CN220254609U - Optical image module - Google Patents

Abstract

An optical image module is provided, which comprises a lens assembly, a housing, a circuit member, a first conductive element and a second conductive element. The lens assembly includes a positive contact and a negative contact. The lens component is arranged on the shell. The circuit member is fixed to the housing. The first conductive element and the second conductive element are arranged on the circuit component. The first conductive element contacts and is electrically connected to the positive contact portion. The second conductive element contacts and is electrically connected to the negative contact portion.

Description

Optical image module

Technical Field

The present utility model relates to an optical image module, and more particularly to an optical image module with a conductive device.

Background

For the optical image module for vehicles and aviation used in extreme environments (such as high-latitude cold zone areas and high-altitude areas), the lens assembly used is generally provided with a heating coil for defrosting so as to avoid the problems of image shielding, image interpretation and the like caused by long-term low temperature in the extreme environments.

In the optical imaging module of the prior art, the connection between the coil and the circuit member used for heating the lens assembly is generally electrically connected from the outside using wires. However, this arrangement not only requires additional dispensing for fixing, but also may cause breakage or disconnection due to a high-low temperature difference or severe vibration environment, thereby losing the conductive function.

Therefore, there is a need for an improved optical image module that solves the above-mentioned problems and meets the requirements of practical use environments, so as to provide a reliable power supply mode for internal connection.

Disclosure of Invention

The embodiment of the utility model provides an optical image module, which comprises a lens assembly, a shell, a circuit component, a first conducting element and a second conducting element. The lens assembly includes a positive contact and a negative contact. The lens component is arranged on the shell. The circuit member is fixed to the housing. The first conductive element and the second conductive element are arranged on the circuit component. The first conductive element contacts and is electrically connected to the positive contact portion. The second conductive element contacts and is electrically connected to the negative contact portion.

According to some embodiments of the utility model, the first conductive element includes a first setting portion and a first connection portion. The first setting part is perpendicular to the first connecting part. The first setting portion is parallel to the circuit member.

According to some embodiments of the utility model, the second conductive element includes a second setting portion and a second connection portion. The second setting part is perpendicular to the second connecting part. The second setting portion is parallel to the circuit member.

According to some embodiments of the utility model, the optical image module further comprises a photosensitive element. The photosensitive element is arranged on the circuit component. The first arrangement portion of the first conductive element and the second arrangement portion of the second conductive element are arranged on opposite sides of the circuit member with respect to the photosensitive element.

According to some embodiments of the utility model, the optical image module further comprises an adhesive element. The adhesive element is applied between the lens assembly and the housing to bond the lens assembly to the housing.

According to some embodiments of the utility model, the lens assembly further comprises a lower portion comprising a positive contact and a negative contact. The housing includes a bearing portion. The bearing part accommodates the lower part of the lens assembly.

According to some embodiments of the utility model, the positive contact and the negative contact are positioned on opposite sides of a lower portion of the lens assembly, respectively.

According to some embodiments of the utility model, the optical image module further comprises a connector. The circuit member includes a lower surface. The lower surface is opposite to the lens assembly. The connector is arranged on the lower surface to be electrically connected with an external circuit.

According to some embodiments of the utility model, the optical image module further comprises a photosensitive element. The circuit member includes an upper surface. The upper surface faces the lens assembly. The first conducting element, the second conducting element and the photosensitive element are all positioned on the upper surface of the circuit component.

According to some embodiments of the utility model, the optical image module further comprises a fastener. The housing includes an opening. The circuit member includes an opening. The opening of the housing is aligned with the opening of the circuit member. The fastener passes through the opening of the circuit member and the opening of the housing to secure the circuit member to the housing.

Drawings

The utility model will be better understood from the following description of embodiments taken in conjunction with the accompanying drawings.

Fig. 1A is a perspective view of an optical image module according to some embodiments of the utility model.

FIG. 1B is an exploded view of an optical imaging module according to some embodiments of the utility model.

Fig. 2 illustrates a perspective view of a lens assembly according to some embodiments of the present utility model.

Fig. 3A and 3B are schematic diagrams illustrating an assembly process of the optical image module, in which the first conductive element and the second conductive element are mounted on the circuit component through Surface-mount technology (SMT).

Fig. 3C and 3D are schematic views of an assembly process of the optical image module, in which the circuit member is locked to the housing by the fastener.

Fig. 4A and 4B are schematic diagrams illustrating an assembling process of the optical image module, in which the housing is glued for subsequent bonding.

Fig. 4C and 4D are schematic diagrams illustrating an assembly process of the optical image module, in which the lens assembly is bonded to the housing by an Active Alignment (AA) process.

The utility model is susceptible to various modifications and alternative forms. Some representative embodiments have been shown by way of example in the drawings and will be described in detail herein. It should be understood, however, that the utility model is not intended to be limited to the particular forms disclosed. Rather, the utility model is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the utility model as defined by the claims.

Description of the reference numerals

1000 optical image module

1100 lens assembly

1110 upper part

1120 annular part

1121 Joint portion

1130 lower part

1131 Positive electrode contact

1132 negative electrode contact

1200 coil

1300 casing

1310 bearing part

1311 adhesive portion

1320 base

1321 opening(s)

1400 Circuit Member

1410 upper surface

1420 lower surface

1430 opening(s)

1500 photosensitive element

1610 first pass element

1611 first connecting portion

1612 first setting part

1620 a second conductive element

1621 second connecting portion

1622 second setting part

1700 fastener

1800 connector

1900 adhesive element

2000 dispensing needle

3000 machine jaw

Detailed Description

Various embodiments are described with reference to the drawings, wherein like reference numerals are used to refer to like or equivalent elements throughout. The drawings are not to scale and are provided merely to illustrate the utility model. It should be understood that numerous specific details, relationships, and methods are set forth to provide a full understanding. However, one of ordinary skill in the art will readily recognize that the various embodiments may be practiced without one or more of the specific details or with other methods. In other instances, well-known structures or operations are shown in detail to avoid obscuring certain features of the various embodiments. Various embodiments are not limited by the illustrated ordering of acts or events, as some acts may occur in different orders and/or concurrently with other acts or events. Moreover, not all illustrated acts or events are required to implement a methodology in accordance with the present utility model.

The elements and limitations disclosed, for example, in the abstract, summary, and detailed description, are not explicitly recited in the claims, and should not be expressly incorporated into the claims, either individually or collectively by a implication, inference or otherwise. For the purposes of this embodiment, the singular includes the plural and vice versa unless explicitly stated otherwise. The term "include" means "including but not limited to". Further, approximating words such as "about" and the like may be used herein to mean, for example, "at", "near at", "within 3% to 5% (within 3-5% of), within acceptable manufacturing tolerances", "within acceptable manufacturing tolerances", or any logical combination thereof.

Fig. 1A illustrates a perspective view of an optical imaging module 1000 according to some embodiments of the utility model. Fig. 1B illustrates an exploded view of an optical imaging module 1000 according to some embodiments of the utility model. According to some embodiments of the present utility model, the optical imaging module 1000 may be an optical imaging module for a vehicle or an aircraft. Please refer to fig. 1A and fig. 1B.

As shown in fig. 1A to 1B, the optical image module 1000 includes a lens assembly 1100, a coil 1200, a housing 1300, a circuit member 1400, a photosensitive element 1500, a first conductive element 1610, a second conductive element 1620, a pair of fasteners 1700, a connector 1800, and an adhesive element 1900.

In some embodiments of the present utility model, the lens assembly 1100 may be a lens assembly for capturing optical images. The lens assembly 1100 includes an upper portion 1110, an annular portion 1120, and a lower portion 1130.

A (heating) coil 1200 for defrosting in a cold environment is provided in the upper portion 1110 of the lens assembly 1100. The annular portion 1120 of the lens assembly 1100 is located between the upper portion 1110 and the lower portion 1130. The lens assembly 1100 is connected to the housing 1300 to be fixedly loaded on the housing 1300.

The lower portion 1130 of the lens assembly 1100 includes a positive contact 1131 and a negative contact 1132. The positive electrode contact 1131 and the negative electrode contact 1132 are located on opposite sides of the surface of the lower portion 1130. The positive electrode contact 1131 and the negative electrode contact 1132 are electrically connected to the coil 1200 shown in fig. 1B in dashed lines, respectively.

In some embodiments of the utility model, the housing 1300 includes a carrier 1310 and a base 1320 that are coupled. The carrier 1310 is generally hollow and circular in shape and is adapted to receive a lower portion 1130 of the lens assembly 1100. The carrier 1310 includes an adhesive portion 1311, the details of which will be described later. The base 1320 is substantially planar. The base 1320 includes a pair of openings 1321 (fig. 3C), the details of which will be described later.

In some embodiments of the utility model, circuit member 1400 is fixedly coupled to housing 1300. The circuit member 1400 includes an upper surface 1410, a lower surface 1420, and a pair of openings 1430. An upper surface 1410 of the circuit member 1400 faces the lens assembly 1100. The lower surface 1420 of the circuit member 1400 faces away from the lens assembly 1100. The opening 1430 is located at a generally diagonal position on the circuit member 1400.

In some embodiments of the present utility model, the photosensitive element 1500 is disposed on the upper surface 1410 of the circuit member 1400 to convert the optical image output by the lens assembly 1100 into an electrical signal. In some embodiments of the present utility model, the first conductive element 1610 and the second conductive element 1620 are disposed on the upper surface 1410 of the circuit member 1400. When the circuit member 1400 is assembled to the housing 1300, the photosensitive element 1500, the first conductive element 1610, and the second conductive element 1620 are all located in the carrier portion 1310 of the housing 1300.

The first conductive element 1610 and the second conductive element 1620 are electrically connected to the lens assembly 1100 and the circuit component 1400. In detail, the first conductive element 1610 and the second conductive element 1620 are disposed on opposite sides of the upper surface 1410 of the circuit member 1400 with respect to the photosensitive element 1500, so as to electrically connect the positive contact 1131 and the negative contact 1132 of the lens assembly 1100, respectively.

In some embodiments of the utility model, the fastener 1700 may be a screw. The fastener 1700 passes through the opening 1430 of the circuit member 1400 to secure the circuit member 1400 to the base 1320 of the housing 1300.

In some embodiments of the present utility model, the connector 1800 is disposed on the lower surface 1420 of the circuit member 1400 to electrically connect to an external circuit (not shown). In some embodiments of the present utility model, the adhesive member 1900 is applied on the adhesive portion 1311 of the housing 1300 to join the lens assembly 1100 to the housing 1300.

Please refer to fig. 2 for a moment. Fig. 2 illustrates a perspective view of a lens assembly 1100 according to some embodiments of the utility model. As shown in fig. 2, the annular portion 1120 of the lens assembly 1100 includes an engagement portion 1121. In addition to the joint 1121, the positive contact 1131 and the negative contact 1132 of the lens assembly 1100 can also be seen from the perspective of fig. 2.

In some embodiments of the present utility model, an adhesive element 1900 (FIG. 1B) is applied between the bonding portion 1121 of the lens assembly 1100 and the bonding portion 1311 (FIG. 1B) of the housing 1300 to bond the lens assembly 1100 to the housing 1300 through an Active Alignment (AA) process.

It should be understood that the adhesive element 1900 shown in fig. 1B is provided only schematically and does not represent the actual shape of the adhesive element 1900, and details regarding the adhesive element 1900 will be described in detail later with respect to fig. 4A through 4B.

The following describes the structure and assembly process of the optical image module 1000 in detail. Fig. 3A to 3B are schematic diagrams illustrating an assembly process of the optical image module 1000, in which the first conductive element 1610 and the second conductive element 1620 are mounted on the circuit component 1400 through a Surface Mount Technology (SMT).

As shown in fig. 3A, the first conductive element 1610 includes a first connection portion 1611 and a first setting portion 1612. The second conductive element 1620 includes a second connecting portion 1621 and a second setting portion 1622.

According to some embodiments of the present utility model, the first connection portion 1611 of the first conductive element 1610 is perpendicular to the first setting portion 1612. The second connection portion 1621 of the second conductive element 1620 is perpendicular to the second setting portion 1622. The first arrangement 1612 of the first conductive element 1610 and the second arrangement 1622 of the second conductive element 1620 are parallel to the circuit member 1400.

As shown in fig. 3B, the first conductive element 1610 and the second conductive element 1620 are mounted to the upper surface 1410 of the circuit member 1400 through Surface Mount Technology (SMT). In detail, the surface Mount technology includes a technology of printing solder paste on a pad (not shown) of the circuit member 1400 using, for example, a solder paste printer, then placing the first conductive element 1610 and the second conductive element 1620 using, for example, a mounting machine (Mount), and then melting the solder paste by Reflow (Reflow), so that the first conductive element 1610 and the second conductive element 1620 are combined with the circuit member 1400 and electrically connected to each other, thereby completing the assembly.

Fig. 3C-3D are schematic diagrams illustrating an assembly process of the optical image module 1000, wherein the circuit member 1400 is locked to the housing 1300 by the fastener 1800. From fig. 3C and 3D, it can be seen that the housing 1300 and the circuit member 1400 are inverted with respect to the optical image module 1000 in fig. 1A.

As shown in fig. 3C, two openings 1430 located at opposite corners of the circuit member 1400 are aligned with two openings 1321 located at opposite corners of the housing 1300, respectively. The fastener 1700 sequentially passes through the opening 1430 of the circuit member 1400 and the opening 1321 of the housing 1300 via the side of the lower surface 1420 of the circuit member 1400 to fix the circuit member to the housing 1300. From fig. 3D, it can be seen that the circuit member 1400 after assembly to the housing 1300, and the connector 1800 for connecting to an external circuit (not shown).

Fig. 4A to 4B are schematic views respectively showing an assembling process of the optical image module 1000, in which the housing 1300 is dispensed for subsequent bonding. Fig. 4A shows a semi-finished product of the optical image module 1000 of fig. 3C assembled to half and a dispensing needle 2000 of a dispensing machine (not shown) for dispensing. As shown in fig. 4A-4B, adhesive 1900 is applied to adhesive 1311 of housing 1300 through dispensing needle 2000.

Fig. 4C-4D are schematic diagrams illustrating an assembly process of the optical image module 1000, wherein the lens assembly 1100 is coupled to the housing 1300 by an Active Alignment (AA) process. In particular, active alignment is a technique used to determine the relative position of components during assembly.

As shown in fig. 4C, the lens assembly 1100 is coupled to the semi-finished optical image module 1000 shown in fig. 4B via a machine jaw 3000. Fig. 4D shows a cross-sectional view of the assembled optical image module 1000. As shown in fig. 4D, the joint 1121 of the lens assembly 1100 is joined with the joint 1311 of the housing 1300 via the adhesive member 1900.

As shown in fig. 4D, the first connection portion 1611 of the first conductive element 1610 of the assembled optical image module 1000 is electrically connected to the positive contact portion 1131 of the lens assembly 1100. The second connection portion 1621 of the second conductive element 1620 of the assembled optical image module 1000 is electrically connected to the negative contact portion 1132 of the lens assembly 1100.

In summary, the present utility model discloses an optical image module having a heating coil for defrosting for use in extreme environments (e.g. high-latitude cold zone areas, high-altitude areas). Unlike the prior art in which wires are used to supply power to the lens assembly from outside, the present utility model provides an improved optical image module which is electrically connected to the lens assembly directly from inside through the conductive element, thereby providing a reliable power supply mode and reducing the risk of cracking or breaking of wires due to high-low temperature differences or severe vibration environments in the prior art in which wires connected from outside are used. In addition, the optical image module of the present utility model can be manufactured by automatic Active Alignment (AA) focusing machine without using additional manual connectors and additional dispensing to fix the wires used in the conventional technology. Thus, the manufacturing process of the optical image module is simplified and has the advantage of cost.

Although the utility model has been shown and described with respect to one or more implementations, equivalents and modifications will occur to others skilled in the art upon the reading and understanding of the specification and the annexed drawings. In addition, while a particular feature of the utility model may have been disclosed with respect to only one of several implementations, such feature may be combined with one or more other features of the other implementations as may be desired and advantageous for any given or particular application.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. As used herein, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. Furthermore, the terms "include," have, "or variations thereof, as used in the description and/or in the claims, are intended to be inclusive in a manner similar to the term" comprise.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art. Furthermore, terms such as those defined in commonly used dictionaries should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

Claims (10)

1. An optical image module, comprising:

a lens assembly including a positive contact and a negative contact;

a housing, wherein the lens assembly is disposed on the housing;

a circuit member fixed to the housing; and

the first conducting element is contacted with and electrically connected with the positive electrode contact part, and the second conducting element is contacted with and electrically connected with the negative electrode contact part.

2. The optical imaging module of claim 1, wherein the first conductive element comprises a first set portion and a first connection portion, the first set portion being perpendicular to the first connection portion, the first set portion being parallel to the circuit member.

3. The optical image module of claim 2, wherein the second conductive element includes a second setting portion and a second connecting portion, the second setting portion is perpendicular to the second connecting portion, and the second setting portion is parallel to the circuit member.

4. The optical imaging module of claim 3, further comprising a photosensitive element disposed on the circuit member, wherein the first portion of the first conductive element and the second portion of the second conductive element are disposed on opposite sides of the circuit member with respect to the photosensitive element.

5. The optical imaging module of claim 1, further comprising an adhesive element applied between the lens assembly and the housing to bond the lens assembly to the housing.

6. The optical image module of claim 1, wherein the lens assembly further comprises a lower portion including the positive contact and the negative contact, and the housing includes a carrying portion for receiving the lower portion of the lens assembly.

7. The optical imaging module of claim 6, wherein the positive contact and the negative contact are positioned on opposite sides of the lower portion of the lens assembly, respectively.

8. The optical imaging module of claim 1, further comprising a connector, the circuit member comprising a lower surface facing away from the lens assembly, wherein the connector is disposed on the lower surface for electrically connecting to an external circuit.

9. The optical imaging module of claim 1, further comprising a photosensitive element, the circuit member including an upper surface facing the lens assembly, wherein the first conductive element, the second conductive element, and the photosensitive element are all located on the upper surface of the circuit member.

10. The optical imaging module of claim 1, further comprising a fastener, the housing including an opening, the circuit member including an opening, wherein the opening of the housing is aligned with the opening of the circuit member, and the fastener passing through the opening of the circuit member and the opening of the housing to secure the circuit member to the housing.