CN220290152U - Low-noise heat dissipation structure for high-power computer - Google Patents
Low-noise heat dissipation structure for high-power computer Download PDFInfo
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- CN220290152U CN220290152U CN202321881748.8U CN202321881748U CN220290152U CN 220290152 U CN220290152 U CN 220290152U CN 202321881748 U CN202321881748 U CN 202321881748U CN 220290152 U CN220290152 U CN 220290152U
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- water tank
- pipe
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 28
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 114
- 239000007788 liquid Substances 0.000 claims abstract description 76
- 238000001816 cooling Methods 0.000 claims abstract description 32
- 238000002347 injection Methods 0.000 claims description 8
- 239000007924 injection Substances 0.000 claims description 8
- 230000005855 radiation Effects 0.000 abstract description 13
- 230000000630 rising effect Effects 0.000 abstract description 4
- 239000000498 cooling water Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 239000000428 dust Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Abstract
The utility model discloses a low-noise heat radiation structure for a high-power computer, which comprises a CPU heat radiation cold head and a GPU heat radiation plate, wherein a first liquid inlet connector and a first liquid outlet connector are arranged on the front side of the CPU heat radiation cold head, and the first liquid inlet connector is matched with a first liquid inlet pipe to be communicated with the water outlet end of a liquid distribution valve; according to the utility model, after the cooled water is circularly injected into the cold water tank for temporary storage, the cooled water is pressurized by the second circulating water pump and is injected into the liquid distribution valve, and then the cooled water is respectively injected into the corresponding CPU heat dissipation cold head and the GPU heat dissipation plate by the first liquid inlet pipe and the second liquid inlet pipe, so that the temperatures of all the CPU chips and the GPU chips are ensured to be consistent, and further, the CPU chips and the GPU chips are ensured to obtain relatively stable cooling efficiency, and the fan rotation speed is prevented from rising due to the high temperature of individual chips, so that the using noise is increased.
Description
Technical Field
The utility model relates to the technical field of computer heat dissipation structures, in particular to a low-noise heat dissipation structure for a high-power computer.
Background
Computer heat dissipation structures refer to a series of components and designs that are used to regulate the internal temperature of a computer to ensure proper functioning of computer components and to prevent overheating. The utility model provides a computer can produce a large amount of heat in the operation in-process, especially CPU, GPU's high performance subassembly, therefore heat radiation structure's design is very important, and reference publication number "CN218848716U", a disclosed "computer machine case heat radiation structure", including A bottom plate, the upper surface fixedly connected with damper of A bottom plate, damper's upper surface fixedly connected with B bottom plate, the middle part joint of B bottom plate upper surface has the box, the both sides of box all articulate through A hinge has filter unit, the upper surface fixedly connected with fan of box, the inside fixedly connected with water-cooling tube of box, the both sides of A bottom plate all fixedly connected with fixed subassembly. This computer machine case heat radiation structure, through damper's setting, in use, if need remove the machine case, can alleviate the range of rocking through damper, can play the effect of protection machine case, through filter assembly's setting, can filter the dust, dual filtration avoids the dust to get into the machine case, causes the short circuit to the internals.
The existing computer heat dissipation structure can be generally divided into air cooling and water cooling, the split type water cooling is a structure based on waterway circulation, a whole set of heat dissipation structure is used for simultaneously dissipating heat of a CPU and a GPU, but the existing split type water cooling structure is generally only provided with a single-stage waterway, namely, when cooling water passes through the CPU and the GPU, the CPU or the GPU at the tail end of the waterway can reduce heat dissipation effect due to rising of water temperature, especially in a high-power computer used by a plurality of GPUs or a plurality of CPUs, the temperature of a single chip is too high, so that the rotating speed of a heat dissipation fan is increased, the whole use noise is increased, and therefore the defects exist in use.
Disclosure of Invention
The utility model aims to provide a low-noise heat dissipation structure for a high-power computer, so as to solve the problems that in the prior art, a split water cooling structure is used at present, and a single-stage waterway is usually only provided, namely, when cooling water passes through a CPU and a GPU, the CPU or the GPU at the tail end of the waterway can reduce the heat dissipation effect due to the rising of water temperature, and especially in a high-power computer used by a plurality of GPUs or a plurality of CPUs, the rotating speed of a heat dissipation fan is increased due to the overhigh temperature of a single chip, and the whole use noise is increased, so that the problem of disadvantages exists in use.
In order to achieve the above purpose, the present utility model provides the following technical solutions:
the low-noise heat radiation structure for the high-power computer comprises a CPU heat radiation cold head and a GPU heat radiation plate, wherein a first liquid inlet connector and a first liquid outlet connector are arranged on the front side of the CPU heat radiation cold head, and the first liquid inlet connector is matched with a first liquid inlet pipe to be communicated with the water outlet end of a liquid distribution valve; the GPU radiating plates are arranged at equal intervals, the bottom of each GPU radiating plate is provided with a second liquid inlet connector and a second liquid outlet connector, and each second liquid inlet connector is respectively matched with a second liquid inlet pipe and connected with a liquid distributing valve; the first liquid outlet connector and the three second liquid inlet connectors are communicated with a liquid outlet pipe, and the tail end of the liquid outlet pipe is connected with one end of the hot water tank; a side shell is arranged on one side of the hot water tank, and an expansion pipe is arranged in the side shell; a first circulating water pump is arranged on one side of the hot water tank, and is matched with a third liquid inlet pipe to be connected with the water inlet end of the first cold row; the first cold drain end is connected with the water inlet end of the second cold drain in a matched mode, and the water outlet end of the second cold drain is connected with the cold water tank in a matched mode; the cold water tank is arranged at the top end of the second circulating water pump, and the second circulating water pump is connected with the water inlet end of the liquid separating valve.
As a further aspect of the utility model: the inside of the hot water tank is communicated with the inside of the side shell, and the inner length of the side shell is larger than the initial length of the expansion pipe.
As a further aspect of the utility model: the expansion pipe is of a corrugated structure, the inside of the expansion pipe is communicated with one end of the side shell, and meanwhile, the joint of the side shell and the expansion pipe is of a hollow structure.
As a further aspect of the utility model: the side of the first cold row, which is far away from the cold water tank, is provided with a first cooling fan, and the first cooling fans are arranged at equal intervals.
As a further aspect of the utility model: the bottom of the second cold row is provided with second cooling fans which are arranged in four at equal intervals.
As a further aspect of the utility model: the top of the cold water tank is communicated with the water injection pipe, and the bottom of the cold water tank is communicated with the top of the second circulating water pump.
Compared with the prior art, the utility model has the beneficial effects that:
1. according to the utility model, the cold water tank and the liquid distribution valve are arranged, after the cooled water is circularly injected into the cold water tank for temporary storage, the cooled water is pressurized by the second circulating water pump and is injected into the liquid distribution valve, and then the cooled water is respectively injected into the corresponding CPU heat dissipation cold head and the GPU heat dissipation plate through the first liquid inlet pipe and the second liquid inlet pipe, so that the temperatures of the contacted cooling water are kept consistent for all CPU and GPU chips, and further, the relatively stable cooling efficiency of all CPU and GPU chips can be ensured, and the fan rotation speed is prevented from rising due to the high temperature of individual chips, so that the using noise is increased.
2. The utility model is provided with the first cold row and the second cold row, the first cold row and the second cold row are respectively matched with the four first cooling fans and the second cooling fans to carry out independent heat dissipation, the first cold row and the second cold row are mutually communicated and can be arranged at two different positions of the chassis, cold air is pumped into the chassis through the second cold row, and then the cold air is discharged through the first cold row, so that a good air duct is formed, and the reduction of air flow noise is facilitated.
3. The utility model is provided with the hot water tank, the side shell and the expansion pipe, because the peak power of the high-power computer can reach 2000W when in use, the high-power computer expands after the water temperature under the load is over-good, and because the internal waterway is closed, the internal space of the hot water tank can be dynamically increased by the self-contraction of the expansion pipe through the expansion pipe with a corrugated shape, so that the pressure in the hot water tank is balanced, the sealing effect of a pipeline is effectively protected, and the use safety is improved.
Drawings
Fig. 1 is a schematic perspective view of the present utility model.
Fig. 2 is a rear view of fig. 1 of the present utility model.
Fig. 3 is a bottom view of fig. 1 of the present utility model.
Fig. 4 is a side view of fig. 1 of the present utility model.
Fig. 5 is an enlarged view of the present utility model at a in fig. 2.
In the figure: the heat-dissipating cold head of the CPU comprises a heat-dissipating cold head of the CPU, a 2-first liquid inlet connector, a 3-first liquid outlet connector, a 4-first liquid inlet pipe, a 5-liquid separating valve, a 6-GPU heat-dissipating plate, a 7-second liquid inlet connector, an 8-second liquid outlet connector, a 9-second liquid inlet pipe, a 10-liquid outlet pipe, an 11-hot water tank, a 12-side shell, a 13-expansion pipe, a 14-first circulating water pump, a 15-third liquid inlet pipe, a 16-first cold row, a 17-first heat-dissipating fan, a 18-water return pipe, a 19-second cold row, a 20-second heat-dissipating fan, a 21-water injection pipe, a 22-cold water tank and a 23-second circulating water pump.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-5, in an embodiment of the present utility model, a low noise heat dissipation structure for a high power computer includes a CPU heat dissipation cold head 1 and a GPU heat dissipation plate 6, wherein a first liquid inlet connector 2 and a first liquid outlet connector 3 are installed on a front side of the CPU heat dissipation cold head 1, and the first liquid inlet connector 2 is matched with a first liquid inlet pipe 4 to be communicated with a water outlet end of a liquid distribution valve 5; three GPU heat dissipation plates 6 are arranged at equal intervals, a second liquid inlet connector 7 and a second liquid outlet connector 8 are arranged at the bottom of each GPU heat dissipation plate 6, and each second liquid inlet connector 7 is respectively matched with a second liquid inlet pipe 9 and connected with a liquid distributing valve 5; the first liquid outlet connector 3 and the three second liquid inlet connectors 7 are communicated with a liquid outlet pipe 10, and the tail end of the liquid outlet pipe 10 is connected with one end of a hot water tank 11; a side shell 12 is arranged on one side of the hot water tank 11, and an expansion pipe 13 is arranged in the side shell 12; a first circulating water pump 14 is arranged on one side of the hot water tank 11, and the first circulating water pump 14 is matched with a third liquid inlet pipe 15 to be connected with the water inlet end of a first cold row 16; the water outlet end of the first cold row 16 is connected with the water inlet end of the second cold row 19 by matching with the water return pipe 18, and the water outlet end of the second cold row 19 is connected with the cold water tank 22 by matching with the water injection pipe 21; the cold water tank 22 is arranged at the top end of the second circulating water pump 23, and the second circulating water pump 23 is connected with the water inlet end of the liquid separating valve 5.
Specifically, the number of the CPU heat-dissipating cold heads 1 and the GPU heat-dissipating plates 6 can be different according to the specification and the requirement of the motherboard.
As a further explanation of the present embodiment, the hot water tank 11 is mounted at the bottom of the cabinet, and when the expansion pipe 13 is broken and leaked, damage to the internal components is less likely to occur.
In this embodiment, the inside of the hot water tank 11 is communicated with the inside of the side case 12, and the inside length of the side case 12 is longer than the initial length of the expansion pipe 13.
Specifically, the hot water collected in the outlet pipe 10 is temporarily stored in the hot water tank 11.
As a further explanation of the present embodiment, the hot water in the hot water tank 11 can freely enter the inside of the side case 12.
In this embodiment, the expansion pipe 13 has a corrugated structure, and the interior of the expansion pipe 13 is connected to one end of the side shell 12, and at the same time, the connection between the side shell 12 and the expansion pipe 13 has a hollow structure.
Specifically, when the internal pressure of the hot water tank 11 and the side case 12 increases, the expansion pipe 13 contracts due to the pressure, and the internal space of the side case 12 increases to balance the internal pressure.
As a further explanation of the present embodiment, when the expansion pipe 13 is contracted, the internal air of the expansion pipe 13 is discharged through the hollowed-out structure.
In this embodiment, the first cooling fan 17 is installed on a side of the first cooling row 16 away from the cooling water tank 22, and four first cooling fans 17 are equally spaced.
Specifically, the first cold row 16 is mounted at the top of the chassis in use.
As a further explanation of the present embodiment, the air inside the cabinet is discharged to the outside through the first cold row 16 by the first heat radiation fan 17.
In this embodiment, the bottom of the second cooling row 19 is provided with the second cooling fans 20, and four second cooling fans 20 are disposed at equal intervals.
In particular, the second cold row 19 is mounted on the front side of the chassis in use.
As a further explanation of the present embodiment, air outside the cabinet is drawn into the interior of the cabinet through the second cold row 19 by the second heat radiation fan 20.
In this embodiment, the top end of the cold water tank 22 is connected to the water injection pipe 21, and the bottom of the cold water tank 22 is connected to the top of the second circulating water pump 23.
Specifically, the water cooled by the second cold row 19 and the first cold row 16 is injected into the cold water tank 22 through the water injection pipe 21 to be temporarily stored.
As a further explanation of the present embodiment, cold water stored inside the cold water tank 22 is drawn into the liquid separation valve 5 by the second circulating water pump 23.
The working principle of the utility model is as follows: when the cooling device is used, an external power supply is connected, the first cooling fan 17, the second cooling fan 20, the first circulating water pump 14 and the second circulating water pump 23 are started at the same time, the first circulating water pump 14 injects cold water stored in the cold water tank 22 into the liquid separating valve 5, then the liquid separating valve 5 is matched with the first liquid inlet pipe 4 and the second liquid inlet pipe 9 respectively to inject into the corresponding CPU cooling head 1 and the GPU cooling plate 6 respectively, cooling water absorbs heat and heats in the process of passing through the CPU cooling head 1 and the GPU cooling plate 6, then the cooling water is intensively injected into the hot water tank 11 through the liquid outlet pipe 10, then the first circulating water pump 14 is matched with the liquid inlet pipe 15 to inject into the second cold row 19, then after the internal circulation of the second cold row 19 is performed, the cold water is injected into the first cold row 16 through the water return pipe 18, then the water is re-injected into the cold water tank 22 through the water injection pipe 21 for storage after the internal circulation of the first cold row 16, in the process, the second fan 20 drives air flow to pass through the second cold row 19 to cool the water in the second cold row 19, and meanwhile the internal circulation of the first cooling water is cooled through the first cooling row 17, and the internal circulation of the cooling water in the first cooling row 16 can be cooled.
It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present utility model may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in detail below, and that the embodiments described in the examples may be combined as appropriate to form other embodiments that will be apparent to those skilled in the art.
Claims (6)
1. A low noise heat dissipation structure for a high power computer, characterized by: the CPU heat dissipation cold head comprises a CPU heat dissipation cold head (1) and a GPU heat dissipation plate (6), wherein a first liquid inlet connector (2) and a first liquid outlet connector (3) are arranged on the front side of the CPU heat dissipation cold head (1), and the first liquid inlet connector (2) is matched with a first liquid inlet pipe (4) to be communicated with the water outlet end of a liquid distribution valve (5); three GPU radiating plates (6) are arranged at equal intervals, a second liquid inlet connector (7) and a second liquid outlet connector (8) are arranged at the bottom of each GPU radiating plate (6), and each second liquid inlet connector (7) is respectively matched with a second liquid inlet pipe (9) and connected with a liquid distributing valve (5); the first liquid outlet connector (3) and the three second liquid inlet connectors (7) are communicated with a liquid outlet pipe (10), and the tail end of the liquid outlet pipe (10) is connected with one end of a hot water tank (11); a side shell (12) is arranged on one side of the hot water tank (11), and an expansion pipe (13) is arranged in the side shell (12); a first circulating water pump (14) is arranged on one side of the hot water tank (11), and the first circulating water pump (14) is matched with a third liquid inlet pipe (15) to be connected with the water inlet end of the first cold row (16); the water outlet end of the second cold row (19) is connected with a water injection pipe (21) and a cold water tank (22); the cold water tank (22) is arranged at the top end of the second circulating water pump (23), and the second circulating water pump (23) is connected with the water inlet end of the liquid separating valve (5).
2. A low noise heat dissipating structure for a high power computer according to claim 1, wherein: the inside of the hot water tank (11) is communicated with the inside of the side shell (12), and the inner length of the side shell (12) is larger than the initial length of the expansion pipe (13).
3. A low noise heat dissipating structure for a high power computer according to claim 1, wherein: the expansion pipe (13) is of a corrugated structure, the inside of the expansion pipe (13) is communicated with one end of the side shell (12), and meanwhile, the joint of the side shell (12) and the expansion pipe (13) is of a hollow structure.
4. A low noise heat dissipating structure for a high power computer according to claim 1, wherein: a first cooling fan (17) is arranged on one side, far away from the cold water tank (22), of the first cold row (16), and four first cooling fans (17) are arranged at equal intervals.
5. A low noise heat dissipating structure for a high power computer according to claim 1, wherein: the bottom of the second cold row (19) is provided with second cooling fans (20), and the second cooling fans (20) are arranged at equal intervals.
6. A low noise heat dissipating structure for a high power computer according to claim 1, wherein: the top of the cold water tank (22) is communicated with the water injection pipe (21), and the bottom of the cold water tank (22) is communicated with the top of the second circulating water pump (23).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321881748.8U CN220290152U (en) | 2023-07-18 | 2023-07-18 | Low-noise heat dissipation structure for high-power computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321881748.8U CN220290152U (en) | 2023-07-18 | 2023-07-18 | Low-noise heat dissipation structure for high-power computer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220290152U true CN220290152U (en) | 2024-01-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321881748.8U Active CN220290152U (en) | 2023-07-18 | 2023-07-18 | Low-noise heat dissipation structure for high-power computer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220290152U (en) |
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2023
- 2023-07-18 CN CN202321881748.8U patent/CN220290152U/en active Active
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