CN220254740U - Multilayer thick copper plate - Google Patents
Multilayer thick copper plate Download PDFInfo
- Publication number
- CN220254740U CN220254740U CN202223370666.5U CN202223370666U CN220254740U CN 220254740 U CN220254740 U CN 220254740U CN 202223370666 U CN202223370666 U CN 202223370666U CN 220254740 U CN220254740 U CN 220254740U
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- China
- Prior art keywords
- plate
- copper
- silica gel
- heat conduction
- epoxy resin
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 158
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 116
- 239000010949 copper Substances 0.000 title claims abstract description 116
- 230000017525 heat dissipation Effects 0.000 claims abstract description 31
- 239000003822 epoxy resin Substances 0.000 claims abstract description 30
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 30
- 239000000758 substrate Substances 0.000 claims abstract description 26
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 46
- 239000000741 silica gel Substances 0.000 claims description 46
- 229910002027 silica gel Inorganic materials 0.000 claims description 46
- 238000009413 insulation Methods 0.000 claims description 28
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 7
- 238000005507 spraying Methods 0.000 claims description 6
- 238000003466 welding Methods 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 20
- 229910000679 solder Inorganic materials 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 239000003365 glass fiber Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a multilayer thick copper plate, which comprises a substrate and a heat dissipation mechanism; a substrate: the upper surface of the substrate at the lower side is provided with a lower epoxy resin plate, the inside of the lower epoxy resin plate is provided with a grounding copper plate, the lower surface of the substrate at the upper side is provided with an upper epoxy resin plate, the inside of the upper epoxy resin plate is provided with a power copper plate, connecting copper rings are arranged between through holes corresponding to vertical positions in the two substrates, the upper copper plate is arranged between the upper ends of the connecting copper rings, the lower copper plate is arranged between the lower ends of the connecting copper rings, and the grounding copper plate and the power copper plate are respectively fixedly connected with the outer cambered surface of the connecting copper rings; heat dissipation mechanism: the multilayer thick copper plate is arranged between two substrates, heat emitted by the inner copper plate and the outer copper plate is prevented from being intersected to cause rapid temperature rise, the inner copper plate and the outer copper plate are subjected to simultaneous heat dissipation, the heat dissipation area is larger, the heat dissipation efficiency is accelerated, and the risk of burning the plates is greatly reduced.
Description
Technical Field
The utility model relates to the technical field of PCBs, in particular to a multilayer thick copper plate.
Background
The PCB, namely the printed circuit board, is a provider of electric connection of electronic components, can greatly reduce errors of wiring and assembly, improves automation level and production labor rate, wherein in most factories, the printed circuit board with the copper thickness of a circuit layer not less than 2oz is called as a thick copper plate, and the thick copper plate can be divided into a single-layer board, a double-layer board, a four-layer board, a six-layer board and other multi-layer circuit boards according to the layer number of the circuit board; in the prior art, common thick copper is the multilayer, simultaneously there is inlayer copper and outer copper, inlayer copper transmits the electric current, outer copper communicates between to electrical components, during operation, because the transportation of electric current, inside and outside copper all can produce heat, common method heat dissipation method is the same as traditional, all set up radiator fan in the outside and dispel the heat to the circuit board, but in the heat dissipation in-process, the heat that the inlayer copper produced can meet with the heat that the outside copper produced when outwards transmitting, make the temperature rise fast, increased the risk of burning the board, for this reason, we propose a multilayer thick copper.
Disclosure of Invention
The utility model aims to overcome the existing defects, provides the multilayer thick copper plate, avoids rapid temperature rise caused by the intersection of heat emitted by inner and outer copper plates, simultaneously dissipates heat of the inner and outer copper plates, greatly reduces the risk of plate burning, and can effectively solve the problems in the background art.
In order to achieve the above purpose, the present utility model provides the following technical solutions: a multilayer thick copper plate comprises a substrate and a heat dissipation mechanism;
a substrate: the upper surface of the substrate at the lower side is provided with a lower epoxy resin plate, the inside of the lower epoxy resin plate is provided with a grounding copper plate, the lower surface of the substrate at the upper side is provided with an upper epoxy resin plate, the inside of the upper epoxy resin plate is provided with a power copper plate, connecting copper rings are arranged between through holes corresponding to vertical positions in the two substrates, the upper copper plate is arranged between the upper ends of the connecting copper rings, the lower copper plate is arranged between the lower ends of the connecting copper rings, and the grounding copper plate and the power copper plate are respectively fixedly connected with the outer cambered surface of the connecting copper rings;
heat dissipation mechanism: the heat dissipation device is arranged between two substrates, heat emitted by the inner copper plate and the outer copper plate is prevented from being intersected to cause rapid temperature rise, the inner copper plate and the outer copper plate are simultaneously dissipated, the heat dissipation area is larger, the heat dissipation efficiency is accelerated, and the risk of burning the plates is greatly reduced.
Further, the heat dissipation mechanism comprises heat insulation boards, the heat insulation boards are respectively arranged on the opposite outer sides of the two base boards, the heat insulation boards are respectively attached to the outer cambered surfaces of the connecting copper rings, the upper surface of the upper heat insulation board is fixedly connected with the upper copper plates, the lower surface of the lower heat insulation board is fixedly connected with the lower copper plates, heat transfer between the inner copper plates and the outer copper plates is blocked, and rapid temperature rise is avoided.
Further, the heat dissipation mechanism further comprises an outer heat conduction silica gel plate and an inner heat conduction silica gel plate, wherein the outer heat conduction silica gel plates are respectively arranged on the opposite outer sides of the two heat insulation plates, the surface of the outer heat conduction silica gel plate is provided with a yielding hole matched with the upper copper wire plate and the lower copper wire plate, and the inner heat conduction silica gel plate is arranged between the upper epoxy resin plate and the lower epoxy resin plate and dissipates heat to the inner copper plate and the outer copper plate.
Further, the heat dissipation mechanism further comprises a side heat conduction silica gel plate, the side heat conduction silica gel plate is wrapped on the outer side surface of the whole body formed by the base plate, the lower epoxy resin plate, the upper epoxy resin plate, the heat insulation plate, the outer heat conduction silica gel plate and the inner heat conduction silica gel plate, and the outer heat conduction silica gel plate and the inner heat conduction silica gel plate are fixedly connected with the side heat conduction silica gel plate, so that the heat dissipation area is increased.
Further, the solder mask further comprises a solder mask ink layer, wherein the solder mask ink layer is arranged on the opposite outer side surfaces of the two outer heat-conducting silica gel plates, and short circuit between non-tin-eating lines is avoided.
Further, the outer side surfaces of the upper copper wire plate and the lower copper wire plate, which are opposite to each other, are respectively provided with a tin spraying layer, so that oxidation of a tin-eating circuit is avoided.
Further, the surface of the anti-welding ink layer is respectively provided with a marking plate for marking the installation position of the electric element.
Compared with the prior art, the utility model has the beneficial effects that: the multilayer thick copper plate has the following advantages:
when using, outside electric current is through ground connection copper, the power copper, go up copper and the conduction of copper down to the electrical components inside, make electrical components work, because ground connection copper, the power copper, go up copper and copper down the thickness of copper all be not less than oz, can bear bigger electric current, so whole device can be called thick copper, in thick copper's course of working, the electric current flow can make inside and outside copper produce heat, separate the heat between inside and outside copper through the heat insulating board, under the heat conduction of outer heat conduction silica gel plate, interior heat conduction silica gel plate and side heat conduction silica gel plate, avoid inside and outside copper to send out the heat and meet and lead to the temperature to rise fast, dispel the heat simultaneously to inside and outside copper, the radiating area is bigger, the radiating efficiency has greatly reduced the risk of burning the board.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model;
fig. 2 is a schematic view of the explosive structure of the upper end of the whole device of the present utility model.
In the figure: 1 a substrate, 2 a lower epoxy resin plate, 3 a grounding copper plate, 4 an upper epoxy resin plate, 5 a power supply copper plate, 6 a connecting copper ring, 7 a lower copper wire plate, 8 an upper copper wire plate, 9 a heat dissipation mechanism, 91 an outer heat conduction silica gel plate, 92 a heat insulation plate, 93 an inner heat conduction silica gel plate, 94 a side heat conduction silica gel plate, 10 a solder resist ink layer, 11 a tin spraying layer and 12 a marking plate.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-2, the present embodiment provides a technical solution: a multilayer thick copper plate comprises a substrate 1 and a heat dissipation mechanism 9;
substrate 1: the two glass fiber substrates are vertically distributed, the substrates 1 are glass fiber substrates, the inner copper plates and the outer copper plates are separated, a lower epoxy resin plate 2 is arranged on the upper surface of the substrate 1 at the lower side, insulation protection is provided for the arrangement of the inner copper plates, a grounding copper plate 3 is arranged in the lower epoxy resin plate 2, grounding protection is provided for the whole device, an upper epoxy resin plate 4 is arranged on the lower surface of the substrate 1 at the upper side, insulation protection is provided for the arrangement of the inner copper plates, a power copper plate 5 is arranged in the upper epoxy resin plate 4, working current is transmitted, connecting copper rings 6 are arranged between through holes corresponding to the vertical positions in the two substrates 1, the inner copper plates and the outer copper plates are communicated, an upper copper plate 8 is arranged between the upper ends of the connecting copper rings 6, a lower copper plate 7 is arranged between the lower ends of the connecting copper rings 6, connection is provided for electrical appliances on the surfaces of the multi-layer thick copper plates, the grounding copper plates 3 and the power copper plates 5 are fixedly connected with the outer cambered surfaces of the connecting copper rings 6 respectively, and tin spraying layers 11 are arranged on the opposite outer side surfaces of the upper copper plates 8 and the lower copper plates 7, so that tin spraying layers cannot be eaten by the tin spraying layers;
heat dissipation mechanism 9: the heat dissipation mechanism 9 comprises heat insulation plates 92, wherein the heat insulation plates 92 are respectively arranged on the opposite outer sides of the two base plates 1, the heat insulation plates 92 are respectively attached to the outer cambered surfaces of the connecting copper rings 6, the heat insulation plates 92 are vacuum heat insulation plates, the upper surface of the upper heat insulation plate 92 is fixedly connected with the upper copper wire plate 8, the lower surface of the lower heat insulation plate 92 is fixedly connected with the lower copper wire plate 7, the heat dissipation mechanism 9 also comprises an outer heat conduction silica gel plate 91 and an inner heat conduction silica gel plate 93, the outer heat conduction silica gel plate 91 is respectively arranged on the opposite outer sides of the two heat insulation plates 92, the surface of the outer heat conduction silica gel plate 91 is provided with a yielding hole which is matched and installed with the upper copper wire plate 8 and the lower copper wire plate 7, the inner heat conduction silica gel plate 93 is arranged between the upper epoxy resin plate 4 and the lower epoxy resin plate 2, the heat dissipation mechanism 9 also comprises a side heat conduction silica gel plate 94, the side heat-conducting silica gel plate 94 is wrapped on the outer side surface of the whole body formed by the base plate 1, the lower epoxy resin plate 2, the upper epoxy resin plate 4, the heat insulation plate 92, the outer heat-conducting silica gel plate 91 and the inner heat-conducting silica gel plate 93 are fixedly connected with the side heat-conducting silica gel plate 94, in the using process of the whole body device, the current flows through the inner copper plate and the outer copper plate to generate heat, the heat between the inner copper plate and the outer copper plate is blocked by the heat insulation plate 92, the heat emitted by the inner copper plate is prevented from being intersected to cause the rapid temperature rise, meanwhile, the heat generated by the inner copper plate and the outer copper plate is simultaneously emitted to the outside under the heat conduction of the outer heat-conducting silica gel plate 91 and the inner heat-conducting silica gel plate 93, the heat dissipation area of the whole body device is increased through the side heat-conducting silica gel plate 94, the heat dissipation speed is accelerated, the solder resist ink layer 10 is arranged on the opposite outer side surfaces of the two outer heat-conducting silica gel plates 91, the solder resist ink layer 10 is prevented from being short-circuited between non-tin-eating lines, the surface of the solder mask ink layer 10 is respectively provided with a marking plate 12, so that the mounting positions of all electrical components on the surface of the thick copper plate are marked, and the electrical components are convenient to mount.
The working principle of the multilayer thick copper plate provided by the utility model is as follows: when the electric appliance is used, pins of an electric appliance element penetrate through the copper ring 6 from top to bottom, then the pins are welded with the lower copper wire plate 7 through soldering tin, the electric appliance element is installed on the surface of the multi-layer thick copper plate, in the working process, external current is conducted to the electric appliance element through the grounding copper plate 3, the power copper plate 5, the upper copper wire plate 8 and the lower copper wire plate 7, the electric appliance element is enabled to work, the thicknesses of the grounding copper plate 3, the power copper plate 5, the upper copper wire plate 8 and the lower copper wire plate 7 are not smaller than 2oz, larger current can be borne, the whole device can be called a thick copper plate, in the working process of the thick copper plate, heat is generated by the current flowing through the inner copper plate and the outer copper plate, the heat between the inner copper plate and the outer copper plate is blocked through the heat insulation plate 92, the heat emitted by the inner copper plate and the outer copper plate are prevented from being intersected to cause the temperature to be rapidly increased, meanwhile, under the heat generated by the outer copper plate and the inner copper plate 93 is diffused to the outside, the heat is increased in the lateral heat dissipation speed of the whole device is increased through the side heat dissipation silicon plate 94.
The foregoing is only illustrative of the present utility model and is not to be construed as limiting the scope of the utility model, and all equivalent structures or equivalent flow modifications which may be made by the teachings of the present utility model and the accompanying drawings or which may be directly or indirectly employed in other related art are within the scope of the utility model.
Claims (5)
1. A multilayer thick copper plate, characterized in that: comprises a base plate (1) and a heat dissipation mechanism (9);
substrate (1): the two substrates (1) are distributed vertically, a lower epoxy resin plate (2) is arranged on the upper surface of each substrate (1) at the lower side, a grounding copper plate (3) is arranged in each lower epoxy resin plate (2), an upper epoxy resin plate (4) is arranged on the lower surface of each substrate (1) at the upper side, a power copper plate (5) is arranged in each upper epoxy resin plate (4), connecting copper rings (6) are arranged between through holes corresponding to the vertical positions in the two substrates (1), an upper copper plate (8) is arranged between the upper ends of the connecting copper rings (6), a lower copper plate (7) is arranged between the lower ends of the connecting copper rings (6), and the grounding copper plates (3) and the power copper plates (5) are fixedly connected with the outer cambered surfaces of the connecting copper rings (6) respectively;
heat dissipation mechanism (9): the heat dissipation mechanism (9) comprises heat insulation plates (92), wherein the heat insulation plates (92) are respectively arranged on the opposite outer sides of the two base plates (1), the heat insulation plates (92) are respectively attached to the outer cambered surfaces of the connecting copper rings (6), the upper surfaces of the upper heat insulation plates (92) are fixedly connected with the upper copper wire plates (8), and the lower surfaces of the lower heat insulation plates (92) are fixedly connected with the lower copper wire plates (7);
the heat dissipation mechanism (9) further comprises an outer heat conduction silica gel plate (91) and an inner heat conduction silica gel plate (93), the outer heat conduction silica gel plate (91) is arranged on the opposite outer sides of the two heat insulation plates (92), the surface of the outer heat conduction silica gel plate (91) is provided with a yielding hole matched with the upper copper wire plate (8) and the lower copper wire plate (7), and the inner heat conduction silica gel plate (93) is arranged between the upper epoxy resin plate (4) and the lower epoxy resin plate (2).
2. The multilayer thick copper plate according to claim 1, wherein: the heat dissipation mechanism (9) further comprises a side heat conduction silica gel plate (94), wherein the side heat conduction silica gel plate (94) is wrapped on the outer side face of the whole body formed by the base plate (1), the lower epoxy resin plate (2), the upper epoxy resin plate (4), the heat insulation plate (92), the outer heat conduction silica gel plate (91) and the inner heat conduction silica gel plate (93), and the outer heat conduction silica gel plate (91) and the inner heat conduction silica gel plate (93) are fixedly connected with the side heat conduction silica gel plate (94).
3. The multilayer thick copper plate according to claim 1, wherein: the anti-welding ink layer (10) is arranged on the opposite outer side surfaces of the two outer heat conduction silica gel plates (91).
4. The multilayer thick copper plate according to claim 1, wherein: the outer side surfaces of the upper copper wire plate (8) and the lower copper wire plate (7) which are opposite to each other are respectively provided with a tin spraying layer (11).
5. A multilayer thick copper plate according to claim 3, characterized in that: the surface of the anti-welding ink layer (10) is respectively provided with a marking plate (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223370666.5U CN220254740U (en) | 2022-12-15 | 2022-12-15 | Multilayer thick copper plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223370666.5U CN220254740U (en) | 2022-12-15 | 2022-12-15 | Multilayer thick copper plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220254740U true CN220254740U (en) | 2023-12-26 |
Family
ID=89229082
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223370666.5U Active CN220254740U (en) | 2022-12-15 | 2022-12-15 | Multilayer thick copper plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220254740U (en) |
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2022
- 2022-12-15 CN CN202223370666.5U patent/CN220254740U/en active Active
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant |