CN220254938U - Heat dissipating device and electronic equipment - Google Patents
Heat dissipating device and electronic equipment Download PDFInfo
- Publication number
- CN220254938U CN220254938U CN202320530909.2U CN202320530909U CN220254938U CN 220254938 U CN220254938 U CN 220254938U CN 202320530909 U CN202320530909 U CN 202320530909U CN 220254938 U CN220254938 U CN 220254938U
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- Prior art keywords
- heat
- fan
- outer frame
- heat dissipation
- heat sink
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 90
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 22
- 239000002184 metal Substances 0.000 claims description 5
- 230000005855 radiation Effects 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 4
- 230000000694 effects Effects 0.000 description 15
- 238000001816 cooling Methods 0.000 description 4
- 230000002860 competitive effect Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 238000013021 overheating Methods 0.000 description 1
Abstract
The application provides a heat abstractor and electronic equipment relates to electronic equipment technical field. Wherein, heat abstractor includes: a water drain heat sink that absorbs heat; a heat conduction sheet disposed above the water discharge radiator for guiding out heat in the water discharge radiator; the fan structure comprises a fan outer frame and a fan body, wherein the fan outer frame is arranged above the heat conducting fin and is used for receiving heat received by the heat conducting fin so as to radiate the heat; the fan body is arranged in the fan outer frame and is also used for radiating for components in the server. Therefore, the heat dissipation device provided by the application utilizes the original structure of the server to realize further heat dissipation of the server, thereby not only meeting the heat dissipation requirement, but also reducing further occupation of space, and avoiding influencing the configuration in the system.
Description
Technical Field
The application relates to the technical field of support, in particular to a heat dissipation device and electronic equipment.
Background
At present, CPU power consumption is higher and higher, and the next generation can reach 500W-600W. The traditional air cooling mode can not meet the heat dissipation requirement.
In the prior art, in order to meet the heat dissipation requirement, a water-cooling radiator is added on the basis of air-cooling heat dissipation, and the water-cooling radiator is arranged between a back plate and a fan, but the radiator occupies a large amount of space in a system, and limits the configuration of the system.
Therefore, how to provide a heat dissipation device that reduces space occupation on the premise of meeting the heat dissipation requirement is a problem to be solved.
Disclosure of Invention
The embodiment of the application aims to provide a heat dissipation device and electronic equipment.
In order to solve the technical problems, the embodiment of the application provides the following technical scheme:
a first aspect of the present application provides a heat dissipating device, comprising:
a water drain heat sink that absorbs heat;
a heat conduction sheet disposed above the water discharge radiator for guiding out heat in the water discharge radiator;
the fan structure comprises a fan outer frame and a fan body, wherein the fan outer frame is arranged above the heat conducting fin and is used for receiving heat received by the heat conducting fin so as to radiate the heat; the fan body is arranged in the fan outer frame and is also used for radiating for components in the server.
In some modified embodiments of the first aspect of the present application, the fan casing is provided with a plurality of heat dissipation holes.
In some modified embodiments of the first aspect of the present application, a plurality of the heat dissipation holes are uniformly distributed on the fan outer frame.
In some modified embodiments of the first aspect of the present application, a plurality of groups of heat dissipation fins are disposed on the fan housing.
In some modified embodiments of the first aspect of the present application, the plurality of sets of heat dissipation fins are all disposed inside the fan frame, and at least one side of each set of heat dissipation fins faces to the outside.
In some modified embodiments of the first aspect of the present application, the plurality of groups of heat dissipation fins are symmetrically disposed around the fan body.
In some variations of the first aspect of the present application, each set of the heat dissipation fins comprises a plurality of fin singlets, each fin singlets having an angle of 45 ° with respect to a surface of the attached fan housing.
In some variations of the first aspect of the present application, the fan housing is a thermally conductive material.
In some variations of the first aspect of the present application, the fan housing is a metal fan housing.
On the other hand, the application further provides an electronic device, which comprises the heat dissipation device, so that all technical features and beneficial technical effects of the heat dissipation device are included, and are not repeated herein.
The application provides a heat abstractor and electronic equipment, wherein, heat abstractor includes water row radiator/conducting strip and fan structure, heat abstractor is used for the server, the conducting strip sets up in the radiating water row top, fan frame setting of fan structure is in the top of fin, thereby the heat that the structure absorbed can be conducted to the fan frame through the conducting strip to give off the heat through the fan frame, and the fan structure still includes the fan body except including the fan frame, the fan body is used for dispelling the heat to the internal part of server. Thereby this application provides and gets heat abstractor realizes the heat dissipation of the heat that the radiator absorbed through being used for carrying out radiating fan body's frame to the inside server, has improved heat radiating area, has more effectively utilized the space in the system, has increased the system heat dissipation ability to further dispel the heat to the server, make the product more competitive. Therefore, the heat dissipation device provided by the application utilizes the original structure of the server to realize further heat dissipation of the server, so that under the condition that CPU power is higher and higher, the heat dissipation requirement can be met, further occupation of space is reduced, and the configuration in the system is not influenced. And the fan housing is used for radiating heat, so that the heat radiation of the radiator to the downstream device can be avoided, and the influence on the downstream device is avoided.
Drawings
The above, as well as additional purposes, features, and advantages of exemplary embodiments of the present application will become readily apparent from the following detailed description when read in conjunction with the accompanying drawings. Several embodiments of the present application are illustrated by way of example and not by way of limitation in the figures of the accompanying drawings, in which like reference numerals refer to similar or corresponding parts and in which:
FIG. 1 schematically illustrates an exploded view of a heat sink provided herein;
FIG. 2 schematically illustrates a front view of a heat sink provided herein;
FIG. 3 schematically illustrates a structural schematic of a fan structure provided herein;
reference numerals illustrate:
the heat sink 1, the water-drain radiator 11, the heat-conducting sheet 12, the fan structure 13, the fan housing 131, the heat-dissipating fins 1312, the fin monolithic 1313, and the fan body 132.
Detailed Description
Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
As shown in fig. 1 to 3, the present application provides a heat dissipating device 1, including:
a water drain radiator 11, the water drain radiator 11 absorbing heat;
a heat conductive sheet 12, the heat conductive sheet 12 being disposed above the water discharge radiator 11 for guiding out heat in the water discharge radiator 11;
a fan structure 13, wherein the fan structure 13 includes a fan outer frame 131 and a fan body 132, and the fan outer frame 131 is disposed above the heat-conducting sheet 12 and is used for receiving the heat received by the heat-conducting sheet 12 so as to emit the heat; the fan body 132 is disposed inside the fan housing 131, and the fan body 132 is further configured to dissipate heat of components inside the server.
The application provides a heat abstractor 1, including water row radiator 11/conducting strip 12 and fan structure 13, heat abstractor 1 is used for the server, and the conducting strip 12 sets up in the radiating water row top, and fan housing 131 of fan structure 13 sets up in the top of fin to the heat that the water row structure absorbed can be conducted to fan housing 131 through the conducting strip 12 to distribute away the heat through fan housing 131, and fan structure 13 includes fan body 132 except including fan housing 131, and fan body 132 is used for dispelling the heat to the inside part of server. The present application thus provides a heat dissipating device 1 that further dissipates heat from a server by dissipating heat absorbed by a water-jet radiator 11 through an outer frame of a fan body 132 for dissipating heat from the inside of the server. Therefore, the heat dissipation device 1 provided by the application utilizes the original structure of the server to realize further heat dissipation of the server, thereby not only meeting the heat dissipation requirement, but also reducing the further occupation of space.
In this embodiment, the fan housing 131 is provided with a plurality of heat dissipation holes.
In this embodiment, the fan housing 131 is provided with a plurality of heat dissipation holes, so that the heat dissipation from the water drain radiator 11 to the fan housing 131 through the heat conducting sheet 12 can be further conducted, thereby better realizing the dissipation of heat dissipation from the fan housing 131, and further improving the heat dissipation effect.
As shown in fig. 1 to 3, in the embodiment of the present application, a plurality of the heat dissipation holes are uniformly distributed on the fan housing 131.
In this embodiment, the fan casing 131 is provided with a plurality of heat dissipation holes, and the plurality of heat dissipation holes are uniformly distributed on the fan casing 131, so that heat dissipation can be uniformly performed for each position of the fan casing 131, and local overheating phenomenon is avoided, so that heat dissipation is better realized, and the heat dissipation effect of the fan casing 131 is further ensured.
As shown in fig. 1 to 3, in the embodiment of the present application, a plurality of sets of heat dissipation fins 1312 are disposed on the fan housing 131.
In this embodiment, the fan housing 131 has a plurality of groups of heat dissipation fins 1312, and one side or both ends of the plurality of groups of heat dissipation fins 1312 face to the outside, so that after the fan housing 131 receives the heat absorbed by the water-draining radiator 11 conducted by the heat conducting sheet 12, the heat dissipation fins 1312 disposed on the fan housing 131 can accelerate the dissipation of the heat while the fan housing 131 radiates the heat, thereby further improving the heat dissipation effect.
As shown in fig. 1 to 3, in the embodiment of the present application, a plurality of sets of the heat dissipation fins 1312 are disposed inside the fan housing 131, and at least one side of each set of the heat dissipation fins 1312 faces the outside.
In this embodiment, a plurality of groups of heat dissipation fins 1312 are disposed inside the fan housing 131, and at least one side of the heat dissipation fins 1312 is disposed towards the outside, so that the heat dissipation fins 1312 can further dissipate heat, and the heat dissipation fins 1312 can better dissipate heat, and the heat dissipation fins 1312 are disposed inside the fan housing 131 to more effectively utilize space, so that no additional space is required, and space occupation is reduced, so that the product is more competitive.
As shown in fig. 1 to 3, in the embodiment of the present application, a plurality of sets of the heat dissipation fins 1312 are symmetrically disposed around the fan body 132.
In this embodiment, the fan housing 131 is internally provided with a plurality of groups of heat dissipation fins 1312 and a fan body 132, the fan body 132 is located at the center of the inside of the fan housing 131, and the cross section is circular, the plurality of groups of heat dissipation fins 1312 are respectively arranged around the fan body 132, and the plurality of groups of heat dissipation fins 1312 are symmetrically arranged, and both ends of each group of heat dissipation fins 1312 face to the outside, so that a better heat dissipation effect is achieved, a space is utilized to the greatest extent, the heat dissipation fins 1312 can be placed better, the area of the heat dissipation fins 1312 can be maximized, an optimal heat dissipation effect is achieved, and a heat dissipation effect is improved.
In this embodiment, four sets of heat dissipation fins 1312 are disposed on each fan structure 13, the four sets of heat dissipation fins 1312 are disposed around the fan body 132, the four sets of heat dissipation fins 1312 are symmetrically disposed, and two sides of each set of heat dissipation fins 1312 are disposed towards the outside, so that occupation of space by the heat dissipation fins 1312 can be avoided while heat dissipation effect is ensured, one end of the heat dissipation fins 1312, which is close to the fan outer frame, is flush with the fan outer frame 131, and the other end of the heat dissipation fins 1312 is provided with a recess towards the fan body 132 to adapt to the structure of the fan body 132, and the appearance of the fan structure 13 can be attractive.
As shown in fig. 1 to 3, in the embodiment of the present application, each set of the heat dissipation fins 1312 includes a plurality of fin singlets 1313, and an angle between each fin singlet 1313 and a surface of the connected fan housing 131 is 45 °.
In this embodiment, each group of heat dissipation fins 1312 includes a plurality of fin singlechips 1313, and the included angle between each fin singlechip 1313 and the fan casing 131 is an included angle, and the length of the fin singlechip 1313 in the middle area of each group of heat dissipation fins 1312 is greater than that of the fin singlechips 1313 on both sides, so as to adapt to the shape of the fan body 132, thereby maximally utilizing the space, better placing the heat dissipation fins 1312, maximizing the area of the heat dissipation fins 1312, further achieving the best heat dissipation effect, and improving the heat dissipation effect. And the included angle between each fin single piece 1313 and the fan outer frame 131 is 45 degrees, so that the fin single pieces 1313 can be better arranged, and the best heat dissipation effect is achieved.
In this embodiment, the fin veneers 1313 included in each group of the heat dissipation fins 1312 are each longer in length in the middle region, the fin veneers 1313 in the both side regions are shorter in length, and the fin veneers 1313 in the both side regions of the middle region are symmetrically disposed with respect to the fin veneers 1313 in the middle region, and the fin veneers 1313 included in each group of the heat dissipation fins 1312 are each spaced apart from the fan body 132.
As shown in fig. 1 to 3, in the embodiment of the present application, the fan housing 131 is made of a heat conductive material.
In this embodiment, the fan housing 131 is made of a heat conductive material, so that the heat transferred from the water drain radiator 11 through the heat conductive sheet 12 can be better received, so that the heat of the fan housing 131 can be conveniently dissipated, and the heat dissipation effect is enhanced.
As shown in fig. 1 to 3, in the embodiment of the present application, the fan housing 131 is a metal fan housing 131.
In this embodiment, the fan housing 131 is of a metal structure, the fan housing 131 of the metal structure has better heat conduction and heat dissipation effects, and can further receive and dissipate heat.
As shown in fig. 1 to 3, in the embodiment of the present application, in the heat dissipating device 1, the water-draining radiator 11 is provided with a plurality of heat conducting fins 12 in turn, and each heat conducting fin 12 is provided with a fan structure 13, so that a better heat dissipating effect can be achieved.
On the other hand, the application further provides an electronic device, which comprises the heat dissipation device, so that all technical features and beneficial technical effects of the heat dissipation device are included, and are not repeated herein.
The application provides a heat abstractor and electronic equipment, wherein, heat abstractor includes water row radiator/conducting strip and fan structure, heat abstractor is used for the server, the conducting strip sets up in the radiating water row top, fan frame setting of fan structure is in the top of fin, thereby the heat that the structure absorbed can be conducted to the fan frame through the conducting strip to give off the heat through the fan frame, and the fan structure still includes the fan body except including the fan frame, the fan body is used for dispelling the heat to the internal part of server. Thereby this application provides and gets heat abstractor realizes the heat dissipation of the heat that the radiator absorbed through being used for carrying out radiating fan body's frame to the inside server, has improved heat radiating area, has more effectively utilized the space in the system, has increased the system heat dissipation ability to further dispel the heat to the server, make the product more competitive. Therefore, the heat dissipation device provided by the application utilizes the original structure of the server to realize further heat dissipation of the server, so that under the condition that CPU power is higher and higher, the heat dissipation requirement can be met, further occupation of space is reduced, and the configuration in the system is not influenced. And the fan housing is used for radiating heat, so that the heat radiation of the radiator to the downstream device can be avoided, and the influence on the downstream device is avoided.
The foregoing is merely specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily think about changes or substitutions within the technical scope of the present application, and the changes and substitutions are intended to be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (10)
1. A heat sink for a server, comprising:
a water drain heat sink that absorbs heat;
a heat conduction sheet disposed above the water discharge radiator for guiding out heat in the water discharge radiator;
the fan structure comprises a fan outer frame and a fan body, wherein the fan outer frame is arranged above the heat conducting fin and is used for receiving heat received by the heat conducting fin so as to radiate the heat; the fan body is arranged in the fan outer frame and is also used for radiating for components in the server.
2. The heat sink of claim 1, wherein,
the fan outer frame is provided with a plurality of heat dissipation holes.
3. The heat sink of claim 2, wherein,
the plurality of radiating holes are uniformly distributed on the fan outer frame.
4. The heat sink of claim 2, wherein,
and a plurality of groups of heat radiation fins are arranged on the fan outer frame.
5. The heat sink of claim 4 wherein the heat sink is a heat sink,
the heat dissipation fins are arranged inside the fan outer frame, and at least one side of each heat dissipation fin faces to the outside.
6. The heat sink of claim 5, wherein,
the heat radiation fins are symmetrically arranged around the fan body.
7. The heat sink of claim 4 wherein the heat sink is a heat sink,
each group of heat radiation fins comprises a plurality of fin singlechips, and an included angle between each fin singlechip and the surface of the connected fan outer frame is 45 degrees.
8. The heat sink of claim 1, wherein,
the fan outer frame is made of heat conducting materials.
9. The heat sink of claim 1, wherein,
the fan outer frame is a metal fan outer frame.
10. An electronic device comprising the heat dissipating device according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320530909.2U CN220254938U (en) | 2023-03-13 | 2023-03-13 | Heat dissipating device and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320530909.2U CN220254938U (en) | 2023-03-13 | 2023-03-13 | Heat dissipating device and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220254938U true CN220254938U (en) | 2023-12-26 |
Family
ID=89268587
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320530909.2U Active CN220254938U (en) | 2023-03-13 | 2023-03-13 | Heat dissipating device and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220254938U (en) |
-
2023
- 2023-03-13 CN CN202320530909.2U patent/CN220254938U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |