board is provided with jacks, and pins matched with the jacks are arranged at the bottom of the heat exchange board;
the bottom of the heat exchange plate is also provided with a fixed lug plate which is fixedly connected to the circuit board in a threaded manner.
Preferably, the bottom of the radiator is provided with a heat exchange fan.
The beneficial effects of the utility model include: the flow rate of the refrigerant in the heat exchange plate can be accelerated through the refrigerant flow channel in the shape of the Tesla valve, so that the heat exchange is accelerated; the radiator can help the heat dissipation of a heating device with larger volume and external insulation, and directly conduct the heat to the heat exchange plate to exchange heat with the refrigerant; the heat exchange fins and the heat exchange net can effectively enlarge the effective heat exchange area of the liquid cooling heat dissipation structure of the power supply; the height of the radiator and the height of the heat exchange net can be adjusted through the sliding grooves between the heat exchange fins, and the radiator is closer to an uninsulated heating device to help the uninsulated heating device to radiate heat.
Drawings
The utility model is described in detail below with reference to examples and figures, wherein:
fig. 1 is an internal structural view of the power supply of the present utility model.
Fig. 2 is an exploded view of the structure of the power supply of the present utility model.
Fig. 3 is a side view of a heat exchanger plate according to the present utility model.
Fig. 4 is a sectional view of the heat exchange plate of the present utility model.
Fig. 5 is a perspective view of the heat sink of the present utility model.
Fig. 6 is a perspective view of the heat exchange network of the present utility model.
Reference numerals:
1-box, 2-circuit board, 21-jack, 3-heat exchange plate, 31-refrigerant runner, 32-heat exchange fin, 33-inlet, 34-outlet, 35-spout, 36-pin, 37-fixed otic placode, 4-radiator, 41-radiator slider, 5-heat exchange net, 51-pendant, 6-heating device, 7-heat exchange fan.
Detailed Description
In order to make the technical problems, technical schemes and beneficial effects to be solved more clear, the utility model is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.
Thus, reference throughout this specification to one feature will be used in order to describe one embodiment of the utility model, not to imply that each embodiment of the utility model must be in the proper motion. Furthermore, it should be noted that the present specification describes a number of features. Although certain features may be combined together to illustrate a possible system design, such features may be used in other combinations not explicitly described. Thus, unless otherwise indicated, the illustrated combinations are not intended to be limiting.
The principles of the present utility model are described in detail below with reference to the drawings and examples.
The utility model provides a liquid cooling heat dissipation structure of a power supply, which is shown in fig. 1-6, and comprises a box body 1 (a top cover is not shown) with an inner cavity, a circuit board 2 is arranged in the inner cavity, two heat exchange plates 3 are vertically arranged on the circuit board 2 at intervals, a refrigerant flow channel 31 with a Tesla valve characteristic is distributed in the heat exchange plates 3, and heat exchange fins 32 are distributed on two side surfaces of the heat exchange plates 3. The tesla valve adopts a special loop design, when fluid passes through the tesla valve in the forward direction, the fluid can be divided into two paths at each loop port, and then the two paths of fluid can be converged at the next junction port, and acceleration is realized. The flow rate of the refrigerant in the heat exchange plate 3 can be increased by the tesla valve-shaped refrigerant flow passage 31, and heat exchange can be accelerated. In addition, the heat exchange fins 32 can enlarge the effective heat exchange area of the heat exchange plate 3. The liquid inlet 33 and the liquid outlet 34 of the refrigerant flow channel 31 are positioned on the side surface of the heat exchange plate 3 and extend out of the box body 1 to be connected with an external refrigerant pipeline.
In this embodiment, the liquid cooling structure of the power supply further includes a radiator 4 that can be mounted on the top of the heat generating device, and one side of the radiator 4 is detachably mounted on the side surface of the heat exchange plate 3. The heat sink 4 may help surface-insulated, bulky heat-generating devices 6 to dissipate heat, such as high voltage filter capacitors, inductors with insulating housings on top, switching tubes, and schottky tubes. For the heat generating devices 6 without insulating housing on the top, the heat sink 4 can also be adjusted to a position above the heat generating devices 6 with a short distance for heat exchange.
In this embodiment, the heat exchange fins 32 extend vertically, a vertically extending chute 35 is provided between the adjacent pair of heat exchange fins 32, and a radiator slider 41 sliding along the chute 35 is provided on the mounting surface of the radiator 4. Accordingly, the heat sink 4 can be adjusted in height by sliding the heat sink slider 41 up and down the slide groove 35.
In this embodiment, the liquid cooling structure of the power supply further includes a heat exchange network 5 that can be installed above the heating device; one side of the heat exchange net 5 is provided with a hanging piece 51 for hanging the heat exchange plate 3. The hanging piece 51 is in a shape like a Chinese character 'ji', and comprises two hanging legs which can slide along the sliding groove 35, and the two sides of the heat exchange fin 32 are respectively provided with the heat exchange fin 32 with the sliding groove 35. The hanging piece 51 has elasticity, and the hanging piece 51 is used for clamping the heat exchange plate 3 through the hanging leg elasticity to keep the relative height with the heat exchange plate 3.
The heat exchange net 5 is used for helping the heat dissipation of the heat-generating device 6 with smaller volume. These heat generating devices 6 are typically soldered to the surface of the circuit board 2, and these heat generating devices 6 are typically arranged relatively densely in order to reduce the area occupied by the circuit board 2. The heat exchange network 5 can be adjusted to be above the heating devices 6 and the distance is shortened as far as possible, so that the heat radiated by the heating devices 6 is absorbed by the heat exchange network 5 more quickly. In addition, the contact area between the hanging piece 51 and the heat exchange plate 3 can be increased by the shape of the Chinese character 'ji', and the heat exchange area between the heat exchange net 5 and the heat exchange plate 3 is increased.
In this embodiment, the circuit board 2 is provided with a jack 21, and the bottom of the heat exchange plate 3 is provided with pins 36 matched with the jack 21. The bottom surfaces of the heat exchange fins 32 and the bottom surfaces of the heat exchange plates 3 are positioned on the same plane so as to increase contact surface connection with the heat exchange plates 3 and help the circuit board 2 to cool down. The pins 36 are used for mounting and positioning the heat exchange plate 3, in addition, a gap is usually reserved between the circuit board 2 and the bottom plate of the box body 1, air in the gap is not easy to flow, a large amount of heat can be accumulated, and the pins 36 can extend into the gap to exchange heat with air at the bottom of the circuit board 2. The bottom of the heat exchange plate 3 is also provided with a fixed lug plate 37, a screw hole is formed in the fixed lug plate 37, and the heat exchange plate 3 is fixedly connected to the circuit board 2 through the fixed lug plate 37 in a screwed mode.
In this embodiment, the bottom of the radiator is provided with a heat exchange fan 7. The heat exchange fan 7 can accelerate the heat exchange of the heating device and help the air in the box body 1 to circulate internally so as to accelerate the flow velocity of the air in the box body 1 on the surfaces of the heat exchange plate 3, the heat exchange fins 32, the radiator 4 and the heat exchange net 5 and accelerate the heat dissipation of the circuit board 2 and the heating device 6.
The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the utility model.
Claims (8)
1. The utility model provides a power supply liquid cooling heat radiation structure, includes the box that has the inner chamber, install the circuit board in the inner chamber, its characterized in that, erect on the circuit board and install at least one heat exchange plate, the inside of heat exchange plate has laid the refrigerant runner that has tesla valve characteristic, heat exchange fin has been laid to the side of heat exchange plate.
2. The power supply liquid-cooled heat dissipating structure of claim 1, further comprising a heat sink mountable on top of the heat generating device, wherein one side of the heat sink is removably mounted to a side of the heat exchange plate.
3. The liquid cooling heat dissipation structure of a power supply unit according to claim 2, wherein the heat exchange fins extend vertically, and a vertically extending chute is arranged between the adjacent pair of heat exchange fins;
the installation surface of the radiator is provided with a radiator sliding block sliding along the sliding groove.
4. A power supply liquid-cooled heat sink structure according to claim 3, further comprising a heat exchange mesh mountable over the heat generating device; one side of the heat exchange net is provided with a hanging piece for hanging the heat exchange plate.
5. The liquid cooling and heat dissipating structure of claim 4, wherein the hanging member is shaped like a Chinese character 'ji', and comprises two hanging legs which can slide along the sliding groove, and the two sides of the heat exchanging fin are respectively provided with the heat exchanging fin with the sliding groove.
6. The liquid-cooled heat dissipating structure of claim 5, wherein the hanging member having a shape of a Chinese character 'ji' has elasticity, and the hanging member maintains a relative height with the heat exchange plate by elastically clamping the heat exchange plate.
7. The liquid cooling heat dissipation structure of a power supply device as claimed in claim 1, wherein the circuit board is provided with jacks, and pins matched with the jacks are arranged at the bottom of the heat exchange plate;
the bottom of the heat exchange plate is also provided with a fixed lug plate, and the fixed lug plate is fixed on the circuit board in a threaded manner.
8. The liquid-cooled heat dissipating structure of claim 2, wherein the heat sink has a heat exchange fan at the bottom.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321976581.3U CN220307688U (en) | 2023-07-25 | 2023-07-25 | Liquid cooling heat radiation structure of power supply |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321976581.3U CN220307688U (en) | 2023-07-25 | 2023-07-25 | Liquid cooling heat radiation structure of power supply |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220307688U true CN220307688U (en) | 2024-01-05 |
Family
ID=89344688
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321976581.3U Active CN220307688U (en) | 2023-07-25 | 2023-07-25 | Liquid cooling heat radiation structure of power supply |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220307688U (en) |
-
2023
- 2023-07-25 CN CN202321976581.3U patent/CN220307688U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107906705B (en) | Air conditioner and electrical box thereof | |
| US10696184B2 (en) | Onboard charger heat dissipation | |
| CN202309486U (en) | Frequency converter capable of dissipating heat by using air cooling and water cooling | |
| CN220307688U (en) | Liquid cooling heat radiation structure of power supply | |
| CN212970511U (en) | Electrical equipment applying heat dissipation device | |
| CN212115993U (en) | Heat pipe type temperature control cabinet using heat pipe as heat conducting element | |
| CN219577681U (en) | Heat dissipating device and industrial control device | |
| CN107223009B (en) | Power module and heat dissipation system thereof | |
| CN106937517A (en) | A kind of heat abstractor for rack server chip | |
| CN213811888U (en) | Heat pipe heat exchange device and heat exchange system | |
| CN110582189B (en) | Heat pipe type temperature control cabinet using heat pipe as heat conducting element | |
| CN211457823U (en) | Air conditioner and fin type phase change heat dissipation control box thereof | |
| CN116642224A (en) | Automatically controlled heat radiation structure, air condensing units and air conditioner | |
| CN220359603U (en) | High-efficient heat dissipation passive filter device | |
| CN220307674U (en) | Water cooling structure of power supply module | |
| CN220476189U (en) | Converter and electrical equipment | |
| CN221305738U (en) | Inverter with a power supply | |
| CN217484683U (en) | Water-cooling heat dissipation structure of high-power multi-light unit | |
| CN221228136U (en) | Power converter | |
| CN217427969U (en) | Large-capacity water-cooling frequency converter | |
| CN217086317U (en) | Inductor with good heat dissipation effect | |
| CN216557431U (en) | Air condensing units and air conditioner | |
| CN220457787U (en) | Radiating mechanism and converter | |
| CN110473847A (en) | A kind of flatwise chip radiator suitable for spraying liquid cooled server | |
| CN221225448U (en) | Heat dissipation module and computer device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |