CN113993290B - Method for manufacturing metal-based printed board - Google Patents
Method for manufacturing metal-based printed board Download PDFInfo
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- CN113993290B CN113993290B CN202111228905.0A CN202111228905A CN113993290B CN 113993290 B CN113993290 B CN 113993290B CN 202111228905 A CN202111228905 A CN 202111228905A CN 113993290 B CN113993290 B CN 113993290B
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- printed board
- milling
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- 239000002184 metal Substances 0.000 title claims abstract description 147
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 147
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 35
- 238000000034 method Methods 0.000 title claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 112
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 87
- 229910052802 copper Inorganic materials 0.000 claims abstract description 80
- 239000010949 copper Substances 0.000 claims abstract description 80
- 238000003801 milling Methods 0.000 claims abstract description 45
- 238000009713 electroplating Methods 0.000 claims abstract description 25
- 238000007747 plating Methods 0.000 claims abstract description 25
- 238000005530 etching Methods 0.000 claims abstract description 17
- 238000007790 scraping Methods 0.000 claims abstract description 13
- 238000000151 deposition Methods 0.000 claims abstract description 11
- 230000008021 deposition Effects 0.000 claims abstract description 10
- 239000011889 copper foil Substances 0.000 claims description 33
- 239000011347 resin Substances 0.000 claims description 23
- 229920005989 resin Polymers 0.000 claims description 23
- 238000005553 drilling Methods 0.000 claims description 15
- 238000004891 communication Methods 0.000 claims description 14
- 238000010030 laminating Methods 0.000 claims description 11
- 230000001681 protective effect Effects 0.000 claims description 11
- 238000003698 laser cutting Methods 0.000 claims description 4
- 230000009286 beneficial effect Effects 0.000 abstract description 8
- 230000017525 heat dissipation Effects 0.000 abstract description 7
- 238000005260 corrosion Methods 0.000 abstract description 6
- 230000007797 corrosion Effects 0.000 abstract description 6
- 238000003825 pressing Methods 0.000 abstract description 3
- 230000000694 effects Effects 0.000 description 9
- 238000009413 insulation Methods 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 5
- 238000003475 lamination Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000000608 laser ablation Methods 0.000 description 3
- 239000011800 void material Substances 0.000 description 3
- 230000003749 cleanliness Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009172 bursting Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
Abstract
The invention relates to the field of printed circuit board manufacturing, and provides a metal-based printed board manufacturing method which comprises the steps of pressing a board, milling a groove, carrying out copper deposition electroplating, tinning, resisting corrosion, scraping a tin groove and etching tin. In the milling groove blank milling step, milling grooves and blank milling are carried out on a non-work plate area except for the bordering edges of the work plate area so as to expose the mounting side wall of the work plate area; in the copper deposition electroplating step, electroplating to form an electroplated copper layer on the mounting side wall; plating a first tin layer on the electroplated copper layer in a tin plating resist step; in the step of scraping the tin stripping groove, scraping the tin stripping groove on the first tin layer to expose an electroplated copper layer area corresponding to the tin stripping groove, wherein the tin stripping groove is arranged between the positive electrode area and the negative electrode area; in the etching stripping step, the electroplated copper layer region corresponding to the stripping groove is etched first, and then the first tin layer is removed. The manufacturing method of the metal-based printed board can manufacture the metal-based printed board which has high heat dissipation, is suitable for flat mounting and vertical mounting of components and parts, occupies small space and is beneficial to miniaturization.
Description
Technical Field
The invention belongs to the technical field of printed circuit board manufacturing, and particularly relates to a manufacturing method of a metal-based printed board.
Background
The metal-based printed board is widely used in electronic devices such as mobile phones due to its good heat dissipation performance. However, as the functions of electronic devices increase, more components are required to be integrated on the metal-based printed board. In order to compress the occupied space of the metal-based printed board, the components are mounted horizontally, and the vertical mounting of part of the components is innovatively considered in the related industry. Therefore, how to manufacture a metal-based printed board suitable for vertical mounting of components becomes a technical problem to be solved in industry.
Disclosure of Invention
The embodiment of the invention aims to provide a method for manufacturing a metal-based printed board, which is suitable for vertical mounting of components.
In order to achieve the above purpose, the invention adopts the following technical scheme: a manufacturing method of a metal-based printed board comprises the following steps:
the method comprises the steps of laminating a plate, preparing copper foil, an insulating medium layer and a metal base which are sequentially laminated from top to bottom, and laminating to form a laminated blank plate, wherein the laminated blank plate is provided with at least one working plate area and a non-working plate area positioned outside each working plate area, and each working plate area is provided with a bordering edge, and a negative electrode area and a positive electrode area which are arranged along the bordering edge;
milling a groove for blank, namely milling the groove for blank areas except for the bordering edges of the working plate areas so as to expose the mounting side walls of the working plate areas;
copper deposition electroplating, wherein an electroplated copper layer is formed on the mounting side wall in an electroplating way;
tin plating resists, and plating a first tin layer on the electroplated copper layer;
scraping a tin stripping groove on the first tin layer to expose the electroplated copper layer area corresponding to the tin stripping groove, wherein the tin stripping groove is arranged between the positive electrode area and the negative electrode area and is communicated in the up-down direction;
and etching tin stripping, namely etching the electroplated copper layer region corresponding to the tin stripping groove, and removing the first tin layer.
In one embodiment, after the copper plating step and before the tin plating resist step, the metal-based printed board manufacturing method further includes the steps of:
preparing a circuit, laminating a film positive film on the upper base surface of the copper foil, exposing and developing to form an outer layer circuit on the positive electrode area of the copper foil, and a dry film is made to cover the area outside the outer layer line, wherein the outer layer line is provided with a bonding pad which extends to the bordering edge and is communicated with the electroplated copper layer;
wherein, in the tin plating resist step, a first tin layer is plated on the electroplated copper layer, and a second tin layer is plated on the outer layer circuit;
in the etching tin stripping step, the dry film is firstly removed, then the electroplated copper layer area corresponding to the tin stripping groove and the copper foil area outside the outer layer circuit are etched together, and finally the first tin layer and the second tin layer are removed.
In one embodiment, after the milling groove milling and emptying step and before the copper deposition electroplating step, the metal-based printed board manufacturing method further comprises the following steps:
laser drilling, namely drilling a communication hole which is communicated with the metal base in the positive electrode area of the copper foil;
in the copper deposition electroplating step, an electroplated copper layer is formed on the mounting side wall in an electroplating manner, and the communication holes are filled in an electroplating manner.
In one embodiment, the pore diameter of the communication hole is 0.1-0.15 mm.
In one embodiment, before the laminating the board, the method for manufacturing a metal-based printed board further comprises the steps of:
preparing a metal base, preparing the metal base, forming a plurality of metal blocks arranged along the extending direction of the bordering edge in each working plate area of the metal base through laser cutting, and filling resin between adjacent metal blocks.
In one embodiment, in the step of filling resin between the adjacent metal blocks, a protective film is attached to the lower base surface of the metal base, then the resin is filled between the adjacent metal blocks, the resin is cured, and finally the protective film is torn off.
In one embodiment, the resin is filled between adjacent metal blocks by a vacuum screen printer and cured by a vacuum press.
In one embodiment, the width of the interval between adjacent metal blocks is 0.2-0.4 mm.
In one embodiment, in the scraping tin-stripping step, the tin-stripping groove is scraped on the first tin layer by a drill, wherein the diameter of the drill is smaller than the diameter of a milling cutter used in the milling groove milling step.
In one embodiment, the diameter of the drill is 0.1mm smaller than the diameter of the milling cutter used in the milling step.
The beneficial effects provided by the invention are as follows:
according to the manufacturing method of the metal-based printed board, after the step of laminating the board, the follow-up mounting side wall of each working board area, which is suitable for vertical mounting of components, is exposed through the step of milling the groove and blank; electroplating the mounting side wall to form an electroplated copper layer through a copper deposition electroplating step, so that the components mounted on the electroplated copper layer can be electrically conducted with an outer layer circuit on the copper foil; then, through the steps of tin plating corrosion resistance, tin scraping and tin etching, an open circuit is etched in the area between the anode area and the cathode area corresponding to the electroplated copper layer, so that the anode area and the cathode area are electrically disconnected, insulation is kept, and different electrical networks are insulated. Based on the above, the metal-based printed board manufacturing method provided by the embodiment of the invention can manufacture the metal-based printed board which has high heat dissipation, is suitable for flat mounting and vertical mounting of components and devices, occupies small space and is beneficial to miniaturization.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a flow chart of a method for manufacturing a metal-based printed board according to an embodiment of the present invention;
FIG. 2 is a top view of a metal base in a metal base preparation step provided in an embodiment of the present invention;
FIG. 3 is a top view of a laminated blank after an etching stripping step according to an embodiment of the present invention;
fig. 4 is a front view of a mounting side wall of a metal-based printed board according to an embodiment of the present invention;
fig. 5 is a cross-sectional view of a metal-based printed board according to an embodiment of the present invention;
fig. 6 is a top view of a metal-based printed board according to an embodiment of the present invention.
Wherein, each reference sign in the figure:
100-pressing blank plates, 101-working plate areas, 1011-bordering edges, 1012-negative electrode areas, 1013-positive electrode areas, 102-non-working plate areas, 1021-milling slots and 1022-drilling tool positions; 110-copper foil, 111-outer layer circuit, 1111-bonding pad, 1112-header, 1113-extension, 112-communication hole; 120-an insulating medium layer; 130-metal base, 131-metal block, 1311-positive electrode block, 1312-negative electrode block, 132-resin; 140-electroplated copper layer, 141-electroplated copper layer region corresponding to the tin stripping groove.
Detailed Description
In order to make the technical problems, technical schemes and beneficial effects to be solved more clear, the invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
In the description of the present invention, it should be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate describing the present invention and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present invention.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present invention, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
In the present invention, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
The following describes in more detail the specific implementation of the present invention in connection with specific embodiments:
referring to fig. 1, an embodiment of the present invention provides a metal-based printed board for manufacturing a metal-based printed board suitable for vertical mounting of components. The metal-based printed board comprises the steps of pressing the board, milling a groove, milling a hole, depositing copper, electroplating, tinning, resisting corrosion, scraping a tin groove, etching and removing tin and the like.
Referring to fig. 2, 3 and 5, in the lamination step, a copper foil 110, an insulating dielectric layer 120 and a metal base 130 are prepared and laminated in order from top to bottom to form a laminated blank 100, wherein the laminated blank 100 has at least one working plate region 101 and a non-working plate region 102 located outside each working plate region 101, and each working plate region 101 has a bordering edge 1011 and a negative electrode region 1012 and a positive electrode region 1013 located along the bordering edge 1011.
It should be noted that, the board surface of the laminated blank board 100 may be divided into one or more working board areas 101 arranged in a matrix array and non-working board areas 102 except for each working board area 101, where each working board area 101 is further divided into a negative electrode area 1012 and a positive electrode area 1013, and the circuits, the bonding pads 1111, the components and the like are all disposed in the positive electrode area 1013 of the working board area 101.
The number of the working board areas 101 arranged on the laminated blank board 100 is planned according to the number of the preset shipment units/finished products of the laminated blank board 100, that is, on the finally manufactured laminated blank board 100, the board cutting can be performed along each working board area 101, so as to obtain the metal-based printed board with the preset shipment unit number.
Specifically, the copper foil 110, the insulating dielectric layer 120, and the positive electrode region 1013 of the metal base 130 are in a vertically corresponding relationship, and the copper foil 110, the insulating dielectric layer 120, and the negative electrode region 1012 of the metal base 130 are also in a vertically corresponding relationship.
It should be noted that at least one prepreg may be laminated on the prepared metal base 130, and then the copper foil 110 may be laminated, so as to form the laminated blank 100, where each prepreg forms the insulating medium layer 120 after lamination.
Wherein, the prepared metal base 130 can be subjected to browning treatment before laminating prepregs so as to remove impurities such as grease on the surface of the metal base 130 and ensure the cleanliness of the metal base 130; the surface of the metal base 130 is roughened, so that the binding force between the metal base 130 and the prepreg in the subsequent lamination is improved, and the risk of layering and bursting of the laminated blank plate 100 can be reduced.
In the milling and blanking step, milling and blanking is performed on the non-work board area 102 except the bordering edge 1011 of the work board area 101 so as to expose the mounting side wall of the work board area 101.
It should be noted that, the milling cutter may be used to void the area (such as milling slot 1021 shown in fig. 3) of the non-work-board area 102 outside the work-board area 101 along the bordering edge 1011 of the work-board area 101, so as to expose the side wall corresponding to the bordering edge 1011 of the work-board area 101 as the subsequent mounting side wall suitable for vertical mounting of the components, and facilitate the subsequent construction of the required power connection relationship corresponding to the positive electrode area 1013 and the negative electrode area 1012.
Based on this step, not only the mounting side wall can be exposed to facilitate the subsequent step to realize the conduction between the mounting side wall and the copper foil 110, but also the problem of burrs of the mounting side wall can be solved, i.e., the processing precision of the mounting side wall can be guaranteed and improved.
Referring to fig. 4, in the copper deposition electroplating step, an electroplated copper layer 140 is formed on the mounting sidewall by electroplating. Based on this step, the electroplated copper layer 140 electrically connected with the copper foil 110 can be formed on the mounting side wall, so that the subsequent components mounted on the electroplated copper layer 140 can be electrically connected with the outer layer circuit 111 on the copper foil 110, and the usability and the function of the components mounted on the electroplated copper layer 140 can be ensured.
However, the electroplated copper layer 140 formed in this step also makes conduction between the positive electrode region 1013 and the negative electrode region 1012, particularly between the positive electrode region 1013 and the negative electrode region 1012 of the metal base 130, and in order to solve this phenomenon, the embodiment is followed by a tin plating resist, a tin stripping bath and an etching tin stripping step.
In the tin plating resist step, a first tin layer (not shown in the drawing) is plated on the electroplated copper layer 140; in the stripping step, a stripping groove (not shown) is scraped on the first tin layer to expose the electroplated copper layer region 141 corresponding to the stripping groove, wherein the stripping groove is arranged between the positive electrode region 1013 and the negative electrode region 1012 and is penetrated in the up-down direction; in the etching stripping step, the electroplated copper layer region 141 corresponding to the stripping groove is etched first, and then the first tin layer is removed.
Based on the above steps, a first tin layer which is fully covered and has corrosion-resistant effect can be plated on the electroplated copper layer 140, then a partial first tin layer is scraped off to form a tin stripping groove, so that corrosion-resistant protection of the electroplated copper layer region 141 corresponding to the tin stripping groove is relieved, then the electroplated copper layer region 141 corresponding to the tin stripping groove can be etched away in a targeted manner during etching, and an open circuit is etched in the region of the electroplated copper layer 140 corresponding to the junction of the positive electrode region 1013 and the negative electrode region 1012, so that the positive electrode region 1013 and the negative electrode region 1012 can be disconnected, insulation between the positive electrode region 1013 and the negative electrode region 1012 is realized, and insulation between different electrical networks is realized. Thus, each functional component can be vertically attached to the corresponding copper electroplating layer 140 area corresponding to the positive electrode area 1013 and the negative electrode area 1012 and the electrical network, so that the performance, the function and the utility of the functional component are ensured.
In summary, after the step of laminating the metal-based printed board, the subsequent mounting side wall of each working board area 101, which is suitable for vertical mounting of components, is exposed through the step of milling a slot and turning the blank; electroplating the surface of the copper foil 110 to form an electroplated copper layer 140 on the surface of the side wall of the mounting part by a copper deposition electroplating step, so that the subsequent components mounted on the electroplated copper layer 140 can be electrically conducted with the outer layer circuit 111 on the copper foil 110; then, through the steps of tin plating corrosion resistance, tin scraping and tin etching, a circuit break is etched in the area between the anode region 1013 and the cathode region 1012 corresponding to the electroplated copper layer 140, so that the anode region 1013 and the cathode region 1012 are electrically disconnected, insulation is maintained, and different electrical networks are insulated. Based on the above, the metal-based printed board provided by the embodiment of the invention can be manufactured, is high in heat dissipation, is suitable for flat mounting and vertical mounting of components, occupies small space and is beneficial to miniaturization.
After the step of laminating the board, and before the step of milling the slot and the step of blank milling, the metal-based printed board further comprises the step of drilling a positioning hole. In the step of drilling the positioning holes, the positioning holes required for the subsequent process are drilled by a target drilling machine.
Referring to fig. 3 and 6, in the present embodiment, after the copper plating step and before the tin plating resist step, the metal-based printed board further includes a circuit preparation step.
In the line preparation step, a film positive is laminated prior to the upper base surface of the copper foil 110, and then exposure and development processes are performed to form an outer layer line 111 exposed at the positive electrode region 1013 of the copper foil 110 and to cover the region outside the outer layer line 111 with a dry film, wherein the outer layer line 111 has a pad 1111 extending to the bordering edge 1011 and being in conduction with the electroplated copper layer 140.
Referring to fig. 4, in the step of tin plating resist, a first tin layer is plated on the electroplated copper layer 140, and a second tin layer (not shown) is plated on the outer layer line 111; in the etching stripping step, the dry film is removed, and then the electroplated copper layer region 141 corresponding to the stripping groove and the copper foil 110 region outside the outer layer circuit 111 are etched together, and finally the first tin layer and the second tin layer are removed.
Here, the shadow region of the film positive corresponds to the outer layer line 111, and the transparent region of the film positive corresponds to a region other than the outer layer line 111. After the exposure treatment, the dry film of the transparent area is irradiated with light to chemically react and harden on the upper base surface of the copper foil 110, and the dry film of the shadow area is not hardened. Subsequently, the dry film which is not hardened can be washed off by a development treatment, and the outer layer line 111 is exposed.
Based on this, when the tin plating resist step is performed, the first tin layer can be plated on the electroplated copper layer 140, and the second tin layer can be plated on the exposed outer layer circuit 111 at the same time, so that the outer layer circuit 111 can be effectively protected in the subsequent process through the second tin layer, and the outer layer circuit 111 can be prevented from being etched.
In this way, in the etching and stripping step, the hardened dry film remaining in the area outside the outer layer circuit 111 is removed, then the electroplated copper layer area 141 corresponding to the stripping groove not covered with the first tin layer and the copper foil 110 area (including the negative electrode area 1012 of the copper foil 110) outside the outer layer circuit 111 not covered with the second tin layer are etched together, finally the first tin layer and the second tin layer are removed, so that the precise outer layer circuit 111 is conveniently manufactured, and the electroplated copper layer 140 part conducted with the outer layer circuit 111 is reserved for vertical mounting of components.
Among them, the outer layer wiring 111 conducts the electroplated copper layer 140 specifically through the bonding pad 1111. Based on this, electrical conduction between the electroplated copper layer 140 and the outer layer line 111 can be conveniently and reliably maintained, and the correlation between the vertical mounted component and the component mounted on the outer layer line 111 can be constructed based on the bonding pad 1111 conducted to the electroplated copper layer 140, thereby being beneficial to guaranteeing the performance and function of the subsequent vertical mounted component on the electroplated copper layer 140.
Wherein the bonding pads 1111, which are in electrical communication with the electroplated copper layer 140, are tangential to the bordering edges 1011, i.e. tangential to the electroplated copper layer 140. Based on this, the level of the boundary between the pad 1111 and the electroplated copper layer 140 can be ensured and improved, so that the risk of burrs occurring at the boundary between the pad 1111 and the electroplated copper layer 140 can be further reduced.
Referring to fig. 4, 5 and 6, the negative electrode region 1012 of the copper foil 110 is etched in the etching-stripping step without covering the second tin layer, and therefore, after the etching-stripping step, a laser ablation step may be provided, in which the negative electrode region 1012 of the insulating dielectric layer 120 may be removed by laser ablation, and the negative electrode region 1012 of the metal base 130 may be exposed. Thus, the negative electrode region 1012 of the exposed metal base 130 can be directly used as the negative electrode of the metal base printed board.
Of course, after the laser ablation step, the metal-based printed board may further include AOI (Automated Optical Inspection, automatic optical inspection), solder mask, character, flying probe test, immersion gold, V-CUT (dicing CUT of edges other than the mounting side walls), routing, finished product cleaning, FQC (Final Quality Control ), package shipment, and the like. The present embodiment is not described in detail herein.
Referring to fig. 3, 4 and 5, in the present embodiment, after the milling and void milling step and before the copper plating step, the metal-based printed board further includes a laser drilling step.
In the laser drilling step, a communication hole 112 is drilled in the positive electrode region 1013 of the copper foil 110 (specifically on the outer layer wiring 111) to (the positive electrode region 1013 of) the metal base 130; in the copper plating step, a plated copper layer 140 is formed on the mounting side wall by plating, and the via 112 is filled by plating.
By adopting the above scheme, the via 112 which is led to (the positive electrode region 1013 of) the metal base 130 along the up-down direction is drilled in the positive electrode region 1013 (the outer layer line 111) of the copper foil 110, and then the via 112 is filled by electroplating while the electroplated copper layer 140 is formed by electroplating, so that conduction and heat conduction between (the positive electrode region 1013 of) the copper foil 110 (the outer layer line 111) and (the positive electrode region 1013 of) the metal base 130 are realized, and the heat dissipation performance of the manufactured metal base printed board can be ensured and improved.
In the present embodiment, the communication hole 112 is provided on the pad 1111 that is in conduction with the electroplated copper layer 140. By this arrangement, conduction and heat conduction between the outer layer line 111 and (the positive electrode region 1013 of) the metal base can be achieved pertinently, and particularly, conduction and heat conduction between the outer layer line 111, the electroplated copper layer 140 and (the positive electrode region 1013 of) the metal base 130 can be achieved through the bonding pad 1111, so that the heat dissipation performance of the manufactured metal base printed board can be further improved.
In the present embodiment, the bonding pad 1111, which is in conduction with the electroplated copper layer 140, has a head portion 1112 far from the electroplated copper layer 140, and an extension portion 1113 connected between the head portion 1112 and the electroplated copper layer 140, the width of the head portion 1112 in the extending direction of the bordering edge 1011 is larger than the width of the extension portion 1113 in the extending direction of the bordering edge 1011, and the communication hole 112 is specifically provided on the head portion 1112. In this way, the head 1112 of the land 1111 can be made to have a sufficient space to provide one or more communication holes 112 while securing and improving the conduction and heat conduction effects of the outer layer wiring 111, the electroplated copper layer 140, and (the positive electrode region 1013 of) the metal base 130 with respect to each other.
Wherein, prior to the laser drilling step, the entire plate may be browned to roughen the upper base surface of the copper foil 110, so as to facilitate energy absorption during the laser drilling step.
Referring to fig. 3, 5 and 6, in the present embodiment, the communication hole 112 is a circular hole, and the aperture of the communication hole 112 is 0.1-0.15 mm.
By adopting the scheme, the electroplating effect of the communication holes 112 can be guaranteed and improved, and the conduction effect and the heat conduction effect between the copper foil 110 (the outer layer circuit 111) and the metal base 130 (the positive electrode region 1013) can be guaranteed and improved, so that the heat dissipation performance of the manufactured metal base printed board can be further improved, and the manufacturing yield of the metal base printed board can be further improved.
Referring to fig. 2 and 5, in the present embodiment, the metal-based printed board further includes a metal-based preparation step before the board is pressed.
In the metal base preparation step, the metal base 130 is prepared, and a plurality of metal blocks 131 arranged along the extending direction of the bordering edge 1011 are formed by laser cutting in each work plate area 101 of the metal base 130, and then the resin 132 is filled between the adjacent metal blocks 131.
Here, the prepared metal base 130 is provided with a plurality of metal blocks 131 in each working plate area 101, wherein the metal blocks 131 corresponding to the negative electrode areas 1012 are negative electrode blocks 1312, the metal blocks 131 corresponding to the remaining positive electrode areas 1013 are positive electrode blocks 1311, and the positive electrode blocks 1311 and the negative electrode blocks 1312 are alternately arranged along the extending direction of the bordering edge 1011. As shown in fig. 2 and 5, the metal base 130 has three metal blocks 131 in each work plate area 101, the middle metal block 131 being a negative electrode block 1312, and the metal blocks 131 on both sides being positive electrode blocks 1311. Based on this, a multi-network design based on each metal block 131 can be facilitated.
Among these, the resin 132 filled between the adjacent metal blocks 131 has effects of connecting the adjacent metal blocks 131 together, insulating the adjacent metal blocks 131 from each other, and conducting heat between the adjacent metal blocks 131.
It should be noted that, in this embodiment, the metal base 130 between the adjacent metal blocks 131 is cut by laser, and compared with the prior art that the metal base 130 between the adjacent metal blocks 131 is milled by a milling machine, the embodiment is more beneficial to miniaturizing and miniaturizing the space between the adjacent metal blocks 131, thereby being beneficial to expanding the occupied space of multiple networks and expanding the wiring space.
Referring to fig. 2 and 5, in the step of filling the resin 132 between the adjacent metal blocks 131 in the present embodiment, a protective film (not shown) is first attached to the lower base surface of the metal base 130, then the resin 132 is filled between the adjacent metal blocks 131, the resin 132 is cured, and finally the protective film is torn off.
It should be noted that, the gap between the adjacent metal blocks 131 is completely penetrated in the vertical direction, and therefore, according to the embodiment, the protective film is attached to the lower base surface of the metal base 130, so that the resin 132 is effectively limited from overflowing downwards during the period from filling between the adjacent metal blocks 131 to curing based on the protective film, so that the filling effect of the resin 132 filled between the adjacent metal blocks 131 is guaranteed and improved, the connection, insulation and heat conduction effects exerted between the adjacent metal blocks 131 by the resin 132 are guaranteed and improved, and the manufacturing yield of the metal base printed board is further improved.
After the step of forming the metal block 131 by laser cutting in each working plate area 101 of the metal base 130 and before the step of attaching the protective film to the lower base surface of the metal base 130, the entire metal base 130 may be subjected to the browning treatment. Based on this, impurities such as grease on the surface of the metal base 130 can be removed, so that the cleanliness of the metal base 130 is ensured; the surface of the metal base 130 may be roughened to improve the bonding force of the subsequent protective film to the metal base 130.
After the "finally tearing off the protective film", the resin 132 on the surface of the metal base 130 may be ground.
Referring to fig. 2 and 5, in the present embodiment, the resin 132 is filled between the adjacent metal blocks 131 by a vacuum screen printer, and the resin 132 is cured by a vacuum press.
By adopting the scheme, the filling effect of the resin 132 filled between the adjacent metal blocks 131 can be improved, and the phenomenon of void caused by uneven gummosis due to the fact that the prepreg gummosis to the gaps between the adjacent metal blocks 131 in the lamination and board making step is avoided. Therefore, by adopting the scheme, the manufacturing yield of the metal-based printed board can be further improved, and the product reliability of the manufactured metal-based printed board can be ensured and improved.
Referring to fig. 2 and 5, in the present embodiment, the width of the space between adjacent metal blocks 131 is 0.2-0.4 mm.
By adopting the scheme, the interval width between the adjacent metal blocks 131 can be ensured to be the micro-spacing, and based on the micro-spacing, the occupied space of the multi-network can be enlarged, and the wiring space can be enlarged.
Referring to fig. 3, in the step of scraping the tin-stripping groove, the tin-stripping groove is scraped on the first tin layer by a drill, wherein the diameter of the drill is smaller than the diameter of the milling cutter used in the step of milling the groove.
Here, by penetrating the drill into the milling groove from top to bottom along the drill position 1022 as shown in the drawing, the stripping of the solder stripping groove on the first solder layer can be achieved, and based on this, the convenience in processing, the processing precision and the processing precision of the solder stripping groove can be improved.
The diameter of the drilling tool is controlled to be smaller than the diameter of the milling cutter used in the milling groove blank milling step, so that the risk that the adjacent working plate area 101 is carelessly damaged by the drilling tool during scraping and withdrawing the tin groove can be effectively reduced, and the manufacturing yield of the metal-based printed board can be further improved.
Referring to fig. 3, in this embodiment, the diameter of the drill is 0.1mm smaller than the diameter of the milling cutter used in the milling step.
By adopting the scheme, the risk that the adjacent working plate areas 101 are carelessly drilled by the drilling tool during scraping and withdrawing the tin bath can be basically avoided, and the manufacturing yield of the metal-based printed board can be further improved.
The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, or alternatives falling within the spirit and principles of the invention.
Claims (9)
1. The manufacturing method of the metal-based printed board is characterized by comprising the following steps of:
the method comprises the steps of laminating a plate, preparing copper foil, an insulating medium layer and a metal base which are sequentially laminated from top to bottom, and laminating to form a laminated blank plate, wherein the laminated blank plate is provided with at least one working plate area and a non-working plate area positioned outside each working plate area, and each working plate area is provided with a bordering edge, and a negative electrode area and a positive electrode area which are arranged along the bordering edge;
milling a groove for blank, namely milling the groove for blank areas except for the bordering edges of the working plate areas so as to expose the mounting side walls of the working plate areas;
copper deposition electroplating, wherein an electroplated copper layer is formed on the mounting side wall in an electroplating way;
tin plating resists, and plating a first tin layer on the electroplated copper layer;
scraping a tin stripping groove on the first tin layer to expose the electroplated copper layer area corresponding to the tin stripping groove, wherein the tin stripping groove is arranged between the positive electrode area and the negative electrode area and is communicated in the up-down direction;
etching tin stripping, namely etching the electroplated copper layer area corresponding to the tin stripping groove, and removing the first tin layer;
after the copper plating step and before the tin plating resist step, the metal-based printed board manufacturing method further includes the steps of:
preparing a circuit, laminating a film positive film on the upper base surface of the copper foil, exposing and developing to form an outer layer circuit on the positive electrode area of the copper foil, and a dry film is made to cover the area outside the outer layer line, wherein the outer layer line is provided with a bonding pad which extends to the bordering edge and is communicated with the electroplated copper layer;
wherein, in the tin plating resist step, a first tin layer is plated on the electroplated copper layer, and a second tin layer is plated on the outer layer circuit;
in the etching tin stripping step, the dry film is firstly removed, then the electroplated copper layer area corresponding to the tin stripping groove and the copper foil area outside the outer layer circuit are etched together, and finally the first tin layer and the second tin layer are removed.
2. The method of manufacturing a metal-based printed board according to claim 1, wherein after the milling groove milling step and before the copper plating step, the method further comprises the steps of:
laser drilling, namely drilling a communication hole which is communicated with the metal base in the positive electrode area of the copper foil;
in the copper deposition electroplating step, an electroplated copper layer is formed on the mounting side wall in an electroplating manner, and the communication holes are filled in an electroplating manner.
3. The method of manufacturing a metal-based printed board as claimed in claim 2, wherein the aperture of the via hole is 0.1 to 0.15mm.
4. The method of manufacturing a metal-based printed board as claimed in claim 1, wherein the method of manufacturing a metal-based printed board further comprises the steps of:
preparing a metal base, preparing the metal base, forming a plurality of metal blocks arranged along the extending direction of the bordering edge in each working plate area of the metal base through laser cutting, and filling resin between adjacent metal blocks.
5. The method of manufacturing a metal-based printed board as claimed in claim 4, wherein in the step of filling resin between adjacent metal blocks, a protective film is attached to a lower base surface of the metal base, the resin is filled between adjacent metal blocks and cured, and the protective film is torn off.
6. The method of manufacturing a metal-based printed board as claimed in claim 5, wherein the resin is filled between adjacent ones of the metal blocks by a vacuum screen printer, and the resin is cured by a vacuum press.
7. The method of manufacturing a metal-based printed board as claimed in claim 4, wherein a width of a space between adjacent metal blocks is 0.2 to 0.4mm.
8. The method of manufacturing a metal-based printed board according to any one of claims 1 to 7, wherein in the scraping and withdrawing tin bath step, the withdrawing tin bath is scraped out on the first tin layer by a drill, wherein a diameter of the drill is smaller than a diameter of a milling cutter used in the milling groove milling step.
9. The method of manufacturing a metal-based printed board as claimed in claim 8, wherein the diameter of the drill is smaller than the diameter of the milling cutter used in the milling step by 0.1mm.
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110996503A (en) * | 2019-12-31 | 2020-04-10 | 四会富仕电子科技股份有限公司 | Manufacturing method of high-heat-dissipation metal substrate |
| CN112351585A (en) * | 2020-09-16 | 2021-02-09 | 东莞康源电子有限公司 | PCB side wall metallization manufacturing method |
| CN112867269A (en) * | 2021-01-06 | 2021-05-28 | 珠海杰赛科技有限公司 | Method for cladding metal on side wall of PCB |
| CN112930024A (en) * | 2021-01-25 | 2021-06-08 | 景旺电子科技(龙川)有限公司 | Metal-based circuit board and manufacturing method thereof |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110996503A (en) * | 2019-12-31 | 2020-04-10 | 四会富仕电子科技股份有限公司 | Manufacturing method of high-heat-dissipation metal substrate |
| CN112351585A (en) * | 2020-09-16 | 2021-02-09 | 东莞康源电子有限公司 | PCB side wall metallization manufacturing method |
| CN112867269A (en) * | 2021-01-06 | 2021-05-28 | 珠海杰赛科技有限公司 | Method for cladding metal on side wall of PCB |
| CN112930024A (en) * | 2021-01-25 | 2021-06-08 | 景旺电子科技(龙川)有限公司 | Metal-based circuit board and manufacturing method thereof |
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