CN216016965U - Assembling structure of digital camera device - Google Patents
Assembling structure of digital camera device Download PDFInfo
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- CN216016965U CN216016965U CN202122210215.4U CN202122210215U CN216016965U CN 216016965 U CN216016965 U CN 216016965U CN 202122210215 U CN202122210215 U CN 202122210215U CN 216016965 U CN216016965 U CN 216016965U
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- circuit board
- assembly
- digital camera
- photosensitive
- assembly structure
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Abstract
The utility model provides an assembly structure of digital camera device, it contains circuit board, support, photosensitive assembly and central processing element. The circuit board has an upper surface and a lower surface. The bracket is detachably assembled on the upper surface of the circuit board. The photosensitive assembly is detachably assembled on the bracket and electrically connected to the circuit board. The central processing element is electrically connected to the circuit board and detachably assembled on the lower surface of the circuit board. Therefore, the utility model discloses can make the circuit board can assemble the central processing element and the photosensitive assembly of different specifications elastically.
Description
Technical Field
The present invention relates to an assembly structure of an electronic device, and more particularly to an assembly structure of a digital camera.
Background
The digital camera can store the image signal in a digital mode directly through light sensing, and the traditional camera does not need to be developed to see the picture. The industrial camera can be regarded as a digital camera with more enhanced functions, can be built in with an artificial intelligence visual mode, and can be connected to a computer to be regulated and controlled in real time. Conventionally, components required for functions of an industrial camera, such as a photosensitive element, a central processing unit, and the like, are surface-mounted on a circuit board. However, different components must be disposed inside the industrial cameras with different specifications. However, if there are too few components that can be commonly used between industrial cameras with different specifications, the assembly plant must order and stock too many kinds of components, thereby increasing the manufacturing cost.
SUMMERY OF THE UTILITY MODEL
Based on the utility model discloses an at least one embodiment, the utility model provides a digital camera device's package assembly to reach and make the circuit board have high pass usage degree, and then reduce cost of manufacture's purpose.
The utility model provides an assembly structure of digital camera device, it contains circuit board, support, photosensitive assembly and central processing element. The circuit board has an upper surface and a lower surface. The bracket is detachably assembled on the upper surface of the circuit board. The photosensitive assembly is detachably assembled on the bracket and electrically connected to the circuit board. The central processing element is electrically connected to the circuit board and detachably assembled on the lower surface of the circuit board.
In an embodiment, the bracket includes a carrier plate and an assembling portion, the carrier plate carries the photosensitive assembly, and the assembling portion extends to two sides of the carrier plate and supports the carrier plate to be higher than the upper surface of the circuit board.
In an embodiment, the assembling portion has a plurality of through holes, and the circuit board has a plurality of convex columns corresponding to the through holes on the upper surface.
In an embodiment, the carrier plate has an electrical connection hole exposing the upper surface of the circuit board, and the photosensitive element is provided with an electrical connection portion penetrating through the electrical connection hole, and the electrical connection portion is electrically connected to the upper surface of the circuit board.
In an embodiment, the bracket further includes a plurality of clamping spring pieces, each clamping spring piece is fixed to the bearing plate and extends towards the photosensitive assembly, and the photosensitive assembly is clamped between the clamping spring pieces.
In an embodiment, the bracket further includes a plurality of positioning pillars extending from the supporting plate and disposed around the photosensitive element, the assembly structure of the digital camera device further includes a stabilizing ring sleeved on the photosensitive element and having a plurality of bonding holes, the stabilizing ring is received on the positioning pillars, and the bonding holes are respectively aligned to the positioning pillars.
In an embodiment, the assembly structure of the digital camera device further includes a heat dissipation plate, the heat dissipation plate is in contact with the central processing element, and the central processing element is in a flat plate shape and is located between the circuit board and the heat dissipation plate.
In an embodiment, the assembly structure of the digital camera device further includes a housing, the housing includes a lower cover contacting the heat dissipation plate, and an outer surface of the lower cover has a concave-convex heat dissipation structure.
In an embodiment, the assembly structure of the digital camera device further includes a housing, the housing includes an upper cover, a lower cover, and a plurality of side covers disposed between the upper cover and the lower cover, the upper cover covers the photosensitive assembly, the bracket, and the circuit board from the upper surface, and the lower cover is disposed on the upper cover and covers the central processing unit and the circuit board from the lower surface.
In an embodiment, the photosensitive assembly has a photographing direction parallel to a normal direction of the upper surface of the circuit board.
In an embodiment, the photosensitive assembly has a photographing direction perpendicular to a normal direction of the upper surface of the circuit board.
In one embodiment, the photosensitive element is a charge coupled device or a CMOS photosensitive device.
Therefore, the utility model discloses a digital camera device's package assembly can be general in the digital camera device of different models because of the liftoff equipment in circuit board of sensitization subassembly and central processing component liftoff for the equipment factory can reduce the kind of customizing and stock circuit board at least, also can dispatch the stock of sensitization subassembly and central processing component in a flexible way, thereby can reduce the cost of manufacture.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.
Fig. 1 is a schematic perspective exploded view of an assembly structure of a digital camera device according to an embodiment of the present invention;
FIG. 2 is an exploded view of the stabilizer ring, photosensitive assembly, bracket and circuit board of an embodiment of the present invention;
fig. 3 is a schematic top perspective view of an assembly structure of the digital camera device according to the embodiment of the present invention;
fig. 4 is a schematic perspective view of a digital camera according to an embodiment of the present invention;
fig. 5 is a schematic perspective view illustrating the photosensitive assembly, the bracket and the circuit board according to an embodiment of the present invention.
[ reference numerals ]
1 digital camera device
2 Circuit Board
20 upper surface of the table
21 lower surface
22 convex column
23 first combining hole
3 support
31 bearing plate
310 electrical connection hole
311 coupling convex part
32 assembly part
33 perforation
34 second combining hole
35 clamping spring plate
36 positioning column
4 photosensitive assembly
40 photosensitive element
41 electric connection part
42 third combining hole
5 Central processing element
6 stabilizing ring
60 fourth coupling hole
7 Heat sink
8 outer cover
80 upper cover
81 lower cover
82 side cover
83 concave-convex heat dissipation structure
C1 first imaging direction
C2 second imaging direction
Normal direction of F1
Detailed Description
The foregoing and other technical matters, features and effects of the present invention will be more clearly understood from the following detailed description of the preferred embodiments taken in conjunction with the accompanying drawings. It is worth mentioning directional terms as mentioned in the following examples, such as: up, down, left, right, front or rear, etc., are simply directions with reference to the drawings. Accordingly, the directional terminology is used for purposes of illustration and is in no way limiting. Further, in the following embodiments, the same or similar components will be given the same or similar reference numerals.
The following will further describe an assembly structure of a digital camera device according to an embodiment of the present invention with reference to the accompanying drawings.
Referring to fig. 1 to 4, the present invention provides an assembly structure of a digital camera 1. The digital photographing apparatus 1 may be an industrial camera or a digital camera, but is not limited thereto. The assembly structure of the digital camera device 1 comprises a circuit board 2, a bracket 3, a photosensitive assembly 4 and a central processing element 5. The circuit board 2 has an upper surface 20 and a lower surface 21. The bracket 3 is detachably assembled on the upper surface 20 of the circuit board 2. The photosensitive element 4 is detachably assembled on the bracket 3 and electrically connected to the circuit board 2. The cpu 5 is electrically connected to the circuit board 2 and is detachably mounted on the lower surface 21 of the circuit board 2. As shown in fig. 3, the photosensitive element 4 may be provided with a photosensitive element 40 which is a Charge Coupled Device (CCD) or a Complementary Metal-Oxide-Semiconductor (CMOS). As shown in FIG. 1, the CPU 5 may be an integrated circuit calculator configured to process computer instructions and process data of a computer program. The circuit board 2 may be provided with a central processing unit socket (not shown) on the lower surface 21, and the CPU 5 may be provided with a plurality of corresponding pins (not shown) for plugging.
As described above, the utility model discloses an assembly structure of digital camera device 1, because of the separable equipment in circuit board 2 of photosensitive assembly 4 and central processing element 5, consequently circuit board 2 can be general in the digital camera device 1 of different models for the assembly factory can reduce the kind of customizing circuit board 2 at least, also can dispatch photosensitive assembly 4 and central processing element 5's inventory in a flexible way, thereby can reduce the cost of manufacture. In addition, the central processing element 5 is arranged on the lower surface 21 of the circuit board 2, and the photosensitive assembly 4 is arranged on the upper surface 20 of the circuit board 2, so that the space can be fully utilized, and the heat generated during the calculation of the central processing element 5 can be reduced to affect the photosensitive element 40 of the photosensitive assembly 4.
As shown in fig. 1 to 3, in an embodiment, the bracket 3 may include a carrier plate 31 and an assembling portion 32. The carrier 31 is used for carrying the photosensitive element 4, the assembling portion 32 extends to two sides of the carrier 31 and supports the carrier 31 to be away from the upper surface 20 of the circuit board 2, and the assembling portion 32 may be an L-shaped plate. Thereby preventing the carrier plate 31 of the bracket 3 from contacting the electronic components or circuits on the upper surface 20 of the circuit board 2 and causing damage. In addition, since the photosensitive element 4 is not directly disposed on the upper surface 20 and does not occupy the space of the upper surface 20, the electronic component configuration and circuit layout of the circuit board 2 on the upper surface 20 can be more flexible.
As shown in fig. 1 to 3, the assembling portion 32 is used to assemble the holder 3 to the circuit board 2 and the entire assembly structure. In an embodiment, the assembling portion 32 may have a plurality of through holes 33, and the circuit board 2 is provided with a plurality of posts 22 on the upper surface 20 corresponding to the through holes 33. The protruding posts 22 can penetrate into the through holes 33 to position the bracket 3 on the upper surface 20 of the circuit board 2, and the second combination holes 34 of the assembling portion 32 can be aligned with the first combination holes 23 of the circuit board 2 to be passed through by a locking element such as a screw when the whole assembling structure is locked. However, the present invention is not limited thereto, and the bracket 3 and the circuit board 2 may be assembled by other methods.
As shown in fig. 1 and fig. 2, in the embodiment, the carrier 31 has an electrical connection hole 310 exposing the upper surface 20 of the circuit board 2, and the photosensitive element 4 is provided with an electrical connection portion 41 passing through the electrical connection hole 310. The electrical connection portion 41 may be a plug-in having a plurality of metal guide pins (not shown), and the circuit board 2 may have a corresponding slot (not shown) on the upper surface 20 to electrically connect the photosensitive element 4 to the circuit board 2, so as to transmit signals or power. For example, when the bracket 3 has no electrical connection hole 310, the photosensitive element 4 and the circuit board 2 may be respectively provided with the same slot, and the photosensitive element 4 is electrically connected to the circuit board 2 by an electrical connection wire with the same plug-in at both ends.
As shown in fig. 1 to 3, in the embodiment, the bracket 3 may further include a plurality of clamping spring pieces 35, each clamping spring piece 35 is fixed to the supporting plate 31 and extends toward the photosensitive assembly 4, and the photosensitive assembly 4 is clamped between the clamping spring pieces 35. In this embodiment, the number of the elastic clamping pieces 35 is three, and when the photosensitive element 4 is clamped in the elastic clamping pieces 35, the third engaging holes 42 on the photosensitive element 4 can be aligned to the engaging protrusions 311 on the carrier 31. The top end of the combining protrusion 311 may have a screw hole, so that the photosensitive element 4 can be locked on the carrier 31 by a plurality of locking accessories (not shown) such as screws. However, the photosensitive element 4 can be assembled on the carrier 31 by other methods.
As shown in fig. 1 to 3, in the embodiment, the bracket 3 further includes a plurality of positioning posts 36 extending from the supporting plate 31 and disposed around the photosensitive assembly 4. In addition, the assembly structure of the digital camera device 1 may further include a stabilizing ring 6, the stabilizing ring 6 is sleeved on the photosensitive assembly 4 and has a plurality of fourth combining holes 60, the stabilizing ring 6 is received on the positioning posts 36, and the fourth combining holes 60 are respectively aligned to the positioning posts 36. The top ends of the positioning posts 36 may have screw holes respectively for locking the stabilizing ring 6 to the positioning posts 36 by a plurality of locking attachments (not shown) such as screws. The stability of the photosensitive assembly 4 on the support 3 can be enhanced by the stabilizing ring 6.
As shown in fig. 1, in the embodiment, the assembly structure of the digital camera 1 may further include a heat dissipation plate 7 to dissipate heat generated by the cpu 5 during operation. The heat dissipation plate 7 may be a metal plate having high heat conductivity, such as an aluminum or aluminum alloy plate; or a ceramic plate, but is not limited thereto. The heat sink 7 is in contact with the cpu 5, and the cpu 5 is flat and located between the circuit board 2 and the heat sink 7. As shown in fig. 1 and 4, the assembly structure of the digital image pickup device 1 may further include a housing 8. The housing 8 includes an upper cover 80, a lower cover 81, and a plurality of side covers 82 assembled between the upper cover 80 and the lower cover 81. The upper cover 80 covers the photosensitive assembly 4, the bracket 3 and the circuit board 2 from the upper surface 20, and the lower cover 81 is disposed on the upper cover 80 and covers the central processing unit 5, the circuit board 2 and the heat dissipation plate 7 from the lower surface 21. The lower cover 81 contacts the heat sink 7, and the outer surface of the lower cover 81 has a concave-convex heat sink 83 to increase the heat dissipation effect.
As shown in fig. 1 and 4, in the embodiment, the photosensitive assembly 4 has a first image capturing direction C1, and the first image capturing direction C1 may be parallel to a normal direction F1 of the upper surface 20 of the circuit board 2. The digital camera device 1 of the present embodiment can be an industrial camera or a digital camera with a general appearance as shown in fig. 4.
As shown in fig. 1 and 5, in another embodiment, the second image capturing direction C2 of the photosensitive assembly 4 may be perpendicular to the normal direction F1 of the upper surface 20 of the circuit board 2. The photosensitive element 4 is coupled to the frame 3 in a direction perpendicular to the direction of fig. 1. For example, the photosensitive element 4 can be bonded to the circuit board 2 in the direction shown in fig. 5 by changing the arrangement of the holding spring pieces 35 and the bonding convex portions 311 on the holder 3 shown in fig. 1. The structure of fig. 5 may correspond to an industrial camera or a digital camera with an upright appearance.
The above description is only an embodiment of the present invention, and it is not intended to limit the scope of the present invention.
Claims (12)
1. An assembly structure of a digital camera device, comprising:
a circuit board having an upper surface and a lower surface;
the bracket is detachably assembled on the upper surface of the circuit board;
the photosensitive assembly is detachably assembled on the bracket and is electrically connected with the circuit board; and
the central processing element is electrically connected to the circuit board and can be separately assembled on the lower surface of the circuit board.
2. The assembly structure of the digital camera device as claimed in claim 1, wherein the bracket includes a carrier plate and an assembly portion, the carrier plate carries the photosensitive assembly, and the assembly portion extends to both sides of the carrier plate and supports the carrier plate away from the upper surface of the circuit board.
3. The assembly structure of the digital camera device as claimed in claim 2, wherein the assembly portion has a plurality of through holes, and the circuit board has a plurality of protruding posts on the upper surface corresponding to the through holes.
4. The assembly structure of the digital camera device as claimed in claim 2, wherein the carrier plate has an electrical connection hole exposing the upper surface of the circuit board, the photosensitive element has an electrical connection portion passing through the electrical connection hole, and the electrical connection portion is electrically connected to the upper surface of the circuit board.
5. The assembly structure of the digital camera device according to claim 2, wherein the bracket further comprises a plurality of holding clips, each holding clip is fixed to the carrier plate and extends toward the photosensitive assembly, and the photosensitive assembly is held between the holding clips.
6. The assembly structure of claim 2, wherein the bracket further comprises a plurality of positioning posts extending from the supporting plate and disposed around the photosensitive assembly, and further comprises a stabilizing ring sleeved on the photosensitive assembly and having a plurality of engaging holes, the stabilizing ring is received on the positioning posts, and the engaging holes are respectively aligned with the positioning posts.
7. The assembly structure of a digital camera according to claim 1, further comprising a heat dissipation plate in contact with the central processing element, the central processing element having a flat plate shape and being located between the circuit board and the heat dissipation plate.
8. The assembly structure of the digital camera device according to claim 7, further comprising a housing, wherein the housing includes a lower cover contacting the heat dissipation plate, and an outer surface of the lower cover has a heat dissipation structure having a concave-convex shape.
9. The assembly structure of a digital camera according to claim 1, further comprising a housing including an upper cover, a lower cover, and a plurality of side covers assembled between the upper cover and the lower cover, wherein the upper cover covers the photosensitive assembly, the holder, and the circuit board from the upper surface, and the lower cover is assembled to the upper cover and covers the central processing element and the circuit board from the lower surface.
10. The assembly structure of a digital camera according to claim 1, wherein the photosensitive member has a photographing direction parallel to a normal direction of an upper surface of the circuit board.
11. The assembly structure of a digital camera according to claim 1, wherein the photosensitive member has a photographing direction perpendicular to a normal direction of an upper surface of the circuit board.
12. The assembly structure of claim 1, wherein the photosensitive element is a charge coupled device or a CMOS photosensitive element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122210215.4U CN216016965U (en) | 2021-09-13 | 2021-09-13 | Assembling structure of digital camera device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122210215.4U CN216016965U (en) | 2021-09-13 | 2021-09-13 | Assembling structure of digital camera device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216016965U true CN216016965U (en) | 2022-03-11 |
Family
ID=80531501
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122210215.4U Active CN216016965U (en) | 2021-09-13 | 2021-09-13 | Assembling structure of digital camera device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216016965U (en) |
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2021
- 2021-09-13 CN CN202122210215.4U patent/CN216016965U/en active Active
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