TWM649960U - Optical image module - Google Patents

Abstract

An optical image module is provided, including a lens assembly, a housing, a circuit member, a first conductive element and a second conductive element. The lens assembly includes a positive contact portion and a negative contact portion. The lens assembly is disposed on the housing. The circuit member is fixed on the housing. The first conductive element and the second conductive element are disposed on the circuit member. The first conductive element is in contact with and electrically connected to the positive contact portion. The second conductive element is in contact with and electrically connected to the negative contact portion.

Description

Optical imaging module

The present invention relates to an optical image module, in particular to an optical image module with a conductive element.

For automotive and aviation optical imaging modules used in extreme environments (such as high-latitude cold zones and high-altitude areas), the lens components used are generally equipped with heating coils for defrosting to avoid long-term damage in extreme environments. Low temperature causes image masking and image interpretation problems.

In conventional optical imaging modules, the connection between the coil used for heating the lens assembly and the circuit component is generally electrically connected externally using wires. However, this setting not only requires additional glue dispensing for fixation, but may also cause cracks or disconnections due to high and low temperature differences or harsh vibration environments, thereby losing the conductive and electrical function.

Therefore, there is a need for an improved optical imaging module that can solve the above problems and meet the needs of actual use environments to provide a reliable internal connection power supply method.

An embodiment of the present disclosure provides an optical imaging module, including a lens assembly, a housing, a circuit component, a first conductive element and a second conductive element. The lens assembly includes a positive contact part and a negative contact part. The lens assembly is arranged on the housing. The circuit components are fixed on the housing. The first conductive element and the second conductive element are disposed on the circuit component. The first conductive element contacts and is electrically connected to the positive electrode contact portion. The second conductive element contacts and is electrically connected to the negative electrode contact portion.

According to some embodiments of the present disclosure, the first conductive element includes a first setting part and a first connecting part. The first setting part is perpendicular to the first connecting part. The first setting portion is parallel to the circuit component.

According to some embodiments of the present disclosure, the second conductive element includes a second setting part and a second connecting part. The second setting part is perpendicular to the second connecting part. The second setting portion is parallel to the circuit component.

According to some embodiments of the present disclosure, the optical imaging module further includes a photosensitive element. The photosensitive element is arranged on the circuit component. The first setting portion of the first conductive element and the second setting portion of the second conductive element are disposed on opposite sides of the circuit member relative to the photosensitive element.

According to some embodiments of the present disclosure, the optical imaging module further includes an adhesive component. The adhesive component is applied between the lens assembly and the housing to join the lens assembly to the housing.

According to some embodiments of the present disclosure, the lens assembly further includes a lower part, and the lower part includes a positive contact part and a negative contact part. The housing includes a carrying portion. The carrying portion accommodates the lower portion of the lens assembly.

According to some embodiments of the present disclosure, the positive contact portion and the negative contact portion are respectively positioned on opposite sides of the lower portion of the lens assembly.

According to some embodiments of the present disclosure, the optical imaging module further includes a connector. The circuit component includes a lower surface. The lower surface faces away from the lens assembly. The connector is disposed on the lower surface to electrically connect to the external circuit.

According to some embodiments of the present disclosure, the optical imaging module further includes a photosensitive element. The circuit member includes an upper surface. The upper surface faces the lens assembly. The first conductive element, the second conductive element and the photosensitive element are all located on the upper surface of the circuit component.

According to some embodiments of the present disclosure, the optical imaging module further includes a fastener. The housing includes an opening. The circuit member includes an opening. The opening of the housing is aligned with the opening of the circuit component. The fastener passes through the opening of the circuit component and the opening of the housing to secure the circuit component to the housing.

Various embodiments are described with reference to the accompanying drawings, wherein like reference characters are used to designate similar or equivalent elements throughout. The drawings are not drawn to scale and are provided solely to illustrate the invention. It is understood that many specific details, relationships, and methods are set forth to provide a comprehensive understanding. However, one of ordinary skill in the art will readily appreciate that various embodiments may be practiced without one or more of the specific details or in other ways. In other instances, well-known structures or operations are shown in detail in order to avoid obscuring certain features of the various embodiments. Various embodiments are not limited to the order in which actions or events are shown, as some actions may occur in a different order and/or concurrently with other actions or events. Furthermore, not all illustrated acts or events may be required to implement methods in accordance with the present invention.

Elements and limitations disclosed, for example, in the abstract, novel content, and embodiments paragraphs, but not explicitly stated in the patent scope, shall not be incorporated into the patent scope individually or collectively by implication, inference, or other means. . For the purposes of this embodiment, the singular includes the plural and vice versa unless expressly stated otherwise. The term "including" means "including without limitation." In addition, similar words such as "about, almost, substantially, approximately" and similar words may here mean, for example, "at", "near, nearly at", "at 3% "Within 3-5% of", "within acceptable manufacturing tolerances", or any logical combination thereof.

Figure 1A shows a perspective view of an optical imaging module 1000 according to some embodiments of the present disclosure. Figure 1B shows an exploded view of an optical imaging module 1000 according to some embodiments of the present disclosure. According to some embodiments of the present disclosure, the optical imaging module 1000 may be an optical imaging module for automobiles or aviation. Please refer to Figure 1A and Figure 1B below.

As shown in Figures 1A to 1B, the optical imaging module 1000 includes a lens assembly 1100, a coil 1200, a housing 1300, a circuit component 1400, a photosensitive element 1500, a first conductive element 1610, a A second conductive component 1620, a pair of fasteners 1700, a connector 1800 and an adhesive component 1900.

In some embodiments of the present disclosure, the lens assembly 1100 may be a lens assembly used to acquire optical images. The lens assembly 1100 includes an upper part 1110, an annular part 1120 and a lower part 1130.

A (heating) coil 1200 for defrosting in cold environments is provided in the upper portion 1110 of the lens assembly 1100 . The annular portion 1120 of the lens assembly 1100 is located between the upper portion 1110 and the lower portion 1130 . The lens assembly 1100 is connected to the housing 1300 to be fixedly loaded on the housing 1300 .

The lower part 1130 of the lens assembly 1100 includes a positive contact part 1131 and a negative contact part 1132. The positive electrode contact portion 1131 and the negative electrode contact portion 1132 are located on opposite sides of the surface of the lower portion 1130 . The positive contact part 1131 and the negative contact part 1132 are respectively electrically connected to the coil 1200 shown in dotted lines in Figure 1B.

In some embodiments of the present disclosure, the housing 1300 includes a supporting portion 1310 and a base portion 1320 that are connected. The carrying portion 1310 is generally in the shape of a hollow ring and can accommodate the lower portion 1130 of the lens assembly 1100 . The carrying part 1310 includes an adhesive part 1311, the details of which will be described in detail later. The base 1320 is generally flat-shaped. The base 1320 includes a pair of openings 1321 (Fig. 3C), the details of which will be described in detail later.

In some embodiments of the present disclosure, circuit component 1400 is fixedly connected to housing 1300 . The circuit component 1400 includes an upper surface 1410, a lower surface 1420, and a pair of openings 1430. The upper surface 1410 of the circuit member 1400 faces the lens assembly 1100 . The lower surface 1420 of the circuit member 1400 faces away from the lens assembly 1100 . The openings 1430 are located at substantially diagonal positions on the circuit component 1400 .

In some embodiments of the present disclosure, the photosensitive element 1500 is disposed on the upper surface 1410 of the circuit component 1400 to convert the optical image output by the lens assembly 1100 into an electronic signal. In some embodiments of the present disclosure, the first conductive element 1610 and the second conductive element 1620 are disposed on the upper surface 1410 of the circuit component 1400 . After the circuit component 1400 is assembled into the casing 1300, the photosensitive element 1500, the first conductive element 1610 and the second conductive element 1620 are all located in the carrying portion 1310 of the casing 1300.

The first conductive element 1610 and the second conductive element 1620 are electrically connected to the lens assembly 1100 and the circuit component 1400 . In detail, the first conductive element 1610 and the second conductive element 1620 are located on opposite sides of the photosensitive element 1500 on the upper surface 1410 of the circuit member 1400 to electrically connect the positive contact portion 1131 of the lens assembly 1100 respectively. and negative contact 1132 .

In some embodiments of the present disclosure, fasteners 1700 may be screws. The fastener 1700 passes through the opening 1430 of the circuit member 1400 to secure the circuit member 1400 to the base 1320 of the housing 1300 .

In some embodiments of the present disclosure, the connector 1800 is disposed on the lower surface 1420 of the circuit component 1400 to electrically connect an external circuit (not shown). In some embodiments of the present disclosure, the adhesive component 1900 is applied on the adhesive portion 1311 of the housing 1300 to join the lens assembly 1100 to the housing 1300 .

Please refer to Figure 2 for now. Figure 2 shows a perspective view of a lens assembly 1100 according to some embodiments of the present disclosure. As shown in FIG. 2 , the annular portion 1120 of the lens assembly 1100 includes a joint portion 1121 . In addition to the joint portion 1121, the positive contact portion 1131 and the negative contact portion 1132 of the lens assembly 1100 can also be seen from the perspective of FIG. 2 .

In some embodiments of the present disclosure, the adhesive element 1900 (FIG. 1B) is applied between the joint portion 1121 of the lens assembly 1100 and the adhesive portion 1311 (FIG. 1B) of the housing 1300 to enable active alignment ( AA) process joins the lens assembly 1100 to the housing 1300.

It should be understood that the adhesive component 1900 shown in Figure 1B is only provided in a schematic manner and does not represent the actual appearance of the adhesive component 1900. Details about the adhesive component 1900 will be related to Figures 4A to 4B later. Detailed description.

The structure and assembly process of the optical imaging module 1000 will be described in detail below. Figures 3A to 3B respectively show a schematic diagram of one of the assembly processes of the optical imaging module 1000, in which the first conductive element 1610 and the second conductive element 1620 are installed on the circuit component 1400 through surface mount technology (SMT).

As shown in FIG. 3A , the first conductive element 1610 includes a first connecting portion 1611 and a first setting portion 1612 . The second conductive element 1620 includes a second connection part 1621 and a second setting part 1622.

According to some embodiments of the present disclosure, the first connecting portion 1611 of the first conductive element 1610 is perpendicular to the first setting portion 1612. The second connecting portion 1621 of the second conductive element 1620 is perpendicular to the second setting portion 1622 . The first setting portion 1612 of the first conductive element 1610 and the second setting portion 1622 of the second conductive element 1620 are parallel to the circuit component 1400 .

As shown in Figure 3B, the first conductive element 1610 and the second conductive element 1620 are mounted on the upper surface 1410 of the circuit component 1400 through surface mount technology (SMT). Specifically, the surface mount technology includes printing solder paste on the solder pads (not shown) on the circuit component 1400 using, for example, a solder paste printer, and then placing the first conductive element 1610 and the second conductive element using, for example, a mounting machine (Mount). The component 1620 is then reflowed to melt the solder paste, so that the first conductive component 1610 and the second conductive component 1620 are combined with the circuit component 1400 and electrically connected to each other to complete the assembly technology.

Figures 3C to 3D respectively show a schematic diagram of one of the assembly processes of the optical imaging module 1000, in which the circuit component 1400 is locked to the housing 1300 through the fastener 1700. From Figure 3C and Figure 3D, you can see the housing 1300 and the circuit component 1400 which are inverted relative to the optical imaging module 1000 in Figure 1A.

As shown in FIG. 3C , the two openings 1430 located at opposite corners of the circuit member 1400 are respectively aligned with the two openings 1321 located at opposite corners of the housing 1300 . The fastener 1700 passes through the opening 1430 of the circuit member 1400 and the opening 1321 of the housing 1300 sequentially through the lower surface 1420 side of the circuit member 1400 to fix the circuit member to the housing 1300. From the 3D figure, the circuit component 1400 assembled into the housing 1300 and the connector 1800 for connecting to an external circuit (not shown) can be seen.

Figures 4A to 4B respectively show a schematic diagram of one of the assembly processes of the optical imaging module 1000, in which the housing 1300 is glued for subsequent jointing. Figure 4A shows the half-assembled semi-finished optical imaging module 1000 of Figure 3C and the dispensing needle 2000 of a dispensing machine (not shown) used for dispensing glue. As shown in Figures 4A to 4B, the adhesive component 1900 is applied to the adhesive portion 1311 of the housing 1300 through the dispensing needle 2000.

Figures 4C to 4D respectively show schematic diagrams of one of the assembly processes of the optical imaging module 1000, in which the lens assembly 1100 is bonded to the housing 1300 using an active alignment (AA) process. Specifically, the active alignment process is a technology used to determine the relative position of components during assembly.

As shown in Figure 4C, the lens assembly 1100 is joined to the semi-finished product of the optical imaging module 1000 shown in Figure 4B through a machine clamp 3000. Figure 4D shows a cross-sectional view of the assembled optical imaging module 1000. As shown in FIG. 4D , the joint portion 1121 of the lens assembly 1100 is joined to the bonding portion 1311 of the housing 1300 via the adhesive element 1900 .

As shown in FIG. 4D , the first connection portion 1611 of the first conductive element 1610 of the assembled optical imaging module 1000 is electrically connected to the positive contact portion 1131 of the lens assembly 1100 . The second connecting portion 1621 of the second conductive element 1620 of the assembled optical imaging module 1000 is electrically connected to the negative contact portion 1132 of the lens assembly 1100 .

To sum up, the present invention discloses an optical imaging module. The optical imaging module has a heating coil that can be used for defrosting, so that it can be used in extreme environments (for example, high-latitude cold zones, high-altitude areas). Different from the conventional technology that uses wires to provide external power supply to the lens assembly, the present invention provides an improved optical imaging module that directly electrically connects the lens assembly from the inside through conductive elements, thereby providing a reliable power supply method and reducing the need for This eliminates the risk of rupture or disconnection due to high and low temperature differences or harsh vibration environments when using externally connected wires in the conventional technology. In addition, the new optical image module of the present invention can be produced using an automated active alignment (AA) focusing machine, without the need for extra manpower to plug in connectors and glue to fix the wires used in the conventional technology. In this way, the manufacturing process of the optical imaging module is simplified and has cost advantages.

Although the present invention has been shown and described with respect to one or more embodiments, equivalents and modifications will occur to those of ordinary skill in the art upon reading and understanding this specification and the accompanying drawings. Additionally, while specific features of the invention may have been disclosed with respect to only one of several embodiments, such features may be combined with one or more of the other embodiments as may be desirable and advantageous for any given or particular application. Other combinations of features.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular form "a, an, the" is intended to include the plural form as well, unless the context clearly indicates otherwise. In addition, the terms "including, includes", "having, has, with" or their variations are used in the embodiments and/or patent claims, and such terms are intended to be replaced by similar terms "including" way included.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art. In addition, terms such as those defined in commonly used dictionaries should be read to have a meaning consistent with their meaning in the context of the relevant technical field and will not be read as an idealized or overly formal meaning unless expressly defined herein.

1000: Optical imaging module 1100: Lens assembly 1110: upper part 1120: Annular part 1121:Joint 1130:lower part 1131: Positive electrode contact part 1132: Negative electrode contact part 1200: coil 1300: Shell 1310: Bearing part 1311: Adhesive part 1320:Base 1321:Open your mouth 1400:Circuit components 1410: Upper surface 1420: Lower surface 1430:Open your mouth 1500: Photosensitive element 1610: First conductive element 1611:First connection part 1612:First setting department 1620: Second conductive element 1621: Second connection part 1622:Second Setup Department 1700: Fasteners 1800:Connector 1900: Adhesive components 2000: Dispensing needle 3000:Machine gripper

The present disclosure will be better understood from the following description of the embodiments in conjunction with reference to the accompanying drawings. Figure 1A shows a perspective view of an optical imaging module according to some embodiments of the present disclosure. Figure 1B shows an exploded view of an optical imaging module according to some embodiments of the present disclosure. Figure 2 shows a perspective view of a lens assembly according to some embodiments of the present disclosure. Figures 3A and 3B respectively show a schematic diagram of one of the assembly processes of the optical imaging module, in which the first conductive element and the second conductive element are installed on the circuit component through surface-mount technology (SMT). Figure 3C and Figure 3D respectively show a schematic diagram of one of the assembly processes of the optical imaging module, in which the circuit components are locked to the casing through fasteners. Figure 4A and Figure 4B respectively show a schematic diagram of one of the assembly processes of the optical imaging module, in which the shell is dispensed for subsequent joining. Figure 4C and Figure 4D respectively show a schematic diagram of one of the assembly processes of the optical imaging module, in which the lens assembly is bonded to the housing using an Active Alignment (AA) process. The disclosure is susceptible to various modifications and alternative forms. Representative embodiments have been shown, by way of example, in the drawings and will be described in detail herein. It should be understood, however, that the invention is not intended to be limited to the particular forms disclosed. Rather, the disclosure is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention as defined by the patent claims.

1000: Optical imaging module

1100: Lens assembly

1110: upper part

1120: Annular part

1130:lower part

1131: Positive electrode contact part

1132: Negative electrode contact part

1200: coil

1300: Shell

1310: Bearing part

1311: Adhesive part

1320:Base

1400:Circuit components

1410: Upper surface

1420: Lower surface

1430:Open your mouth

1500: Photosensitive element

1610: First conductive element

1620: Second conductive element

1700: Fasteners

1800:Connector

1900: Adhesive components

Claims (10)

An optical imaging module including: A lens assembly includes a positive contact part and a negative contact part; A housing, wherein the lens assembly is disposed on the housing; a circuit component fixed on the housing; and A first conductive element and a second conductive element are disposed on the circuit component, wherein the first conductive element contacts and is electrically connected to the positive contact portion, and the second conductive element contacts and is electrically connected to the negative contact portion. The optical imaging module of claim 1, wherein the first conductive element includes a first setting part and a first connecting part, the first setting part is perpendicular to the first connecting part, and the first setting part is parallel to the Circuit components. The optical imaging module of claim 2, wherein the second conductive element includes a second setting part and a second connecting part, the second setting part is perpendicular to the second connecting part, and the second setting part is parallel to the Circuit components. The optical imaging module of claim 3 further includes a photosensitive element disposed on the circuit component, wherein the first setting portion of the first conductive element and the second setting portion of the second conductive element are disposed on the Opposite sides of the circuit component relative to the photosensitive element. The optical imaging module of claim 1 further includes an adhesive component applied between the lens component and the housing to join the lens component to the housing. The optical image module of claim 1, wherein the lens assembly further includes a lower portion including the positive contact portion and the negative contact portion, and the housing includes a bearing portion to accommodate the lower portion of the lens assembly. The optical imaging module of claim 6, wherein the positive contact part and the negative contact part are respectively positioned on opposite sides of the lower part of the lens assembly. The optical imaging module of claim 1 further includes a connector, the circuit component includes a lower surface facing away from the lens assembly, and the connector is disposed on the lower surface to electrically connect an external circuit. The optical imaging module of claim 1 further includes a photosensitive element, and the circuit component includes an upper surface facing the lens assembly, wherein the first conductive element, the second conductive element and the photosensitive element are all located on the circuit component on the surface. The optical imaging module of claim 1 further includes a fastener, the housing includes an opening, and the circuit component includes an opening, wherein the opening of the housing is aligned with the opening of the circuit component, and the fastener The circuit component is fixed on the housing through the opening of the circuit component and the opening of the housing.

Images