CN220258882U - Cleaning mechanism of silicon wafer cleaning machine - Google Patents
Cleaning mechanism of silicon wafer cleaning machine Download PDFInfo
- Publication number
- CN220258882U CN220258882U CN202321467534.6U CN202321467534U CN220258882U CN 220258882 U CN220258882 U CN 220258882U CN 202321467534 U CN202321467534 U CN 202321467534U CN 220258882 U CN220258882 U CN 220258882U
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- CN
- China
- Prior art keywords
- cleaning
- silicon wafer
- fixedly connected
- box body
- transmission box
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- 238000004140 cleaning Methods 0.000 title claims abstract description 90
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 62
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 61
- 239000010703 silicon Substances 0.000 title claims abstract description 61
- 230000007246 mechanism Effects 0.000 title claims abstract description 18
- 230000005540 biological transmission Effects 0.000 claims abstract description 42
- 239000007788 liquid Substances 0.000 claims abstract description 41
- 238000005507 spraying Methods 0.000 claims abstract description 21
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 10
- 235000012431 wafers Nutrition 0.000 claims description 48
- 239000012535 impurity Substances 0.000 abstract description 4
- 238000005406 washing Methods 0.000 description 6
- 230000001680 brushing effect Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000004506 ultrasonic cleaning Methods 0.000 description 2
- 230000005526 G1 to G0 transition Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 239000011863 silicon-based powder Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000005341 toughened glass Substances 0.000 description 1
Abstract
The utility model relates to the technical field of silicon wafer cleaning, in particular to a cleaning mechanism of a silicon wafer cleaning machine, which comprises a bottom plate, wherein a transmission box body is fixedly connected above the bottom plate, a plurality of silicon wafer inlets and outlets are formed in the upper part of the transmission box body, a motor is fixedly connected to one side of the transmission box body, a rotary supporting component is arranged on the left side of the transmission box body, a parallel cleaning disc is arranged above the transmission box body, an air inlet pipe is fixedly connected to one side of the cleaning disc, two supporting parts are arranged on the right side of the transmission box body, a liquid spraying disc is arranged on the supporting parts, a cleaning liquid water pipe is fixedly connected to one side of the liquid spraying disc, and the cleaning mechanism of the silicon wafer cleaning machine can clean the silicon wafer and clean the silicon wafer cleaning machine together through two stages of cleaning and cleaning of the silicon wafer cleaning machine, so that the silicon wafer cleaning mechanism can clean water stains and impurities left on the silicon wafer cleaning machine timely.
Description
Technical Field
The utility model relates to the technical field of silicon wafer cleaning, in particular to a cleaning mechanism of a silicon wafer cleaning machine.
Background
The silicon wafer cleaning machine is characterized in that a large amount of silicon powder and other impurity particles are generated in the production process of the silicon wafer, and the silicon wafer is subjected to large-size and flaking development due to the size of the silicon wafer, so that the bonding area between the cut silicon wafers is increased, the adsorption force is larger, and the silicon wafer needs to be cleaned by using the cleaning machine.
The silicon wafer cleaning machine utilizes ultrasonic cleaning technology, the ultrasonic frequency in the cleaning process is swept reciprocally in a reasonable range to drive cleaning liquid to form fine reflux, so that workpiece dirt is quickly taken away from the surface of a workpiece when being stripped by ultrasonic, although the ultrasonic cleaning can remove the dirt on the surface of the silicon wafer, compared with a liquid cleaning mode, the cleaning degree is insufficient, the surface of the silicon wafer cannot be air-dried, and not only is the cleaning machine, but also a part of the dirt on the surface of the workpiece can be left in a cavity after leaving the surface of the workpiece, and because the cavity of the existing cleaning machine is narrow, the structure is complex, and the residual dirt cannot be well cleaned.
Disclosure of Invention
The utility model aims to overcome the defects of the prior art and provides a cleaning mechanism of a silicon wafer cleaning machine.
The aim of the utility model is achieved by the following technical scheme:
the utility model provides a brush mechanism of silicon chip cleaning machine, includes the bottom plate, the top fixedly connected with transmission box of bottom plate, the upper portion of transmission box is equipped with a plurality of silicon chip access & exit, transmission box one side fixedly connected with motor, transmission box left side is equipped with rotatory supporting component, transmission box top is equipped with parallel cleaning dish, cleaning dish one side fixedly connected with intake pipe, transmission box right side is equipped with two supporting parts, install the hydrojet dish on the supporting part, hydrojet dish one side fixedly connected with washing liquid water pipe.
Preferably, the support part comprises two mutually parallel support columns, and the two support columns are fixedly connected with the liquid spraying disc through connecting columns.
As the preferable mode of the utility model, the sizes of the silicon wafer inlets and outlets are completely the same as those of the regular shapes, and the silicon wafer inlets and outlets are uniformly distributed.
As the preferable mode of the utility model, the bottom of the cleaning disc is uniformly provided with a plurality of air holes.
Preferably, the rotary support assembly comprises rotary struts fixedly connected to the base plate, and both the support struts are fixedly connected to the base plate.
As the preferable mode of the utility model, a plurality of liquid spraying holes are uniformly and fixedly connected below the liquid spraying disc.
As the preferable mode of the utility model, a transmission assembly for conveying the silicon wafers is arranged in the transmission box body.
The utility model has the following advantages:
according to the cleaning mechanism of the silicon wafer cleaning machine, through two stages of cleaning and cleaning, a motor is used for driving a transmission shaft to start rotating, so that a belt can be driven to rotate synchronously, meanwhile, silicon wafers can be placed in an inlet and an outlet of the silicon wafers, a cleaning liquid water pipe starts to flow in cleaning liquid, the cleaning liquid reaches a liquid spraying disc, and the silicon wafers are sprayed from liquid spraying holes to be cleaned; after the silicon wafer is cleaned, the motor is turned off, meanwhile, the cleaning liquid is cut off to continuously flow into the liquid spraying disc, the T-shaped rotating column is rotated, the cleaning disc is enabled to return to the position right below the liquid spraying disc, then the T-shaped rotating column is lowered, the cleaning disc is enabled to be close to the upper portion of the belt, at the moment, the air inlet pipe is connected with a blower, air holes are enabled to continuously blow out air flow, and the surface of the cleaned silicon wafer is cleaned.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present utility model;
FIG. 2 is a schematic diagram of a second overall structure of the present utility model;
FIG. 3 is an enlarged schematic view of the structure of the transmission case of the present utility model;
FIG. 4 is an enlarged schematic view of the structure of the brush plate of the present utility model;
in the figure:
1. a bottom plate; 2. a support column; 3. a liquid spraying hole; 4. a liquid spraying disc; 5. a connecting column; 6. a cleaning liquid water pipe; 7. cleaning the disc; 71. air holes; 8. a motor; 9. a T-shaped rotating column; 10. a rotating support; 11. a belt; 12. a transmission shaft; 13. a silicon wafer inlet and outlet; 14. an air inlet pipe; 15. a transmission case body.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
As shown in fig. 1 to 4, the present utility model details the above technical scheme by the following examples:
the cleaning mechanism of the silicon wafer cleaning machine comprises a bottom plate 1, wherein the bottom plate 1 can adopt flat toughened glass for supporting the cleaning mechanism of the whole silicon wafer cleaning machine, a transmission box body 15 is fixedly connected above the bottom plate 1, a plurality of silicon wafer inlets and outlets 13 are arranged on the upper part of the transmission box body 15, and the silicon wafer inlets and outlets 13 are identical in size and regular shape and are uniformly distributed;
the transmission assembly comprises a motor 8 and two transmission shafts 12 capable of freely rotating in a transmission box body 15, an output shaft of the motor 8 is fixedly connected with one of the transmission shafts 12, a belt 11 is wound on the transmission shaft 12, the motor 8 at one end of the transmission shaft 12 provides a power source for the whole transmission assembly, and the motor 8 drives the transmission shaft 12 to rotate, so that the transmission shaft 12 drives the belt 11 above to synchronously rotate, and the purpose of transporting silicon wafers at a silicon wafer inlet and outlet 13 is achieved;
the left side of the transmission box body 15 is provided with a rotary supporting component, the rotary supporting component comprises a rotary support column 10 fixedly arranged on the bottom plate 1, the upper part of the rotary support column 10 is provided with a T-shaped rotary column 9, the T-shaped rotary column 9 and the rotary support column 10 form a rotary structure through threads in the rotary support column 10, the T-shaped rotary column 9 can freely rotate and lift under manual pushing without a holding power source, the T-shaped rotary column 9 is fixedly connected with the cleaning disc 7, so the T-shaped rotary column 9 can also drive the cleaning disc 7 to synchronously rotate and lift, the rotary support column 10 is fixed on the bottom plate 1 and used for supporting the T-shaped rotary column 9, and the T-shaped rotary column 9 is fixedly connected with the cleaning disc 7;
one side of the cleaning disc 7 is fixedly connected with an air inlet pipe 14, the cleaning disc 7 just can cover the whole transmission box body 15, a plurality of air holes 71 are uniformly formed in the bottom of the cleaning disc 7, the air holes 71 can blow strong air through air flow entering through the air inlet pipe 14 and are used for cleaning impurities remained on the surface of a cleaned silicon wafer on the transmission box body 15, the air inlet pipe 14 can be connected with an air blower at the tail part, and when the air is required to work, the air blower is started, so that the surface of the cleaned silicon wafer can be cleaned;
in addition, the transmission box 15 right side is equipped with two supporting parts, the supporting part includes two support columns 2 that are parallel to each other, two support column 2 all is connected with hydrojet dish 4 stationary phase through spliced pole 5, two support columns 2 are through both ends fixed continuous bottom plate 1 and spliced pole 5 for top hydrojet dish 4 provide supporting stability, let hydrojet dish 4 can not influence whole cleaning process because of rocking, hydrojet dish 4 one side fixedly connected with washing liquid water pipe 6, hydrojet dish 4 below even fixedly connected with a plurality of hydrojet hole 3, washing liquid water pipe 6 can be followed outside continuous input washing liquid and let whole working process can be incessant, and the utilization washing liquid that hydrojet hole 3 can maximize makes the washing liquid refine the hydrobead and spray, reach more comprehensive cleaning effect.
The specific principle is as follows: the utility model is divided into two steps for cleaning and brushing, firstly, the T-shaped rotary column 9 is rotated to enable the brushing disc 7 to rotate so as to prevent the brushing disc 7 from blocking the cleaning liquid in the liquid spraying hole 3 from being sprayed down, then the motor 8 is turned on, the motor 8 drives the transmission shaft 12 to start rotating, so that the belt 11 can be driven to rotate synchronously, meanwhile, silicon wafers can be put into the silicon wafer inlet and outlet 13, and meanwhile, the cleaning liquid water pipe 6 is enabled to start flowing in the cleaning liquid so as to enable the cleaning liquid to reach the liquid spraying disc 4, and the silicon wafers are cleaned after being sprayed down from the liquid spraying hole 3;
and secondly, after the silicon wafer is cleaned, the motor 8 is closed, meanwhile, the cleaning liquid is cut off to continuously flow into the liquid spraying disc 4, the T-shaped rotary column 9 is rotated, the cleaning disc 7 returns to the position right below the liquid spraying disc 4, the T-shaped rotary column 9 is lowered, the cleaning disc 7 is close to the upper part of the belt 11, at the moment, the air inlet pipe 14 is connected with a blower, the air holes 71 continuously blow out air flow, the surface of the cleaned silicon wafer is cleaned, after the cleaning is finished, the silicon wafer still in the silicon wafer inlet and outlet 13 is taken away, the residual impurities and water stains in the silicon wafer inlet and outlet 13 are cleaned by the cleaning disc 7, and after a period of time, the blower is disconnected.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The utility model provides a cleaning mechanism of silicon chip cleaning machine, includes bottom plate (1), its characterized in that: the cleaning device is characterized in that a transmission box body (15) is fixedly connected to the upper portion of the bottom plate (1), a plurality of silicon wafer inlets and outlets (13) are formed in the upper portion of the transmission box body (15), a motor (8) is fixedly connected to one side of the transmission box body (15), a rotary supporting component is arranged on the left side of the transmission box body (15), a parallel cleaning disc (7) is arranged above the transmission box body (15), an air inlet pipe (14) is fixedly connected to one side of the cleaning disc (7), two supporting portions are arranged on the right side of the transmission box body (15), a liquid spraying disc (4) is arranged on the supporting portions, and a cleaning liquid water pipe (6) is fixedly connected to one side of the liquid spraying disc (4).
2. The cleaning mechanism of a silicon wafer cleaning machine as set forth in claim 1, wherein: the support part comprises two mutually parallel support columns (2), and the two support columns (2) are fixedly connected with the liquid spraying disc (4) through connecting columns (5).
3. The cleaning mechanism of a silicon wafer cleaning machine as set forth in claim 1, wherein: the silicon wafer inlets and outlets (13) are identical in size and regular shape and are uniformly distributed.
4. The cleaning mechanism of a silicon wafer cleaning machine as set forth in claim 1, wherein: a plurality of air holes (71) are uniformly formed in the bottom of the cleaning disc (7).
5. The cleaning mechanism of a silicon wafer cleaning machine as set forth in claim 2, wherein: the rotary support assembly comprises rotary support columns (10), the rotary support columns (10) are fixedly connected to the bottom plate (1), and the two support columns (2) are fixedly connected to the bottom plate (1).
6. The cleaning mechanism of a silicon wafer cleaning machine as set forth in claim 1, wherein: the lower part of the liquid spraying disc (4) is uniformly and fixedly connected with a plurality of liquid spraying holes (3).
7. The cleaning mechanism of a silicon wafer cleaning machine as set forth in claim 1, wherein: a transmission assembly for conveying silicon wafers is arranged in the transmission box body (15).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321467534.6U CN220258882U (en) | 2023-06-09 | 2023-06-09 | Cleaning mechanism of silicon wafer cleaning machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321467534.6U CN220258882U (en) | 2023-06-09 | 2023-06-09 | Cleaning mechanism of silicon wafer cleaning machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220258882U true CN220258882U (en) | 2023-12-29 |
Family
ID=89302522
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321467534.6U Active CN220258882U (en) | 2023-06-09 | 2023-06-09 | Cleaning mechanism of silicon wafer cleaning machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220258882U (en) |
-
2023
- 2023-06-09 CN CN202321467534.6U patent/CN220258882U/en active Active
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