CN220272423U - Particle core removing device of chip - Google Patents

Abstract

The utility model discloses a particle core removing device of a chip, which comprises a workbench, a particle picking mechanism and a driving mechanism, wherein the workbench is used for placing the chip; the grain picking mechanism comprises a substrate, a film feeding structure, a probe and a lifting driving structure, wherein the film feeding structure is arranged on the substrate and used for conveying and removing films, one side of each film removing layer is downwards formed into an adhesive surface, the probe is arranged at the bottom of the substrate in a lifting manner, and the lifting driving structure is used for driving the probe to lift relative to the substrate: the driving mechanism is used for driving the substrate to lift; the lifting driving structure drives the probe to descend so that the probe downwards props to remove the film and form a bonding position, the driving mechanism drives the substrate to drive the bonding position to descend so as to bond the particle core of the chip on the bonding surface, and the driving mechanism drives the substrate to ascend so as to drive the bonding position to ascend so as to bond the particle core from the chip. The particle core removing device of the chip can remove the particle cores from the chip, thereby reducing the cost of personnel and improving the production efficiency.

Description

Particle core removing device of chip

Technical Field

The utility model relates to the field of chip particle core removing equipment, in particular to a particle core removing device for a chip.

Background

After the chips such as the LED chips are subjected to back inspection and AOI inspection (AOl is abbreviated as english Automatic Optical Inspector, and is named as an automatic optical inspection instrument), core particles of a part of the chips are unqualified, and the core particles in the unqualified chips need to be removed before shipment, and at the present stage, a vacuum suction pen or a removing device is generally adopted to remove the core particles. The method has the advantages that the method for removing the core by the vacuum suction pen is adopted, the core to be removed is required to be sucked away by an operator through the vacuum suction pen, the operator can master skills through training, the operation threshold is high, the number of required operators is large, the cost is high, the efficiency is low, the process is greatly influenced by human factors, the operator can be trained through long-time training, and the quality is difficult to control; adopt remove the mode that the device got rid of the grain core, CN216350173U discloses a chip granule detects and bad granule remove device, and through the use of moving mechanism and pushing mechanism, detect the chip granule and get rid of bad chip granule, its structure adopts a large amount of gear structure to carry out the removal of grain core, and the structure is complicated, and equipment cost is high.

Disclosure of Invention

The utility model mainly aims to provide a chip particle core removing device, which aims to solve the technical problems of high equipment and personnel cost in the existing chip particle core removing process.

In order to achieve the above object, the utility model provides a chip removing device for chips, which comprises a workbench, a grain picking mechanism and a driving mechanism, wherein the workbench is used for placing chips, the grain picking mechanism comprises a substrate, a film feeding structure, a probe and a lifting driving structure, the substrate is arranged above the workbench, the film feeding structure is arranged on the substrate and is used for conveying a removing film, a bonding surface is formed on one downward side of the removing film, the probe is positioned above the removing film, the probe is arranged at the bottom of the substrate in a lifting manner, and the lifting driving structure is used for driving the probe to lift relative to the substrate: the driving mechanism is arranged on the workbench and connected with the substrate, and is used for driving the substrate to lift; the lifting driving structure drives the probe to descend so that the probe supports the removing film downwards and forms a bonding position, the driving mechanism drives the substrate to drive the bonding position to descend so that the particle cores of the chips are bonded on the bonding surface, and the driving mechanism drives the substrate to ascend so as to drive the bonding position to ascend so that the particle cores are bonded off the chips.

In an embodiment, the lifting driving structure comprises a lifting assembly and a lifting seat, the lifting seat is connected with the lifting assembly, the probe is installed on the lifting seat, the lifting assembly is used for driving the lifting seat to descend so that the probe supports the removing film downwards and forms the bonding position, or the lifting assembly is used for driving the lifting seat to ascend so that the probe is separated from the removing film.

In an embodiment, an operation area is formed on one side of the substrate, the lifting assembly comprises a first driving piece arranged on one side, away from the operation area, of the substrate, a cam and a follower assembly, the cam is arranged on one side, facing the operation area, of the substrate, the cam is located above the lifting seat and the follower assembly and is connected with the first driving piece, the follower assembly is connected with the lifting seat, the first driving piece drives the cam to rotate, the large end of the cam is enabled to be in butt joint or be out of butt joint with the top end of the follower assembly, an elastic piece is arranged on one side, facing the cam, of the substrate, the upper end of the elastic piece is connected with the substrate, and the lower end of the elastic piece is connected with the follower assembly.

In an embodiment, the follower assembly comprises a cam follower and a mounting seat, a vertically extending sliding rail is formed on one side of the base plate, which faces the operation area, a sliding groove which is in sliding fit with the sliding rail is formed in the mounting seat, the cam follower is connected to the top end of the mounting seat, the lifting seat is connected to the bottom end of the mounting seat, the first driving piece drives the cam to rotate, so that the large end of the cam is in butt joint or separation butt joint with the top end of the cam follower, and the mounting seat is connected with the elastic piece.

In an embodiment, the follower assembly further comprises a first sensor, one end of the first sensor is connected with the mounting seat, and the other end of the first sensor is connected with the lifting seat; the second sensor is installed towards one side of the cam on the base plate, and an induction probe used for inducing by the second sensor is connected to the outer wall of the cam.

In an embodiment, send the membrane structure to include second driving piece, receive membrane roll and unreel the membrane roll, receive the membrane roll with unreel the membrane roll interval install in the base plate is towards one side of operation district, the probe is located receive the membrane roll with unreel between the membrane roll, get rid of the both ends of membrane and roll up respectively and locate receive the membrane roll with unreel the membrane roll, the second driving piece drive receive the membrane roll and rotate, so that receive the membrane roll with unreel the membrane roll cooperation is carried get rid of the membrane.

In an embodiment, send membrane structure still includes two leading wheels and two supporting wheels, one of them the leading wheel corresponds receive the membrane roll setting, another the leading wheel corresponds the setting of unreeling the membrane roll, two the supporting wheel interval set up in two between the leading wheel, the probe is located two between the supporting wheel, get rid of the membrane around locating two the leading wheel with two the outer wall surface of supporting wheel, and two the bottom parallel and level of supporting wheel.

In an embodiment, the particle core removing device of the chip further comprises a coding disc, the coding disc and the film collecting roll are coaxially arranged and located between the film collecting roll and the substrate, a third sensor is installed on one side, facing the coding disc, of the substrate, and a plurality of signal detection grooves used for being sensed by the third sensor are formed in the coding disc in a circumferential spacing mode.

In an embodiment, the driving mechanism includes an X-axis driving module, a Y-axis driving module and a Z-axis driving module, where the Y-axis driving module is mounted on the workbench and is used to drive the X-axis driving module and the Z-axis driving module to move along the Y-axis, the X-axis driving module is used to drive the Z-axis driving module to move along the X-axis, and the Z-axis driving module is connected with the substrate and is used to drive the substrate to lift.

In an embodiment, the device for removing the particle core of the chip further comprises a vision mechanism, wherein the vision mechanism comprises a camera, the camera is installed above the workbench, and a lens of the camera is arranged opposite to the probe.

According to the technical scheme, in the process of working, the lifting driving structure drives the probe to descend, the probe is located above the removing film, after the probe descends, the probe can be abutted against the removing film and press the removing film downwards, the removing film forms a bonding position after being pressed downwards by the probe, the driving mechanism drives the substrate connected with the probe to descend, after the substrate descends, the driving mechanism drives the bonding position to descend so that the bonding position is bonded with the particle core on the chip, then the driving mechanism drives the substrate to ascend, the substrate ascends and then drives the bonding position to ascend, the bonding position bonds the particle core on the chip, the lifting driving piece drives the probe to ascend, the film conveying structure conveys the removing film, so that the removing film moves and replaces a new removing film, the removal of the particle core on the chip is completed in a reciprocating mode, the removing efficiency is high, the cost of people is reduced, the structure of the particle core removing device of the chip is simplified, and the equipment cost is reduced.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of a chip removing apparatus according to an embodiment of the present utility model;

FIG. 2 is a schematic diagram of a structure of a picking mechanism and a driving mechanism according to an embodiment of the present utility model;

FIG. 3 is a schematic diagram of another structure of the picking mechanism and the driving mechanism according to an embodiment of the present utility model;

FIG. 4 is a schematic diagram showing a structure of a probe contacting a core according to an embodiment of the present utility model;

FIG. 5 is a schematic view of a particle picking mechanism according to an embodiment of the present utility model;

FIG. 6 is a schematic diagram of a lifting driving structure according to an embodiment of the present utility model;

FIG. 7 is a schematic cross-sectional view of a lift driving structure according to an embodiment of the present utility model;

FIG. 8 is a schematic diagram of a driving mechanism according to an embodiment of the present utility model;

fig. 9 is a schematic cross-sectional view of a driving mechanism according to an embodiment of the utility model.

Reference numerals illustrate:

the achievement of the objects, functional features and advantages of the present utility model will be further described with reference to the accompanying drawings, in conjunction with the embodiments.

Detailed Description

The technical solutions of the present embodiment will be clearly and completely described below with reference to the drawings in the present embodiment, and it is apparent that the described embodiments are only some embodiments of the present utility model, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Furthermore, descriptions such as those referred to as "first," "second," and the like, are provided for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implying an order of magnitude of the indicated technical features in the present disclosure. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present utility model, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.

In the present utility model, unless specifically stated and limited otherwise, the terms "connected," "affixed," and the like are to be construed broadly, and for example, "affixed" may be a fixed connection, a removable connection, or an integral body; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

In addition, the technical solutions of the embodiments of the present utility model may be combined with each other, but it is necessary to be based on the fact that those skilled in the art can implement the technical solutions, and when the technical solutions are contradictory or cannot be implemented, the combination of the technical solutions should be considered as not existing, and not falling within the scope of protection claimed by the present utility model. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.

After the chips such as the LED chips are subjected to back inspection and AOI inspection (AOl is abbreviated as english Automatic Optical Inspector, and is named as an automatic optical inspection instrument), core particles of a part of the chips are unqualified, and the core particles in the unqualified chips need to be removed before shipment, and at the present stage, a vacuum suction pen or a removing device is generally adopted to remove the core particles. The method has the advantages that the method for removing the core by the vacuum suction pen is adopted, the core to be removed is required to be sucked away by an operator through the vacuum suction pen, the operator can master skills through training, the operation threshold is high, the number of required operators is large, the cost is high, the efficiency is low, the process is greatly influenced by human factors, the operator can be trained through long-time training, and the quality is difficult to control; the utility model discloses a chip particle detection and bad particle removal device, which adopts a mode of removing a particle core by a removal device, CN216350173U, and detects chip particles and removes bad chip particles by using a moving mechanism and a pushing mechanism.

Referring to fig. 1 to 5, a chip removing apparatus 100 according to the present utility model includes a table 1, a picking mechanism 2 and a driving mechanism 3, wherein the table 1 is used for placing a chip 5, the picking mechanism 2 includes a substrate 21, a film feeding structure, a probe 23 and a lifting driving structure 24, the substrate 21 is disposed above the table 1, the film feeding structure is mounted on the substrate 21 and is used for conveying a removing film 25, a bonding surface 251 is formed on a downward side of the removing film 25, the probe 23 is located above the removing film 25, the probe 23 is disposed at a bottom of the substrate 21 in a liftable manner, and the lifting driving structure 24 is used for driving the probe 23 to lift relative to the substrate 21: the driving mechanism 3 is installed on the workbench 1 and connected with the substrate 21, and the driving mechanism 3 is used for driving the substrate 21 to lift; the lifting driving structure 24 drives the probe 23 to descend so that the probe 23 supports the removing film 25 downwards to form a bonding position 2511, the driving mechanism 3 drives the substrate 21 to drive the bonding position 2511 to descend so as to bond the particle cores 51 of the chips 5 on the bonding surface 251, and the driving mechanism 3 drives the substrate 21 to ascend so as to drive the bonding position 2511 to ascend so as to bond the particle cores 51 of the chips 5.

In the technical solution of this embodiment, the chip 5 is placed on top of the workbench 1, the workbench 1 in this embodiment may be composed of a base 11 and a supporting frame 12, the top of the base 11 is provided with a tray 111, the chip 5 is loaded on the tray 111, wherein the supporting frame 12 may include a supporting plate 121 and supporting legs 122 which are mutually connected, the supporting legs 122 are supported on the base 11, the supporting plate 121 is transversely provided with a through hole 1221, the transverse direction is the x direction shown in fig. 1, the vertical direction is the z direction, the through hole 1221 is arranged corresponding to the tray 111, and the granule picking mechanism 2 and the driving mechanism 3 are both supported above the supporting plate 121, so that the supporting plate 121 supports the granule picking mechanism 2 and the driving mechanism 3, and the granule picking mechanism 2 and the supporting mechanism are supported above the workbench 1.

Further, in the chip core removing device 100, during operation, the lifting driving structure 24 drives the probe 23 to descend, the probe 23 is located above the removing film 25, after the probe 23 descends, the probe 23 can be abutted against the removing film 25 and press down the removing film 25, after the removing film 25 is pressed down by the probe 23, the removing film 25 forms a bonding position 2511, the driving mechanism 3 drives the substrate 21 connected with the removing film to descend, after the substrate 21 descends, the bonding position 2511 is driven to descend, so that the bonding position 2511 is bonded with the core 51 on the chip 5, after that, the driving mechanism 3 drives the substrate 21 to ascend, the substrate 21 ascends, the bonding position 2511 is driven to ascend, the bonding position 2511 is used for bonding the core 51 on the chip 5, the lifting driving member drives the probe 23 to ascend, and the film feeding structure is used for conveying the removing film 25, so that the removing film 25 moves and replaces the new removing film 25, and the chip core 51 on the chip 5 is removed in a bonding mode, the structure of the chip core removing device 100 is simplified, and the equipment cost is reduced.

Furthermore, the cores 51 on the chip 5 are all supported by a blue film, and the cores 51 are adhered to the chip 5 by the adhesion of the blue film, so that the adhesive surface 251 of the removing film 25 in this embodiment may be coated with a highly adhesive back adhesive, wherein the back adhesive may be a 3M600 test adhesive tape, and in other embodiments, a back adhesive with a viscosity greater than 10N/25mm may be used.

Referring to fig. 6 and 7, in an embodiment, the lift driving structure 24 includes a lift assembly 241 and a lift base 242, the lift base 242 is connected to the lift assembly 241, the probe 23 is mounted on the lift base 242, and the lift assembly 241 is used for driving the lift base 242 to lift up so that the probe 23 supports the removal film 25 downward and forms the bonding site 2511 or driving the lift base 242 to descend so that the probe 23 is separated from the removal film 25. In this embodiment, the lifting driving structure 24 includes a lifting component 241 and a lifting seat 242, and the lifting component 241 and the probe 23 are connected by the lifting seat 242, so that stability of the probe 23 in the lifting or descending process can be increased.

In an embodiment, an operation area 211 is formed on one side of the base plate 21, the lifting assembly 241 includes a first driving member 2411 disposed on one side of the base plate 21 facing away from the operation area 211, a cam 2412 and a follower assembly 2413 disposed on one side of the base plate 21 facing toward the operation area 211, the cam 2412 is located above the lifting seat 242 and the follower assembly 2413 and is connected with the first driving member 2411, the follower assembly 2413 is connected with the lifting seat 242, the first driving member 2411 drives the cam 2412 to rotate, so that a large end of the cam 2412 is abutted against or separated from a top end of the follower assembly 2413, an elastic member 212 is disposed on one side of the base plate 21 facing toward the cam 2412, one end of the elastic member 212 is connected with the base plate 21, and the other end of the elastic member 212 is connected with the follower assembly 2413. In this embodiment, the lifting assembly 241 includes a first drive 2411, a cam 2412 and a follower assembly 2413. The first driving member 2411 is disposed on a side of the substrate 21 facing away from the operation area 211, and the cam 2412 and the follower assembly 2413 are disposed on a side of the substrate 21 facing toward the operation area 211, so that the space on both sides of the substrate 21 is reasonably utilized. The first driving piece 2411 is used for driving the cam 2412 to rotate, a rotating motor in the prior art can be adopted for the specific first driving piece 2411, and the rotating shaft of the first driving piece 2411 is connected with the base circle of the cam 2412, so that the first driving piece 2411 can drive the cam 2412 to rotate in the rotating process, the cam 2412 is arranged above the follow-up piece 2413 and is close to the follow-up piece 2413, the large end of the cam 2412 abuts against and pushes the follow-up piece 2413 to move downwards in the rotating process, the follow-up piece 2413 drives the lifting seat 242 connected with the cam 2413 to move downwards, one end of the elastic piece 212 is connected with the base plate 21, the other end of the elastic piece 212 is connected with the follow-up piece 2413, the elastic piece 212 can be a stretching spring, and the elastic piece 212 is stretched and generates elastic force in the downward moving process of the follow-up piece 2413, so that after the first driving piece 2411 drives the cam 2412 to rotate, the large end of the cam 2412 is separated from the follow-up piece 2413 and drives the lifting seat 242 to move downwards, and the elastic piece 212 can return to the probe to lift up the probe 2413 by itself by virtue of the elastic force.

In an embodiment, the follower assembly 2413 includes a cam follower 2414 and a mounting base 2415, a vertically extending slide rail is formed on a side of the base plate 21 facing the operation area 211, a slide groove 2416 slidingly engaged with the slide rail is formed on the mounting base 2415, the cam follower 2414 is connected to a top end of the mounting base 2415, the lifting base 242 is connected to a bottom end of the mounting base 2415, and the first driving member 2411 drives the cam 2412 to rotate, so that a large end of the cam 2412 abuts against or is separated from abutting against the top end of the cam follower 2414. In this embodiment, the sliding groove 2416 is formed on the mounting base 2415, and the mounting base 2415 is slidably matched with the sliding rail provided on the base 21, so that the mounting base 2415 is more stable in the up-down moving process, the cam follower 2414 may be a cam follower 2414 in the prior art, the cam follower 2414 includes a bolt as a shaft, a roller and a roller between the end of the bolt and the roller, where the bolt of the cam follower 2414 as the shaft is penetrated through the mounting base 2415 and fixed with the mounting base 2415. The mounting seat 2415 is connected with the elastic element 212, a first connecting rod 215 is disposed on a side of the substrate 21 facing the operation area 211, one end of the elastic element 212 is connected with the first connecting rod, the first connecting rod 215 extends along the x direction, the follower assembly 2413 is connected with the second connecting rod 216, two ends of the elastic element 212 are respectively connected with the first connecting rod 215 and the second connecting rod 216, and the connection positions of the first connecting rod 215 and the second connecting rod 216 and the elastic element 212 are located on the same horizontal line.

Further, in the above embodiment, besides the lifting assembly 241 to lift the lifting seat 242 and the probe 23, other possible manners may be adopted to lift the lifting seat 242 and the probe 23, for example, a screw 333, a worm wheel, a worm rod, a belt transmission, etc. are adopted to lift the lifting seat 242 and the probe 23, which is not described herein.

In one embodiment, the follower assembly 2413 further includes a first sensor 2417, one end of the first sensor 2417 is connected to the mounting base 2415, and the other end of the first sensor 2417 is connected to the lifting base 242; the second sensor 213 is mounted on the side of the base plate 21 facing the cam 2412, and a sensing probe 2418 for sensing by the second sensor 213 is connected to the outer wall of the cam 2412. In this embodiment, the lifting component 241 may be further connected to an external control device through a signal, the first sensor 2417 is connected to the second sensor 213 through a signal, and the lifting component 241 completes one-side lifting movement due to one rotation of the cam 2412 along its base circle, so that after one rotation of the cam 2412, the second sensor 213 and the sensing probe 2418 generate a sensing signal; the follower assembly 2413 further includes a first sensor 2417, where the first sensor 2417 is a pressure sensor, one end of the first sensor 2417 is connected to the mounting base 2415, the other end of the first sensor 2417 is connected to the lifting base 242, the first sensor 2417 is disposed between the mounting base 2415 and the lifting base 242, when the probe 23 descends and presses the removal film 25, the first sensor 2417 can detect a pressure value of the probe 23, and after receiving the pressure value of the first sensor 2417, the control device identifies a protrusion height of the bonding site 2511 formed by pressing the removal film 25 by the probe 23, and the control device is connected to the lifting assembly 241 to control the protrusion height of the bonding site 2511 by controlling the lifting assembly 241.

In an embodiment, the film feeding structure includes a second driving member 221, a film winding roll 222 and a film unwinding roll 223, the film winding roll 222 and the film unwinding roll 223 are installed at a side of the substrate 21 facing the operation area 211 at intervals, the probe 23 is located between the film winding roll 222 and the film unwinding roll 223, two ends of the removing film 25 are respectively wound on the film winding roll 222 and the film unwinding roll 223, and the second driving member 221 drives the film winding roll 222 to rotate, so that the film winding roll 222 and the film unwinding roll 223 are matched to convey the removing film 25. The film feeding structure further comprises two guide wheels 224 and two support wheels 225, wherein one guide wheel 224 is arranged corresponding to the film collecting roll 222, the other guide wheel 224 is arranged corresponding to the film discharging roll 223, the two support wheels 225 are arranged between the two guide wheels 224 at intervals, the probe 23 is positioned between the two support wheels 225, the film removing 25 is wound on the outer wall surfaces of the two guide wheels 224 and the two support wheels 225, and the bottoms of the two support wheels 225 are flush.

The second driving member 221 in this embodiment may be a motor, and particularly may be a servo motor in the prior art, which has high precision, better stability and timeliness, and lower heating and noise. The film winding roll 222 and the film unwinding roll 223 are respectively arranged at the left end and the right end of the substrate 21, the left and the right directions are the y-axis directions in fig. 1, the left end roll of the removing film 25 is arranged on the film winding roll 222, the right end roll of the removing film 25 is arranged on the film unwinding roll 223, and in the process of the film feeding structure, the film unwinding roll 223 rotates to discharge materials under the driving of the film winding roll 222, and the film winding roll 222 is used for winding materials, so that the conveying of the removing film 25 is realized. In the conveying process, the removing film 25 sequentially passes under the probes 23, the removing film 25 is pressed down by the probes 23, and the driving mechanism 3 drives the substrate 21 to descend so as to bond the removing film 25 and the particle cores 51 on the chip 5.

In an embodiment, the chip core removing apparatus 100 further includes a code disc 4, where the code disc 4 is coaxially disposed with the film winding roll 222 and located between the film winding roll 222 and the substrate 21, and a third sensor 214 is mounted on a side of the substrate 21 facing the code disc 4, and a plurality of signal detecting grooves 41 for sensing signals from the third sensor 214 are spaced apart from the code disc 4 along a circumferential direction. The code disc 4 and the film winding roll 222 are coaxially arranged, so that the film winding roll 222 can drive the code disc 4 to synchronously rotate in the rotating process, the third sensor 214 is in a static state relative to the code disc 4, when the code disc 4 rotates, the third sensor 214 can sense the groove part and the non-groove part of the signal detection groove 41 on the code disc 4, the code disc 4 can alternately transmit signals to the third sensor 214, and the rotation of the film unwinding roll 223 is monitored through the code disc 4.

In an embodiment, the driving mechanism 3 includes an X-axis driving module, a Y-axis driving module, and a Z-axis driving module, where the Y-axis driving module is mounted on the workbench 1 and is used to drive the X-axis driving module and the Y-axis driving module to move along the Y-axis, and the X-axis driving module is used to drive the Z-axis driving module to move along the X-axis, and the Z-axis driving module is connected with the substrate 21 and is used to drive the substrate 21 to lift.

As shown in fig. 8 and 9, the Y-axis driving module includes a first base 311, a first slide table 312 and a first adjustment knob 313, the x-axis driving module includes a second base 321, a second slide table 322 and a second adjustment knob 323, and the z-axis driving module includes a third base, a third slide table 331, a connection block 332, a screw 333 and a ball nut 334. It should be noted that, the Y axis is the left-right direction shown in fig. 8, the X axis is the front-back direction, the Z axis is the up-down direction, the Y axis driving module is used to drive the X axis driving module Y and the Z axis driving module to move along the left-right direction, the X axis driving module is used to drive the Z driving module to move along the front-back direction, the Z driving module is used to drive the substrate 21 to move along the up-down direction, wherein the first base 311 is installed on the workbench 1, a first sliding rail is provided above the first base 311, and a sliding groove in sliding fit with the first sliding rail is provided below the first sliding table 312; second base 321 and first slip table 312 fixed connection, second base 321 top is provided with the second slide rail, and second slip table 322 below is provided with the spout that is in second slide rail sliding fit, and third base and second slip table 322 fixed connection, third slip table 331 still set up along vertical, and the third base is provided with the third slide rail along vertical setting, and third slip table 331 is provided with the spout that is in third slide rail sliding fit. The first adjusting knob 313 is installed on the first base 311, and the first adjusting knob 313 is used for driving the first sliding table 312 to move along the y-axis relative to the first base 311, so as to drive the second base 321 and the third base to move along the y-axis; the second adjusting knob 323 is installed on the second base 321, and the second adjusting knob 323 is used for driving the second sliding table 322 to move along the x-axis relative to the second base 321, so as to drive the third base to move along the x-axis; the third base forms the via hole along vertical, the lead screw 333 is worn to locate the base along vertical and stretches into in the first via hole, ball nut 334 cover is located outside the lead screw 333 and with lead screw 333 screw-thread fit, ball nut 334 is connected to the one end of connecting block 332, third slip table 331 is connected to the other end of connecting block 332, third adjust knob 335 can drive lead screw 333 rotation, thereby make lead screw 333 pivoted in-process can drive connecting block 332 reciprocate, thereby drive third slip table 331 and rise or descend along the third base, third slip table 331 connects base plate 21, thereby make actuating mechanism 3 can drive the removal of base plate 21 realization x, y, z three direction.

In an embodiment, the chip particle removing apparatus 100 further includes a vision mechanism, the vision mechanism includes a camera 51, the camera 51 is mounted above the table 1, and a lens of the camera 51 is disposed opposite to the probe 23. In this embodiment, the camera 51 may be in signal connection with an external control device, and by providing the camera 51, the position of the core particle can be positioned, and the removal of the core particle can be observed.

The foregoing description of the preferred embodiments of the present utility model should not be construed as limiting the scope of the utility model, but rather should be understood to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the utility model as defined by the following description and drawings or any application directly or indirectly to other relevant art(s).

Claims (10)

1. A die-chip removing apparatus for a die, comprising:

the workbench is used for placing chips;

the grain picking mechanism comprises a substrate, a film feeding structure, a probe and a lifting driving structure, wherein the substrate is arranged above the workbench, the film feeding structure is arranged on the substrate and used for conveying and removing films, the film removing side downwards forms an adhesive surface, the probe is positioned above the film removing side, the probe is arranged at the bottom of the substrate in a lifting manner, and the lifting driving structure is used for driving the probe to lift relative to the substrate:

the driving mechanism is arranged on the workbench and connected with the substrate, and is used for driving the substrate to lift;

the lifting driving structure drives the probe to descend so that the probe supports the removing film downwards and forms a bonding position, the driving mechanism drives the substrate to drive the bonding position to descend so that the particle cores of the chips are bonded on the bonding surface, and the driving mechanism drives the substrate to ascend so as to drive the bonding position to ascend so that the particle cores are bonded off the chips.

2. The die removing apparatus according to claim 1, wherein the elevation driving structure comprises an elevation assembly and an elevation seat, the elevation seat is connected to the elevation assembly, the probe is mounted on the elevation seat, the elevation assembly is used for driving the elevation seat to descend so that the probe supports the removing film downward and forms the bonding site, or the elevation assembly is used for driving the elevation seat to ascend so that the probe is separated from the removing film.

3. The chip removing apparatus according to claim 2, wherein an operation area is formed on one side of the substrate, the lifting assembly comprises a first driving member disposed on one side of the substrate facing away from the operation area, and a cam and a follower assembly disposed on one side of the substrate facing toward the operation area, the cam is disposed above the lifting base and the follower assembly and connected with the first driving member, the follower assembly is connected with the lifting base, the first driving member drives the cam to rotate so that a large end of the cam is in abutment with or out of abutment with a top end of the follower assembly, an elastic member is disposed on one side of the substrate facing toward the cam, an upper end of the elastic member is connected with the substrate, and a lower end of the elastic member is connected with the follower assembly.

4. The chip removing apparatus according to claim 3, wherein the follower assembly includes a cam follower and a mounting base, a vertically extending slide rail is formed on a side of the base plate facing the operation area, the mounting base is provided with a slide groove slidably engaged with the slide rail, the cam follower is connected to a top end of the mounting base, the lifting base is connected to a bottom end of the mounting base, and the first driving member drives the cam to rotate so that a large end of the cam is in or out of abutment with the top end of the cam follower, and the mounting base is connected to the elastic member.

5. The chip removing apparatus according to claim 4, wherein the follower assembly further comprises a first sensor, one end of the first sensor is connected to the mounting base, and the other end of the first sensor is connected to the lifting base; the second sensor is installed towards one side of the cam on the base plate, and an induction probe used for inducing by the second sensor is connected to the outer wall of the cam.

6. The die removing apparatus of claim 3, wherein the film feeding structure comprises a second driving member, a film winding roll and a film unwinding roll, the film winding roll and the film unwinding roll are mounted at a side of the substrate facing the operation area at intervals, the probe is located between the film winding roll and the film unwinding roll, two ends of the removing film are respectively wound on the film winding roll and the film unwinding roll, and the second driving member drives the film winding roll to rotate so that the film winding roll and the film unwinding roll cooperatively convey the removing film.

7. The die removing apparatus of claim 6, wherein the film feeding structure further comprises two guide wheels and two support wheels, one of the guide wheels is arranged corresponding to the film collecting roll, the other guide wheel is arranged corresponding to the film discharging roll, the two support wheels are arranged between the two guide wheels at intervals, the probe is positioned between the two support wheels, the removing film is wound on the outer wall surfaces of the two guide wheels and the two support wheels, and the bottoms of the two support wheels are level.

8. The chip core removing apparatus according to claim 7, further comprising a code disc coaxially disposed with the film take-up roll and located between the film take-up roll and the substrate, a third sensor being mounted on a side of the substrate facing the code disc, the code disc being provided with a plurality of signal detection grooves spaced apart in a circumferential direction for sensing with the third sensor.

9. The die removing apparatus according to any one of claims 1 to 8, wherein the driving mechanism comprises an X-axis driving module, a Y-axis driving module, and a Z-axis driving module, the Y-axis driving module is mounted on the table and is configured to drive the X-axis driving module and the Z-axis driving module to move along the Y-axis, the X-axis driving module is configured to drive the Z-axis driving module to move along the X-axis, and the Z-axis driving module is connected to the substrate and is configured to drive the substrate to lift.

10. The die removal apparatus of any one of claims 1 to 8, further comprising a vision mechanism including a camera mounted above the table, a lens of the camera being disposed directly opposite the probe.