CN210840535U

CN210840535U - Sound input module and terminal equipment

Info

Publication number: CN210840535U
Application number: CN201921400810.0U
Authority: CN
Inventors: 石奇; 张鹏飞; 谢红奎
Original assignee: Beijing Xiaomi Mobile Software Co Ltd
Current assignee: Beijing Xiaomi Mobile Software Co Ltd
Priority date: 2019-08-26
Filing date: 2019-08-26
Publication date: 2020-06-23
Anticipated expiration: 2029-08-26

Abstract

The present disclosure relates to a voice input module and a terminal device, the voice input module includes: a substrate; the first shielding shell covers the substrate and forms a first accommodating space with the substrate; the second shielding shell covers the substrate and forms a second accommodating space with the substrate; the second shielding shell is positioned in the first accommodating space and is arranged at an interval with the first shielding shell; the sound conversion assembly is arranged on the substrate, is positioned in the second accommodating space and is used for converting the detected sound signal into an electric signal; the first shielding shell is connected with a first grounding end; the second shielding shell is connected with a second grounding terminal, and the first grounding terminal is different from the second grounding terminal. The situation that the sound conversion assembly is subjected to radiation interference can be effectively reduced through the embodiment of the disclosure.

Description

Sound input module and terminal equipment

Technical Field

The present disclosure relates to the field of electronic devices, and in particular, to a sound input module and a terminal device.

Background

With the wide application of the terminal device and the complexity of the radiation environment, the sound input module of the terminal device is more and more easily subjected to radiation interference in practical application. At present, when a sound input module is designed, a shielding shell is usually welded on the sound input module to improve the anti-interference capability of the sound input module. Then, radio frequency interference cannot be effectively reduced by only one shielding case.

SUMMERY OF THE UTILITY MODEL

The disclosure provides a sound input module and a terminal device.

According to a first aspect of the embodiments of the present disclosure, there is provided a sound input module, at least including:

a substrate;

the first shielding shell covers the substrate and forms a first accommodating space with the substrate;

the second shielding shell covers the substrate and forms a second accommodating space with the substrate; the second shielding shell is positioned in the first accommodating space and is arranged at an interval with the first shielding shell;

the sound conversion assembly is arranged on the substrate, is positioned in the second accommodating space and is used for converting the detected sound signal into an electric signal;

the first shielding shell is connected with a first grounding end; the second shielding shell is connected with a second grounding terminal, and the first grounding terminal is different from the second grounding terminal.

In one embodiment, the substrate includes:

a first pad provided on a first surface of the substrate for fixing the first shield case on the first surface;

the second bonding pad is arranged on the second surface of the substrate and is connected with the first grounding terminal;

the first shielding shell is connected with the second bonding pad through the first bonding pad, and the second surface of the substrate is the opposite surface of the first surface of the substrate.

In one embodiment, the substrate further comprises:

the at least two first through holes are arranged on the substrate at intervals, are communicated with the first bonding pads and the second bonding pads, and are used for transmitting the radiation signals of the first shielding shell to the first grounding end connected with the second bonding pads through the connecting conductors of the at least two first through holes.

In one embodiment, the first pad surrounds an edge of the first shielding shell.

In one embodiment, the substrate further comprises:

a third pad provided on the first surface of the substrate and capable of fixing the second shield case on the first surface;

the fourth bonding pad is arranged on the second surface of the substrate and is connected with the second grounding terminal;

the second shielding shell is connected with the fourth bonding pad through the third bonding pad, and the second surface of the substrate is the opposite surface of the first surface of the substrate.

In one embodiment, the substrate further comprises:

and the at least two second through holes are arranged on the substrate at intervals, are communicated with the third bonding pad and the fourth bonding pad, and are used for transmitting the radiation signal of the second shielding shell to the second grounding end connected with the fourth bonding pad through the connecting conductors of the at least two second through holes.

In one embodiment, the sound input module further includes:

the sound hole is arranged on the substrate and is used for allowing the sound signal to enter the second accommodating space, so that the sound conversion assembly in the second accommodating space can detect the sound signal;

the fourth pad surrounds the edge of the sound hole.

In one embodiment, the sound input module further includes:

the signal processing assembly is connected with the sound conversion assembly, is positioned in the second accommodating space and is used for processing the electric signal to obtain a processed electric signal;

the second grounding terminal is connected with the grounding terminal of the signal processing assembly.

In one embodiment, the first and second shield shells are each a shell formed of a metal structure.

According to a second aspect of the embodiments of the present disclosure, there is provided a terminal device, at least comprising:

a printed circuit board;

and the sound input module, which comprises the sound input module described in one or more embodiments above, is mounted on the printed circuit board and is used for converting the detected sound signal into an electrical signal.

In one embodiment, the terminal device further includes:

the decoding assembly is arranged on the printed circuit board, is connected with the sound conversion assembly of the sound input module and is used for decoding the electric signal;

a first line connecting an output terminal of the voice conversion module and an input terminal of the decoding module;

a second line connecting the second shield case and a ground terminal of the signal processing module;

wherein the second line and the first line form a pseudo-differential line for the electrical signal transmission.

The technical scheme provided by the embodiment of the disclosure can have the following beneficial effects:

the sound conversion subassembly is located first shield shell and second shield shell respectively, that is to say, this disclosed embodiment can realize double-deck shielding to the sound conversion subassembly, has effectively reduced the condition that the sound conversion subassembly received radiation interference. In addition, the first shielding shell and the second shielding shell of the embodiment of the disclosure are arranged at intervals and are respectively connected with different grounding ends, so that the first shielding shell and the second shielding shell can be physically isolated, the condition that the sound conversion assembly is subjected to radiation interference is further reduced, and the performance of the sound conversion assembly is effectively improved.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.

Fig. 1 is a schematic diagram of a sound input module according to an exemplary embodiment.

Fig. 2 is a schematic diagram of a sound input module according to an exemplary embodiment.

Fig. 3 is a schematic diagram illustrating an arrangement of a first pad and a second pad according to an exemplary embodiment.

Fig. 4 is a first schematic diagram illustrating a via arrangement according to an example embodiment.

Fig. 5 is a schematic diagram illustrating an arrangement of third and fourth pads according to an exemplary embodiment.

FIG. 6 is a second schematic diagram illustrating a via arrangement according to an exemplary embodiment.

Fig. 7 is a schematic diagram of a sound input module according to an exemplary embodiment.

Fig. 8 is a third schematic diagram illustrating a via arrangement according to an exemplary embodiment.

Fig. 9 is a schematic diagram illustrating connection lines of a sound input module according to an exemplary embodiment.

Fig. 10 is a block diagram illustrating a terminal device structure according to an example embodiment.

Detailed Description

Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present invention. Rather, they are merely examples of apparatus consistent with certain aspects of the invention, as detailed in the appended claims.

An embodiment of the present disclosure provides a voice input module, as shown in fig. 1, the voice input module at least includes:

a substrate 11;

a first shielding case 12 covering the substrate and forming a first accommodating space with the substrate;

a second shielding case 13 covering the substrate and forming a second accommodating space with the substrate; the second shielding shell is positioned in the first accommodating space and is arranged at an interval with the first shielding shell;

a sound conversion assembly 14 mounted on the substrate and located in the second accommodating space for converting the detected sound signal into an electrical signal;

In an embodiment of the present disclosure, the sound input module includes a substrate, a first shielding case, a second shielding case, and a sound conversion module.

Illustratively, the sound input module includes, but is not limited to, a microphone, which may be a Micro-Electro-Mechanical System (MEMS) microphone.

In the disclosed embodiment, the substrate includes, but is not limited to, being formed of a copper clad laminate.

It should be noted that, the first shielding shell and the second shielding shell are both used for transmitting the radiation signal to the ground terminal, so as to reduce the radiation interference on the sound conversion assembly.

In one embodiment, the first and second shielding shells are each shells formed from a conductive structure.

Illustratively, the conductive structure includes, but is not limited to, a metal or an alloy.

In the embodiment of the present disclosure, the first shielding shell and the second shielding shell are disposed at an interval and are respectively connected to different ground terminals.

As shown in fig. 2, a predetermined distance is provided between the first shielding shell 12 and the second shielding shell 13, a first accommodating space formed by the first shielding shell 12 and the substrate is larger than a second accommodating space formed by the second shielding shell and the substrate, the second shielding shell 13 is located in the first accommodating space, the first shielding shell 12 is connected to the first ground terminal 31, and the second shielding shell 13 is connected to the second ground terminal 32.

It should be noted that the preset distance between the first shielding shell 12 and the second shielding shell 13 may be designed according to actual needs, for example, the preset distance may be set to 10 mm, and the embodiment of the present disclosure is not limited.

It can be understood that the first shielding shell and the second shielding shell are respectively connected with different grounding ends, and the two shielding shells can form physical isolation, so that the condition that the sound conversion assembly is interfered by radiation is further reduced.

In one embodiment, as shown in fig. 3, the substrate includes:

a first pad 15 provided on the first surface of the substrate 11 for fixing the first shield case 12 on the first surface;

a second pad 16 disposed on the second surface of the substrate 11 and connected to the first ground terminal;

the first shielding shell 12 is connected to the second pad 16 through the first pad 15, and the second surface of the substrate 11 is opposite to the first surface of the substrate 11.

That is, the first surface of the substrate is provided with the first pads, and the second surface of the substrate is provided with the second pads. The second bonding pad can be connected with the first grounding terminal, and the first bonding pad can be used for fixing the first shielding shell and can be connected with the second bonding pad so as to realize that the first shielding shell can be connected with the first grounding terminal.

The first ground terminal is connected to the main ground of the substrate.

In the embodiment of the present disclosure, the shapes of the first pad and the second pad may be set according to practical applications. For example, the shapes of the first pad and the second pad may be set to be circular, and the embodiments of the present disclosure are not limited.

In one embodiment, the substrate further comprises:

and the at least two first through holes are arranged on the substrate at intervals, are communicated with the first bonding pad and the second bonding pad, and are used for transmitting the radiation signal of the first shielding shell to a first grounding end connected with the second bonding pad through the connecting conductors of the at least two first through holes.

It should be noted that at least two first through holes are covered with a connection conductor. The first pad and the second pad may be connected by a connection conductor in the first through hole, so that the radiation signal of the first shield case is transmitted to the first ground terminal.

For example, the connection conductor in the first through hole may be a conductor formed of a metal or an alloy.

As shown in fig. 4, fig. 4 is a schematic view from the second surface of the substrate, at least two first through holes 19 are provided on the substrate, the first through holes are located on the second pads 16 on the second surface, and the second pads 16 can be connected to the first pads through the connection conductors in the at least two first through holes 19, so that the radiation signals from the first shield case can be connected to the first ground terminals connected to the second pads.

It can be understood that the first pad is connected to the second pad through at least two first through holes, so that the radiation signal of the first shielding shell can be transmitted to the first ground terminal connected to the second pad, and the sound conversion assembly can be protected from each surface of the first shielding shell, so as to reduce the radiation interference of the sound conversion assembly.

In the embodiment of the present disclosure, the first pad forms a closed shape around the edge of the first shield case. The shape of the first pad may be set according to the edge shape of the first shielding shell, for example, when the edge shape of the first shielding shell is a rectangle, the shape of the first pad may also be set to be a rectangle, and the embodiment of the disclosure is not limited.

It should be noted that the position of the second pad can be set according to actual needs, as long as the first pad can be connected with the second pad through at least two first vias. For example, the second pad may be correspondingly disposed on the second surface according to the position of the first pad, or disposed to surround the edge of the second surface, and the embodiments of the present disclosure are not limited thereto.

It can be understood that the first shielding shell can be better fixed on the first surface by arranging the first pad to surround the edge of the first shielding shell, and meanwhile, the subsequent arrangement of a plurality of through holes on the first pad is convenient to block radio frequency interference entering from the periphery of the base material, so that the condition that the resistor or the capacitor arranged in the base material is interfered by the radio frequency is reduced.

In one embodiment, as shown in fig. 5, the substrate further includes:

third pads 17 provided on the first surface of the substrate 11 and capable of fixing the second shield case 13 on the first surface;

a fourth pad 18 disposed on the second surface of the substrate 11 and connected to the second ground terminal;

That is, the first surface of the substrate is provided with the third pads, and the second surface of the substrate is provided with the fourth pads. The fourth pad can be connected to the second ground terminal, and the third pad can be used to fix the second shielding shell and can be connected to the fourth pad, so that the second shielding shell can be connected to the second ground terminal.

In the embodiment of the present disclosure, the shapes of the third pad and the fourth pad may be set according to practical applications. For example, the shape of the third pad and the fourth pad may be set to be circular, and the disclosed embodiment is not limited.

In one embodiment, the substrate further comprises:

and the at least two second through holes are arranged on the substrate at intervals, are communicated with the third bonding pad and the fourth bonding pad, and are used for transmitting the radiation signal of the second shielding shell to a second grounding end connected with the fourth bonding pad through the connecting conductors of the at least two second through holes.

It should be noted that at least two second through holes are covered with connecting conductors. The third pad and the fourth pad may be connected by the connection conductor in the second through hole, so that the radiation signal of the second shield case is transmitted to the second ground terminal.

The connection conductor in the second through hole may be a conductor formed of a metal or an alloy, for example.

As shown in fig. 6, fig. 6 is a schematic view from the second surface of the substrate, at least two first through holes 19 and at least two second through holes 20 are provided on the substrate, the at least two first through holes 19 are provided on the second pads 16 of the second surface, and the at least two second through holes 20 are provided on the fourth pads 18 of the second surface. And, the fourth pad 18 can be connected to the second pad through the connection conductors in the at least two second through holes 20, so that the radiation signal from the second shield case can be connected to the second ground terminal connected to the fourth pad.

It can be understood that the third pad is connected to the fourth pad through at least two second through holes, so that the radiation signal of the second shielding case can be transmitted to the second ground terminal connected to the fourth pad, and the sound conversion module can be protected from each surface of the second shielding case, so as to reduce the radiation interference of the sound conversion module.

In one embodiment, the third pad surrounds an edge of the second shielding shell.

In one embodiment, the sound input module further includes:

the sound hole is arranged on the substrate and used for allowing the sound signal to enter the second accommodating space, so that the sound conversion assembly in the second accommodating space can detect the sound signal;

and a fourth pad surrounding an edge of the sound hole.

As shown in fig. 7, the first surface of the substrate 11 has a first pad 15 and a third pad 17, the first pad 15 surrounds the edge of the first shielding shell to form a closed shape, and the third pad 17 surrounds the edge of the base material to form a closed shape. The second surface of the substrate 11 has a second pad 16 and a fourth pad 18, the second pad 16 forms a closed shape around the edge of the second shielding shell, and the fourth pad 18 forms a closed shape around the edge of the sound hole 21. The sound hole 21 penetrates through the substrate 11, and can allow a sound signal to enter the second accommodating space, so that the sound signal can be detected by the sound conversion assembly in the second accommodating space.

In the embodiment of the present disclosure, the shape of the fourth pad may be set according to the shape of the sound hole, for example, when the shape of the sound hole is a circle, the shape of the fourth pad may be set to be a circular ring, and the embodiment of the present disclosure is not limited.

Of course, when the shape of the fourth pad is a circular ring, the diameter of the circular ring of the fourth pad may also be set according to the diameter of the acoustic hole. For example, the diameter of the circular ring of the fourth pad may be set to be 0.65 cm, and the embodiments of the present disclosure are not limited thereto.

In one embodiment, at least two first through holes surround the edge of the substrate; at least two second through holes surround the edge of the sound hole.

As shown in fig. 8, at least two first through holes 19 are provided on the third pad 16 of the substrate and surround the edge of the substrate. According to the embodiment of the disclosure, through the at least two surrounding first through holes, the radio frequency interference signal entering from the direction of the first through hole can be transmitted to the second bonding pad and further down to the first grounding end, so that the radio frequency interference signal can be prevented from entering from the side surface of the substrate, and the condition that the resistor or the capacitor surrounding in the substrate is interfered by the radio frequency is reduced.

At least two second through holes 20 are provided on the fourth pad 18 of the substrate and surround the edge of the sound hole 21. Compared with the situation that the grounding pad is connected with the grounding pad nearby the sound hole through only one through hole, the embodiment of the disclosure can enable the radio frequency interference signal entering from the direction of the second through hole to be transmitted to the fourth pad through the at least two second through holes which are surrounded, and then the radio frequency interference signal is lowered to the second grounding end, so that the radio frequency interference signal can be prevented from entering from the side surface of the sound hole, and the situation that the resistor or the capacitor which is surrounded nearby the sound hole is interfered by the radio frequency is reduced.

In one embodiment, the sound input module further includes:

and the second grounding end is connected with the grounding end of the signal processing assembly.

It should be noted that the signal processing component can be used for performing amplification processing on the electrical signal and/or performing analog-to-digital conversion on the electrical signal.

Illustratively, the signal processing components include, but are not limited to, Application Specific Integrated Circuits (ASICs).

It can be understood that the signal processing assembly and the sound conversion assembly are located in the second accommodating space, and the second accommodating space is located in the first accommodating space of the first shielding shell. Therefore, when radiation interference exists, the first shielding shell is connected with the first grounding end, the interference radiated in can be directly transmitted to the first grounding end, and therefore the signal processing assembly and the sound conversion assembly cannot be influenced. And, when the radiation interference signal passes through first shield shell, the second shield shell can be once more with the radiation signal access of entering to second earthing terminal, realizes double-deck shielding, reaches the effect that improves the antiradiation.

The embodiment of the present disclosure further provides a terminal device, where the terminal device at least includes:

a printed circuit board;

the voice input module, including the voice input module in the above embodiments, is mounted on the printed circuit board, and is configured to convert the detected voice signal into an electrical signal.

In the embodiment of the present disclosure, the terminal device may include, but is not limited to, a mobile device or a wearable device, wherein the mobile device includes a smartphone, a tablet computer, and an e-book reader.

The second surface of the substrate of the sound input module is connected to the printed circuit board, and the sound input module can be fixed on the printed circuit board through the second bonding pad and the fourth bonding pad on the second surface.

In one embodiment, the terminal device further includes:

the decoding component is arranged on the printed circuit board, is connected with the sound conversion component of the sound input module and is used for decoding the electric signal;

the first circuit is connected with the output end of the sound conversion component and the input end of the decoding component;

the second circuit is connected with the second shielding shell and the grounding end of the signal processing assembly;

the second circuit and the first circuit form a pseudo differential circuit for electric signal transmission.

The terminal device further includes a third line and a fourth line, where the third line is connected to the ground terminal of the signal processing module and the ground terminal of the sound conversion module; a fourth line connected to the ground terminal of the signal processing module and the ground terminal of the decoding module; the connecting line from the grounding end of the sound input module to the grounding end of the decoding component is formed through the second line, the third line and the fourth line.

As shown in fig. 9, the power supply terminal VDD of the sound conversion module is connected to the power supply MIC _ BIAS1 of the sound input module through the inductor L6000; the OUTPUT end OUTPUT of the sound conversion assembly OUTPUTs signals through an inductor R6000; the ground GND of the sound conversion block is connected to the ground ASIC GND of the signal processing block. In practical application, the sound input module transmits the OUTPUT signal to the decoding module, the ground ASIC GND of the signal processing module is connected to the ground GND of the decoding module, and the OUTPUT terminal OUTPUT of the signal processing module is connected to the input terminal of the decoding module. The line connected to the ground terminal ASIC GND of the signal processing module and the line connected to the output terminal of the sound conversion module are parallel lines, and a pseudo-differential line for transmitting an electric signal can be formed.

It can be understood that the first line and the second line form a pseudo differential line for electric signal transmission, which not only can improve the anti-interference capability of the lines, but also can effectively suppress electromagnetic radiation interference.

It should be noted that "first", "second", "third" and "fourth" in the embodiments of the present disclosure are merely for convenience of description and distinction, and have no other specific meaning.

With regard to the apparatus in the above-described embodiment, the specific manner in which each unit performs the operation has been described in detail in the embodiment related to the method, and will not be described in detail here.

Fig. 10 is a block diagram illustrating a terminal device structure according to an example embodiment. For example, the terminal device 800 may be a mobile phone, a computer, a digital broadcast terminal, a messaging device, a game console, a tablet device, a medical device, a fitness device, a personal digital assistant, and the like.

Referring to fig. 10, terminal device 800 may include one or more of the following components: a processing component 802, a memory 804, a power component 806, a multimedia component 808, an audio component 810, an input/output (I/O) interface 812, a sensor component 814, and a communication component 816.

The processing component 802 generally controls overall operation of the terminal device 800, such as operations associated with display, telephone calls, data communications, camera operations, and recording operations. The processing components 802 may include one or more processors 820 to execute instructions to perform all or a portion of the steps of the methods described above. Further, the processing component 802 can include one or more modules that facilitate interaction between the processing component 802 and other components. For example, the processing component 802 can include a multimedia module to facilitate interaction between the multimedia component 808 and the processing component 802.

The memory 804 is configured to store various types of data to support operations at the terminal device 800. Examples of such data include instructions for any application or method operating on terminal device 800, contact data, phonebook data, messages, pictures, videos, and so forth. The memory 804 may be implemented by any type or combination of volatile or non-volatile memory devices such as Static Random Access Memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, magnetic or optical disks.

Power components 806 provide power to the various components of terminal device 800. Power components 806 may include a power management system, one or more power sources, and other components associated with generating, managing, and distributing power for terminal device 800.

The multimedia component 808 comprises a screen providing an output interface between the terminal device 800 and a user. In some embodiments, the screen may include a Liquid Crystal Display (LCD) and a Touch Panel (TP). If the screen includes a touch panel, the screen may be implemented as a touch screen to receive an input signal from a user. The touch panel includes one or more touch sensors to sense touch, slide, and gestures on the touch panel. The touch sensor may not only sense the boundary of a touch or slide action, but also detect the duration and pressure associated with the touch or slide operation. In some embodiments, the multimedia component 808 includes a front facing camera and/or a rear facing camera. When the terminal device 800 is in an operation mode, such as a shooting mode or a video mode, the front camera and/or the rear camera may receive external multimedia data. Each front camera and rear camera may be a fixed optical lens system or have a focal length and optical zoom capability.

The audio component 810 is configured to output and/or input audio signals. For example, the audio component 810 includes a Microphone (MIC) configured to receive an external audio signal when the terminal device 800 is in an operation mode, such as a call mode, a recording mode, and a voice recognition mode. The received audio signals may further be stored in the memory 804 or transmitted via the communication component 816. In some embodiments, audio component 810 also includes a speaker for outputting audio signals.

The I/O interface 812 provides an interface between the processing component 802 and peripheral interface modules, which may be keyboards, click wheels, buttons, etc. These buttons may include, but are not limited to: a home button, a volume button, a start button, and a lock button.

Sensor component 814 includes one or more sensors for providing various aspects of state assessment for terminal device 800. For example, sensor assembly 814 may detect an open/closed status of terminal device 800, the relative positioning of components, such as a display and keypad of terminal device 800, sensor assembly 814 may also detect a change in the position of terminal device 800 or a component of terminal device 800, the presence or absence of user contact with terminal device 800, orientation or acceleration/deceleration of terminal device 800, and a change in the temperature of terminal device 800. Sensor assembly 814 may include a proximity sensor configured to detect the presence of a nearby object without any physical contact. The sensor assembly 814 may also include a light sensor, such as a CMOS or CCD image sensor, for use in imaging applications. In some embodiments, the sensor assembly 814 may also include an acceleration sensor, a gyroscope sensor, a magnetic sensor, a pressure sensor, or a temperature sensor.

Communication component 816 is configured to facilitate communications between terminal device 800 and other devices in a wired or wireless manner. The terminal device 800 may access a wireless network based on a communication standard, such as WiFi, 2G or 3G, or a combination thereof. In an exemplary embodiment, the communication component 816 receives a broadcast signal or broadcast related information from an external broadcast management system via a broadcast channel. In an exemplary embodiment, the communication component 816 further includes a Near Field Communication (NFC) module to facilitate short-range communications. For example, the NFC module may be implemented based on Radio Frequency Identification (RFID) technology, infrared data association (IrDA) technology, Ultra Wideband (UWB) technology, Bluetooth (BT) technology, and other technologies.

In an exemplary embodiment, the terminal device 800 may be implemented by one or more Application Specific Integrated Circuits (ASICs), Digital Signal Processors (DSPs), Digital Signal Processing Devices (DSPDs), Programmable Logic Devices (PLDs), Field Programmable Gate Arrays (FPGAs), controllers, micro-controllers, microprocessors or other electronic components for performing the above-described methods.

In an exemplary embodiment, a non-transitory computer-readable storage medium comprising instructions, such as the memory 804 comprising instructions, executable by the processor 820 of the terminal device 800 to perform the above-described method is also provided. For example, the non-transitory computer readable storage medium may be a ROM, a Random Access Memory (RAM), a CD-ROM, a magnetic tape, a floppy disk, an optical data storage device, and the like.

Other embodiments of the invention will be apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the invention and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the invention being indicated by the following claims.

It will be understood that the invention is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the invention is limited only by the appended claims.

Claims

1. A voice input module, comprising at least:

a substrate;

2. The voice input module of claim 1, wherein the substrate comprises:

3. The acoustic input module of claim 2, wherein the substrate further comprises:

4. The sound input module of claim 2, wherein the first pad surrounds an edge of the first shielding shell.

5. The acoustic input module of any of claims 1-4, wherein the substrate further comprises:

6. The acoustic input module of claim 5, wherein the substrate further comprises:

7. The voice input module of claim 5, further comprising:

the fourth pad surrounds the edge of the sound hole.

8. The audio input module of any one of claims 1-4, further comprising:

9. A terminal device, characterized in that the terminal device comprises at least:

a printed circuit board;

an audio input module comprising an audio input module as claimed in any one of claims 1 to 8 mounted on the printed circuit board for converting a detected audio signal into an electrical signal.

10. The terminal device of claim 9, wherein the voice input module comprises a signal processing component for processing signals;

the terminal device further includes: