CN220234796U - Image acquisition module and electronic equipment - Google Patents

Abstract

The application relates to an image acquisition module and electronic equipment, wherein, the image acquisition module includes: an image acquisition assembly and a shielding film; the shielding film includes: a first film layer comprising a conductive material; the second film layer is arranged on the first film layer and comprises an insulating material or a semi-insulating material; the first film layer is attached to the outer surface of the image acquisition assembly, and interference current is led out through a path isolated from a circuit in the image acquisition assembly.

Description

Image acquisition module and electronic equipment

Technical Field

The application relates to the technical field of electronics, in particular to an image acquisition module and electronic equipment.

Background

Along with the continuous improvement of the requirements of users on the photographing quality of smart phones, more and more smart phones are designed with image acquisition modules comprising a plurality of cameras so as to improve the quality of images acquired by the image acquisition modules.

However, along with the continuous increase of camera quantity in the image acquisition module, the camera is also being close to with the distance that is located the frame antenna on the smart mobile phone constantly, has led to appearing electromagnetic coupling between image acquisition module and the frame antenna, and then has produced harmful effects to the course of working of image acquisition module and frame antenna.

Disclosure of Invention

The application provides an image acquisition module and electronic equipment.

According to a first aspect of embodiments of the present application, there is provided an image acquisition module, including:

an image acquisition component;

and the shielding film is coated on the outer surface of the image acquisition component and is used for shielding interference of interference current on the image acquisition component.

Optionally, the shielding film includes:

a first film layer comprising a conductive material;

the second film layer is arranged on the first film layer and comprises an insulating material or a semi-insulating material;

the first film layer is attached to the outer surface of the image acquisition assembly, and the interference current is led out through a path isolated from a circuit in the image acquisition assembly.

Optionally, the heat dissipation coefficient of the shielding film is greater than a first preset value.

Optionally, the ratio of the attaching area of the first film layer on the surface of the image acquisition assembly to the external surface area of the image acquisition assembly is greater than a second preset value.

Optionally, the first film layer is made of copper material;

the second film layer is made of graphite materials.

According to a second aspect of embodiments of the present application, there is provided an electronic device, including:

the image acquisition module is used for acquiring the image;

and a first conductive member disposed between the rear case of the electronic device and the image acquisition module; wherein the first conductive member is grounded;

the shielding film of the image acquisition module realizes shielding of interference current through electromagnetic coupling with the first conductive piece.

Optionally, a ratio of a projection area of the first conductive member on the image acquisition module to a projection area of the image acquisition module on the middle frame of the electronic device is greater than a third preset value.

Optionally, a second conductive member is attached to a side of the first conductive member facing the image acquisition module, where the first conductive member is a hard conductive member, and the second conductive member is a flexible conductive member.

Optionally, the second conductive member is conductive foam.

Optionally, the first conductive member is provided with a protrusion approaching to the image acquisition module;

the protrusions are arranged at intervals with the shielding films, and the distance between the protrusions and the shielding films is smaller than a preset distance.

The technical scheme provided by the embodiment of the application can comprise the following beneficial effects:

in the embodiment of the application, the image acquisition module in the embodiment of the application is used in the electronic equipment, and the shielding of external interference current can be realized through electromagnetic coupling between the shielding film on the image acquisition module and the conductive piece in the electronic equipment, so that the interference of the interference current on the image acquisition module is reduced.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the application and together with the description, serve to explain the principles of the application.

FIG. 1 is a schematic diagram of an image acquisition module according to an exemplary embodiment;

FIG. 2 is a schematic diagram illustrating another image acquisition module according to an exemplary embodiment;

fig. 3 is a schematic view of a shielding film according to an exemplary embodiment;

FIG. 4 is a schematic diagram of an electronic device, according to an example embodiment;

fig. 5 is a schematic structural view of a first conductive member according to an exemplary embodiment;

FIG. 6 is a smith chart illustrating an exemplary embodiment;

FIG. 7 is a current simulation diagram illustrating an exemplary embodiment;

fig. 8 is a schematic structural view of an electronic device shown according to another exemplary embodiment.

Reference numerals illustrate:

10, an image acquisition component; 11, shielding film; 111, a first film layer; 112, a second film layer; 2, a first conductive member; 3, a frame antenna; 4, a second conductive member; 5, protruding.

Detailed Description

Reference will now be made in detail to exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numbers in different drawings refer to the same or similar elements, unless otherwise indicated. The implementations described in the following exemplary examples are not representative of all implementations consistent with the present application. Rather, they are merely examples of apparatus consistent with some aspects of the present application as detailed in the accompanying claims.

The terminology used in the embodiments of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. Unless defined otherwise, technical or scientific terms used herein should be given the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure belongs.

The terms "first," "second," and the like in the description and in the claims, are not used for any order, quantity, or importance, but are used for distinguishing between different elements. Also, the terms "a" or "an" and the like do not denote a limitation of quantity, but rather denote the presence of at least one, and the terms "a" and "an" are used individually. "plurality" or "plurality" means two or more. Unless otherwise indicated, the terms "front," "rear," "lower," and/or "upper" and the like are merely for convenience of description and are not limited to one location or one spatial orientation. The word "comprising" or "comprises", and the like, means that elements or items appearing before "comprising" or "comprising" are encompassed by the element or item recited after "comprising" or "comprising" and equivalents thereof, and that other elements or items are not excluded.

As used in this specification and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any or all possible combinations of one or more of the associated listed items.

Referring to fig. 1 and 2, as shown in fig. 1 and 2, an embodiment of the present application provides an image capturing module, including:

an image acquisition assembly 10;

the shielding film 11 is coated on the outer surface of the image acquisition assembly 10 and is used for shielding interference of interference current to the image acquisition assembly 10.

The number of cameras included in the image capturing assembly 10 may be designed according to needs, for example, 2, 3 or 4 cameras, which is not limited in the embodiment of the present application.

And a shielding film 11 covering at least part of the surface of the image acquisition assembly 10 for shielding the image acquisition assembly 10 from interference caused by the interference current.

When the image capturing assembly 10 is mounted in an electronic device, the distance between the image capturing assembly 10 and the frame antenna 3 is relatively short. Illustratively, when the distance between the image capturing component 10 and the frame antenna 3 is smaller than 2mm, electromagnetic coupling is generated between the image capturing component 10 and the frame antenna 3 on the electronic device, and the electromagnetic coupling generates alternating current that interferes with the operation of the image capturing component 10, so that adverse effects are generated on the operation process of the image capturing component 10 and the frame antenna 3.

Based on this, the interference of the interference current to the image acquisition assembly 10 can be reduced by covering the outer surface of the image acquisition assembly 10 with a shielding film 11, isolating the interference current by the shielding film 11, and then guiding the interference current to the ground by electromagnetic coupling between the shielding film 11 and the conductive member near the shielding film 11.

The conductive member near the shielding film 11 may be a conductive member in the electronic device where the image capturing module is located, and capable of achieving electromagnetic coupling with the shielding film 11, or may be a conductive member included in the image capturing module, and capable of achieving electromagnetic coupling with the shielding film 11.

Illustratively, the shielding film 11 may cover the outer surface of each camera included in the image capturing assembly 10 on the side away from the lens, or may cover all the outer surfaces of each camera included in the image capturing assembly 10 except the lens.

In addition, the shielding film 11 may be adhered to the outer surface of the image acquisition assembly 10 by using an adhesive, or may be fixed to the outer surface of the image acquisition assembly 10 by using a fixing member, or may be fixed to the outer surface of the image acquisition assembly 10 by using other methods.

The shielding film 11 described above may be a thin film made of a material capable of shielding electromagnetic signals, for example.

For example, the shielding film 11 may be a multilayer film made of a conductive material and an insulating material, or a multilayer film made of a conductive material and a semi-insulating material.

The thickness of the shielding film 11 may be designed as required, for example, 0.02 to 0.04mm.

In the embodiment of the application, the image acquisition module in the embodiment of the application is used in the electronic equipment, and the shielding of external interference current can be realized through electromagnetic coupling between the shielding film 11 on the image acquisition module and the conductive piece in the electronic equipment, so that the interference of the interference current to the image acquisition assembly 10 is reduced.

Referring to fig. 3, in one embodiment, the shielding film 11 includes:

a first film layer 111 comprising a conductive material;

a second film layer 112, which is laminated with the first film layer 111 and includes an insulating material or a semi-insulating material;

the first film 111 is attached to the outer surface of the image capturing component 10, and conducts the interference current through a path isolated from the circuit in the image capturing component 10.

The first film layer 111 of the shielding film 11 may be a conductive sheet or a conductive thin film made of a conductive material, and the conductive sheet or the conductive thin film is covered with a second film layer 112 made of a semiconductor material or an insulating material. The conductor material may include, but is not limited to, a metal and/or an alloy.

The shielding film 11 may be obtained by covering a first surface of a conductive sheet or a conductive thin film made of an alloy material with a first film layer 111 made of a metal material, and covering a second surface of the conductive sheet or the conductive thin film with a second film layer 112 made of an insulating material or a semi-insulating material, wherein the first surface and the second surface are opposite surfaces of the conductive sheet or the conductive thin film made of an alloy material.

When the shielding film 11 is coated on the outer surface of the image pickup assembly 10, the first film layer 111 made of a conductive material may be coated on the outer surface of the image pickup assembly 10. Because the first film 111 has conductivity, the first film 111 can collect the interference current on the first film 111, so as to avoid the interference current from entering the image acquisition assembly 10 and interfering with the image acquisition assembly 10.

In addition, since the second film layer 112 is made of an insulating material or a semi-insulating material, the second film layer 112 can electrically isolate the first film layer 111 from the conductive member, so that electromagnetic coupling is generated between the first film layer 111 and the conductive member, and interference current can be conducted from the first film layer 111 to the conductive member, and then grounding of the interference current is realized through the conductive member.

Wherein the circuitry within the image acquisition assembly 10 may include an image sensor and/or control circuitry for the image sensor, in one embodiment, the heat dissipation factor of the shielding film 11 is greater than a first preset value.

Illustratively, the first film 111 of the shielding film 11 may also be made of a conductive material having a heat dissipation coefficient greater than a first preset value, and the second film 112 of the shielding film 11 may also be made of an insulating material or semi-insulating material having a heat dissipation coefficient greater than the first preset value.

Based on this, this shielding film 11 not only can play the shielding effect to interference electric current, can also be when image acquisition subassembly 10 because of work produces heat, in time diffuse the heat that image acquisition subassembly 10 produced through shielding film 11 to reduce image acquisition subassembly 10's operating temperature, extension image acquisition subassembly 10's life.

The first preset value may be set according to the number of cameras included in the image capturing assembly 10, and because the more the number of cameras included in the image capturing assembly 10 is, the greater the heat generated during operation, at this time, the shielding film 11 with a greater heat dissipation coefficient is needed to realize rapid heat dissipation of the image capturing assembly 10. Thus, the first preset value may be set to a larger value when the image acquisition assembly 10 comprises a larger number of cameras, for example when the image acquisition assembly 10 comprises 3, 4 or even more cameras.

That is, the first film 111 of the shielding film 11 is made of a conductive material having a large heat dissipation coefficient, and the second film 112 of the shielding film 11 is made of an insulating material or a semi-insulating material having a large heat dissipation coefficient.

When the number of cameras included in the image pickup assembly 10 is small, for example, when 1 or 2 cameras are included in the image pickup assembly 10, the first preset value may be set to a small value.

That is, the first film layer 111 and the second film layer 112 of the shielding film 11 may be made of a material having a small heat dissipation coefficient.

In one embodiment, the ratio of the bonding area of the first film 111 on the surface of the image capturing component 10 to the external surface area of the image capturing component 10 is greater than the second preset value.

In this embodiment of the present application, in order to improve the shielding effect and the heat dissipation effect of the shielding film 11 on the interference current, when the outer surface of the image acquisition assembly 10 is covered by the shielding film 11, the ratio between the coverage area of the shielding film 11 on the outer surface of the image acquisition assembly 10 and the outer surface area of the image acquisition assembly 10 is greater than or equal to the second preset value.

The second preset value may be 3/4 or 4/5, for example.

Also, when the shielding film 11 is coated on the image pickup assembly 10, the shielding film 11 is coated on at least 3/4 outer surface, or 4/5 outer surface of the image pickup assembly 10 away from the lens.

In one embodiment, the first film 111 is made of a copper material;

the second film 112 is made of a graphite material.

Illustratively, a thin sheet made of a copper material may be used as the first film layer 111, and a heat dissipation graphite film may be coated on the first film layer 111.

For example, a conductor sheet made of a conductor material may be used as a base material, and one surface of the conductor sheet may be covered with the first film layer 111 made of a copper material, and the other surface of the conductor sheet may be covered with a heat dissipating graphite film having low conductivity to obtain the shielding film 11.

In this application embodiment, because copper has good conductivity and heat conductivity, adopts copper material preparation first rete 111, not only can connect each camera that image acquisition assembly 10 includes as a whole through this first rete 111, can also be through the heat conduction that first rete 111 is quick with image acquisition assembly 10 because of the work produces to image acquisition assembly 10 outside, realizes image acquisition assembly 10's quick heat dissipation.

The graphite heat dissipation film made of graphite material not only has good heat conductivity, but also can play an electromagnetic shielding role, so that the heat dissipation graphite film is used as the second film layer 112 of the shielding film 11 in the embodiment of the application, so that the interference of external interference current to the image acquisition module can be shielded, the heat conducted from the image acquisition assembly 10 to the first film layer 111 can be quickly conducted to the second film layer 112, and the quick heat dissipation of the image acquisition assembly 10 is further realized.

Referring to fig. 4, an embodiment of the present application further provides an electronic device, including:

the image acquisition module is used for acquiring the image;

the first conductive piece 2 is arranged between the rear shell of the electronic equipment and the image acquisition module, and is grounded;

the shielding film 11 of the image acquisition module realizes shielding of interference current through electromagnetic coupling with the first conductive member 2.

The electronic device in the embodiment of the application can be a terminal device with an image acquisition function, such as a smart phone, a tablet personal computer, a notebook personal computer and the like.

The electronic device generally uses a metal frame as an antenna to reduce occupation of an internal space of the electronic device by the antenna, and the image capturing assembly 10 is generally disposed in the electronic device near the upper frame, so that a distance between the image capturing assembly 10 and the frame of the electronic device is relatively close. For example, when the distance between the image capturing element 10 and the frame antenna 3 is less than or equal to 2mm, electromagnetic coupling occurs between the image capturing element 10 and the frame antenna 3, thereby affecting the normal operation of the image capturing element and the frame antenna 3.

Based on this, in the present example, by covering the shielding film 11 on the image capturing assembly 10, the image capturing assembly 10 covered with the shielding film 11, that is, the image capturing module of the embodiment of the present application, is obtained. Because the first film layer 111 of the shielding film 11 of the image acquisition module is made of a conductor material, electromagnetic coupling can be generated between the shielding film 11 and the first conductive piece 2, which is close to the shielding film 11, in the electronic equipment through the first film layer 111, interference current generated by the frame antenna 3 is conducted onto the first conductive piece 2 through the first film layer 111, and the grounding effect is achieved through the first conductive piece 2, so that the influence of the electromagnetic coupling of the frame antenna 3 and the image acquisition module 10 on the frame antenna 3 and the image acquisition module is reduced.

For example, referring to fig. 5, the first conductive member 2 may be a metal fixing frame located between the rear case of the electronic device and the image capturing assembly 10, and fig. 5 is a specific structure of the metal fixing frame for fixing each electronic component on the motherboard of the electronic device.

In the embodiment of the application, the image acquisition assembly 10 covered with the shielding film 11 is used in the electronic device, and shielding of the interference current can be achieved based on electromagnetic coupling of the shielding film 11 and the first conductive member 2 in the electronic device. Because the first conductive element 2 is an inherent conductive element in the electronic equipment, the shielding of the interference current is realized through the electromagnetic coupling of the first conductive element 2 and the shielding film 11, a new conductive element is not required to be added in the electronic equipment, and the occupation of the internal space of the electronic equipment is not caused because the new conductive element is not required to be added in the electronic equipment while the mutual interference between the image acquisition assembly and the frame antenna 3 is reduced.

In one embodiment, the ratio of the projection area of the first conductive member 2 on the image capturing module to the projection area of the image capturing module on the middle frame of the electronic device is greater than a third preset value.

In this embodiment of the present application, in order to improve the electromagnetic coupling effect between the shielding film 11 and the first conductive member 2, the projection area of the electronic device on the image acquisition module may be larger, and the conductive member closer to the image acquisition module may be used as the first conductive member 2.

Hereinafter, for convenience of explanation, the projection area of the first conductive member 2 on the image capturing module is referred to as a first projection area, the projection area of the image capturing module on the middle frame of the electronic device is referred to as a second projection area,

for example, a conductive member having a ratio of the first projected area to the second projected area larger than a third preset value in the electronic apparatus may be used as the first conductive member 2.

The third preset value may be any value greater than or equal to 4/5.

If the electronic device does not have a conductive member having a ratio of the first projection area to the second projection area greater than the third preset value, the size of the conductive member in the electronic device that can be used as the first conductive member 2 can be properly adjusted to obtain the first conductive member 2.

In one embodiment, a second conductive member 4 is attached to a side of the first conductive member 2 facing the image capturing module, where the first conductive member 2 is a hard conductive member and the second conductive member 4 is a flexible conductive member.

In the embodiment of the present application, if the distance between the first conductive element 2 and the shielding film 11 is too large, the electromagnetic coupling effect between the first conductive element 2 and the shielding film 11 is affected. Based on this, the second conductive member 4 may be attached to the side of the first conductive member 2 close to the shielding film 11, so as to shorten the coupling distance between the first conductive member 2 and the shielding film 11, and improve the coupling effect.

In another embodiment, the second conductive member 4 may be attached to the second film layer 112 of the shielding film 11, so that the coupling distance between the first conductive member 2 and the shielding film 11 may be shortened, and the coupling effect may be improved.

In another embodiment, the coupling distance between the first conductive element 2 and the shielding film 11 may be shortened by attaching the second conductive element 4 to both the side of the first conductive element 2 near the shielding film 11 and the second film layer 112 of the shielding film 11, so as to improve the coupling effect.

Illustratively, the coupling distance between the first conductive member 2 and the second film layer 112 of the shielding film 11 may be shortened to be less than a preset distance by attaching the second conductive member 4 on the first conductive member 2 and/or on the second film layer 112 of the shielding film 11.

Wherein the preset distance may be a maximum distance enabling a tight coupling in the electromagnetic coupling between the first conductive member 2 and the shielding film 11.

For example, the above-mentioned preset distance may be set to 0.1mm.

The first conductive member 2 is made of a hard material.

For example, a conductive member made of a steel material.

The second conductive member 4 is made of a flexible conductive material.

For example, the second conductive member 4 is a conductive member made of conductive foam.

The second conductive element 4 may be fixed on the first conductive element 2 and/or the second film layer 112 of the shielding film 11 by using an adhesive, or may be fixed on the first conductive element 2 and/or the second film layer 112 of the shielding film 11 by using other methods, which is not limited in the embodiment of the present application.

The thickness and the dimension of the second conductive member 4 on the first conductive member 2 and/or the shielding film 11 may be designed according to the needs, which is not limited in the embodiment of the present application.

The second conductive member 4 attached to the first conductive member 2 and/or the shielding film 11 may be, for example, a conductive foam having a loop shape.

In another embodiment, the first conductive member 2 is provided with a protrusion 5 which is close to the image acquisition module;

the protrusion 5 is spaced from the shielding film 11, and the distance between the protrusion 5 and the shielding film 11 is smaller than a preset distance.

In this embodiment of the present application, when the electronic device is produced, the first conductive element 2 in the electronic device is designed to have the protrusion 5 facing the image acquisition module, and the distance between the first conductive element 2 and the shielding film 11 can be shortened to be smaller than the preset distance by the protrusion 5, so that electromagnetic coupling between the first conductive element 2 and the shielding film 11 can be achieved.

For example, in order to increase the coupling area between the first conductive element 2 and the shielding film 11 and improve the coupling effect, the ratio of the projection surface of the bump 5 on the manufactured first conductive element 2 on the image acquisition module to the second projection area may be greater than a third preset value.

The above-mentioned bump 5 may be obtained by sinking at least a part of the plane of the first conductive member 2, for example.

It should be noted that, the electromagnetic coupling in the embodiment of the present application may be a tight coupling.

Referring to fig. 1 to 7, an electronic device is further provided in an embodiment of the present application, including:

the image acquisition assembly 10 with OIS (Optical Image Stabilizer ) needs to wrap the shielding film 11 outside as an equivalent "ground" of the image acquisition assembly 10 itself, changing the metal boundary conditions of the image acquisition assembly 10 so that the interference current cannot enter the interior of the image acquisition assembly 10 to be directed to the equivalent "ground".

According to the heat dissipation demand, the upper side of the image acquisition assembly 10 can be covered with a complete shielding film 11 made of copper graphite materials, a first film layer 111 of the shielding film 11 is made of copper materials, a second film layer 112 is made of heat dissipation graphite films, and the shielding film is attached to the outer surface of each camera included in the image acquisition assembly 10, so that coupling energy between each camera and an antenna included in the image acquisition assembly 10 is integrated, and the follow-up electromagnetic coupling is facilitated.

The heat dissipation graphite film is arranged between the first film layer 111 and the first conductive piece 2, plays a semi-insulating role, blocks current coupling, namely prevents the current on the front camera of the image acquisition assembly 10 and the first conductive piece 2 from being led into new clutters by forming other resonance paths on the first conductive piece 2 due to short circuit, and ensures that only electromagnetic coupling relation exists between the first conductive piece 2 and the copper sheet and the image acquisition assembly 10.

Note that the coverage area of the shielding film 11 on the image acquisition assembly 10 must not be less than 80% of the outer surface area of the image acquisition assembly 10. The second film layer 112 of the shielding film 11 is placed on the first conductive piece 2 stuck with the loop-type conductive foam, and the projection area of the first conductive piece 2 on the image acquisition assembly 10 needs to cover more than 4/5 of the image acquisition assembly 10, so that a sufficient coupling surface is ensured. The effect of adding the back-type conductive foam is to equivalently shorten the distance between the first conductive piece 2 and the shielding film 11 and ensure that the first conductive piece 2 and the shielding film 11 can effectively generate a tight coupling effect, so that the distance between the conductive foam and the shielding film 11 needs to be ensured to be within 0.1mm.

As shown in fig. 2, if the image capturing element 10 without the shielding film 11 is directly installed in the electronic device, a clutter will be introduced in the operating band of the bezel antenna 3, such as at a point a in the SMITH chart in fig. 2, and after the image capturing element 10 with OIS is wrapped with copper sheet, the SMITH chart of the bezel antenna 3 is unchanged, which indicates that the operation only changes the metal boundary condition of the image capturing element 10 and does not have the effect of moving clutter. It can be observed that the shape of the SMITH circle map hit by the clutter location is not smooth, because the two cameras included in the image acquisition assembly 10 both generate clutter to affect the bezel antenna 3, and because the relative positions of the two cameras and the bezel antenna 3 are different, the frequencies of the two clutter will be different, so that the clutter is not smooth on the SMITH circle map.

After the image capturing component 10 is covered by the shielding film 11, see line B in the SMITH chart in fig. 2, the clutter is found to shift to a low frequency, and the circle corresponding to the clutter on the SMITH chart becomes smoother and converges, because after the two cameras are connected by the first film layer 111 of the shielding film 11, the original two clutter paths are combined into one, and the new path is longer than the clutter paths generated by the two separate cameras. Although the clutter is pulled out of the sidebands of the antenna operating frequency, the radiation efficiency of the antenna sidebands still has an effect. Thus, the problem is further solved here by means of electromagnetic coupling.

By adding conductive foam on the first conductive member 2, the distance between the first conductive member 2 and the image acquisition assembly 10 is reduced, so that an electric field tight coupling state is generated between the first conductive member 2 and the image acquisition assembly 10. As can be seen from line C in the SMITH chart shown in fig. 2, clutter completely disappears, since the electric field on the image acquisition assembly 10 now has a short-circuited effect to ground by the close coupling of the shielding film 11 to the first conductive member 2, and the corresponding current path is correspondingly destroyed.

In addition, as can be seen from the simulation current diagram of fig. 7, after the image acquisition module according to the embodiment of the present application is used in the electronic device, the interference current near the image acquisition assembly 10 is significantly reduced (the size and the intensity of the arrows in fig. 7 are used to indicate the current size).

With reference to fig. 6, it should be noted that this tight coupling method must be implemented based on the presence of a weakly conductive or insulating material, such as graphite, between the image acquisition assembly 10 and the first conductive member 2. Referring to line a in fig. 6, after the surface of the image acquisition component 10 is coated by using copper sheet, the surface is directly connected with the first conductive member 2 through conductive foam, and clutter at the side band is only weakened but cannot be removed. It is explained that simply relying on the short circuit between the image capturing element 10 and the first conductive member 2 cannot solve the clutter problem between the image capturing element 10 and the frame antenna 3. Meanwhile, after the copper sheet is used for short circuit, the overall standing wave of the antenna and the circular figure of the SMITH become unsmooth, because after the energy of the hybrid wave is directly conducted to the first conductive member 2, resonance can be formed on the first conductive member 2, the performance of the frame antenna 3 is more adversely affected,

referring to line b in fig. 6, after the coupling distance between the first conductive member 2 and the shielding film 11 is smaller than the preset distance when the shielding film 11 and the conductive foam are used, clutter on the frame antenna 3 has completely disappeared, so that it can be seen that by adopting the image acquisition module of the embodiment of the present application in electronic equipment, interference current generated by the frame antenna 3 can be effectively shielded.

In addition, the sinking processing can be performed on the part of the first conductive element 2 located in the projection area of the image acquisition assembly 10, so that the distance between the first conductive element 2 and the image acquisition assembly 10 is shortened to be less than 0.1mm, and the tight coupling effect can be achieved.

Referring to fig. 8, in an embodiment of the present application, an electronic device 800 is provided, where the electronic device 900 is the first device or the second device, and the electronic device includes:

a memory 904 for storing processor-executable instructions;

a processor 820 connected to the memory 804;

a block diagram of an electronic device 800 is shown in accordance with an exemplary embodiment. For example, the electronic device 800 may be a mobile phone, a tablet computer, a notebook computer, or a terminal device with an image capturing function.

Referring to fig. 8, an electronic device 800 may include one or more of the following components: a processing component 802, a memory 804, a power component 806, a multimedia component 808, an audio component 810, an input/output (I/O) interface 812, a sensor component 814, and a communication component 818.

The processing component 802 generally controls overall operation of the electronic device 800, such as operations associated with display, telephone calls, data communications, camera operations, and recording operations. The processing component 802 may include one or more processors 820 to execute instructions to perform all or part of the steps of the methods described above. Further, the processing component 802 can include one or more modules that facilitate interactions between the processing component 802 and other components. For example, the processing component 802 can include a multimedia module to facilitate interaction between the multimedia component 808 and the processing component 802.

The memory 804 is configured to store various types of data to support operations at the electronic device 800. Examples of such data include instructions for any application or method operating on the electronic device 800, contact data, phonebook data, messages, pictures, videos, and so forth. The memory 804 may be implemented by any type or combination of volatile or nonvolatile memory devices such as Static Random Access Memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, magnetic or optical disk.

The power supply component 806 provides power to the various components of the electronic device 800. The power components 806 may include a power management system, one or more power sources, and other components associated with generating, managing, and distributing power for the electronic device 800.

The multimedia component 808 includes a screen between the electronic device 800 and the user that provides an output interface. In some embodiments, the screen may include a Liquid Crystal Display (LCD) and a Touch Panel (TP). If the screen includes a touch panel, the screen may be implemented as a touch screen to receive input signals from a user. The touch panel includes one or more touch sensors to sense touches, swipes, and gestures on the touch panel. The touch sensor may sense not only the boundary of a touch or slide action, but also the duration and pressure associated with the touch or slide operation. In some embodiments, the multimedia component 808 includes a front camera and/or a rear camera. When the electronic device 800 is in an operational mode, such as a shooting mode or a video mode, the front camera and/or the rear camera may receive external multimedia data. Each front camera and rear camera may be a fixed optical lens system or have focal length and optical zoom capabilities.

The audio component 810 is configured to output and/or input audio signals. For example, the audio component 810 includes a Microphone (MIC) configured to receive external audio signals when the electronic device 800 is in an operational mode, such as a call mode, a recording mode, and a voice recognition mode. The received audio signals may be further stored in memory 804 or transmitted via communication component 818. In some embodiments, audio component 810 further includes a speaker for outputting audio signals.

The I/O interface 812 provides an interface between the processing component 802 and peripheral interface modules, which may be a keyboard, click wheel, buttons, etc. These buttons may include, but are not limited to: homepage button, volume button, start button, and lock button.

The sensor assembly 814 includes one or more sensors for providing status assessment of various aspects of the electronic device 800. For example, the sensor assembly 814 may detect an on/off state of the electronic device 800, a relative positioning of the components, such as a display and keypad of the electronic device 800, the sensor assembly 814 may also detect a change in position of the electronic device 800 or a component of the electronic device 800, the presence or absence of a user's contact with the electronic device 800, an orientation or acceleration/deceleration of the electronic device 800, and a change in temperature of the electronic device 800. The sensor assembly 814 may include a proximity sensor configured to detect the presence of nearby objects without any physical contact. The sensor assembly 814 may also include a light sensor, such as a CMOS or CCD biometric sensor, for use in imaging applications. In some embodiments, the sensor assembly 814 may also include an acceleration sensor, a gyroscopic sensor, a magnetic sensor, a pressure sensor, or a temperature sensor.

Communication component 818 is configured to facilitate communication between electronic device 800 and other devices, either wired or wireless. The electronic device 800 may access a wireless network based on a communication standard, such as WiFi,2G, or 3G, or a combination thereof. In one exemplary embodiment, communication component 818 receives broadcast signals or broadcast related information from an external broadcast management system via a broadcast channel. In an exemplary embodiment, the communication component 818 further includes a Near Field Communication (NFC) module to facilitate short range communications. For example, the NFC module may be implemented based on Radio Frequency Identification (RFID) technology, infrared data association (IrDA) technology, ultra Wideband (UWB) technology, bluetooth (BT) technology, and other technologies.

It is to be understood that the present application is not limited to the precise arrangements and instrumentalities shown in the drawings, which have been described above, and that various modifications and changes may be effected without departing from the scope thereof. The scope of the application is limited only by the appended claims.

Claims (9)

1. An image acquisition module, characterized by comprising: an image acquisition assembly and a shielding film;

the shielding film includes:

a first film layer comprising a conductive material;

the second film layer is arranged on the first film layer and comprises an insulating material or a semi-insulating material;

the first film layer is attached to the outer surface of the image acquisition assembly, and interference current is led out through a path isolated from a circuit in the image acquisition assembly.

2. The image acquisition module of claim 1, wherein the image acquisition module comprises a plurality of image acquisition modules,

the heat dissipation coefficient of the shielding film is larger than a first preset value.

3. The image acquisition module of claim 2, wherein the image acquisition module comprises a plurality of image acquisition modules,

the ratio of the attaching area of the first film layer on the surface of the image acquisition assembly to the outer surface area of the image acquisition assembly is larger than a second preset value.

4. The image acquisition module according to claim 3, wherein,

the first film layer is made of copper materials;

the second film layer is made of graphite materials.

5. An electronic device, comprising:

an image acquisition module according to any one of claims 1 to 4;

and a first conductive member disposed between the rear case of the electronic device and the image acquisition module; wherein the first conductive member is grounded;

the shielding film of the image acquisition module realizes shielding of interference current through electromagnetic coupling with the first conductive piece.

6. The electronic device of claim 5, wherein the electronic device comprises a memory device,

the ratio of the projection area of the first conductive piece on the image acquisition module to the projection area of the image acquisition module on the middle frame of the electronic equipment is larger than a third preset value.

7. The electronic device of claim 6, wherein the electronic device comprises a memory device,

and a second conductive piece is attached to one side of the first conductive piece, which faces the image acquisition module, wherein the first conductive piece is a hard conductive piece, and the second conductive piece is a flexible conductive piece.

8. The electronic device of claim 7, wherein the electronic device comprises a memory device,

the second conductive piece is conductive foam.

9. The electronic device of claim 5, wherein the electronic device comprises a memory device,

the first conductive piece is provided with a bulge which is close to the image acquisition module;

the protrusions are arranged at intervals with the shielding films, and the distance between the protrusions and the shielding films is smaller than a preset distance.