CN112492190B - Electronic device - Google Patents
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- CN112492190B CN112492190B CN202011493061.8A CN202011493061A CN112492190B CN 112492190 B CN112492190 B CN 112492190B CN 202011493061 A CN202011493061 A CN 202011493061A CN 112492190 B CN112492190 B CN 112492190B
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
Abstract
The application discloses electronic equipment, disclosed electronic equipment includes: a housing (100); the display module (200) is arranged on the shell (100), and the display module (200) and the shell (100) form an equipment inner cavity (300); a light sensing chip (400) disposed within the device lumen (300), wherein: the display module assembly (200) comprises a light transmission area, the light transmission area comprises a lens mechanism (200a), and the lens mechanism (200a) and the photosensitive chip (400) are arranged oppositely. The scheme can solve the problem that the overall thickness of the electronic equipment is larger because the camera device of the electronic equipment is arranged below the display device.
Description
Technical Field
The application belongs to the technical field of communication, and particularly relates to an electronic device.
Background
Along with communication technology's development, the user is more and more high to the requirement of making a video recording, and at present, the technical staff is through placing electronic equipment's camera device and taking a picture in the display screen below, and also we common screen following formula camera, this kind of screen following formula camera do not occupy electronic equipment's frame space, can realize super narrow frame, reach higher screen and account for than, better full-face screen effect.
It is known that the thickness of electronic equipment is developed towards the direction of thinning, and the thickness of electronic equipment is difficult to increase at will, but in the existing mode, the camera device of the electronic equipment needs to be placed below the display screen, and the display screen occupies the space originally belonging to the camera device, so that the thickness of the whole machine is thickened, which is contradictory to the demand of thinning and thinning of the electronic equipment.
Disclosure of Invention
The invention discloses electronic equipment, which aims to solve the problem that the overall thickness of the electronic equipment is larger because a camera device of the electronic equipment is arranged below a display device.
In order to solve the problems, the invention adopts the following technical scheme:
an electronic device, comprising:
a housing;
the display module is arranged on the shell, and the display module and the shell form an equipment inner cavity;
locate the sensitization chip of equipment intracavity, wherein:
the display module assembly includes that the printing opacity is regional, the printing opacity is regional including lens mechanism, lens mechanism with sensitization chip sets up relatively.
The technical scheme adopted by the invention can achieve the following beneficial effects:
the electronic equipment that this application embodiment discloses improves through the structure to the electronic equipment among the correlation technique, through installing display module assembly on the casing, be provided with the lens mechanism that can see through ambient light on display module assembly, thereby can ensure that the outside ambient light of casing passes through the inside that lens mechanism enters into the equipment inner chamber that display module assembly and casing formed, because the sensitization chip is placed inside the equipment inner chamber, make the lens mechanism on electronic equipment's the display module assembly can mutually support with the sensitization chip and realize the function of shooing. The electronic equipment disclosed by the embodiment of the application is realized by the partial functional structure of the camera device through the display module, so that the electronic equipment does not need to be additionally provided with the lens mechanism in the inner cavity of the equipment, and the thickness of the whole electronic equipment can be reduced.
Drawings
Fig. 1 is a schematic partial structural diagram of a display module of an electronic device disclosed in an embodiment of the present application;
fig. 2 is a schematic partial structural diagram of a display module of an electronic device disclosed in an embodiment of the present application;
fig. 3 is a schematic partial structural diagram of a display module of an electronic device according to an embodiment of the present disclosure;
fig. 4 is a schematic partial structural diagram of a display module of an electronic device disclosed in an embodiment of the present application;
fig. 5 is a schematic structural diagram of an electronic device disclosed in an embodiment of the present application.
Description of the reference numerals:
100-shell body,
200-display module, 200 a-lens mechanism,
210-first substrate, 211-first lens,
220-second substrate, 221-second lens,
230-a first supporting structural member, 240-a second supporting structural member,
250-light-transmitting cover plate, 251-third lens,
260-polarizer, 261-first mounting hole, 262-fourth lens,
270-light-transmitting glue layer, 271-second mounting hole, 272-fifth lens,
300-an inner cavity of the equipment,
400-photosensitive chip,
500-assembling the connecting piece,
600-a substrate,
700-optical filter.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present application without making any creative effort belong to the protection scope of the present application.
The terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It will be appreciated that the data so used may be interchanged under appropriate circumstances such that embodiments of the application may be practiced in sequences other than those illustrated or described herein, and that the terms "first," "second," and the like are generally used herein in a generic sense and do not limit the number of terms, e.g., the first term can be one or more than one. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/", and generally means that the former and latter related objects are in an "or" relationship.
The display screen and the electronic device provided by the embodiment of the present application are described in detail below with reference to the accompanying drawings through specific embodiments and application scenarios thereof.
As shown in fig. 1 to 5, an electronic device disclosed in the embodiments of the present application includes a housing 100, a display module 200, a device cavity 300, and a photosensitive chip 400.
The housing 100 is a mounting base for various components of the electronic device and also provides protection for the components. The display module 200 is disposed on the casing 100, and specifically, the casing 100 may be formed with a mounting hole, and a part of the structure of the display module 200 is mounted in the mounting hole, and a part of the structure of the display module 200 is exposed outside the casing 100.
Referring to fig. 5, the display module 200 includes a lens mechanism 200a, and the lens mechanism 200a is a lens portion of the electronic device for capturing images, and can cooperate with the photosensitive chip 400 to implement a camera function, and the display module 200 with such a structure can integrate a display device and a camera device of the electronic device, so that an additional independent lens mechanism does not need to be installed on the electronic device, and the thickness of the electronic device does not need to be increased.
Specifically, the display module 200 may be mounted on the housing 100, the display module 200 and the housing 100 form an equipment cavity 300, and other components of the electronic equipment may be mounted inside the equipment cavity 300, and meanwhile, the components in the equipment cavity 300 may be prevented from directly contacting with the external environment.
The electronic equipment that this application embodiment discloses improves through the structure to the electronic equipment in the correlation technique, through installing display module assembly 200 on casing 100, be provided with the lens mechanism 200a that can see through ambient light on display module assembly 200, thereby can ensure that the outside ambient light of casing 100 sees through lens mechanism 200a and enters into the inside of the equipment inner chamber 300 that display module assembly 200 and casing 100 formed, ambient light sees through lens mechanism 200a and reachs sensitization chip 400, thereby acquire the image through sensitization chip 400, realize the function of shooing. The electronic equipment disclosed by the embodiment of the application is realized by the partial functional structure of the camera device through the display module 200, so that the lens mechanism 200a does not need to be additionally arranged in the inner cavity 300 of the equipment, and the thickness of the whole electronic equipment can be reduced.
In the embodiment of the present application, the display module 200 may further include a first substrate 210 and a second substrate 220, the first substrate 210 and the second substrate 220 are sequentially stacked on the photosensitive chip 400, and the first substrate 210 and the second substrate 220 are main supporting members of the display module 200. The area of the first substrate 210 opposite to the light-transmitting area is a first area, the area of the second substrate 220 opposite to the light-transmitting area is a second area, and the first area and the second area are arranged so that ambient light outside the electronic device casing 100 can sequentially pass through the first area and the second area and is finally sensed by the light-sensing chip 400. Wherein the first region may include the first lens 211, and the second region may include the second lens 221; the lens mechanism 200a may include the first lens 211 and the second lens 221, and may also include one of the first lens 211 and the second lens 221.
Since the first substrate 210 and the second substrate 220 are main components of the display module 200, and the first substrate 210 and the second substrate 220 have a relatively large thickness, the first lens 211 or the second lens 221 having a relatively large thickness required in the photographing process can be easily formed in the first region or the second region.
In a further embodiment, the display module 200 may further include a first support structure 230 and a second support structure 240. The second support structure 240 is supported between the edge of the first substrate 210 and the edge of the second substrate 220, so as to realize the spaced arrangement between the first substrate 210 and the second substrate 220, thereby facilitating the arrangement of the display layer of the display module 200 between the first substrate 210 and the second substrate 220.
The first supporting structure 230 is disposed between the first substrate 210 and the second substrate 220, and the first supporting structure 230 is located in an area surrounded by the second supporting structure 240. Specifically, the first support structure 230 may be disposed around the first lens 211 or the second lens 221. Because the arrangement of the first lens 211 can influence the strength of the partial region of the first substrate 210, and at the same time, the arrangement of the second lens 221 can influence the strength of the partial region of the second substrate 220, the first supporting structure 230 is arranged around the first lens 211 and the second lens 221, and can pertinently support the region with influenced strength, thereby avoiding the problem that the first substrate 210 and the second substrate 220 are easily damaged due to large deflection.
The first supporting structure 230 may be attached to the portions of the first substrate 210 and the second substrate 220, which are in contact with each other, by means of an attaching method, so that the first supporting structure 230 may be stably fixed between the first substrate 210 and the second substrate 220. The structure of the first supporting structure 230 may be various, and in an alternative, the first supporting structure 230 and the second supporting structure 240 may be an insulating adhesive, such as a photo-curing adhesive, a thermal-curing adhesive, or the like.
Meanwhile, the second support structure 240 is supported between the edge of the first substrate 210 and the edge of the second substrate 220, and the first support structure 230 is located in the area surrounded by the second support structure 240, so that the flexible deformation of the first substrate 210 and the second substrate 220 can be better alleviated.
In an alternative, the first support structure 230 is a cylindrical light blocking member. The tube-shape light-blocking piece can ensure that the ambient light passing through the second substrate 220 does not pass through the first supporting structural member 230, and can prevent light in other directions from entering the light-transmitting area through the first supporting structural member 230, so that the light sensitivity of the light-sensing chip 400 is affected, and meanwhile, the tube-shape structure of the tube-shape light-blocking piece can enable the stress of the parts of the first substrate 210 and the second substrate 220 contacting with the first supporting structural member 230 to be uniform.
As described above, a part of the structure of the display module 200 is exposed on the outer surface of the casing 100, in a further embodiment, the display module 200 may further include a light-transmitting cover plate 250 exposed on the outer surface of the electronic device, the light-transmitting cover plate 250 is located outside the display module 200, so as to perform a protection function, and meanwhile, ambient light outside the casing 100 may enter the device cavity 300 through the light-transmitting cover plate 250 and is finally sensed by the light-sensing chip 400. Specifically, the light-transmitting cover plate 250 may be fixed by an optical adhesive layer.
As mentioned above, the display module 200 includes the light-transmissive region, and in an alternative, a region of the outer surface of the light-transmissive cover 250 opposite to the light-transmissive region is used as a third region, the third region includes the third lens 251, and the lens mechanism 200a includes the third lens 251. Specifically, the third area of the transparent cover plate 250 may be processed into a lens shape required by the lens mechanism 200a, that is, the third lens 251, by etching (exposure or development etching) or laser processing. Under this kind of condition, the outside ambient light of electronic equipment can see through inside third lens 251 enters into equipment inner chamber 300, is sensitization by sensitization chip 400 at last to the function of shooing is realized, through the mode to lens mechanism 200a increase third lens 251, makes display module assembly 200's grading function more perfect, the requirement is shot in satisfying that can be better.
In a further technical solution, the display module 200 may further include a polarizer 260, the polarizer 260 is disposed between the transparent cover 250 and the second substrate 220, a first mounting hole 261 is formed in a region of the polarizer 260 opposite to the transparent region, the fourth lens 262 is mounted in the first mounting hole 261, and the lens mechanism 200a includes the fourth lens 262. The polarizer 260 is an important component of the display module 200, and the polarizer 260 can perform a polarization function, so that the display function of the display module 200 is better. The fourth lens 262 is attached to the polarizer 260 by opening the first attachment hole 261, so that the light distribution performance of the lens mechanism 200a can be improved.
In an optional scheme, the polarizer 260 may be provided with a first mounting hole 261, and a fourth lens 262 is mounted in the first mounting hole 261, and in an optional manner, a transparent ultraviolet glue (for example, a curing glue) may be fixed on a hole wall of the first mounting hole 261 of the polarizer 260 in a dispensing manner, and the fourth lens 262 may be fixed on the polarizer 260 in a bonding manner.
In a further embodiment, the polarizer 260 may be bonded to the second substrate 220 and the transparent cover plate 250 through the transparent adhesive layer 270, that is, the transparent adhesive layer 270 has a bonding effect, and the transparent adhesive layer 270 may be bonded between the inner side of the polarizer 260 and the inner side of the transparent cover plate 250.
In a further technical solution, a region of the light-transmitting adhesive layer 270 opposite to the light-transmitting region may be provided with a second mounting hole 271, the fifth lens 272 is mounted in the second mounting hole 271, and the lens mechanism 200a includes the fifth lens 272. The fifth lens 272 is disposed on the light-transmitting adhesive layer 270, so that the light distribution performance of the lens mechanism 200a can be better.
In an alternative scheme, the first substrate 210 includes a first lens 211, the second substrate 220 includes a second lens 221, the transparent cover 250 includes a third lens 251, the polarizer 260 is installed with a fourth lens 262, the transparent adhesive layer 270 is installed with a fifth lens 272, and the lens mechanism 200a includes the first lens 211, the second lens 221, the third lens 251, the fourth lens 262, and the fifth lens 272, so as to form a strong light distribution mechanism, which is beneficial to improving the quality of an image formed after the photosensitive chip 400 is photosensitive.
Referring to fig. 5, in a specific implementation manner, the first lens 211, the second lens 221, and the fourth lens 262 have the same bending direction and are disposed toward the photosensitive chip 400, and the third lens 251 and the fifth lens 272 have the same bending direction and are disposed away from the polarizer 260.
In an alternative scheme, the positions of the first substrate 210, the second substrate 220, the polarizer 260, the transparent adhesive layer 270, and the transparent cover plate 250, which are opposite to the photosensitive chip 400, are etched, so that the lens portion of the camera is integrated in the display module 200 in the area, thereby effectively reducing the overall thickness of the electronic device.
In this embodiment, the electronic device may further include an assembly connector 500, the assembly connector 500 may be in a cylindrical shape or in other shapes, and the photosensitive chip 400 may be connected to the inner surface of the display module 200 through the assembly connector 500, and specifically, two ends of the assembly connector 500 may be respectively attached to the lower surface of the first substrate 210 and the upper surface of the photosensitive chip 400 in an adhesion manner. The assembly connector 500 may be a field deformable structure (e.g., a shape memory alloy), but may also be a cured adhesive, or other devices capable of performing the same function, and the embodiment of the present invention is not limited to the specific type of the assembly connector 500.
Under assembly connector 500 is the condition of field deformation structure, assembly connector 500 can be through drive sensitization chip 400 to the direction removal of being close to or keeping away from display module assembly 200, and then can adjust the distance between first lens 211 and the sensitization chip 400, in the electronic equipment in-process of shooing, the effect of focusing can be played, and simultaneously, assembly connector 500 has the supporting role, make sensitization chip 400 and display module assembly 200 can not direct contact, thereby protection sensitization chip 400 can not damage, has a dual-purpose function of thing.
In an optional scheme, assembly connector 500 can be the tube-shape structure, plays the effect of support, and assembly connector 500 can also be arranged in sealed space with display module assembly 200 and sensitization chip 400 formation sealed space sensitization face of sensitization chip 400 to avoid falling the dirt, and then can ensure better and shoot the quality.
In one particular embodiment, the assembly connector 500 may be an electro-deformable structure. The assembly connector 500 may be electrically connected to a circuit board of an electronic device through a conductive structure in a connection hole of the filter 700, and the assembly connector 500 may drive the photosensitive chip 400 to move toward or away from the display module 200 in a power-on state, so that a distance between the photosensitive chip 400 and the display module 200 is changed. By the mode, when a user uses the electronic equipment to take a picture, focusing is more convenient and quicker, and a picture required by the user is shot.
In another optional scheme, the number of the assembly connectors 500 is one, and the assembly connectors are cylindrical structural members, at least one sixth lens is arranged in an inner cavity of each cylindrical structural member, and the lens mechanism 200a may include the sixth lens, in which case, the inner space of the assembly connectors 500 can be fully utilized to add the lenses, and further, the light distribution performance can be further improved.
In a further technical scheme, electronic equipment can also include base plate 600, and photosensitive chip 400 sets up on base plate 600, and photosensitive chip 400 is located between base plate 600 and the display module assembly 200, and assembly connector 500 connects between display module assembly 200 and base plate 600, and photosensitive chip 400 passes through base plate 600 and is connected with assembly connector 500 electricity. That is to say, the photosensitive chip 400 is disposed on the substrate 600, the assembly connector 500 is connected between the display module 200 and the substrate 600, and the display module 200 is fixed on the assembly connector 500, so that the electronic device is compactly mounted between the components inside the electronic device, and the electronic device occupies less space, thereby reducing the thickness of the whole electronic device. The substrate 600 may be a circuit board, in which case the substrate 600 may not only perform a supporting function but also perform a power supplying function.
In a further technical solution, the electronic device may further include a filter 700, the filter 700 is provided with a connection hole, the connection hole has a conductive structure therein, and can be electrically connected to the assembly connector 500, and the filter 700 is attached to the substrate 600 and covers the light sensing chip 400. The optical filter 700 can adjust the ambient light passing through the first substrate 210, filter out stray light, and finally sense light by the photosensitive chip 400, so that the ambient light sensed by the photosensitive chip 400 is better, and the imaging effect of the electronic device is best. Specifically, the filter 700 may be an infrared filter.
The utility model provides a preferred scheme, light filter 700 can all cover the surface that is close to sensitization chip 400 one side at first base plate 210, with light filter 700 and sensitization chip 400 fixed connection, light filter 700 and assembly connector 500 fixed connection, through this kind of packaging method, make sensitization chip 400, stable in structure between assembly connector 500 and the light filter 700, and simultaneously, the packaging structural style together, in electronic equipment's installation, convenient and fast more, can improve production efficiency simultaneously, and the production cost is reduced, moreover, the protection of light filter 700 to sensitization chip 400 can be realized to this kind of structure.
The electronic device disclosed in the embodiment of the present application may be a smart phone, a tablet computer, an electronic book reader, a wearable device (e.g., a smart watch), an electronic game machine, and the like, and the specific kind of the electronic device is not limited in the embodiment of the present application.
While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to the precise embodiments described above, which are meant to be illustrative and not restrictive, and that various changes may be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (8)
1. An electronic device, comprising:
a housing (100);
the display module (200) is arranged on the shell (100), and the display module (200) and the shell (100) form an equipment inner cavity (300);
a light sensing chip (400) disposed within the device lumen (300), wherein:
the display module (200) comprises a light-transmitting area, the light-transmitting area comprises a lens mechanism (200a), the lens mechanism (200a) is arranged opposite to the photosensitive chip (400),
the display module (200) comprises a first substrate (210) and a second substrate (220), wherein the first substrate (210) and the second substrate (220) are sequentially overlapped on the photosensitive chip (400), the area of the first substrate (210) opposite to the light-transmitting area is a first area, the area of the second substrate (220) opposite to the light-transmitting area is a second area, and the first area and the second area are respectively arranged on the first substrate (210) and the second substrate (220), wherein:
the first region comprises a first lens (211), and/or the second region comprises a second lens (221); the lens mechanism (200a) comprises the first lens (211) and/or the second lens (221),
the display module (200) further comprises a first supporting structural part (230), the first supporting structural part (230) is arranged between the first substrate (210) and the second substrate (220), the first supporting structural part (230) surrounds the first lens (211) and/or the second lens (221), and the first supporting structural part (230) is a cylindrical light blocking part.
2. The electronic device of claim 1, wherein the display module (200) further comprises a second support structure (240), the second support structure (240) being supported between an edge of the first substrate (210) and an edge of the second substrate (220), the first support structure (230) being located within an area surrounded by the second support structure (240).
3. The electronic device according to claim 1, wherein the display module (200) comprises a light-transmissive cover plate (250) exposed to an outer surface of the electronic device, an area of the outer surface of the light-transmissive cover plate (250) opposite to the light-transmissive area is a third area, the third area comprises a third lens (251), and the lens mechanism (200a) comprises the third lens (251).
4. The electronic device according to claim 3, wherein the display module (200) further comprises a polarizer (260), the polarizer (260) is disposed between the transparent cover plate (250) and the second substrate (220), a first mounting hole (261) is opened in a region of the polarizer (260) opposite to the transparent region, a fourth lens (262) is mounted in the first mounting hole (261), and the lens mechanism (200a) comprises the fourth lens (262).
5. The electronic device according to claim 4, wherein the polarizer (260) is bonded to the second substrate (220) and the transparent cover (250) through a transparent adhesive layer (270), a second mounting hole (271) is opened in a region of the transparent adhesive layer (270) opposite to the transparent region, a fifth lens (272) is mounted in the second mounting hole (271), and the lens mechanism (200a) includes the fifth lens (272).
6. The electronic device of claim 1, further comprising an assembly connector (500), wherein the photo sensor chip (400) is connected to an inner surface of the display module (200) through the assembly connector (500), the assembly connector (500) is a field-induced deformation structure, and the assembly connector (500) can drive the photo sensor chip (400) to move toward or away from the display module (200) in a power-on state.
7. The electronic device according to claim 6, further comprising a substrate (600), wherein the photosensitive chip (400) is disposed on the substrate (600), the photosensitive chip (400) is located between the substrate (600) and the display module (200), the assembly connector (500) is connected between the display module (200) and the substrate (600), and the photosensitive chip (400) is electrically connected to the assembly connector (500) through the substrate (600).
8. The electronic device of claim 7, further comprising a filter (700), wherein the filter (700) is attached to the substrate (600) and covers the photosensitive chip (400).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202011493061.8A CN112492190B (en) | 2020-12-17 | 2020-12-17 | Electronic device |
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| CN202011493061.8A CN112492190B (en) | 2020-12-17 | 2020-12-17 | Electronic device |
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| CN112492190B true CN112492190B (en) | 2022-08-19 |
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| CN114125233A (en) * | 2021-11-19 | 2022-03-01 | 维沃移动通信有限公司 | Electronic device |
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| CN110213465A (en) * | 2019-04-24 | 2019-09-06 | 维沃移动通信有限公司 | A kind of display module and terminal |
| CN111031155A (en) * | 2019-12-11 | 2020-04-17 | 上海传英信息技术有限公司 | Display device |
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| CN112492190A (en) | 2021-03-12 |
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