CN217424559U

CN217424559U - Card type thermal imaging system

Info

Publication number: CN217424559U
Application number: CN202221060279.9U
Authority: CN
Inventors: 蔡伟明; 陈闰; 林泽强; 胡明; 周伟坚
Original assignee: Uni Trend Technology China Co Ltd
Current assignee: Uni Trend Technology China Co Ltd
Priority date: 2022-05-05
Filing date: 2022-05-05
Publication date: 2022-09-13
Anticipated expiration: 2032-05-05

Abstract

The utility model belongs to the technical field of thermal imaging equipment, especially, relate to a card formula thermal imager, include: the PCB and the camera shooting assembly; an FPGA chip is integrated on the PCB; and the subassembly of making a video recording includes sensor seat, the unit of making a video recording, blotter and camera lens enclosing cover, sensor seat with the PCB board is connected, the unit of making a video recording is arranged in the sensor seat and with PCB board electric connection, the blotter set up in the sensor seat on and with the unit contact of making a video recording, the camera lens enclosing cover passes the blotter and with the sensor seat is connected. According to the thermal imager, the camera shooting unit is arranged in the sensor seat, so that the structural stability and the protectiveness of the camera shooting unit in the thermal imager are improved, and the cushion pad is arranged between the camera shooting unit and the outer cover of the lens, so that the protection capability of the camera shooting unit is further improved.

Description

Card type thermal imaging system

Technical Field

The application relates to the technical field of thermal imagers, in particular to a card type thermal imager.

Background

At present, with the development of science and technology, the field of equipment detection, in particular to the equipment detection of an electric power system, is more and more modernized and automated. The demand for commonly used inspection equipment, such as thermal imagers, is also increasing. Most of the existing thermal imagers are gun-shaped and inconvenient to carry, so that a more miniaturized and intelligent card-type thermal imager appears on the market.

In the process of implementing the technical solution in the embodiment of the present application, the inventor of the present application finds that the above-mentioned technology has at least the following technical problems:

at the miniaturized in-process of equipment, current card formula thermal imager is not enough to the protection of the module of making a video recording, causes the module of making a video recording to damage easily.

It is to be noted that the information disclosed in the above background section is only for enhancement of understanding of the background of the present disclosure, and thus may include information that does not constitute prior art known to those of ordinary skill in the art.

SUMMERY OF THE UTILITY MODEL

In view of at least one of the above technical problems, the application provides a card type thermal imager, has solved card type thermal imager at the miniaturized in-process of equipment, to the not enough problem of protection of the module of making a video recording.

According to an embodiment of a first aspect of the present application, there is provided a thermal card imager, comprising: the PCB and the camera shooting assembly;

an FPGA chip is integrated on the PCB; and

the camera shooting assembly comprises a sensor seat, a camera shooting unit, a buffering pad and a lens outer cover, wherein the sensor seat is connected with the PCB, the camera shooting unit is arranged in the sensor seat and electrically connected with the PCB, the buffering pad is arranged on the sensor seat and is in contact with the camera shooting unit, and the lens outer cover penetrates through the buffering pad and is connected with the sensor seat.

In one implementation manner, a bearing seat is arranged at one end, facing the PCB, of the sensor seat, a first accommodating cavity is formed between the bearing seat and the sensor seat, and a second accommodating cavity communicated with the first accommodating cavity is arranged at one end, facing away from the PCB, of the sensor seat;

the camera shooting unit comprises a camera shooting module and a shutter which are respectively electrically connected with the PCB, one part of the camera shooting module is arranged in the first accommodating cavity, the other part of the camera shooting module is arranged in the second accommodating cavity and extends into the shutter, and the shutter is arranged in the second accommodating cavity.

In one implementation mode, a positioning bracket is arranged between the shutter and the buffer cushion, a fixing part is formed on the positioning bracket in a bending mode, and the outer lens cover penetrates through the positioning bracket;

be provided with the holding on the cushion the third holding chamber of fixed part, the cushion is gone up dorsad the locating support one end is provided with the installation department, the installation department with third holding chamber intercommunication, be provided with silicon lens in the installation department, silicon lens's axis with the axis of shutter, the axis of the module of making a video recording overlap.

In one implementation mode, a positioning column is arranged on one end, facing the PCB, of the lens outer cover, a threaded hole is formed in the positioning column, and the positioning column penetrates through the positioning support, the buffer cushion and the sensor seat;

the bearing seat is connected with the positioning column through a positioning screw.

In one implementation mode, first mounting holes are arranged on the sensor seat and positioned on two sides of the second accommodating cavity in a penetrating manner; a second mounting hole is formed in the positioning bracket corresponding to the first mounting hole; a third mounting hole is formed in the buffer pad corresponding to the second mounting hole; a fourth mounting hole is formed in the bearing seat corresponding to the first mounting hole;

the positioning column sequentially penetrates through the third mounting hole, the second mounting hole and the first mounting hole, and the positioning screw penetrates through the fourth mounting hole and is connected with the threaded hole.

The embodiment of the application has the following technical effects: the thermal imager provided by the application has the advantages that the camera shooting unit is arranged in the sensor seat, the structural stability and the protectiveness of the camera shooting unit in the thermal imager are improved, and the cushion pad is arranged between the camera shooting unit and the outer cover of the lens, so that the protection capability of the camera shooting unit is further improved.

The present invention will be further explained with reference to the drawings and the embodiments.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on the drawings without creative efforts.

Fig. 1 is an exploded structure schematic diagram of a PCB board and a camera assembly of a card-type thermal imager in an embodiment of the application;

fig. 2 is an exploded view of a camera module in an embodiment of the present application;

fig. 3 is a first structural view of a sensor receptacle according to an embodiment of the application;

fig. 4 is a second structural view of the sensor receptacle according to an embodiment of the application;

Detailed Description

In order to make the aforementioned objects, features and advantages of the present application more comprehensible, embodiments accompanying figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. This application is capable of embodiment in many different forms than those described herein and those skilled in the art will be able to make similar modifications without departing from the spirit of the application and therefore the application is not limited to the specific embodiments disclosed below.

In the description of the present application, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on those shown in the drawings, merely for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and therefore, are not to be construed as limiting the present application.

In the description of the present application, it is to be understood that the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or as implying that the number of indicated technical features is indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the embodiments of the present application, unless otherwise explicitly stated or limited, the terms "mounted," "connected," "fixed," and the like are to be construed broadly, e.g., as being fixedly connected, detachably connected, or integrated; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. Specific meanings of the above terms in the embodiments of the present invention can be understood by those of ordinary skill in the art according to specific situations.

At present, thermal imagers on the market are all based on ISP chips, and when thermal imaging measurement is carried out, the algorithms carried by the ISP chips are used for image transmission and processing, so that high-quality thermal imaging is obtained.

According to the card type thermal imager, the FPGA chip is used for processing thermal imaging data, and the strong operational capability and the parallel capability of the FPGA are used for outputting high-quality thermal imaging images. Compared with the use of an ISP chip, the FPGA chip has the advantage of low power consumption. The FPGA chip has strong operational capability, so that a high-performance MPU is not required to be configured, only a low-cost MCU is required to be used as a main control unit, and the FPGA chip is more flexible in processing image data and can introduce a custom algorithm.

In addition, the card formula thermal imaging system of this application embodiment, simple structure, production convenient assembling can also effectively protect the module of making a video recording, specifically for through setting up the unit of making a video recording in the sensor seat, promotes the structural stability and the protectiveness of the unit of making a video recording in the thermal imaging system to be provided with the blotter between the unit of making a video recording, camera lens enclosing cover, further promote the protective capacities to the unit of making a video recording. The following will describe the card thermal imager in the embodiment of the present application.

Fig. 1 is an exploded structural schematic view of a PCB board and a camera assembly of a card thermal imager in an embodiment of the application. Fig. 2 is an exploded view of the camera module in the embodiment of the present application. As shown in fig. 1 and fig. 2, an embodiment of a first aspect of the present application provides a thermal card imager, including: a PCB board 100 and a camera assembly 200;

an FPGA chip is integrated on the PCB 100.

In the present embodiment, a clearance groove 110 is formed on the PCB 100 for accommodating a protruding portion of the camera module 200 in the clearance groove 110, so that the camera module 200 is more attached to the PCB 100. Two first connection holes 120 are provided on the PCB 100, and connection screws are provided in the first connection holes 120 to fix the camera module 200 on the PCB 100.

The camera module 200 includes a sensor holder 210, a camera unit, a buffer pad 230 and a lens cover 240, the sensor holder 210 is connected to the PCB board 100, the camera unit is disposed in the sensor holder 210 and electrically connected to the PCB board 100, the buffer pad 230 is disposed on the sensor holder 210 and contacts the camera unit, and the lens cover 240 penetrates the buffer pad 230 and is connected to the sensor holder 210.

In this embodiment, the camera assembly 200 is a detachable structure, which is beneficial to the production and assembly of the thermal imager. When the camera module 200 is assembled, the camera unit is first mounted and fixed on the sensor base 210, and then the cushion pad 230 and the lens outer cover 240 are connected to integrate the camera module 200, then the camera module 200 and the PCB 100 are connected, and finally the camera unit is electrically connected to the PCB 100.

The sensor holder 210 is provided with a second connection hole 213 corresponding to the first connection hole 120, and a connection screw passes through the first connection hole 120 from bottom to top and is placed in the second connection hole 213 of the sensor holder 210, thereby fixedly connecting the PCB 100 to the sensor holder 210. Therefore, the sensor base 210 is simply connected with the PCB 100, and is of a detachable structure, thereby facilitating subsequent installation and maintenance.

In addition, the lens cover 240 and the housing of the thermal imager are not an integral structure, which facilitates the installation of the camera module 200 on one hand and facilitates the subsequent maintenance of the thermal imager on the other hand.

In further embodiments, fig. 3 is a first schematic structural view of the sensor receptacle 210 according to an embodiment of the present application, and fig. 4 is a second schematic structural view of the sensor receptacle 210 according to an embodiment of the present application. As shown in fig. 1 to 4, a bearing seat 250 is disposed on one end of the sensor seat 210 facing the PCB 100, a first receiving cavity 211 is formed between the bearing seat 250 and the sensor seat 210, and a second receiving cavity 212 communicated with the first receiving cavity 211 is disposed on one end of the sensor seat 210 facing away from the PCB 100;

the camera shooting unit comprises a camera shooting module 221 and a shutter 222 which are respectively electrically connected with the PCB 100, wherein one part of the camera shooting module 221 is arranged in the first accommodating cavity 211, the other part of the camera shooting module 221 is arranged in the second accommodating cavity 212 and extends into the shutter 222, and the shutter 222 is arranged in the second accommodating cavity 212.

In the present embodiment, the supporting base 250 has a protrusion 251, the protrusion 251 has a frame-shaped structure 252, and a portion of the camera module 221 is disposed on the frame-shaped structure 252 of the protrusion 251 to stabilize the camera module 221. The frame structure 252 is matched with a portion of the camera module 221. When the camera module 200 is attached to the PCB 100, the protrusion 251 of the carrier 250 is received in the clearance groove 110.

The shape of the first accommodating cavity 211 matches with a part of the shape of the camera module 221. The shape of the second receiving cavity 212 matches the shape of the shutter 222.

In other embodiments, as shown in fig. 2, a positioning bracket 260 is disposed between the shutter 222 and the cushion pad 230, a fixing portion 261 is formed on the positioning bracket 260 in a bent manner, and the lens cover 240 is disposed through the positioning bracket 260;

be provided with the holding on the blotter 230 the third holding chamber of fixed part 261, dorsad on the blotter 230 location support 260 one end is provided with installation department 231, installation department 231 with third holding chamber intercommunication, be provided with silicon lens 270 in the installation department 231, the axis of silicon lens 270 with the axis of shutter 222, the axis of the module 221 of making a video recording overlap.

In this embodiment, the fixing portion 261 of the positioning bracket 260 can be just received in the third receiving cavity of the cushion pad 230, so as to improve the connection stability between the cushion pad 230 and the positioning bracket 260. And the fixing part 261 of the positioning bracket 260 is structured with the shutter 222, so as to stabilize the position of the shutter 222 in the sensor holder 210, thereby ensuring the precision of the shutter 222 and the camera module 221.

The mounting portion 231 of the cushion pad 230 is used to fix the position of the silicon lens 270, thereby ensuring the accuracy of the silicon lens 270, the shutter 222 and the camera module 221.

In other embodiments, as shown in fig. 2, a positioning post 241 is disposed on one end of the lens outer cover facing the PCB 100, a threaded hole is formed in the positioning post 241, and the positioning post 241 passes through the positioning bracket 260, the cushion pad 230 and the sensor seat 210;

the bearing seat 250 is connected to the positioning post 241 through a positioning screw.

In the embodiment, the positioning posts 241 on the lens cover are used for positioning the cushion pad 230, the positioning bracket 260 and the sensor seat 210, and then the bearing seat 250 is connected and fixed with the positioning posts 241 of the lens cover.

The number of the positioning posts 241 on the lens outer cover is two.

In other embodiments, as shown in fig. 2, first mounting holes 213 are formed through the sensor seat 210 and located at two sides of the second receiving cavity 212; a second mounting hole 262 is formed in the positioning bracket 260 corresponding to the first mounting hole 213; the cushion pad 230 is provided with a third mounting hole 232 corresponding to the second mounting hole 262; a fourth mounting hole is formed in the carrying seat 250 corresponding to the first mounting hole 213;

the positioning column 241 sequentially passes through the third mounting hole 232, the second mounting hole 262 and the first mounting hole 213, and the positioning screw passes through the fourth mounting hole to be connected with the threaded hole.

The foregoing is merely a preferred embodiment of the present application and is not intended to limit the present application in any way. Those skilled in the art can now make numerous possible variations and modifications to the disclosed embodiments, or modify equivalent embodiments, using the methods and techniques disclosed above, without departing from the scope of the claimed embodiments. Therefore, all equivalent changes in shape, structure and principle according to the present application should be covered by the protection scope of the present application without departing from the technical scheme of the present application.

Claims

1. A card-type thermal imager, comprising: the PCB and the camera shooting assembly;

an FPGA chip is integrated on the PCB; and

the subassembly of making a video recording includes sensor seat, the unit of making a video recording, blotter and camera lens enclosing cover, sensor seat with the PCB board is connected, the unit of making a video recording is arranged in the sensor seat and with PCB board electric connection, the blotter set up in the sensor seat go up and with the unit contact of making a video recording, the camera lens enclosing cover passes the blotter and with the sensor seat is connected.

2. The card-type thermal imager according to claim 1, wherein a bearing seat is disposed on the sensor seat at an end facing the PCB, a first receiving cavity is formed between the bearing seat and the sensor seat, and a second receiving cavity communicated with the first receiving cavity is disposed on an end of the sensor seat facing away from the PCB;

3. The card-type thermal imager according to claim 2, wherein a positioning bracket is arranged between the shutter and the cushion pad, a fixing portion is formed on the positioning bracket in a bending manner, and the lens outer cover is arranged to penetrate through the positioning bracket;

4. The card-type thermal imager according to claim 3, wherein a positioning column is arranged on the lens outer cover towards one end of the PCB, a threaded hole is formed in the positioning column, and the positioning column penetrates through the positioning support, the cushion pad and the sensor seat;

5. The card thermal imager according to claim 4, wherein first mounting holes are formed in the sensor base and positioned on two sides of the second accommodating cavity in a penetrating manner; a second mounting hole is formed in the positioning bracket corresponding to the first mounting hole; a third mounting hole is formed in the buffer pad corresponding to the second mounting hole; a fourth mounting hole is formed in the bearing seat corresponding to the first mounting hole;