CN216795100U - Camera module, electronic equipment and car - Google Patents

Abstract

The utility model provides a camera module, which comprises a mounting seat, an image sensor and a circuit board, wherein the mounting seat is provided with a plurality of mounting holes; the circuit board is provided with a first top surface and a first bottom surface which are arranged oppositely; the first bottom surface is provided with a first connecting point, and the first connecting point corresponds to a region between the image sensor and the electric connecting piece; the mounting seat comprises a bottom wall and a supporting body protruding from the bottom wall, a first mounting surface is arranged at one end, far away from the bottom wall, of the supporting body, and the first mounting surface comprises a first sub-mounting surface and a second sub-mounting surface; the first sub-mounting surface and the second sub-mounting surface are connected with the first top surface, the first sub-mounting surface is arranged on the periphery of the image sensor in a surrounding mode, and the second sub-mounting surface and the first connecting point are arranged in the thickness direction of the circuit board in a corresponding mode. The utility model also discloses electronic equipment with the camera module and an automobile.

Description

Camera module, electronic equipment and car

Technical Field

The utility model relates to the technical field of imaging devices, in particular to a camera module, electronic equipment and an automobile.

Background

In the camera module in the prior art, if an image sensor mounted on a flexible circuit board needs to be tested and lighted, detection equipment is often needed and connection detection is carried out through an electric connecting piece on the flexible circuit board. However, the electrical connection member on the flexible circuit board is often difficult to fix and has a small thickness, so that the electrical connection member is easily punctured by using a probe to cause damage, and the stable electrical connection process is difficult to ensure, which causes great trouble to the detection process.

SUMMERY OF THE UTILITY MODEL

The utility model provides a camera module, which can solve the problem that a flexible circuit board provided with an image sensor is difficult to detect in the existing camera module.

The utility model provides an electronic device and an automobile.

In order to achieve the purpose, the utility model provides the following technical scheme:

in a first aspect, a camera module is provided, which includes: the device comprises a mounting seat, an image sensor and a circuit board;

the circuit board is provided with a first top surface and a first bottom surface which are arranged oppositely; the image sensor is positioned on the first top surface, the circuit board is also provided with an electric connecting piece, the image sensor and the electric connecting piece are arranged at intervals in a direction parallel to the first bottom surface, the first bottom surface is provided with a first connecting point, the first connecting point is arranged in a region between the image sensor and the electric connecting piece, and the first connecting point is electrically connected with the electric connecting piece; the circuit board further comprises a flexible part, and the electric connector and the first connecting point are both positioned on the flexible part; the mounting seat comprises a bottom wall and a supporting body protruding from the bottom wall, a first mounting surface is arranged at one end, far away from the bottom wall, of the supporting body, and the first mounting surface comprises a first sub-mounting surface and a second sub-mounting surface; the first sub-mounting surface and the second sub-mounting surface are connected with the first top surface, the first sub-mounting surface is arranged on the periphery of the image sensor in a surrounding mode, and the second sub-mounting surface and the first connecting point are arranged in the thickness direction of the circuit board in a corresponding mode.

So set up, first connecting point can replace electric connector detects, first connecting point can by the second installation face of supporter supports and leans on, in the testing process, the testing probe can stabilize with first connecting point contact, very big improvement detection efficiency. The first connecting point is thicker than the electric connecting piece, and is less prone to being punctured and damaged.

In some embodiments, the camera module further includes a main board and an electronic component mounted on the main board, wherein the electronic component is electrically connected to the main board; the mounting seat is arranged on the mainboard, the circuit board is positioned between the mainboard and the mounting seat, the circuit board and the mainboard are arranged at intervals, and the circuit board is electrically connected with the mainboard through the electric connecting piece.

The circuit board with the mainboard interval sets up, can avoid the mainboard and on the mainboard the heat that electronic component will give off transmits for image sensor, and then has avoided the condition of temperature drift to take place, the effectual imaging quality that has improved.

In some embodiments, the main board comprises a second top surface, the second top surface is provided with a second connection point, and the electric connector is connected with the second connection point; the mounting seat further comprises a fixing part, and the fixing part comprises a second mounting surface which is arranged in the same direction as the first mounting surface; in the direction perpendicular to the first mounting surface, the second mounting surface is positioned on one side of the first mounting surface close to the mainboard; the second top surface is connected with the second mounting surface, and the first bottom surface and the second top surface are arranged at intervals.

Through setting up the fixed part can be in the mount pad with certain space is separated to the interval between the mainboard, thereby will the circuit board with the mainboard is spaced apart, makes image sensor not receive the mainboard with the influence that the heat that electronic component gived off brought.

In some embodiments, the two fixing portions are arranged on two opposite sides of the peripheral outer surface of the mounting seat, and the two fixing portions are distributed along a first direction; each fixing part comprises a lug part and lug parts symmetrically arranged about the lug part, the lug parts are distributed along a second direction, and the first direction is vertical to the second direction; the bellying with the one end of keeping away from the diapire of ear is equipped with the second installation face of common formation, the second installation face is the plane.

So set up, set up ear and increased the mount pad with the area of contact of mainboard, the fixed part with ear distributes according to first direction and second direction respectively and can makes the mount pad is in more firm on the second top surface, even also be difficult for taking place the slope under the vibration of high strength.

In some embodiments, the camera module further comprises a filter switcher, wherein the filter switcher comprises a switching part and a driving part; the mounting seat also comprises an accommodating cavity; the accommodating cavity is provided with an installation opening, the switching part is arranged in the accommodating cavity from the installation opening, and the driving part is arranged outside the accommodating cavity.

The driving part is arranged outside the containing cavity, so that the containing cavity is too large, the miniaturization design is facilitated, and the manufacturing difficulty of the mounting seat is also reduced.

In some embodiments, the first bottom surface is provided with a reinforcing plate, and the reinforcing plate is arranged corresponding to the image sensor.

Through setting up the stiffening plate can make the circuit board can be more smooth bear image sensor also provides the basis for image sensor's installation and supports, the stiffening plate can also with image sensor's heat.

In some embodiments, a first positioning column is arranged on the first mounting surface, a notch corresponding to the first positioning column is arranged on the circuit board, and the first positioning column is clamped with the notch.

So set up, help improving the equipment precision of circuit board, avoided image sensor equipment skew's the condition to take place.

In some embodiments, a second positioning column is disposed on the second mounting surface, the main board is provided with a positioning hole, and the second positioning column is inserted into the positioning hole and clamps the mounting base.

By the arrangement, the assembling precision of the circuit board is improved, and the assembling deviation of the mounting seat is avoided.

In a second aspect, an electronic device is provided, which includes a housing and the camera module of the first aspect, and the camera module is disposed in the housing.

Compared with the prior art, the electronic equipment has the same advantages as the camera module, and is not repeated herein.

In a third aspect, an automobile is provided, which includes the electronic device of the second aspect, wherein the electronic device includes a fixing member, and the electronic device is mounted on the automobile through the fixing member.

Compared with the prior art, the automobile has the same advantages as the camera module, and the description is omitted here.

Drawings

In order to more clearly illustrate the technical solution in the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below.

Fig. 1 is a schematic structural diagram of an automobile and an electronic device according to an embodiment of the present application.

FIG. 2 is a schematic structural diagram of an embodiment of a camera module in the electronic device shown in FIG. 1

Fig. 3 is a top exploded view of the camera module shown in fig. 2.

Fig. 4 is a bottom exploded view of the camera module shown in fig. 2.

Fig. 5 is a schematic structural view of the imaging photosensitive assembly shown in fig. 3, in which the first mounting portion is removed from the mounting seat.

Fig. 6 is a schematic structural view of a mount in the image pickup photosensitive assembly shown in fig. 3.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

It will be understood that when an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. As used herein, the terms "left," "right," "upper," "lower," and the like are for purposes of illustration only and do not denote a single embodiment.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the utility model herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model.

It should be noted that the terms "top," "bottom," and the like, as used herein, are used with reference to the orientation of FIG. 2, and do not indicate or imply that the referenced device or element must have a particular orientation, configuration, and operation in a particular orientation, and therefore should not be considered limiting of the present application.

Referring to fig. 1, fig. 1 is a schematic structural diagram of an automobile according to an embodiment of the present disclosure. The automobile 200 is provided with the electronic apparatus 100 having an image pickup function. The electronic device 100 may be an electronic product having a camera function, such as a surveillance camera, a mobile phone, a tablet computer, a notebook computer, a car machine, a point of sale terminal (POS machine for short), or a wearable device. The wearable device may be an intelligent bracelet, an intelligent watch, Augmented Reality (AR) glasses, Virtual Reality (VR) glasses, or the like. In the embodiment of the present application, the electronic device 100 is a monitoring camera, for example, wherein the electronic device 100 is installed on a rearview mirror of the automobile 200, and one end of the electronic device 100 for shooting faces to the front of the automobile 200 to record a driving track or identify a road condition in front.

For convenience of description, it is defined that a width direction of the electronic device 100 is an X-axis direction, a length direction of the electronic device 100 is a Y-axis direction, a thickness direction of the electronic device 100 is a Z-axis direction (not shown), and the X-axis direction, the Y-axis direction, and the Z-axis direction are perpendicular to each other two by two.

In this embodiment, the electronic device 100 includes a housing 10, a fixing member 20, and a camera module 30. The fixing member 20 is disposed on the top of the housing 10, and the fixing member 20 is fixedly connected to the automobile 200 to position the electronic device 100 on the automobile 200. The fixing part 20 can be a colloid, a hook, a clamping structure, a magnetic structure and the like, and the fixing part matched with the colloid can be arranged on the automobile corresponding to different structures, or the colloid is directly adhered to the inside of the automobile, or the colloid is clamped on the rearview mirror; the specific structure of the fixing member 20 is not limited as long as the fixing member can be fixed to the automobile to stabilize the electronic device 100. The camera module 30 is installed in the housing 10, and the housing is provided with a light-transmitting area 201, and the light-transmitting area 201 is used for external light to pass through so as to facilitate the lighting and working of the camera module 30. The camera module 30 collects light outside the electronic device 100 through the light-transmitting area 201 arranged on the housing 10, and after acquiring the light signal, the camera module 30 forms corresponding image data and transmits the image data to the display device in the vehicle.

It should be noted that the camera module 30 shown in fig. 1 is only an optional example in the electronic device 100, that is, the optical axis of the camera module 30 is parallel to the Z axis. In other embodiments, the optical axis direction of the camera module 30 may also be perpendicular to the Z axis, which is not specifically limited in this application.

The camera module 30 according to the present application will be described in detail with reference to the accompanying drawings.

Referring to fig. 2, fig. 3 and fig. 4, fig. 2 is a schematic structural diagram of an embodiment of the camera module shown in fig. 1, and fig. 3 is an exploded top view of the camera module shown in fig. 2. Fig. 4 is a bottom exploded view of the camera module shown in fig. 2.

In the present embodiment, the camera module 30 is of a day and night dual-purpose type, and includes a mounting base 40, a lens 50, a camera module 55, a board mounting module 60, a fixing screw 65 and a filter switcher 70. The lens 50, the camera shooting photosensitive assembly 55 and the filter switcher 70 are all installed on the installation base 40, the installation base 40 and the camera shooting photosensitive assembly 55 are installed on the board-mounted assembly 60, the installation base 40 is fixed with the board-mounted assembly 60 through a fixing screw 65, and the camera shooting photosensitive assembly 55 is located between the installation base 40 and the board-mounted assembly 60, and the following details are provided.

The lens 50 is substantially cylindrical and has an optical axis parallel to the Z axis, and two ends, namely an object side end (end for acquiring light) and an image side end (end where the focal plane is located). The outer peripheral wall of the image side end of the lens 50 is provided with an external thread for being screwed with the mount 40. The optical axis of the image pickup module 30 is the optical axis of the lens 50.

As shown in fig. 3, the filter switcher 70 includes a switching section 71, a driving section 72, and a patch cord 73. The switching part 71 has an infrared cut-off filter and an infrared band-pass filter, so that the camera module 30 can perform imaging in both day and night; the driving unit 72 is used for driving the switching unit 71 to switch the filters, and the patch cord 73 is connected to the driving unit 72 and can supply power to the driving unit 72 and transmit a control command to the driving unit 72. The switching part 71 has a filter hole 711 covered by a filter for passing the imaging light and filtering the corresponding non-imaging light.

Referring to fig. 5 and 6, fig. 5 is a schematic structural view of the photographic photosensitive assembly shown in fig. 3, in which the first mounting portion is removed from the mounting base. Fig. 6 is a schematic structural view of a mount in the image pickup photosensitive assembly shown in fig. 3.

As shown in fig. 4, the mount 40 includes a first mounting portion 41, a second mounting portion 43, a support body 45, and a fixing portion 47. The first mounting part 41 is used for mounting the lens 50, the second mounting part 43 is used for mounting the filter switcher 70, the supporting body 45 is used for mounting the camera shooting photosensitive assembly 55, and the fixing part 47 is used for fixing the mounting seat 40 on the board mounting assembly 60.

The first mounting portion 41 has a cylindrical structure with two open ends, and extends in the Z-axis direction, and the inner wall of the first mounting portion 41 is provided with an internal thread corresponding to the lens 50. The image side end of the lens 50 is mounted in the first mounting portion 41, and is screwed to the first mounting portion 41.

As shown in fig. 5 and 6, the second mounting portion 43 is a substantially hollow square box and is connected to the image side end of the first mounting portion 41. The second mounting portion 43 has a top wall 431 and a bottom wall 432 oppositely arranged in the Z-axis direction, and a peripheral side wall 433 annularly arranged and connected to the top wall 431 and the bottom wall 432; the top wall 431, the bottom wall 432 and the peripheral sidewall 433 enclose a receiving cavity 434. The top wall 431 is provided with a first light passing hole 4311 penetrating the top wall 431 in the optical axis (Z axis) direction. The first mounting portion 41 is mounted on the top wall 431 of the second mounting portion 43, the image side end of the first mounting portion 41 is connected to the top wall 431 and covers the first light-passing hole 4311, the first light-passing hole 4311 is communicated with the first mounting portion 41, and the imaging light of the lens 50 can completely pass through the first light-passing hole 4311. The bottom wall 432 is provided with a second light passing hole 4321 penetrating through the bottom wall 432 in the optical axis (Z axis) direction, the second light passing hole 4321 is opposite to and communicated with the first light passing hole 4311, and the imaging light of the lens 50 can completely pass through the second light passing hole 4321.

The peripheral wall 433 is provided with a mounting opening 4331 communicating with the accommodating chamber 434, and it can be understood that the mounting opening 4331 is a mounting opening of the accommodating chamber 434. The switching part 71 of the optical filter switcher 70 is inserted and installed in the accommodating cavity 434 along the X-axis direction through the installation hole 4331, the driving part 72 is located on the bottom wall 432 and faces the top wall 431, and is located outside the accommodating cavity 434 to cover the installation hole 4331, the surface of the driving part 72 facing the second installation part 43 is abutted to the second installation part 43, so that the driving part 72 is partially located outside the accommodating cavity 434, and is partially located in the accommodating cavity, the overall size of the accommodating cavity 434 can be relatively small, the size of the second installation part 43 can be saved, the miniaturization design of the installation seat 40 is facilitated, and the manufacturing difficulty of the installation seat 40 is also reduced.

The support 45 is a frame structure, and is protruded from the bottom wall 432 of the second mounting portion 43, and the support 45 surrounds the second light passing hole 4321. The support body 45 includes a first frame wall 451 and a second frame wall 452 connected to each other. The first frame wall 451 is a closed loop structure in a direction parallel to the X-Y direction, and a spacer ring is disposed on the outer periphery of the second light passing hole 4321. In the X-axis direction, the second frame wall 452 is located on a side of the first frame wall 451 away from the mounting opening 4331, and the second frame wall 452 is a closed loop structure in a direction parallel to the X-Y direction and has a common side wall with the first frame wall 451.

The support body 45 includes a first mounting surface 453, and the first mounting surface 453 faces away from the second mounting portion 43. The first mounting surface 453 includes a first sub-mounting surface 4531 located on the first frame wall 451, and a second sub-mounting surface 4532 located on the second frame wall 452. The first sub-mounting surface 4531 is provided with two first positioning posts 454 which are symmetrically arranged and extend along the Z-axis direction, and are used for assisting the photographic sensitive assembly 55 to be positioned and mounted on the first mounting surface 453.

The fixing portion 47 includes a protrusion 471 protruding from the peripheral sidewall 433, and an ear 472 extending from two opposite sidewalls of the protrusion 471 along the X-axis direction. The protruding portions 471 are two and are arranged on opposite sides of the second mounting portion 43 along the Y-axis direction. Two ears 472 are provided on two opposite sides of each protrusion 471 in the X-axis direction. The protruding portion 471 is provided with a first mounting hole 473 extending along the Z-axis direction, and the inner hole wall of the first mounting hole 473 is provided with an internal thread, which is threaded and screwed by the fixing screw 65, so as to fix the mounting seats 40 and 60. The fixing portion 47 is provided with a second mounting surface 474. The second mounting surface 474 relatively protrudes from the first mounting surface 453 in the Z-axis direction, and the distance between the first mounting surface 453 and the second mounting surface 474 in the Z-axis direction is larger than the thickness of the image pickup photosensitive assembly 55 in the Z-axis direction. The second mounting surface 474 is provided with a second positioning post 475 protruding from the second mounting surface 474 for positioning and mounting the auxiliary camera mounting base 40 on the board carrier assembly 60. The reinforcing ribs are arranged between the fixing portion 47 and the side wall of the first frame wall 451, so that the overall structural strength of the mounting seat 40 is improved, the probability of deformation of the fixing portion 47 is reduced, and the assembly precision is improved.

Referring to fig. 3 and 4, the image sensor module 55 includes a circuit board 551, a reinforcing plate 552, an image sensor 553, and a first electronic component 554. The image sensor 553 and the first electronic component 554 are disposed on the same side of the circuit board 551, and the stiffener 552 is disposed on the other side of the circuit board 551, as described below.

The circuit board 551 is a strip-shaped flexible circuit board, and includes a first top surface 5511 and a first bottom surface 5512. The reinforcing plate 552 is stacked on one end of the first bottom surface 5512, the image sensor 553 and the first electronic component 554 are both mounted on the first top surface 5511 and are disposed corresponding to the reinforcing plate 552 in the Z-axis direction, and the first electronic component 554 is disposed around the image sensor 553. It should be noted that the reinforcing plate is generally a metal plate, which can improve the structural flatness of the circuit board 551 and can transfer heat dissipated by the image sensor 553 and the first electronic component 554. The other end of the circuit board 551 is provided with an electrical connector, and the electrical connector is positioned on the first top surface 5511 or the first bottom surface 5512; the image sensor 553 and the electrical connection members are spaced apart, and may be both spaced apart from the first top surface, or the electrical connection members are spaced apart from the image sensor 553 at the first bottom surface 5512, that is, the electrical connection members are offset from the image sensor 553 in a direction parallel to the first bottom surface 5512. The electrical connector is a gold finger 5513 for electrically connecting the image pickup photosensitive assembly 55 and the board mounting assembly 60. A first connection point is arranged on the first bottom surface 5512 between the gold finger 5513 and the reinforcing plate 552, the first connection point is a first bonding pad 5514, and the first bonding pad 5514 is electrically connected with the gold finger 5513 and can be used for replacing a gold finger 5513 detection circuit. The image capturing photosensitive assembly 55 further has a notch penetrating through the circuit board 551 and the reinforcing plate 552 for positioning with the first positioning post 454. In this embodiment, the gold finger 5513 may be disposed on both the first top surface 5511 and the first bottom surface 5512, and in other embodiments, the gold finger 5513 may be disposed on the first top surface 5511 or the first bottom surface 5512, which is not limited herein.

It should be noted that the structure of the circuit board 551 is only an implementable manner, and only the circuit board 551 has a flexible portion. For example, the circuit board 551 may also be a flexible-rigid board, and it is only necessary that the image sensor 553 is disposed on the rigid board portion and the electrical connector is disposed on the flexible portion, which is not limited herein.

The first positioning column 454 is correspondingly clamped into the notch of the photographic photosensitive assembly 55 to position the photographic photosensitive assembly 55 between the mounting seats 40, and the first top surface 5511 is attached to the first mounting surface 453 through a colloid a; the first sub-mounting surface 4531 and the periphery of the reinforcing plate 552 are disposed correspondingly in the Z-axis direction, the image sensor 553 and the first electronic component 554 are both packaged in the area surrounded by the first frame wall 451, the optical axis of the lens 50 is perpendicular to the light-sensing surface of the image sensor 553, and the image sensor 553 and the second light-passing hole 4321 are disposed correspondingly in the Z-axis direction so as to receive the imaging light of the lens 50; the second sub-mounting surface 4532 and the first pad 5514 are disposed correspondingly in the Z-axis direction, that is, the first pad 5514 may abut against the second frame wall 452, so that the area where the first pad 5514 is located does not shake or deform during circuit detection; the remaining portion of the wiring board 551 (the portion between the gold finger 5513 and the first pad 5514) is suspended.

It should be noted that, before the gold finger 5513 is fixedly connected to the carrier board assembly 60, the gold finger 5513 is in a suspended state, so that the gold finger 5513 is easily punctured when the camera shooting photosensitive assembly 55 is tested by using a device with a probe; in the detection process, the golden finger 5513 cannot be stabilized, and therefore, disconnection often occurs, so that it is impossible to determine whether the image pickup photosensitive assembly 55 is in a good state. The first bonding pad 5514 is generally a bonding pad disposed on the circuit board 551, which not only has a stable structure, but also has a thickness greater than the thickness of the gold finger 5513 at the corresponding position, so that the first bonding pad cannot be punctured; in addition, the back side of the first pad 5514 is bonded to the second frame wall 452, and the second frame wall 452 can bear the first pad, so that the first pad 5514 is stable in structure and free from shaking, can keep a good contact state with a probe of a detection device, and improves the efficiency of the detection process.

The on-board assembly 60 includes a main board 61 and a second electronic component 62. The main board 61 includes a second top surface 611 and a second bottom surface 612, which are opposite to each other, and a mounting area 6111 for mounting the mounting seat 40 is disposed in the middle of the second top surface 611. The second electronic component 62 is located on the second top surface 611 and the second bottom surface 612, and the second electronic component 62 on the second top surface 611 is disposed around the periphery of the mounting area 6111 to avoid the mounting seat 40. The mounting area 6111 is provided with a second mounting hole 63, a positioning hole 64 and a second connection point corresponding to the gold finger 5513, where the second connection point is a second bonding pad 6112. The second mounting hole 63 penetrates through the second top surface 611 and the second bottom surface 612 and is used for being arranged corresponding to the first mounting hole 473, and the positioning hole 64 penetrates through the second top surface 611 and the second bottom surface 612 and is used for being arranged corresponding to the second positioning column 475.

The second positioning posts 475 are correspondingly inserted into the positioning holes 64, the second mounting surface 474 abuts against the second top surface 611, the fixing screws 65 pass through the second mounting holes 63 from the second bottom surface 612 to the first mounting holes 473, and after the fixing screws 65 are screwed, the mounting base 40 is fixed to the second top surface 611 in the Z-axis direction. The two protruding portions 471 arranged on the two opposite sides of the second mounting portion 43 abut against the main plate 61, so that the degree of freedom of the mounting base 40 in the Y-axis direction can be limited, and the two ear portions 472 arranged on the two opposite sides of each protruding portion 471 in the X-axis direction also abut against the main plate 61, so that the degree of freedom of the mounting base 40 in the X-axis direction can be limited. With the arrangement, the mounting seat 40 is firmly connected with the main board 61, and is not easy to shake. The gold finger 5513 is fixed and electrically connected to the second pad 6112 by thermocompression bonding, so that the image capturing and sensing device 55 can obtain power or transmit data.

It should be noted that, since the second mounting surface 474 protrudes from the first mounting surface 453 in the Z-axis direction, the portions of the camera photosensitive assembly 55 corresponding to the first mounting surface 453 are disposed at intervals with the carrier board assembly 60, and the rest of the camera photosensitive assembly 55 is bent to connect the golden finger 5513 with the main board 61, that is, the portions of the camera photosensitive assembly 55 except the golden finger 5513 are disposed at intervals with the main board 61, so that the camera photosensitive assembly 55 is ensured to be not in contact with the carrier board assembly 60, and temperature drift caused by heat generation of the carrier board assembly 60 when the camera photosensitive assembly 55 images is avoided, thereby improving the imaging quality.

The above description is only a part of the examples and embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present application, and all the changes or substitutions should be covered within the scope of the present application; the embodiments and features of the embodiments of the present application may be combined with each other without conflict. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (10)

1. The utility model provides a module of making a video recording, its characterized in that, the module of making a video recording includes: the device comprises a mounting seat, an image sensor and a circuit board;

the circuit board is provided with a first top surface and a first bottom surface which are arranged oppositely; the image sensor is positioned on the first top surface, the circuit board is further provided with an electric connecting piece, the image sensor and the electric connecting piece are arranged at intervals in a direction parallel to the first bottom surface, the first bottom surface is provided with a first connecting point, the first connecting point is arranged in a region between the image sensor and the electric connecting piece, and the first connecting point is electrically connected with the electric connecting piece; the circuit board further comprises a flexible part, and the electric connector and the first connecting point are both positioned on the flexible part;

the mounting seat comprises a bottom wall and a supporting body protruding from the bottom wall, a first mounting surface is arranged at one end, far away from the bottom wall, of the supporting body, and the first mounting surface comprises a first sub-mounting surface and a second sub-mounting surface;

the first sub-mounting surface and the second sub-mounting surface are connected with the first top surface, the first sub-mounting surface is arranged on the periphery of the image sensor in a surrounding mode, and the second sub-mounting surface and the first connecting point are arranged in the thickness direction of the circuit board in a corresponding mode.

2. The camera module of claim 1, further comprising a motherboard and an electronic component mounted on the motherboard, the electronic component being electrically connected to the motherboard; the mounting seat is arranged on the mainboard, the circuit board is positioned between the mainboard and the mounting seat, the circuit board and the mainboard are arranged at intervals, and the circuit board is electrically connected with the mainboard through the electric connecting piece.

3. The camera module of claim 2, wherein the motherboard includes a second top surface, the second top surface having a second connection point, the electrical connector being electrically connected to the second connection point; the mounting seat further comprises a fixing part, and the fixing part comprises a second mounting surface which is arranged in the same direction as the first mounting surface; in the direction perpendicular to the first mounting surface, the second mounting surface is positioned on one side of the first mounting surface close to the mainboard; the second top surface is connected with the second mounting surface, and the first bottom surface and the second top surface are arranged at intervals.

4. The camera module of claim 3, wherein the two securing portions are disposed on opposite sides of the peripheral outer surface of the mounting base, the two securing portions being distributed along a first direction; each fixing part comprises a lug boss and lug parts symmetrically arranged relative to the lug boss, the lug parts are distributed along a second direction, and the first direction is vertical to the second direction; the bellying with the one end of keeping away from the diapire of ear is equipped with the second installation face of common formation, the second installation face is the plane.

5. The camera module of claim 1, further comprising a filter switcher, the filter switcher comprising a switching portion and a driving portion; the mounting seat also comprises an accommodating cavity; the accommodating cavity is provided with an installation opening, the switching part is arranged in the accommodating cavity from the installation opening, and the driving part is arranged outside the accommodating cavity.

6. The camera module of claim 1, wherein the first bottom surface is provided with a stiffening plate, and the stiffening plate is arranged corresponding to the image sensor.

7. The camera module of claim 1, wherein the first mounting surface is provided with a first positioning column, the circuit board is provided with a notch corresponding to the first positioning column, and the first positioning column is clamped with the notch.

8. The camera module according to claim 3, wherein a second positioning post is disposed on the second mounting surface, the main board has a positioning hole, and the second positioning post is inserted into the positioning hole and holds the mounting base.

9. An electronic device comprising a housing and the camera module of claims 1-8, the camera module being disposed within the housing.

10. An automobile comprising the electronic device of claim 9, wherein the electronic device comprises a fastener, and wherein the electronic device is mounted to the automobile via the fastener.

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