CN220292249U - Circuit board with protection architecture - Google Patents
Circuit board with protection architecture Download PDFInfo
- Publication number
- CN220292249U CN220292249U CN202321929552.1U CN202321929552U CN220292249U CN 220292249 U CN220292249 U CN 220292249U CN 202321929552 U CN202321929552 U CN 202321929552U CN 220292249 U CN220292249 U CN 220292249U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- holes
- substrate
- explosion
- punching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000000758 substrate Substances 0.000 claims abstract description 30
- 239000000835 fiber Substances 0.000 claims abstract description 16
- 239000011229 interlayer Substances 0.000 claims abstract description 15
- 239000010410 layer Substances 0.000 claims abstract 7
- 238000009434 installation Methods 0.000 claims description 8
- 239000003365 glass fiber Substances 0.000 claims description 3
- 230000001681 protective effect Effects 0.000 claims 5
- 238000004080 punching Methods 0.000 abstract description 18
- 230000009172 bursting Effects 0.000 abstract description 5
- 238000005520 cutting process Methods 0.000 description 4
- 239000011148 porous material Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
The utility model discloses a circuit board with a protection structure, which relates to the technical field of circuit boards and comprises a substrate, wherein the top of the substrate is fixedly connected with a wire guide plate, the top of the wire guide plate is fixedly connected with a top layer plate, a fiber interlayer is fixedly connected inside the substrate, the top of the substrate is provided with a plurality of through holes, the top of the top layer plate is provided with a mounting area, and the top of the top layer plate is provided with a plurality of explosion-proof holes; according to the technical scheme provided by the utility model, the fiber interlayer and the through holes are formed in the substrate, the explosion-proof holes are formed around the mounting area, when the mounting area is punched, the explosion-proof holes are used for dispersing the punching pressure of the punching edge, and then the triangular through holes formed in the substrate are used for punching the substrate, so that the contact area between the punching edge and the substrate can be reduced, the downward punching can be more easily performed, the punching stress is reduced, the circuit board is prevented from bursting, and the protection of the circuit board is realized.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to a circuit board with a protection structure.
Background
The names of the circuit boards are: ceramic circuit boards, alumina ceramic circuit boards, aluminum nitride ceramic circuit boards, PCB boards, aluminum substrates, high frequency boards, thick copper plates, impedance boards, PCBs, ultra-thin circuit boards, printed (copper etching technology) circuit boards, and the like. The circuit board enables the circuit to be miniaturized and visualized, and plays an important role in mass production of fixed circuits and optimization of the layout of electrical appliances. At present, when the circuit board is stamped in an installation area, because the pressure of equipment is large, the circuit board lacks a protection structure and has small stress area, and the circuit board can be burst and damaged due to the fact that stamping stress is concentrated.
Disclosure of Invention
The utility model aims to solve the technical problems that the circuit board with the protection structure is provided for overcoming the defects of the prior art, and the circuit board is used for solving the problems that the stress concentration and burst damage are caused when the circuit board is stamped due to the fact that the circuit board lacks a protection structure and has small stress area because the pressure of equipment is large when the circuit board in the prior art is stamped in a mounting area.
In view of the above, the utility model provides a circuit board with a protection structure, which comprises a substrate, wherein the top of the substrate is fixedly connected with a wire guide plate, the top of the wire guide plate is fixedly connected with a top plate, the inside of the substrate is fixedly connected with a fiber interlayer, the top of the substrate is provided with a plurality of through holes, the top of the top plate is provided with a mounting area, and the top of the top plate is provided with a plurality of explosion-proof holes.
Furthermore, grooves are formed in two sides of the wire guide plate, and a plurality of fine holes are formed in the inner side of each groove.
Further, the fiber interlayer is made of glass fibers, and the thickness of the fiber interlayer is 0.1-0.3mm.
Further, the through holes are triangular in shape, and the through holes are arranged on the top of the substrate in an array mode.
Further, explosion-proof holes are formed in the outer side of the installation area, and the explosion-proof holes penetrate through the bottoms of the base plate and the wire guide plate respectively.
Further, one end of the fine hole is arranged at the top of the through hole, and the fine hole is communicated with the through hole.
From the above technical solutions, the embodiment of the present utility model has the following advantages:
1. according to the circuit board with the protection structure, the fiber interlayer and the through holes are formed in the base plate, the explosion-proof holes are formed in the periphery of the installation area, when the installation area is punched with the installation groove, the explosion-proof holes are used for dispersing the punching pressure of the punching edge, then the triangular through holes formed in the base plate are used for punching the base plate, so that the contact area between the punching edge and the base plate can be reduced, the downward punching can be carried out more easily, the punching stress is reduced, the circuit board is prevented from bursting, and the protection of the circuit board is finally realized.
2. According to the circuit board with the protection structure, the grooves and the fine holes are formed in the wire guide plate, the fine holes are communicated with the through holes, and when the circuit board is heated by mounting components, heat can be discharged through the fine holes and the through holes, so that local heating expansion can be prevented from bursting.
3. According to the circuit board with the protection structure, the fiber interlayer and the triangular through holes are arranged in the substrate, the toughness of the substrate is enhanced by the fiber interlayer, the strength of the substrate can be ensured by the triangular through holes by using the triangular stability, and meanwhile, the contact surface when the front face of the circuit board presses the mounting groove is reduced.
Drawings
The utility model is further described with reference to the accompanying drawings:
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is an exploded view of the structure of the present utility model;
fig. 3 is a side partial cross-sectional view of the present utility model.
Reference numerals illustrate: 1. a substrate; 101. a fiber interlayer; 102. a through hole; 2. a wire guide plate; 201. a groove; 202. fine pores; 3. a top plate; 4. an installation area; 401. explosion-proof hole.
Detailed Description
The technical solutions of the embodiments of the present utility model will be explained and illustrated below with reference to the drawings of the embodiments of the present utility model, but the following embodiments are only preferred embodiments of the present utility model, and not all embodiments. Based on the examples in the implementation manner, other examples obtained by a person skilled in the art without making creative efforts fall within the protection scope of the present utility model.
A circuit board with a protection structure according to an embodiment of the present utility model is described in detail below with reference to the accompanying drawings.
Examples
In order to facilitate understanding, referring to fig. 1 to 3, an embodiment of a circuit board with a protection structure provided by the present utility model includes a circuit board with a protection structure, including a substrate 1, a wire board 2 is fixedly connected to the top of the substrate 1, a top board 3 is fixedly connected to the top of the wire board 2, a fiber interlayer 101 is fixedly connected to the inside of the substrate 1, a plurality of through holes 102 are formed in the top of the substrate 1, a mounting area 4 is provided in the top of the top board 3, a plurality of explosion-proof holes 401 are formed in the top of the top board 3, the fiber interlayer 101 is made of glass fibers, and the thickness of the fiber interlayer 101 is 0.1-0.3mm.
It should be noted that, the wire guide plate 2 is used for arranging the circuit wires of the circuit board, the top plate 3 is used for separating components and wires, the fiber interlayer 101 can improve the toughness of the substrate 1, can prevent the substrate 1 from bursting and breaking during punching, the through hole 102 is formed, when the punching tool is provided with the mounting groove, the contact area between the cutting edge and the substrate 1 is reduced when the cutting edge is punched on the surface of the substrate 1, the stress during punching is reduced, and further the bursting caused by punching can be prevented, and the function of the explosion-proof hole 401 is the same as that of the through hole 102.
In some embodiments, grooves 201 are formed on two sides of the wire guide plate 2, a plurality of pores 202 are formed on the inner side of the grooves 201, one end of each pore 202 is formed on the top of the corresponding through hole 102, and the pores 202 are communicated with the through hole 102.
When the purpose of forming the holes 202 and the grooves 201 is to form, a moisture absorption phenomenon occurs in the water washing treatment process in the production process of the circuit board, and heat can be discharged when the circuit board is heated by using the holes 202 and the grooves 201, so that local heating, expansion and burst can be prevented when the welding components are assembled.
In some embodiments, the through holes 102 are triangular in shape, and the through holes 102 are arranged in an array on top of the substrate 1.
The triangular through-holes 102 can reduce the contact surface when the mounting groove is punched on the front surface while ensuring the strength of the substrate 1 by the triangular stability.
In some embodiments, the explosion-proof hole 401 is formed outside the mounting area 4, and the explosion-proof hole 401 penetrates through the bottoms of the substrate 1 and the wire guide plate 2, respectively, and it should be noted that the purpose of this arrangement can reduce the punching stress of the punching mounting groove as much as possible, and prevent the explosion.
Working principle: when the circuit board is used, the circuit board is placed in the stamping position of the mounting groove stamping equipment, the mounting groove is stamped by the stamping equipment, the explosion-proof hole 401 and the through hole 102 are utilized by the stamping knife in the stamping process, when the circuit board is contacted, the position of the opening is not contacted with the cutting edge, the contact area between the cutting edge and the board body is reduced, the stress during stamping is reduced, the breakage and burst phenomenon can be prevented from occurring during stamping, then when the working procedures such as welding of assembly elements are performed, heat can be removed when the circuit board is heated by utilizing the fine holes 202 and the grooves 201, and then the local heating expansion burst during the assembly of welding elements can be prevented.
The above embodiments are merely for illustrating the technical solution of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the corresponding technical solutions.
Claims (6)
1. A circuit board with protection architecture, characterized in that: including base plate (1), base plate (1) top fixedly connected with wire guide (2), wire guide (2) top fixedly connected with top layer board (3), inside fixedly connected with fibre intermediate layer (101) of base plate (1), a plurality of through-holes (102) have been seted up at base plate (1) top, top layer board (3) top is provided with installation zone (4), a plurality of explosion-proof holes (401) have been seted up at top layer board (3) top.
2. The circuit board with protective structure of claim 1, wherein: grooves (201) are formed in two sides of the wire guide plate (2), and a plurality of fine holes (202) are formed in the inner side of the grooves (201).
3. The circuit board with protective structure of claim 1, wherein: the fiber interlayer (101) is made of glass fibers, and the thickness of the fiber interlayer (101) is 0.1-0.3mm.
4. The circuit board with protective structure of claim 1, wherein: the through holes (102) are triangular, and the through holes (102) are arranged at the top of the substrate (1) in an array mode.
5. The circuit board with protective structure of claim 1, wherein: the explosion-proof hole (401) is formed in the outer side of the installation area (4), and the explosion-proof hole (401) penetrates through the bottoms of the base plate (1) and the wire guide plate (2) respectively.
6. A circuit board with a protective structure according to claim 2, characterized in that: one end of the fine hole (202) is arranged at the top of the through hole (102), and the fine hole (202) is communicated with the through hole (102).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321929552.1U CN220292249U (en) | 2023-07-21 | 2023-07-21 | Circuit board with protection architecture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321929552.1U CN220292249U (en) | 2023-07-21 | 2023-07-21 | Circuit board with protection architecture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220292249U true CN220292249U (en) | 2024-01-02 |
Family
ID=89328437
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321929552.1U Active CN220292249U (en) | 2023-07-21 | 2023-07-21 | Circuit board with protection architecture |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220292249U (en) |
-
2023
- 2023-07-21 CN CN202321929552.1U patent/CN220292249U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |