CN220272445U - Transfer robot - Google Patents

Abstract

The utility model discloses a transfer robot which is used for being matched with semiconductor processing equipment to convey a semiconductor sheet assembly, wherein the transfer robot comprises a frame, a clamping mechanism and a driving mechanism, the frame is provided with a first transfer area and a second transfer area, the driving mechanism is arranged on the frame, the driving mechanism is connected with the clamping mechanism and used for driving the clamping mechanism to move, so that the clamping mechanism can be used for conveying the semiconductor sheet assembly to be processed, which is positioned in the first transfer area, into the semiconductor processing equipment, or conveying the processed semiconductor sheet assembly, which is positioned in the semiconductor processing equipment, into the second transfer area. The scheme can solve the problem that the equipment in the related technology has relatively single operation function.

Description

Transfer robot

The present utility model relates to a transfer robot. The application claims priority, and the application number of the prior application is: CN202210900689.8, name: a transfer robot, priority date, 2022-07-28.

Technical Field

The utility model relates to the technical field of transportation equipment, in particular to a transfer robot.

Background

Semiconductors are used as a material between conductors and insulators and have a wide range of applications in various fields, such as crystal bars in the photovoltaic industry. In the production process of semiconductor sheets, the handling of the semiconductor sheets, the feeding of the sheets to be processed to semiconductor process equipment, the blanking of the processed sheets from the semiconductor process equipment, the assembly and handling of the semiconductor sheets and a degumming frame and the like are respectively realized by means of corresponding auxiliary tools, such as a manual feeding and discharging trolley, a degumming frame handling trolley, a semiconductor sheet handling trolley and the like, and various equipment has the problem of relatively single operation function.

Disclosure of Invention

The utility model discloses a transfer robot which aims to solve the problem that equipment in the related technology has relatively single operation function.

In order to solve the technical problems, the utility model is realized as follows:

the application discloses transfer robot for cooperate with semiconductor processing equipment, in order to carry semiconductor sheet subassembly, wherein, transfer robot includes frame, fixture and actuating mechanism, the frame is equipped with first transfer district and second transfer district, actuating mechanism locates the frame, actuating mechanism with fixture connects, is used for the drive fixture motion, so that fixture will be located first transfer district's waiting to process semiconductor sheet subassembly transmits to in the semiconductor processing equipment, perhaps will be located semiconductor processing equipment's processed semiconductor sheet subassembly transmits to the second transfer district.

The technical scheme adopted by the utility model can achieve the following technical effects:

the transfer robot disclosed by the embodiment of the application is arranged to comprise the frame, the clamping mechanism and the driving mechanism, so that the driving mechanism can drive the clamping mechanism to move, the clamping mechanism can transmit the semiconductor wafer assembly to be processed in the first transfer area into semiconductor process equipment, or transmit the processed semiconductor wafer assembly in the semiconductor process equipment into the second transfer area, and therefore the transfer robot can integrate the functions of clamping the semiconductor wafer assembly, bearing the semiconductor wafer assembly, transporting the semiconductor wafer assembly and the like into a whole, and the problem of single operation function caused by the fact that different special tools are needed to be used for clamping the semiconductor wafer assembly, bearing the semiconductor wafer assembly, transporting the semiconductor wafer assembly and the like in the related art can be solved. Moreover, the first transfer area and the second transfer area are arranged through the frame, so that the semiconductor sheet assembly to be processed and the processed semiconductor sheet assembly can be arranged at corresponding positions, and the transfer robot can be arranged in a partitioning manner according to the actual conditions of the semiconductor sheet assembly to be processed and the processed semiconductor sheet assembly.

Drawings

Fig. 1 is a schematic structural diagram of a first transfer robot according to an embodiment of the present disclosure at a first view angle;

fig. 2 is a schematic structural diagram of a first transfer robot according to an embodiment of the present disclosure at a second view angle;

fig. 3 is a schematic structural diagram of a second transfer robot according to an embodiment of the present utility model under a first view angle;

FIG. 4 is a schematic view of a clamping mechanism according to an embodiment of the present utility model extending into a semiconductor processing apparatus;

FIG. 5 is a schematic structural view of a clamping mechanism according to an embodiment of the present utility model;

FIG. 6 is a schematic diagram of the connection of the clamping mechanism to the second bracket;

FIG. 7 is a schematic view of the structure of the arm;

FIG. 8 is a schematic view of a clasping arm clamping semiconductor wafer assembly;

FIG. 9 is a schematic view of a trailing arm dragging a processed semiconductor wafer assembly;

FIG. 10 is a schematic structural view of a semiconductor wafer assembly;

FIG. 11 is a schematic view of the structure of the loading ledges;

fig. 12 is a schematic structural view of a drum assembly and a fixed buffer bracket.

Reference numerals illustrate:

100-frame, 110-first transfer zone, 120-second transfer zone, 130-roller assembly, 131-roller, 140-fixed buffer bracket,

200-clamping mechanism, 210-first driving component, 211-first guide rail, 212-first slide block, 213-first driving source,

220-arm, 221-towing projection, 222-support projection, 223-limit stop, 224-hooking projection, 225-arm body, 226-extension,

310-second drive assembly, 311-second guide rail, 312-second slider, 313-second drive source, 320-third drive assembly, 322-third slider, 323-third drive source,

400-semiconductor wafer assembly, 410-drag fit, 420-hooking flange, 450-semiconductor wafer, 460-wafer pallet,

500-loading rack, 510-hanging fitting part,

700-a second bracket,

800-semiconductor processing equipment,

900-water receiving tank.

Detailed Description

In order to make the objects, technical solutions and advantages of the present utility model more apparent, the technical solutions of the present utility model will be clearly and completely described below with reference to specific embodiments of the present utility model and corresponding drawings. It will be apparent that the described embodiments are only some, but not all, embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

The technical scheme disclosed by each embodiment of the utility model is described in detail below with reference to the accompanying drawings.

Referring to fig. 1-12, a transfer robot is disclosed for use with a semiconductor processing apparatus 800 to transfer a semiconductor wafer assembly 400, which may be a boule, in accordance with an embodiment of the present utility model. For example, the handling robot may transport the ingot to be processed into the semiconductor processing apparatus 800 and take out and transport the ingot processed in the semiconductor processing apparatus 800 to other apparatuses. The semiconductor processing equipment may be a microtome, and the handling robot may transport the ingot to be processed to the microtome for the slicing process.

The transfer robot includes a frame 100, a gripping mechanism 200, and a driving mechanism. The frame 100 is the basis for the installation of the components of the transfer robot, and the frame 100 is provided with a first transfer area 110 and a second transfer area 120, wherein the first transfer area 110 may be an area where the semiconductor wafer assembly 400 to be processed is placed, and the second transfer area 120 may be an area where the processed semiconductor wafer assembly 400 processed from within the semiconductor processing apparatus 800 is placed. The first transfer area 110 may be provided with a fixed buffer support 140, and the semiconductor wafer assembly 400 to be processed may be placed on the fixed buffer support 140.

The driving mechanism is disposed on the frame 100, and is connected to the clamping mechanism 200, for driving the clamping mechanism 200 to move, so that the clamping mechanism 200 transfers the semiconductor wafer assembly 400 to be processed located in the first transfer area 110 into the semiconductor processing apparatus 800, or transfers the processed semiconductor wafer assembly 400 located in the semiconductor processing apparatus 800 into the second transfer area 120.

Specifically, the clamping mechanism 200 may be a link-crossed clamping mechanism 200, in which two crossed links rotate around a connection center to clamp the semiconductor wafer assembly 400 or unclamp the semiconductor wafer assembly 400. The clamping mechanism 200 may also be a straight rod type translational clamping mechanism 200, in which two oppositely disposed straight rods approach or separate from each other to clamp the semiconductor wafer assembly 400 or unclamp the semiconductor wafer assembly 400. Of course, the clamping mechanism 200 may be other types of clamping structures, and is not limited herein.

The driving mechanism may be a hydraulic driving mechanism, an air driving mechanism, an electric driving mechanism, or the like, and is not particularly limited herein.

In a specific implementation process, the handling robot drives the clamping mechanism 200 to transfer the semiconductor wafer assembly 400 to be processed located in the storage area of the semiconductor wafer assembly to be processed to the first transfer area 110 through the driving mechanism, then the handling robot transfers the semiconductor wafer assembly 400 to be processed to the semiconductor processing equipment 800, drives the clamping mechanism 200 to transfer the processed semiconductor wafer assembly 400 located in the semiconductor processing equipment 800 to the second transfer area 120 through the driving mechanism, and then drives the clamping mechanism 200 to transfer the semiconductor wafer assembly 400 to be processed located in the first transfer area 110 to the semiconductor processing equipment 800, thereby completing the blanking of the processed semiconductor wafer assembly 400 and the feeding of the semiconductor wafer assembly 400 to be processed, and then the handling robot transfers the processed semiconductor wafer assembly 400 to a designated area.

By arranging the transfer robot disclosed in the embodiments of the present application to include the frame 100, the clamping mechanism 200 and the driving mechanism, the driving mechanism can drive the clamping mechanism 200 to move, so that the clamping mechanism 200 transfers the semiconductor wafer assembly 400 to be processed located in the first transfer area 110 to the semiconductor processing equipment 800, or transfers the processed semiconductor wafer assembly 400 located in the semiconductor processing equipment 800 to the second transfer area 120, so that the transfer robot can integrate the functions of clamping the semiconductor wafer assembly 400, carrying the semiconductor wafer assembly 400, transporting the semiconductor wafer assembly 400 and the like, thereby solving the problem of single operation function caused by the need of using different special tools for clamping the semiconductor wafer assembly 400, carrying the semiconductor wafer assembly 400, transporting the semiconductor wafer assembly 400 and the like in the related art. Moreover, the first transfer area 110 and the second transfer area 120 are provided through the frame 100, so that the semiconductor wafer assembly 400 to be processed and the processed semiconductor wafer assembly 400 can be provided at the corresponding positions, thereby enabling the transfer robot to be arranged in a partitioned manner according to the actual conditions of the semiconductor wafer assembly 400 to be processed and the processed semiconductor wafer assembly 400.

In particular, the clamping mechanism 200 may include a first drive assembly 210 and two arms 220. The first driving assembly 210 may be disposed on the frame 100, and the two arms 220 may be movably disposed on the frame 100, where the first driving assembly 210 may be connected to at least one of the two arms 220 to drive the two arms 220 to move relatively close to or away from each other. The first driving assembly 210 may be a pneumatic driving assembly, a hydraulic driving assembly, an electric driving assembly, etc., and the first driving assembly 210 is not particularly limited herein. When the first driving assembly 210 is connected to one of the two arms 220, the first driving assembly 210 may drive the one arm 220 connected thereto to move so as to move the two arms 220 toward or away from each other. When the first driving assembly 210 is connected to both arms 220, the first driving assembly 210 may also drive one of the arms 220 to move so as to make the two arms 220 relatively close to or far away from each other, and of course, the first driving assembly 210 may also drive the two arms 220 to move together so as to make the two arms 220 relatively close to or far away from each other. The clamping mechanism 200 is configured to include the first driving assembly 210 and the two arms 220, so that the first driving assembly 210 drives the two arms 220 relatively close to or far away from each other to achieve the clamping function, so that the structure of the clamping mechanism 200 is relatively simple.

The semiconductor wafer assembly 400 is processed in a chamber of the semiconductor processing apparatus 800, in order to facilitate the transfer of the semiconductor wafer assembly 400 to be processed into the chamber by the arm 220 or the removal of the processed semiconductor wafer assembly 400 from the chamber, the arm 220 may include an arm body 225 and an extension 226, one end of the arm body 225 and the extension 226 being connected, the other end of the extension 226 may extend along a side facing away from the arm body 225, the extension 226 may be a rod structure, and the extension 226 may be configured to carry the semiconductor wafer assembly 400 to be processed and the processed semiconductor wafer assembly 400. The end of the extension 226 facing away from the arm body 225 is adapted to extend into the chamber as the arm 220 transfers the semiconductor wafer assembly 400 to be processed into the chamber or as the processed semiconductor wafer assembly 400 is removed from the chamber.

Since the semiconductor wafer assembly 400 is processed in the chamber of the semiconductor processing apparatus 800, when the holding arms 220 are used to remove the processed semiconductor wafer assembly 400 from the chamber, the processed semiconductor wafer assembly 400 needs to be pulled outward by a specific pulling tool for a distance before being held by the two holding arms 220. However, providing the drag tool alone may result in relatively more devices and lower device utilization. In order that the equipment may be reduced and the utilization of the equipment may be improved, optionally, a front end of at least one of the two clasping arms 220 may have a drag protrusion 221, an end of the semiconductor wafer assembly 400 may have a drag engagement portion 410 for engaging with the drag protrusion 221, and the clasping arms 220 may drag the processed semiconductor wafer assembly 400 into and out of the semiconductor process equipment 800 by the engagement of the drag protrusion 221 with the drag engagement portion 410.

Specifically, the drag matching portion 410 may be a ring, a protrusion, a groove, or the like, and when the processed semiconductor wafer assembly 400 needs to be dragged outward from the chamber by a distance, the arm 220 having the drag protrusion 221 may extend into the inner cavity, and the drag protrusion 221 and the drag matching portion 410 drag the processed semiconductor wafer assembly 400 outward by a distance, which is not limited in this application, as long as the semiconductor wafer assembly 400 can be pulled to a position convenient for clamping. When both arms 220 have the drag protrusion 221, the two arms 220 may enter the cavity together, and the drag protrusion 221 of one arm 220 is engaged with the drag engaging portion 410, or, of course, one of the two arms 220 may enter the cavity to engage with the drag engaging portion 410.

Through setting up and dragging protruding 221 for when embracing arm 220 takes out the semiconductor wafer subassembly 400 that has processed from the cavity in, can drag the protruding 221 outside one end distance of dragging of semiconductor wafer subassembly 400 that has processed through embracing arm 220 back, the rethread embraces arm 220 clamp and embraces and take out, thereby no longer use other special drawing tools, thereby make transfer robot's function further promote.

In the related art, the opposite sides of the top of the semiconductor wafer assembly 400 are provided with the hooking flanges 420, thereby facilitating the separate clamping device to clamp the semiconductor wafer assembly 400 in a lap fit with the hooking flanges 420. In order to facilitate gripping of the semiconductor sheet assembly 400 by the handling robot from the hooking flange 420, the gripper arms 220 may optionally have inner side walls, and the inner side walls of the two gripper arms 220 may be disposed opposite each other. The inner sidewall may be provided with support protrusions 222, and opposite sides of the top of the semiconductor wafer assembly 400 may be provided with hooking flanges 420, and when the two arms 220 are relatively close, the support protrusions 222 of the two arms 220 may be correspondingly overlapped with the hooking flanges 420, so that the semiconductor wafer assembly 400 is clamped between the two support protrusions 222. By providing the support protrusions 222 on the clasping arms 220, the support protrusions 222 can be engaged with the hooking flange 420 of the semiconductor sheet assembly 400, thereby allowing the clasping and releasing of the semiconductor sheet assembly 400 by the two clasping arms 220.

In a specific implementation, before the two holding arms 220 clamp the semiconductor wafer assembly 400, the two holding arms 220 are located at two sides of the semiconductor wafer assembly 400 with the hanging flanges 420, and when the two holding arms 220 approach each other, the supporting protrusions 222 on the two holding arms 220 approach each other and are respectively in overlap fit with the corresponding hanging flanges 420, so that the two hanging flanges 420 are hung and supported on the two supporting protrusions 222, and the semiconductor wafer assembly 400 can be clamped and held. With the arms 220 relatively far apart, the support protrusions 222 may be separated from the hooking flanges 420, thereby releasing the semiconductor wafer assembly 400.

In order to prevent the semiconductor wafer assembly 400 from sliding down, if the clamping mechanism 200 is inclined while the two holding arms 220 clamp the semiconductor wafer assembly 400, the semiconductor wafer assembly 400 may easily slide down at the end portions along the extending directions of the two holding arms, and optionally, the front end of at least one of the two holding arms 220 may have a limit stopper 223 for limiting contact with the end surface of the semiconductor wafer assembly 400 when the two holding arms 220 clamp the semiconductor wafer assembly 400, so as to limit the movement of the semiconductor wafer assembly 400 along the end surface direction along which the semiconductor wafer assembly 400 is in limiting contact with the limit stopper 223, and the direction along which the semiconductor wafer assembly 400 moves along the end surface along which the limit stopper 223 is in limiting contact coincides with the extending directions of the two holding arms 220.

By providing the limit stopper 223, when the two holding arms 220 hold the semiconductor sheet assembly 400, the limit stopper 223 is used for being in limit contact with the end face of the semiconductor sheet assembly 400, so that the semiconductor sheet assembly 400 can be limited to move along the direction of the end face of the semiconductor sheet assembly in limit contact with the limit stopper 223, and the semiconductor sheet assembly 400 can be prevented from sliding from the extending directions of the two holding arms 220.

Semiconductor wafer assembly 400 may include a semiconductor wafer 450 and a wafer pallet 460 to which semiconductor wafer 450 may be adhered prior to transfer of semiconductor wafer assembly 400 into semiconductor processing apparatus 800, and in the above embodiments both drag fit 410 and hooking flange 420 may be provided on wafer pallet 460. In some processes, the semiconductor wafer assembly 400 is subjected to a dicing process (i.e., dicing the semiconductor wafer 450 bonded to the wafer pallet 460), such as dicing the ingot in a dicing machine, the semiconductor wafer 450 is bonded to the wafer pallet 460 prior to dicing, each of the diced semiconductor wafer 450 is bonded to the wafer pallet 460, and all of the diced semiconductor wafer units and the wafer pallet 460 together form the processed semiconductor wafer assembly 400, thereby leaving the semiconductor wafer assembly 400 in a processed state. In order to prevent the gripper 220 from scattering the sliced semiconductor wafer assemblies 400 after being transferred to the second transfer area 120, the transfer robot may optionally further include a loading rack 500, where the loading rack 500 may be used to load the processed semiconductor wafer assemblies 400, and the loading rack 500 may be movably disposed in the second transfer area 120. Both holding arms 220 may have a hooking protrusion 224, and the loading bracket 500 may be provided with a hooking engagement portion 510 hooking-engaged with the hooking protrusion 224, and the clamping mechanism 200 may transfer the loading bracket 500 to the second transfer area 120 or from the second transfer area 120 to a designated area outside the second transfer area 120 through the hooking engagement of the hooking protrusion 224 with the hooking engagement portion 510.

The loading rack 500 is a rack capable of protecting the processed semiconductor wafer assembly 400 loaded thereon, for example, the loading rack 500 can prevent the sliced semiconductor wafer 450 loaded thereon from scattering, and its specific structure can be designed accordingly according to the shape of the sliced semiconductor wafer 450. For example, the loading ledges 500 may be a flower basket like structure. In some application scenarios, since the semiconductor wafer 450 is adhered to the wafer pallet 460, after the semiconductor wafer 450 is sliced, the processed semiconductor wafer assembly 400 needs to be degummed, i.e. the glue adhered between the wafer pallet 460 and the semiconductor wafer 450 is removed, and at this time, the two holding arms 220 can be engaged with the engaging portions 510 of the loading rack 500 by the engaging protrusions 224 to transport the loading rack 500 and the processed semiconductor wafer assembly 400 loaded thereon to the degumping device for degumping. The de-bonding process may be performed on the loading ledges 500, during which the loading ledges 500 may limit the diced semiconductor wafer assembly 400 to prevent the diced semiconductor wafer 450 from scattering.

By movably positioning the loading ledges 500 in the second staging area 120, the processed semiconductor wafer assembly 400 may be placed on the loading ledges 500 after the two arms 220 are removed from the semiconductor processing apparatus 800, thereby allowing the loading ledges 500 to secure the processed semiconductor wafer assembly 400. Moreover, the processed semiconductor wafer assembly 400 and the loading bay 500 may also be transferred together from the second transfer section 120 to a processed semiconductor wafer assembly storage or designated area by the snap-fit engagement of the snap-fit protrusions 224 of the two arms 220 with the snap-fit portions 510 of the loading bay 500.

Specifically, the first driving assembly 210 may include a first guide rail 211, a first slider 212 and a first driving source 213, the first guide rail 211 may be mounted on the frame 100, the first slider 212 may be slidably disposed on the first guide rail 211, the arm 220 may be connected with the first slider 212, and the first driving source 213 may be disposed on the frame 100 and connected with at least one of the two arm 220 for driving the two arm 220 to approach or separate from each other. The first driving source 213 is configured to drive the arm 220 connected thereto to move along the first rail 211, so as to drive the two arms 220 toward or away from each other. The first rail 211 may be directly attached to the frame 100 or may be indirectly attached to the frame 100 by other means. The first driving source 213 may be provided directly to the frame 100, or may be connected to the frame 100 by another member.

The embodiment of the application discloses a specific first driving assembly 210, by setting the first driving assembly 210 to include a first guide rail 211, a first slider 212 and a first driving source 213, two holding arms 220 are relatively close to or far away from each other in a sliding fit manner of the first guide rail 211 and the first slider 212 to be more stable.

In order that the two arms 220 may be individually controlled, the first driving assembly 210 may optionally include two first guide rails 211, two first sliders 212, and two first driving sources 213. The two arms 220 may be connected to the two first sliders 212, the two first sliders 212 are slidably engaged with the two first rails 211, and the two first driving sources 213 are connected to the two arms 220. By correspondingly arranging the first guide rail 211, the first slider 212 and the first driving source 213 on the two holding arms 220, the two holding arms 220 can move independently, so that the movement modes of the two holding arms 220 are more flexible.

Specifically, the driving mechanism may include a second driving assembly 310 and a third driving assembly 320, where the second driving assembly 310 and the third driving assembly 320 may be disposed on the frame 100, the second driving assembly 310 and the third driving assembly 320 may be connected to the clamping mechanism 200, the second driving assembly 310 may be used to drive the clamping mechanism 200 to move in a vertical direction, and the third driving assembly 320 may be used to drive the clamping mechanism 200 to move in a first horizontal direction.

By providing the drive mechanism to include the second drive assembly 310 and the third drive assembly 320, such that the second drive assembly 310 may drive the fixture 200 to move in a vertical direction, the third drive assembly 320 may drive the fixture 200 to move in a first horizontal direction, such that the fixture 200 may move in a vertical direction and in a first horizontal direction.

Specifically, the second driving assembly 310 may include a second guide rail 311, a second slider 312, and a second driving source 313, where the second guide rail 311 may be mounted on the frame 100, the second slider 312 may be slidably disposed on the second guide rail 311, the clamping mechanism 200 may be connected with the second slider 312, and the second driving source 313 may be disposed on the frame 100 and connected with the second slider 312, and configured to drive the second slider 312 to drive the clamping mechanism 200 to move along the second guide rail 311, where a moving direction of the second slider 312 along the second guide rail 311 is consistent with a vertical direction. By providing the second driving assembly 310 in a structure including the second guide rail 311, the second slider 312, and the second driving source 313, the movement of the chucking mechanism 200 in the vertical direction is relatively stable.

The handling robot may further include a second support 700, the second support 700 may be connected to the second slider 312, the second slider 312 may drive the second support 700 to move along the second guide rail 311, the third driving assembly 320 may include a third guide rail, a third slider 322 and a third driving source 323, the third guide rail may be mounted on the second support 700, the third slider 322 may be slidably disposed on the third guide rail, the clamping mechanism 200 may be connected to the third slider 322, the third driving source 323 may be disposed on the second support 700 and connected to the clamping mechanism 200, for driving the clamping mechanism 200 to move along the third guide rail along with the third slider 322, where the third slider 322 is consistent with the first horizontal direction along the moving direction of the third guide rail, and the clamping mechanism 200 may drag the processed semiconductor wafer assembly 400 in the first horizontal direction into and out of the semiconductor processing apparatus. By providing the third driving assembly 320 in a structure including the third guide rail, the third slider 322, and the third driving source 323, the movement of the chucking mechanism 200 in the first horizontal direction is relatively stable.

Alternatively, the clamping mechanism 200 may include two arms 220 and a first driving component 210, the first driving component 210 may be disposed on the frame 100, the two arms 220 may be movably disposed on the frame 100, and the first driving component 210 may be connected to at least one of the two arms 220 to drive the two arms 220 to relatively approach or separate, where a moving direction of the two arms 220 that relatively approach or separate is a second horizontal direction, and the second horizontal direction intersects or is different from the first horizontal direction. The first driving assembly 210 drives the two holding arms 220 to relatively approach or separate from each other in the second horizontal direction, and the second horizontal direction intersects or is different from the first horizontal direction, so that the two holding arms 220 can move in the vertical direction, the first horizontal direction and the second horizontal direction.

In some embodiments, the frame 100 includes a frame body, a first support and a second support, where the first support and the second support are movably disposed on the frame body, the support surface of the first support is a first middle transition zone 110, and the support surface of the second support is a second middle transition zone 120. The first support member and the second support member are movable in a horizontal direction along the frame body, for example, in a first horizontal direction and a second horizontal direction, respectively. By arranging the first support and the second support to be movable in the horizontal direction along the frame body, respectively, the position adjustment of the first transfer region 110 and the second transfer region 120 can be facilitated, so that when the transfer robot stops and deviates, the clamping mechanism 200 can accurately place the semiconductor sheet assembly 400 in the first transfer region 110 or the second transfer region 120 and accurately remove the semiconductor sheet assembly 400 from the first transfer region 110 or the second transfer region 120 by adjusting the positions of the first transfer region 110 and the second transfer region 120.

When the clamping mechanism 200 removes the processed semiconductor wafer assembly 400 from the semiconductor processing apparatus 800, the processed semiconductor wafer assembly 400 may be attached with a liquid, for example, slurry water may remain on the sliced semiconductor wafer assembly 400 when the semiconductor wafer assembly 400 is sliced, in order to avoid random dripping of the liquid, the transfer robot may optionally further include a water receiving tank 900, the water receiving tank 900 may be movably disposed in the frame 100, and the water receiving tank 900 may extend out of the frame 100 and move below a moving path of the processed semiconductor wafer assembly 400 during the process of the clamping mechanism 200 removing the processed semiconductor wafer assembly 400 from the semiconductor processing apparatus 800 to collect the dripping liquid, and the water receiving tank 900 may be retracted into the frame 100 when the processed semiconductor wafer assembly 400 is transferred to the second transfer area 120. In embodiments including the loading rack 500, the water receiving tank 900 may be movably provided at the bottom of the loading rack 500, and after the processed semiconductor wafer assembly 400 is transferred to the loading rack 500, the water receiving tank 900 may be provided at the bottom of the loading rack 500, thereby collecting the liquid dropped from the processed semiconductor wafer assembly 400 loaded on the loading rack 500.

By providing the water receiving tank 900, when the clamping mechanism 200 takes the processed semiconductor wafer assembly 400 out of the semiconductor processing apparatus 800, the liquid to which the processed semiconductor wafer assembly 400 is attached is collected by the water receiving tank 900, so that random dripping of the liquid can be avoided.

In order to enable the transfer robot to automatically transfer the semiconductor wafer assembly 400 located at the second transfer zone 120, the transfer robot may optionally further comprise a transfer mechanism. A transfer mechanism may be provided to the frame 100, and the transfer mechanism may be used to transfer the loading ledges 500 of the loaded semiconductor wafer assembly 400 to the second transfer area 120, or to transfer the loading ledges 500 located at the second transfer area 120 to the outside of the second transfer area 120. The drive mechanism may be used to drive movement of the clamping mechanism 200 such that the clamping mechanism 200 transfers the semiconductor wafer assembly 400 to be processed located in the first transfer zone 110 into the semiconductor processing apparatus 800 or transfers the processed semiconductor wafer assembly 400 located in the semiconductor processing apparatus 800 to the loading ledges 500 located in the second transfer zone 120.

When the loading rack 500 without the semiconductor wafer assembly 400 is required to load the processed semiconductor wafer assembly 400, the transfer mechanism may transfer the loading rack 500 without the semiconductor wafer assembly 400 to the second transfer area 120, so that the loading rack 500 waits for the processed semiconductor wafer assembly 400 to be loaded. After the processed semiconductor wafer assembly 400 within the semiconductor processing apparatus 800 is transferred to the loading ledges 500 located at the second transfer zone 120, the transfer mechanism may transfer the loading ledges 500 located at the second transfer zone 120 to the outside of the second transfer zone 120, for example, may transfer the loading ledges 500 located at the second transfer zone 120 to a position corresponding to a microtome located outside the second transfer zone 120.

The transfer robot disclosed in the embodiments of the present application may automatically transfer the loading rack 500 without the semiconductor wafer assembly 400 to the second transfer area 120 and transfer the loading rack 500 with the semiconductor wafer assembly 400 to the outside of the second transfer area 120 by arranging the transfer mechanism on the frame 100, so that the transfer mechanism may transfer the loading rack 500 with the semiconductor wafer assembly 400 to the second transfer area 120 or transfer the loading rack 500 with the semiconductor wafer assembly 400 to the outside of the second transfer area 120, thereby automatically transferring the semiconductor wafer assembly 400 with the transfer robot to the outside of the second transfer area 120.

Specifically, the conveying mechanism may be a conveyor belt, a conveyor chain, a roller assembly, a telescopic fork, etc., for example, after the loading bracket 500 contacts the conveyor belt or the conveyor chain in the process of driving the conveyor belt or the conveyor chain, the loading bracket 500 may move along with the conveyor belt or the conveyor chain under the driving of the conveyor belt or the conveyor chain, so that the loading bracket 500 may be conveyed to the second transfer area 120 or conveyed outside the second transfer area 120.

In another implementation manner, the conveying mechanism may include a roller assembly 130, where the roller assembly 130 may include a plurality of rollers 131 sequentially arranged, and the rollers 131 may be rotatably disposed on the carriage 100 around respective central axes, and the central axes of the plurality of rollers 131 are parallel. The plurality of rollers 131 may be used to be in rolling engagement with the loading ledges 500 to transfer the loading ledges 500 to positions corresponding to the second transfer area 120 and support the loading ledges 500, or to transfer the loading ledges 500 positioned at the second transfer area 120 and supported on the plurality of rollers to the outside of the second transfer area 120.

The transfer robot disclosed in the embodiment of the present application sets the transfer mechanism as the roller assembly 130, so that the rotation of the plurality of rollers 131 of the roller assembly 130 can drive the loading rack 500 to move to the position corresponding to the second transfer area 120, or drive the loading rack 500 to move out of the second transfer area 120.

The plurality of rollers 131 may be independently driven, for example, each roller 131 may be a motorized roller, or each roller 131 may be independently connected to a driving motor. Of course, the plurality of drums 131 may be driven by one driving motor, for example, the plurality of drums 131 may be connected by a transmission belt, a chain, or the like, so that the driving motor may drive the plurality of drums 131 to rotate synchronously by the transmission belt, the chain, or the like.

In an alternative embodiment, the clamping mechanism 200 may be multiple, one of the clamping mechanisms 200 may be used to clamp the semiconductor wafer assembly 400 to be processed and transfer the semiconductor wafer assembly 400 to the semiconductor processing tool 800, and another of the clamping mechanisms 200 may be used to clamp the processed semiconductor wafer assembly 400 and remove the processed semiconductor wafer assembly 400 from the semiconductor processing tool 800. The number of the plurality of clamping mechanisms 200 may be two, three, four, etc., and the embodiments of the present application do not limit the specific number of the clamping mechanisms 200.

The transfer robot disclosed in the embodiments of the present application, by adopting a plurality of independent clamping mechanisms 200, at least some of the plurality of clamping mechanisms 200 can independently clamp the semiconductor wafer assembly 400 to be processed and the processed semiconductor wafer assembly 400, so that the working efficiency of the transfer robot can be improved.

The foregoing embodiments of the present utility model mainly describe differences between the embodiments, and as long as there is no contradiction between different optimization features of the embodiments, the embodiments may be combined to form a better embodiment, and in view of brevity of line text, no further description is provided herein.

The embodiments of the present utility model have been described above with reference to the accompanying drawings, but the present utility model is not limited to the above-described embodiments, which are merely illustrative and not restrictive, and many forms may be made by those having ordinary skill in the art without departing from the spirit of the present utility model and the scope of the claims, which are to be protected by the present utility model.

Claims (15)

1. A transfer robot for cooperation with a semiconductor processing apparatus (800) for transporting a semiconductor wafer assembly (400), wherein the transfer robot comprises a frame (100), a clamping mechanism (200) and a driving mechanism, wherein the frame (100) is provided with a first transfer zone (110) and a second transfer zone (120), the driving mechanism is provided to the frame (100), and the driving mechanism is connected to the clamping mechanism (200) for driving the clamping mechanism (200) to move so that the clamping mechanism (200) transfers the semiconductor wafer assembly (400) to be processed in the first transfer zone (110) into the semiconductor processing apparatus (800) or transfers the processed semiconductor wafer assembly (400) in the semiconductor processing apparatus (800) into the second transfer zone (120).

2. The transfer robot according to claim 1, wherein the clamping mechanism (200) comprises a first driving assembly (210) and two holding arms (220), the first driving assembly (210) is arranged on the frame (100), the two holding arms (220) are movably arranged on the frame (100), and the first driving assembly (210) is connected with at least one of the two holding arms (220) to drive the two holding arms (220) relatively close to or far away from each other.

3. The transfer robot of claim 2, wherein a front end of at least one of the two clasping arms (220) has a drag protrusion (221), an end of the semiconductor wafer assembly (400) has a drag engagement portion (410) for engaging with the drag protrusion (221), and the clasping arm (220) is operable to drag the processed semiconductor wafer assembly (400) into and out of the semiconductor processing apparatus (800) through engagement of the drag protrusion (221) with the drag engagement portion (410).

4. The transfer robot according to claim 2, wherein the holding arms (220) have inner side walls, the inner side walls of the two holding arms (220) are disposed opposite to each other, the inner side walls are provided with support protrusions (222), opposite sides of the top of the semiconductor wafer assembly (400) are provided with hooking flanges (420), and when the two holding arms (220) are relatively close to each other, the support protrusions (222) of the two holding arms (220) can be correspondingly overlapped with the hooking flanges (420) so that the semiconductor wafer assembly (400) is clamped between the two support protrusions (222).

5. The transfer robot of claim 2, wherein a front end of at least one of the two arms (220) has a limit stop (223), the limit stop (223) being for limiting contact with an end face of the semiconductor wafer assembly (400) when the two arms (220) clamp the semiconductor wafer assembly (400).

6. The transfer robot according to claim 2, further comprising a loading rack (500), the loading rack (500) being adapted to load the processed semiconductor wafer assembly (400), the loading rack (500) being movably arranged in the second transfer section (120), the two holding arms (220) each having a hooking protrusion (224), the loading rack (500) being provided with a hooking engagement portion (510) with the hooking protrusions (224), the clamping mechanism (200) transferring the loading rack (500) to the second transfer section (120) or from the second transfer section (120) to outside the second transfer section (120) by means of the hooking engagement of the hooking protrusions (224) with the hooking engagement portion (510).

7. The transfer robot according to claim 2, wherein the first driving assembly (210) comprises a first guide rail (211), a first slider (212) and a first driving source (213), the first guide rail (211) is mounted on the frame (100), the first slider (212) is slidably disposed on the first guide rail (211), the holding arm (220) is connected with the first slider (212), and the first driving source (213) is disposed on the frame (100) and connected with at least one of the two holding arms (220) for driving the two holding arms (220) to approach or separate from each other.

8. The transfer robot according to claim 7, wherein the first driving assembly (210) comprises two first guide rails (211), two first sliders (212) and two first driving sources (213), two holding arms (220) are correspondingly connected with the two first sliders (212), two first sliders (212) are correspondingly in sliding fit with the two first guide rails (211), and two first driving sources (213) are correspondingly connected with the two holding arms (220).

9. The transfer robot according to claim 1, wherein the driving mechanism comprises a second driving assembly (310) and a third driving assembly (320), the second driving assembly (310) and the third driving assembly (320) are both arranged on the frame (100), the second driving assembly (310) and the third driving assembly (320) are both connected with the clamping mechanism (200), the second driving assembly (310) is used for driving the clamping mechanism (200) to move in a vertical direction, and the third driving assembly (320) is used for driving the clamping mechanism (200) to move in a first horizontal direction.

10. The transfer robot according to claim 9, wherein the second driving assembly (310) comprises a second guide rail (311), a second slider (312) and a second driving source (313), the second guide rail (311) is mounted on the frame (100), the second slider (312) is slidably disposed on the second guide rail (311), the clamping mechanism (200) is connected with the second slider (312), and the second driving source (313) is disposed on the frame (100) and connected with the second slider (312) for driving the second slider (312) to drive the clamping mechanism (200) to move along the second guide rail (311), wherein the direction in which the second slider (312) moves along the second guide rail (311) is consistent with the vertical direction.

11. The transfer robot according to claim 10, further comprising a second support (700), wherein the second support (700) is connected to the second slider (312), the second slider (312) is capable of driving the second support (700) to move along the second guide rail (311), the third driving assembly (320) comprises a third guide rail, a third slider (322) and a third driving source (323), the third guide rail is mounted to the second support (700), the third slider (322) is slidably disposed on the third guide rail, the clamping mechanism (200) is connected to the third slider (322), the third driving source (323) is disposed on the second support (700), and is connected to the clamping mechanism (200) for driving the clamping mechanism (200) to move along the third guide rail along the third slider (322), wherein the third slider (322) is disposed along a moving direction of the third guide rail and is in a horizontal direction of the third guide rail, and the clamping mechanism (200) is capable of clamping a semiconductor wafer (400) in a horizontal direction of being processed and carried out by the semiconductor wafer handling device.

12. The transfer robot of claim 1, further comprising a water receiving tank (900), wherein the water receiving tank (900) is movably provided to the frame (100), and wherein the water receiving tank (900) extends out of the frame (100) and moves below a movement path of the processed semiconductor wafer assembly (400) during the process of taking the processed semiconductor wafer assembly (400) out of the semiconductor processing apparatus (800) by the clamping mechanism (200).

13. The transfer robot according to claim 1, further comprising a transfer mechanism provided to the frame (100) for transferring a loading rack (500) loading the semiconductor wafer assembly (400) to the second transfer zone (120) or transferring the loading rack (500) located at the second transfer zone (120) to the outside of the second transfer zone (120);

the drive mechanism is used for driving the clamping mechanism (200) to move so that the clamping mechanism (200) can transmit the semiconductor wafer assembly (400) to be processed in the first transfer zone (110) into the semiconductor process equipment (800) or transmit the processed semiconductor wafer assembly (400) in the semiconductor process equipment (800) to the loading bracket (500) in the second transfer zone (120).

14. The transfer robot of claim 13, wherein the transfer mechanism comprises a roller assembly (130), the roller assembly (130) comprises a plurality of rollers (131) arranged in sequence, the plurality of rollers (131) are used for being in rolling fit with the loading support (500) to transfer the loading support (500) to a position corresponding to the second transfer zone (120) and support the loading support (500), or transfer the loading support (500) located at the second transfer zone (120) and supported on the plurality of rollers (131) outside the second transfer zone (120).

15. The transfer robot of claim 1, wherein the clamping mechanism (200) is a plurality, one of the clamping mechanisms (200) is configured to clamp the semiconductor wafer assembly (400) to be processed and transfer the semiconductor wafer assembly (400) to be processed into the semiconductor processing apparatus (800), and another of the clamping mechanisms (200) is configured to clamp the processed semiconductor wafer assembly (400) and remove the processed semiconductor wafer assembly (400) from the semiconductor processing apparatus (800).