CN220235055U

CN220235055U - Central control main board with 360-degree looking-around function and central control screen for automobile

Info

Publication number: CN220235055U
Application number: CN202321828928.XU
Authority: CN
Inventors: 刘春燕; 吴锦华
Original assignee: Shenzhen Source Cheng Technology Co ltd
Current assignee: Shenzhen Source Cheng Technology Co ltd
Priority date: 2023-07-12
Filing date: 2023-07-12
Publication date: 2023-12-22
Anticipated expiration: 2033-07-12

Abstract

The utility model discloses a central control main board with a 360-degree looking-around function and an automobile central control screen, wherein the central control main board comprises a main circuit board and further comprises a heat dissipation plate arranged on the main circuit board, an antenna seat for connecting an antenna, a main control chip for processing information, a functional interface for connecting external equipment and a power amplification module for amplifying sound are arranged on one surface of the main circuit board facing the heat dissipation plate, and the power amplification module is far away from the main control chip; the main control chip and the power amplifier module are in contact with the heat dissipation plate through a heat conducting medium so as to diffuse heat to the heat dissipation plate. Compared with the prior art, the heat dissipation device has the advantages of multiple expansion functions and good heat dissipation effect.

Description

Central control main board with 360-degree looking-around function and central control screen for automobile

Technical Field

The utility model relates to the technical field of vehicle-mounted system mainboards, in particular to a central control mainboard with a 360-degree looking-around function and an automobile central control screen.

Background

Along with the development of the Internet, the vehicle intellectualization is continuously improved, and along with the intellectualization, the functions of the vehicle-mounted equipment are more intelligent. For example, the vehicle-mounted display screen is used for watching 360-degree panoramic fusion around the vehicle, the real-time image information of seamless splicing is used for knowing the blind area of the vision around the vehicle, a driver of the vehicle is helped to park the parking auxiliary system of the vehicle more intuitively and safely, the main board is required to process data in the panoramic image, the main board of the existing vehicle-mounted 360-degree panoramic image system is generally required to be connected with various devices, however, the number of interfaces on most main boards is limited at present, the number of externally-connected electronic devices is less, and in addition, the heat dissipation performance of the main board is poor and the main board is easy to crash when in a high-load or high-temperature environment.

Disclosure of Invention

Aiming at the problems in the prior art, the utility model provides a central control main board with a 360-degree looking-around function and a central control screen of an automobile, and the central control main board has the advantages of multiple expansion functions and good heat dissipation effect.

The technical scheme of the utility model is that the central control main board with the 360-degree looking-around function comprises a main circuit board and a heat dissipation plate arranged on the main circuit board, wherein one surface of the main circuit board facing the heat dissipation plate is provided with an antenna seat for connecting an antenna, a main control chip for processing information, a functional interface for connecting external equipment and a power amplification module for amplifying sound, and the power amplification module is arranged far away from the main control chip;

the main control chip and the power amplifier module are in contact with the heat dissipation plate through a heat conducting medium so as to diffuse heat to the heat dissipation plate.

Further, a base connected with a coaxial optical fiber board is further arranged on the surface, connected with the heat dissipation plate, of the main circuit board, and a coaxial connector and an optical fiber connector are arranged on the coaxial optical fiber board.

Further, the heat dissipation plate is provided with openings at the positions of the functional interface, the antenna base and the coaxial optical fiber plate, and the openings are used for external wiring of the central control main board.

Further, a cooling fan is arranged on one surface of the cooling plate, which is opposite to the main circuit board, and the cooling fan is located right above the main control chip.

Further, radiating fins are arranged on one surface, facing away from the main circuit board, of the radiating plate, and radiating holes are further formed in the radiating plate.

Further, the heat conducting medium comprises a silica gel sheet arranged on the main control chip and heat conducting paste coated on the power amplifier module.

Further, one surface of the main circuit board, which is away from the heat dissipation plate, is provided with an MCU chip for assisting the main control chip, a 360-panorama chip for processing image data around the vehicle body, and a radio chip for processing digital wireless broadcast signals.

Further, the antenna base comprises a 4G antenna base, a GPS antenna base, a 5G_WiFi antenna base and a radio receiving antenna base, and the radio receiving chip is located right below the radio receiving antenna base.

Further, the function interface includes bluetooth interface, USB interface, audio-video interface, 360 video interface and image interface of backing a car, 360 panorama chip is located under the function interface.

The application also discloses a control screen in car, control screen has foretell well accuse mainboard in the car.

Compared with the prior art, the utility model has at least the following beneficial effects:

1. the integrated level is high, the universality is good, and various different functions and accessories can be compatible.

2. The heat dissipation effect is good, and the heat dissipation mode is diversified.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of a front structure of a heat dissipating plate according to the present utility model;

FIG. 2 is a schematic diagram of the front structure of a main circuit board according to the present utility model;

FIG. 3 is a schematic view of the back surface structure of the heat dissipating plate according to the present utility model;

fig. 4 is a schematic view of a coaxial fiber optic plate structure of the present utility model.

Fig. 5 is a schematic diagram of the reverse structure of the main circuit board of the present utility model.

Detailed Description

In order to make the technical problems, technical schemes and beneficial effects to be solved more clear, the utility model is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.

Thus, reference throughout this specification to one feature will be used in order to describe one embodiment of the utility model, not to imply that each embodiment of the utility model must be in the proper motion. Furthermore, it should be noted that the present specification describes a number of features. Although certain features may be combined together to illustrate a possible system design, such features may be used in other combinations not explicitly described. Thus, unless otherwise indicated, the illustrated combinations are not intended to be limiting.

The principles and structures of the present utility model are described in detail below with reference to the drawings and the examples.

The central control main board with the 360-degree looking-around function comprises a main circuit board 1 and further comprises a heat dissipation plate 32 arranged on the main circuit board 1, wherein an antenna seat for connecting an antenna, a main control chip 3 for processing information, a functional interface for connecting external equipment and a power amplification module 17 for amplifying sound are arranged on one surface of the main circuit board 1 facing the heat dissipation plate 32, and the power amplification module 17 is arranged far away from the main control chip 3;

the main control chip 3 and the power amplifier module 17 are in contact with the heat dissipation plate 32 through a heat conduction medium to diffuse heat onto the heat dissipation plate 32.

As shown in fig. 1 and fig. 2, in a specific embodiment, the central control motherboard with 360 ° looking around function is composed of two parts of a main circuit board 1 and a heat dissipation board 32, and various components for adjusting the operation state of the central control screen of the automobile are integrated on the main circuit board 1. The four corners of the heat dissipation plate 32 and the main circuit board 1 are provided with screw holes with corresponding positions, screws are used for penetrating through the screw holes of the heat dissipation plate 32 and the main circuit board 1 to install the heat dissipation plate 32 on the main circuit board 1, the whole heat dissipation plate 32 is made of metal, the heat dissipation plate 32 is attached to the main circuit board 1, on one hand, signal interference between components on the main circuit board 1 can be reduced, on the other hand, the components on the main circuit board 1 can be protected, and on the other hand, the components on the main circuit board 1 can be cooled.

Here, an antenna base, a main control chip 3, a functional interface, and a power amplifier module 17 are provided on a surface of the main circuit board 1 facing the heat dissipation plate 32. In the description of the present application, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of description of the present application and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application. As shown in fig. 2, an antenna base is disposed at the leftmost position of the main circuit board 1, a power amplifier module 17 is disposed at the upper right corner of the main circuit board 1, a radio frequency chip 4 and a main control chip 3 for wireless communication are disposed at the position of the main circuit board 1 near the antenna base, a functional interface is disposed at the uppermost position of the middle of the main circuit board 1, and a capacitor and a winding inductance are disposed at the lower right corner of the main circuit board 1. Among these components, the main control chip 3 is the main component for processing information, the power amplifier module 17 is the main component for amplifying audio signal output, and the amplitude and the power of reinforcing signal, the calorific capacity of main control chip 3 and power amplifier module 17 is great, so the distance between main control chip 3 and power amplifier module 17 is far away, prevents that these two parts from generating heat together and leading to the heat difficult dispersion at the during operation.

In the description of the present application, the terms "first," "second," and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. Meanwhile, in order to ensure the heat dissipation effect, as shown in fig. 3, heat conducting media are arranged on the main control chip 3 and the power amplifier module 17, and the heat dissipation plate 32 extends downwards towards the position of the main control chip 3 to form a first heat dissipation block 34, and the first heat dissipation block 34 is abutted with the heat conducting media on the main control chip 3; because the power amplifier module 17 is a standing plate-shaped object, the heat dissipation plate 32 is provided with a containing groove for containing the power amplifier module 17, the containing groove is internally provided with the second heat dissipation block 35, the second heat dissipation block 35 is abutted with a heat conduction medium on the power amplifier module 17, the two main heating parts of the main control chip 3 and the power amplifier module 17 are far away, and the heat of the main control chip 3 and the power amplifier module 17 is dispersed to the whole heat dissipation plate 32 through the heat conduction medium, the first heat dissipation block 34 and the second heat dissipation block 35, so that the heat dissipation effect is ensured, the central control main board is more stable and durable in the working state, and the condition that equipment is halted when in a high-load or high-temperature environment is avoided.

Further, the base 16 connected to the coaxial optical fiber plate 28 is provided on the surface of the main circuit board 1 connected to the heat dissipation plate 32, and the coaxial connector 31 and the optical fiber connector 30 are provided on the coaxial optical fiber plate 28.

Specifically, as shown in fig. 2 and fig. 4, a base 16 is further disposed on a surface of the main circuit board 1, where the main circuit board is connected to the heat dissipation plate 32, the base 16 is connected to the coaxial fiber board connector 29, two threaded holes are disposed on the coaxial fiber board 28, where the coaxial connector 31 and the fiber connector 30 are disposed, the coaxial fiber board 28 is fixed on a surface of the heat dissipation plate 32, which faces the main circuit board 1, by screws, the coaxial connector 31 corresponds to a coaxial interface position on the heat dissipation plate 32, and the fiber connector 30 corresponds to a fiber interface position on the heat dissipation plate 32.

Further, the heat sink 32 is provided with openings at the locations of the functional interface, the antenna mount, and the coaxial fiber optic plate 28 for external wiring of the central motherboard.

In one embodiment, as shown in the orientation of fig. 3, the heat sink 32 is hollowed out to avoid the design at some locations where external wiring is required, forming an opening for wiring. A plurality of round holes for accessing various antennas are provided right above the antenna base by connecting the heat radiating plate 32 and the main circuit board 1. Two through holes, one coaxial interface and one optical fiber interface, are arranged right above the coaxial optical fiber plate 28, and the coaxial interface and the optical fiber interface are provided at the same time, so that a user can select to use coaxial transmission or optical fiber transmission according to actual needs. The heat dissipation plate 32 is provided with a rectangular opening at the position of the functional interface, the wiring needle seat of the functional interface is exposed for wiring, and the rectangular opening is provided at the position of the power interface 2 for plugging the power line.

Further, a cooling fan 36 is disposed on a surface of the cooling plate 32 facing away from the main circuit board 1, and the cooling fan 36 is located right above the main control chip 3.

Specifically, as shown in fig. 1, a cooling fan 36 is disposed on a side of the cooling plate 32 facing away from the main circuit board 1, a fan mounting position 33 is disposed right above the main control chip 3, through holes with matching positions are formed in the cooling fan 36 and the fan mounting position 33, and the cooling fan 36 is mounted on the cooling plate 32 by screws. The bottom of the fan mounting position 33 is a first heat dissipation block 34 contacting with the main control chip 3, and heat on the main control chip 3 is transferred to the fan mounting position 33 through the first heat dissipation block 34, and further dissipates heat of the main control chip 3 through a heat dissipation fan 36.

Further, a heat radiating fin is provided on a surface of the heat radiating plate 32 facing away from the main circuit board 1, and heat radiating holes are provided on the heat radiating plate 32.

Specifically, as shown in fig. 1, the heat dissipating plate 32 is further provided with a plurality of heat dissipating holes, and heat is dissipated from the components on the main circuit board 1 through the heat dissipating holes. The surface of the heat dissipation plate 32 is further provided with a plurality of heat dissipation fins with interval design, and the heat dissipation fins are perpendicular to the surface of the heat dissipation plate 32 and used for increasing the heat dissipation area of the heat dissipation plate 32 and further improving the heat dissipation effect.

Further, the heat-conducting medium comprises a silica gel sheet arranged on the main control chip 3 and heat-conducting paste coated on the power amplifier module 17.

Specifically, the two main heating elements of the main control chip 3 and the power amplifier module 17 are also provided with heat conducting media, which are respectively a silica gel sheet stuck on the main control chip 3 and heat conducting paste coated on the power amplifier module 17, so that heat emitted by the main control chip 3 and the power amplifier module 17 can be quickly transferred to the heat dissipation plate 32 through the heat conducting media, and the heat dissipation effect is improved.

Further, the main circuit board 1 is provided with an MCU chip 18 of the auxiliary main control chip 3, a 360 panorama chip 19 for processing image data around the vehicle body, and a radio chip 20 for processing digital radio broadcasting signals on a side facing away from the heat dissipation plate 32.

Specifically, as shown in fig. 5, a plurality of components are integrated on the side of the main circuit board 1 facing away from the heat dissipation plate 32, and include an MCU chip 18 for assisting the main control chip 3, a 360 panoramic chip 19 for processing panoramic image data around the vehicle body, and a radio chip 20 for processing digital wireless broadcast signals. A plurality of connectors including TF card socket connector 21, 1.8V level TP connector 22, 3.3V level TP connector 23, LCD connector 24, keypad connector 25, backlight connector 26 are further provided at the uppermost position in the middle of the side of main circuit board 1 facing away from heat dissipation plate 32. A display screen power supply port 27 is also provided in the upper right corner of the side of the main circuit board 1 facing away from the heat dissipation plate 32.

Further, the antenna base comprises a 4G antenna base, a GPS antenna base 7, a 5G_WiFi antenna base 8 and a radio antenna base 9, and the radio chip is located under the radio antenna base 9.

Specifically, as shown in fig. 5, the antenna base disposed on one surface of the main circuit board 1 facing the heat dissipation plate 32 includes a 4G main antenna base 5,4G auxiliary antenna reservation base 6, a gps antenna base 7, a 5g_wifi antenna base 8, and a radio antenna base 9, and a radio chip 20 is disposed on the other surface of the main circuit board 1 below the radio antenna base 9.

Further, the function interface comprises a Bluetooth interface, a USB interface, an audio/video interface, a 360-degree video interface and a reversing image interface, and the 360-degree panoramic chip is located under the function interface.

Specifically, as shown in fig. 2, the functional interfaces on the main circuit board 1 include 5 areas, a first area 15 provided with an audio/video interface, a second area 14 provided with a 360 video interface, a third area 13 provided with an external protocol box, a fourth area 12 provided with a first USB interface, a fifth area 11 provided with a second USB interface, and a sixth area 10 provided with a reverse image interface, a bluetooth interface, and a WiFi interface. Directly below the functional interface, the other side of the main circuit board 1 is provided with a 360 panorama chip 19.

The application also discloses an automobile central control screen, which is provided with the central control main board. Four wide-angle cameras installed around an automobile body are connected to a central control main board through an interface arranged on the central control main board with the 360-degree looking-around function, image data are processed through a 360-degree panoramic chip 19 and an algorithm, images of 360 degrees around the automobile are displayed on an automobile central control screen, and the external environment of the automobile is monitored in an auxiliary mode.

Compared with the prior art, the central control mainboard that this application provided is integrated level high, and the commonality is good, can compatible various functions and accessories through the setting of various connectors, compatible various high definition display screen, satisfy the user demand of vehicle, the subsidiary 360 panorama of central control mainboard of this application looks around the function, can assist the control external environment to the radiating mode of central control mainboard is diversified, uses heat-conducting medium, modes such as heating panel, radiator fan, improves heat dispersion, makes equipment more stable lasting at the during operation.

The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the utility model.

Claims

1. The central control main board with the 360-degree looking-around function comprises a main circuit board and is characterized by further comprising a heat radiation plate arranged on the main circuit board, wherein one surface of the main circuit board, facing the heat radiation plate, is provided with an antenna seat for connecting an antenna, a main control chip for processing information, a functional interface for connecting external equipment and a power amplification module for amplifying sound, and the power amplification module is far away from the main control chip;

2. The center control motherboard of claim 1, wherein a base connected to a coaxial fiber board is further provided on a side of the main circuit board connected to the heat dissipation plate, and a coaxial connector and a fiber connector are provided on the coaxial fiber board.

3. The center control motherboard of claim 2, wherein the heat sink is provided with openings at the functional interface, the antenna mount, and the coaxial fiber optic plate for external wiring of the center control motherboard.

4. The central control motherboard according to claim 1, wherein a cooling fan is disposed on a surface of the cooling board facing away from the main circuit board, and the cooling fan is located right above the main control chip.

5. The central control motherboard according to claim 1, wherein a heat dissipation fin is disposed on a surface of the heat dissipation plate facing away from the main circuit board, and heat dissipation holes are further disposed on the heat dissipation plate.

6. The center control motherboard of claim 1, wherein the heat-conducting medium comprises a silica gel sheet arranged on the main control chip and a heat-conducting paste coated on the power amplifier module.

7. The center control motherboard of claim 1, wherein a side of the main circuit board facing away from the heat dissipation plate is provided with an MCU chip for assisting the main control chip, a 360 panorama chip for processing image data around a vehicle body, and a radio chip for processing digital wireless broadcast signals.

8. The center control motherboard of claim 7, wherein the antenna mount comprises a 4G antenna mount, a GPS antenna mount, a 5g_wifi antenna mount, and a radio antenna mount, the radio chip being located directly below the radio antenna mount.

9. The center control motherboard of claim 7, wherein the functional interface comprises a bluetooth interface, a USB interface, an audio-video interface, a 360 ° video interface, and a back-up video interface, and the 360 ° panoramic chip is located directly under the functional interface.

10. A vehicle center control panel, characterized in that the vehicle center control panel has a center control main board according to any one of claims 1 to 9.