CN220231524U - Wafer detection device - Google Patents
Wafer detection device Download PDFInfo
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- CN220231524U CN220231524U CN202321584618.8U CN202321584618U CN220231524U CN 220231524 U CN220231524 U CN 220231524U CN 202321584618 U CN202321584618 U CN 202321584618U CN 220231524 U CN220231524 U CN 220231524U
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- 238000001514 detection method Methods 0.000 title claims abstract description 13
- 238000005286 illumination Methods 0.000 claims abstract description 42
- 238000003384 imaging method Methods 0.000 claims abstract description 36
- 238000007689 inspection Methods 0.000 claims description 22
- 239000000523 sample Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 9
- 238000012935 Averaging Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000006112 glass ceramic composition Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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Abstract
The utility model provides a wafer detection device, which comprises a support frame, an illumination system, a prism assembly, a light equalizing plate assembly and an imaging camera, wherein the support frame is provided with a plurality of light guide plates; the lighting system is arranged on the supporting frame and is positioned on one side of the supporting frame, and the lighting system is used for emitting light rays towards the other side of the supporting frame; the other side of the supporting frame is provided with an opening, and the imaging camera is positioned at the other side of the supporting frame and corresponds to the opening and is used for receiving light rays emitted from the opening and imaging; the prism assembly and the light homogenizing plate assembly are both arranged on the supporting frame, the prism assembly is located above the light homogenizing plate assembly, light emitted by the illumination system can sequentially pass through the prism assembly and the light homogenizing plate assembly to irradiate on a wafer, and the prism assembly is further used for guiding out light reflected on the wafer from the opening. The wafer detection device provided by the utility model has smaller space size, realizes bright field illumination, reduces the power of a light source and improves the system performance.
Description
Technical Field
The utility model relates to the technical field of semiconductor detection, in particular to a wafer detection device.
Background
Bright field imaging is an important component in an automatic optical inspection (Automated Optical Inspection, AOI) system, an illumination system is generally inclined at a certain angle or vertically illuminated to the surface of a wafer, and light enters an imaging camera (an imaging lens and a linear array detector) placed at a corresponding angle according to the law of reflection, and the wafer is driven to move by a linear displacement platform to acquire the whole image.
When illumination is performed at an oblique angle, the illumination system and the imaging camera need to be arranged obliquely, so that the space size in the vertical direction is greatly increased, and particularly, the closer the incident angle is to the vertical side, the larger the space size is required, and interference is easy to occur in arrangement. When vertical illumination is used, the system arrangement is usually achieved by using a half-reflecting half-mirror, but the energy entering the imaging lens is lost by 3/4, and the spatial dimension in the vertical direction is also increased.
Disclosure of Invention
The utility model aims to provide a wafer detection device, which reduces the space size of the device, realizes bright field illumination, reduces the power of a light source and improves the system performance.
In order to achieve the above object, in a first aspect, the present utility model provides a wafer inspection apparatus, including a support frame, an illumination system, a prism assembly, a light-equalizing plate assembly, and an imaging camera;
the lighting system is arranged on the supporting frame and is positioned on one side of the supporting frame, and the lighting system is used for emitting light rays towards the other side of the supporting frame;
the other side of the supporting frame is provided with an opening, and the imaging camera is positioned at the other side of the supporting frame and corresponds to the opening and is used for receiving light rays emitted from the opening and imaging;
the prism assembly and the light homogenizing plate assembly are both arranged on the supporting frame, the prism assembly is located above the light homogenizing plate assembly, light emitted by the illumination system can sequentially pass through the prism assembly and the light homogenizing plate assembly to irradiate on a wafer, and the prism assembly is further used for guiding out light reflected on the wafer from the opening.
In some embodiments, the prism assembly and the light homogenizing plate assembly are both positioned between two sides of the support frame, and the prism assembly is disposed in horizontal alignment with the illumination system such that light emitted by the illumination system impinges on the prism assembly.
In some embodiments, the prism assembly includes a prism having a first reflective surface, the light-averaging plate assembly includes a light-averaging plate;
when the illumination system emits light towards the first reflecting surface, the first reflecting surface reflects the light to the light-equalizing plate, and the light reflected by the first reflecting surface is perpendicular to the light-equalizing plate.
In some embodiments, the prism further has a second reflective surface for receiving light reflected from the wafer and directing the reflected light out of the opening.
In some embodiments, the prism assembly further comprises a prism mount;
the prism seat is arranged at the top of the supporting frame, the prism seat is provided with a mounting groove towards the light equalizing plate assembly, and the prism is arranged in the mounting groove.
In some embodiments, the prism assembly further comprises a soft rubber pad and a press block;
the soft rubber pad is arranged on the prism and positioned at two ends of the prism, and the pressing block is arranged on the soft rubber pad and connected with the prism seat.
In some embodiments, the prism seat is provided with an adjusting hole, and the adjusting hole can enable the prism seat to move and adjust towards the direction of the illumination system.
In some embodiments, the prism assembly further includes a first adjustment pad disposed between the prism seat and the support frame for adjusting a height of the prism assembly.
In some embodiments, the light balancing plate assembly further comprises a light balancing plate seat and a connector;
the light-equalizing plate seat is arranged at the bottom of the supporting frame, the light-equalizing plate seat is provided with a groove, the light-equalizing plate is arranged in the groove, and the connecting piece is used for fixing the light-equalizing plate on the light-equalizing plate seat.
In some embodiments, the illumination system may emit focused light, the illumination system being connected to the support frame by a second adjustment pad for adjusting the height of the illumination system.
In some embodiments, a light source heat sink is further included, the light source heat sink being disposed on top of the support frame and disposed proximate the lighting system.
In some embodiments, the wafer carrier further comprises a motion platform disposed below the support frame, wherein the motion platform is used for carrying the wafer and driving the wafer to move along a horizontal direction.
In some embodiments, the imaging camera includes an imaging lens and a linear array detector, the imaging lens being threadably coupled to the linear array detector.
The wafer detection device provided by the utility model has the beneficial effects that:
1. the prism assembly is adopted to realize the horizontal arrangement of the illumination system and the imaging camera, so that the space size of the system in the vertical direction is greatly reduced, and the prism angle design can be carried out according to the actual detection requirement.
2. The illumination system and the light-equalizing plate assembly are combined to realize bright field illumination, so that the power of a light source is reduced, and the system performance is improved.
3. The light-equalizing plate assembly is arranged close to the detection target, the target illuminance value and illuminance uniformity are improved, and meanwhile, the light-equalizing plate base can also play a role in shading.
4. The device can realize ultra-short object imaging, effectively improve the image resolution and reduce the image distortion.
Drawings
FIG. 1 is a schematic diagram of a wafer inspection apparatus according to an embodiment of the present utility model;
FIG. 2 is a schematic diagram of a wafer inspection apparatus according to an embodiment of the present utility model;
FIG. 3 is a cross-sectional view of a wafer inspection apparatus according to an embodiment of the present utility model;
FIG. 4 is a schematic view of a prism assembly according to an embodiment of the present utility model;
FIG. 5 is a cross-sectional view of an embodiment of a prism assembly according to the present utility model taken along the axial direction thereof;
fig. 6 is a schematic structural diagram of a light-equalizing plate assembly according to an embodiment of the present utility model;
fig. 7 is a schematic structural diagram of an imaging camera according to an embodiment of the present utility model.
Reference numerals:
the light source comprises a support frame 1, an opening 11, an illumination system 2, a second adjusting pad 21, a prism assembly 3, a prism 31, a first reflecting surface 311, a second reflecting surface 312, a prism seat 32, a mounting groove 321, a soft rubber pad 33, a pressing block 34, a first adjusting pad 35, a light-equalizing plate assembly 4, a light-equalizing plate seat 41, a connecting piece 42, a light-equalizing plate 43, an imaging lens 51, a linear array detector 52 and a light source radiating fin 6.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions in the embodiments of the present utility model will be clearly and completely described below, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model. Unless otherwise defined, technical or scientific terms used herein should be given the ordinary meaning as understood by one of ordinary skill in the art to which this utility model belongs. As used herein, the word "comprising" and the like means that elements or items preceding the word are included in the element or item listed after the word and equivalents thereof without precluding other elements or items.
Fig. 1 is a schematic diagram of a wafer inspection apparatus according to an embodiment of the present utility model.
Fig. 2 is a schematic structural diagram of a wafer inspection apparatus according to an embodiment of the present utility model.
Referring to fig. 1 and 2, an embodiment of the present utility model provides a wafer inspection apparatus, which includes a motion platform, a support frame 1, an illumination system 2, a prism assembly 3, a light-equalizing plate assembly 4, and an imaging camera.
The supporting frame 1 is located above the moving platform, and the moving platform is used for driving a wafer to pass through the bottom of the supporting frame 1. The lighting system 2 is arranged on the support frame 1 and is positioned on one side of the support frame 1, and the lighting system 2 can emit light rays horizontally in the support frame 1 towards the other side of the support frame 1. The other side of the support frame 1 is provided with an opening 11, and the imaging camera is positioned on the other side of the support frame 1 and corresponds to the opening 11, and is used for receiving light rays emitted from the opening 11 and imaging.
The prism assembly 3 and the light homogenizing plate assembly 4 are both arranged on the supporting frame 1, specifically the prism assembly 3 and the light homogenizing plate assembly 4 are positioned between two sides of the supporting frame 1, the prism assembly 3 is positioned above the light homogenizing plate assembly 4, and a through hole is formed in the bottom of the supporting frame 1. The light emitted by the illumination system 2 can sequentially pass through the prism assembly 3, the light-equalizing plate assembly 4 and the through hole to irradiate on the wafer positioned on the motion platform, and the prism assembly 3 is further used for guiding out the light reflected on the wafer from the opening 11 so that the imaging camera receives the light for imaging, thereby realizing the detection of the appearance defects of the wafer.
In this embodiment, the spatial dimensions of the device are reduced by allowing the illumination system 2 and the imaging camera to be arranged horizontally using the prism assembly 3. And through the cooperation of lighting system 2 with the even light board subassembly 4 has realized bright field illumination, has reduced the light source power, has promoted system performance.
Fig. 3 is a cross-sectional view of a wafer inspection apparatus according to an embodiment of the present utility model.
Referring to fig. 2 and 3, in some embodiments, the prism assembly 3 is disposed on the top of the support frame 1, the light-equalizing plate assembly 4 is disposed on the bottom of the support frame 1, and the prism assembly 3 is disposed in horizontal alignment with the illumination system 2, so that the light emitted from the illumination system 2 irradiates the prism assembly 3 in a horizontal direction.
Fig. 4 is a schematic structural diagram of a prism assembly according to an embodiment of the present utility model.
Fig. 5 is a cross-sectional view of an embodiment of a prism assembly according to the present utility model taken along the axial direction thereof.
Referring to fig. 1 to 5, in some embodiments, the prism assembly 3 includes a prism 31, the prism 31 having a first reflective surface 311, and the light-equalizing plate assembly 4 includes a light-equalizing plate 43. When the illumination system 2 emits light toward the first reflecting surface 311, the first reflecting surface 311 reflects the light to the light-equalizing plate 43, and then the light passes through the light-equalizing plate 43 to be irradiated on the underlying wafer. The light reflected by the first reflecting surface 311 is perpendicular to the light-equalizing plate 43.
The prism 31 further has a second reflecting surface 312, and the second reflecting surface 312 is configured to receive the light reflected from the wafer and guide the reflected light out of the opening 11.
In this embodiment, the angle between the first and second radial surfaces is 105 °. Since the prisms 31 are detachably connected, in practical application, the prisms 31 with different angles can be replaced. To suit the application.
In addition, the prism 31 may be formed by using a glass ceramic material.
Further, referring to fig. 5, the prism assembly 3 further includes a prism base 32, a soft rubber pad 33, and a pressing block 34.
The prism seat 32 has a strip structure, and the prism seat 32 is provided with a mounting groove 321 along an axial direction thereof. The prism seat 32 is detachably arranged at the top of the supporting frame 1 through a fixing bolt, so that the mounting groove 321 faces the light equalizing plate assembly 4, and the prism 31 is arranged in the mounting groove 321.
When the prism 31 is installed, a certain amount of adhesive can be coated on the inner side surface of the installation groove 321, then the prism 31 is placed in the installation groove 321 for fixing, after the adhesive is solidified, the soft rubber pads 33 can be sequentially arranged at the two ends of the prism 31, and the soft rubber pads 33 are fixed through the pressing blocks 34, so that the influence of the surface stress of the prism 31 on the precision is avoided.
In this embodiment, the pressing block 34 may be provided with a through hole, the prism seat 32 may be provided with a threaded hole, and the bolt passes through the through hole to be connected with the threaded hole of the prism seat 32, so as to fix the soft rubber pad 33, and facilitate the disassembly and replacement of the soft rubber pad 33.
In some embodiments, the prism holder 32 is provided with an adjustment hole, and the adjustment hole can enable the prism holder 32 to be moved and adjusted towards the illumination system 2.
Specifically, the bolt passes through the adjusting hole and is in threaded connection with the top of the support frame 1, and the prism seat 32 is fixed on the support frame 1.
The adjusting hole is a waist hole, so that the position of the prism seat 32 can be adjusted, and the distance between the prism assembly 3 and the illumination system 2 can be adjusted by adjusting the position of the prism seat 32.
In addition, the prism assembly 3 further includes a first adjusting pad 35 disposed between the prism seat 32 and the support frame 1 for adjusting the height of the prism assembly 3. Specifically, the first adjusting pad 35 is provided with a through hole corresponding to the waist hole, and the bolt sequentially passes through the waist hole and the through hole to be in threaded connection with the supporting frame 1.
In some embodiments, the bottom supporting position of the mounting groove 321 of the prism base 32 is formed by a precision grinding process, so that the entire flatness of the bottom of the mounting groove 321 of the prism base 32 can reach 5 μm, so as to ensure that the wave aberration value of each side mirror surface of the prism is better than 1/10 λ (λ=632.8 nm).
Fig. 6 is a schematic structural diagram of a light-equalizing plate assembly according to an embodiment of the present utility model.
Referring to fig. 2 and 6, in some embodiments, the light equalizing plate assembly 4 further includes a light equalizing plate holder 41 and a connector 42. The light-equalizing plate seat 41 is arranged at the bottom of the supporting frame 1, and the light-equalizing plate seat 41 is provided with a groove. The light-equalizing plate 43 is detachably disposed in the groove, and the connecting piece 42 fixes the light-equalizing plate 43 on the light-equalizing plate seat 41.
In this embodiment, the light equalizing board seat 41 also plays a role of light shielding at the bottom of the supporting frame 1. The connecting piece 42 is a strip-shaped plate structure, a connecting hole is formed in the connecting piece 42, a bolt can pass through the connecting hole and is in threaded connection with the light-equalizing plate seat 41, and the light-equalizing plate 43 is located between the connecting piece 42 and the light-equalizing plate seat 41, so that the light-equalizing plate 43 can be clamped and fixed on the light-equalizing plate seat 41, and meanwhile, the light-equalizing plate 43 is convenient to replace.
In some embodiments, the illumination system 2 may emit focused light.
In other embodiments, the lighting system 2 is connected to the support frame 1 by a second adjustment pad 21, the second adjustment pad 21 being used to adjust the height of the lighting system 2. Therefore, the relative position between the illumination system 2 and the prism assembly 3 can be adjusted, and the position can be adjusted according to the actual situation during actual use so as to achieve the optimal detection effect.
In this embodiment, the support frame 1, the prism seat 32, the pressing block 34, and the light-equalizing plate seat 41 may be made of an aluminum alloy material.
In some embodiments, the lighting device further comprises a light source heat sink 6, and the light source heat sink 6 is disposed on top of the support frame 1 and is disposed close to the lighting system 2, so as to dissipate heat of the lighting system 2.
Fig. 7 is a schematic structural diagram of an imaging camera according to an embodiment of the present utility model.
Referring to fig. 7, in some embodiments, the imaging camera includes an imaging lens 51 and a line detector 52, and the imaging lens 51 is screwed with the line detector 52. The imaging lens 51 has the advantages of ultra-short object image distance, high resolution, low distortion and the like, and the imaging lens 51 is directly arranged in the linear array detector 52 by using threads, and the adjustment of the rear intercept is realized by rotating the threads.
While embodiments of the present utility model have been described in detail hereinabove, it will be apparent to those skilled in the art that various modifications and variations can be made to these embodiments. It is to be understood that such modifications and variations are within the scope and spirit of the present utility model as set forth in the following claims. Moreover, the utility model described herein is capable of other embodiments and of being practiced or of being carried out in various ways.
Claims (13)
1. The wafer detection device is characterized by comprising a supporting frame, an illumination system, a prism assembly, a light equalizing plate assembly and an imaging camera;
the lighting system is arranged on the supporting frame and is positioned on one side of the supporting frame, and the lighting system is used for emitting light rays towards the other side of the supporting frame;
the other side of the supporting frame is provided with an opening, and the imaging camera is positioned at the other side of the supporting frame and corresponds to the opening and is used for receiving light rays emitted from the opening and imaging;
the prism assembly and the light homogenizing plate assembly are both arranged on the supporting frame, the prism assembly is located above the light homogenizing plate assembly, light emitted by the illumination system can sequentially pass through the prism assembly and the light homogenizing plate assembly to irradiate on a wafer, and the prism assembly is further used for guiding out light reflected on the wafer from the opening.
2. The wafer inspection apparatus of claim 1, wherein the prism assembly and the light homogenizing plate assembly are each positioned between two sides of the support frame, and the prism assembly is disposed in horizontal alignment with the illumination system such that light emitted by the illumination system impinges on the prism assembly.
3. The wafer inspection apparatus of claim 2 wherein the prism assembly comprises a prism having a first reflective surface, the light-homogenizing plate assembly comprising a light-homogenizing plate;
when the illumination system emits light towards the first reflecting surface, the first reflecting surface reflects the light to the light-equalizing plate, and the light reflected by the first reflecting surface is perpendicular to the light-equalizing plate.
4. The wafer inspection apparatus of claim 3 wherein the prism further has a second reflective surface for receiving light reflected from the wafer and directing the reflected light out of the opening.
5. The wafer inspection apparatus of claim 3 wherein the prism assembly further comprises a prism seat;
the prism seat is arranged at the top of the supporting frame, the prism seat is provided with a mounting groove towards the light equalizing plate assembly, and the prism is arranged in the mounting groove.
6. The wafer inspection apparatus of claim 5, wherein the prism assembly further comprises a soft rubber pad and a press block;
the soft rubber pad is arranged on the prism and positioned at two ends of the prism, and the pressing block is arranged on the soft rubber pad and connected with the prism seat.
7. The wafer inspection apparatus according to claim 5, wherein the prism holder is provided with an adjustment hole, and the adjustment hole enables the prism holder to be moved and adjusted in the direction of the illumination system.
8. The wafer inspection apparatus of claim 5, wherein the prism assembly further comprises a first adjustment pad disposed between the prism seat and the support frame for adjusting a height of the prism assembly.
9. The wafer inspection apparatus of claim 3 wherein the light panel assembly further comprises a light panel seat and a connector;
the light-equalizing plate seat is arranged at the bottom of the supporting frame, the light-equalizing plate seat is provided with a groove, the light-equalizing plate is arranged in the groove, and the connecting piece is used for fixing the light-equalizing plate on the light-equalizing plate seat.
10. The wafer inspection apparatus of claim 1, wherein the illumination system is operable to emit focused light, the illumination system being coupled to the support frame by a second adjustment pad, the second adjustment pad being operable to adjust a height of the illumination system.
11. The wafer inspection apparatus of claim 1, further comprising a light source heat sink disposed on top of the support frame and positioned proximate the illumination system.
12. The wafer inspection apparatus of claim 1, further comprising a motion platform disposed below the support frame, the motion platform being configured to carry a wafer and drive the wafer to move in a horizontal direction.
13. The wafer inspection apparatus of claim 1 wherein the imaging camera comprises an imaging lens and a linear probe, the imaging lens being threadably coupled to the linear probe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321584618.8U CN220231524U (en) | 2023-06-20 | 2023-06-20 | Wafer detection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321584618.8U CN220231524U (en) | 2023-06-20 | 2023-06-20 | Wafer detection device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220231524U true CN220231524U (en) | 2023-12-22 |
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ID=89186807
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321584618.8U Active CN220231524U (en) | 2023-06-20 | 2023-06-20 | Wafer detection device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220231524U (en) |
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2023
- 2023-06-20 CN CN202321584618.8U patent/CN220231524U/en active Active
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