CN220202075U - Water electric plating device - Google Patents

Abstract

The utility model discloses a hydropower plating device, which comprises a plating bath and a plating assembly arranged in the plating bath, wherein the plating assembly comprises a plurality of mounting frames, two film feeding mechanisms which are arranged vertically symmetrically are arranged on the mounting frames, each film feeding mechanism comprises a driving roller, a driven roller, a film feeding belt and a first motor, the driving rollers and the driven rollers are arranged at intervals along the length direction of the plating bath and are respectively and rotatably arranged in the mounting frames, the film feeding belts are sleeved on the peripheries of the driving rollers and the driven rollers, and the first motor is arranged on the outer wall of one side of the mounting frame and is connected with one end of the driving roller; two mounting plates are arranged between two adjacent mounting frames, two conductive rollers are rotatably arranged between the two mounting plates, and the two conductive rollers are arranged symmetrically up and down and are positioned above the electroplating bath. The utility model can reduce the vertical floating of the conductive film in the electroplating process, and can reduce the electroplating reaction between the electroplating liquid and the conductive roller, thereby avoiding the condition that the conductive film is pierced by the metal layer on the conductive roller.

Description

Water electric plating device

Technical Field

The utility model relates to the technical field of electroplating, in particular to a hydropower plating device.

Background

The conductive film is an organic film having a conductive function. Currently, the production of conductive films generally adopts a calendaring method, a vacuum plating method (vacuum evaporation and ion spraying), an electroplating method, a thermal decomposition method, a coating method and the like. In the production of conductive films by electroplating, a water electroplating apparatus is generally used.

The current water and electricity plating device generally comprises a plating bath for containing plating solution and a plating assembly arranged in the plating bath, wherein the plating assembly comprises two conductive roller assemblies which are arranged in an up-down symmetrical mode, each conductive roller assembly comprises a plurality of round conductive rollers which are arranged along the length direction of the plating bath at intervals, each conductive roller is respectively connected with a driving motor, each conductive roller is respectively connected with the negative electrode of a power supply, the conductive rollers of the two conductive roller assemblies are respectively used for being in contact with the two sides of a conductive film, when the plating is actually carried out, the conductive film passes through between the conductive rollers of the two conductive roller assemblies after entering the plating bath from the left end of the plating bath, then comes out from the right end of the plating bath, the driving motor drives the corresponding conductive rollers to rotate, and in the process, the conductive film can be driven to move rightwards by using the friction force between the conductive rollers of the two conductive roller assemblies and the two sides of the conductive film. The water and electricity plating device with the structure has the advantages that on one hand, the conductive roller is of a round structure, when the conductive roller drives the conductive film to move, the conductive film is easy to float up and down under the impact of the plating solution, so that the plating quality is reduced, and on the other hand, the conductive roller is electrically conductive due to the fact that the conductive roller is connected with the negative electrode of the power supply, so that the plating solution is easy to perform a plating reaction with the conductive roller, a metal layer is plated on the conductive roller, and the metal layer on the conductive roller is easy to pierce the conductive film, so that the plating quality is further reduced.

Disclosure of Invention

In order to overcome the defects in the prior art, the utility model provides the hydropower plating device which can reduce the vertical floating of the conductive film in the plating process and reduce the plating reaction between the plating solution and the conductive roller, thereby avoiding the condition that the conductive film is pierced by a metal layer on the conductive roller and improving the plating quality.

The technical scheme adopted for solving the technical problems is as follows:

the utility model provides a water and electricity plating device, includes plating bath and sets up the electroplating subassembly in the plating bath, electroplating subassembly includes along the length direction interval of plating bath sets up a plurality of mounting brackets, the both ends of mounting bracket all open-ended, be equipped with two on the mounting bracket and be the mechanism of going the membrane of upper and lower symmetry setting, it includes drive roll, driven voller, go the membrane area and first motor to go the membrane mechanism, drive roll and driven voller follow the length direction interval of plating bath sets up and rotationally sets up respectively in the mounting bracket, it cup joints to go the membrane area the periphery of drive roll and driven voller, the membrane area of going of two membrane mechanisms is used for laminating mutually with the two sides of conductive film respectively, first motor sets up on the outer wall of one side of mounting bracket and with one end of drive roll is connected in order to drive this drive roll rotation. Two mounting plates are arranged between two adjacent mounting frames, the two mounting plates are arranged at intervals along the width direction of the electroplating bath, two conductive rollers are rotatably arranged between the two mounting plates, the two conductive rollers are arranged symmetrically up and down and are positioned above the electroplating bath, and the two conductive rollers are respectively used for being in contact with two sides of a conductive film.

As the preferable technical scheme, be equipped with two scrapers between two mounting panels, two scrapers are located two conductive roller's below, have the clearance that supplies the conductive film to pass through between two scrapers, two scrapers are used for striking off unnecessary plating solution on the conductive film two sides respectively.

As a preferable technical scheme, the two scraping plates are both arranged obliquely downwards and form a V-shaped structure.

As the preferable technical scheme, be equipped with the backup pad in the mounting bracket, the backup pad is located two below of walking the membrane mechanism, the first end setting of backup pad is in on the one side inner wall of mounting bracket, the second end of backup pad is followed stretch out and support to in the through-hole on the opposite side inner wall of mounting bracket on the one side inner wall of plating bath, the top of backup pad is equipped with the titanium basket, the open-top of titanium basket, the titanium basket with the through-hole corresponds, the titanium basket can remove between the first end and the second end of backup pad.

As the preferable technical scheme, one side of the titanium basket, which is close to the through hole, is provided with an L-shaped pull rod, the L-shaped pull rod part extends out of the through hole and is positioned in the electroplating bath, and the top end of the L-shaped pull rod extends out of the top end of the electroplating bath and is positioned outside the electroplating bath.

As the preferable technical scheme, the top of backup pad is equipped with the slide rail that extends along its length direction, the bottom of titanium basket be equipped with slide rail sliding fit's slider.

As the preferred technical scheme, be equipped with in the mounting bracket and dial the liquid subassembly, dial the liquid subassembly and be located the below of backup pad, dial the liquid subassembly including dialling liquid board, connecting axle and second motor, the connecting axle rotationally sets up in the mounting bracket, it establishes to dial the liquid board cover the periphery of connecting axle, the second motor sets up on one side outer wall of mounting bracket and with the one end of connecting axle is connected in order to drive this connecting axle and rotate.

As the preferable technical scheme, be equipped with magnetic shielding mechanism between titanium basket and the two membrane mechanisms of walking, magnetic shielding mechanism includes magnetic shielding plate, magnetic shielding plate is used for blockking the magnetic force line, magnetic shielding plate's both ends set up respectively on the both sides inner wall of mounting bracket, magnetic shielding plate has along its length direction extended fretwork vacancy, fretwork vacancy with the membrane area of walking of membrane mechanism is dislocation set from top to bottom.

As a preferable technical scheme, two guide rollers are rotatably arranged between the two mounting plates, and the two guide rollers are respectively positioned at two sides of the two conductive rollers and below the two conductive rollers.

The beneficial effects of the utility model are as follows: the utility model adopts the two film moving belts of the film moving mechanism which are vertically symmetrically arranged to be attached to two sides of the conductive film to drive the conductive film to move, thereby realizing the limit of the conductive film, reducing the vertical floating of the conductive film in the electroplating process, improving the electroplating quality, simultaneously arranging the conductive roller above the electroplating bath, reducing the contact between the conductive roller and the electroplating liquid, reducing the electroplating reaction between the electroplating liquid and the conductive roller, reducing the plating reaction between the electroplating liquid and the conductive roller, and avoiding the condition that the conductive film is pierced by the metal layer on the conductive roller, and further improving the electroplating quality of the conductive film.

Drawings

The utility model will be further described with reference to the drawings and examples.

FIG. 1 is a schematic view of a hydropower plating apparatus according to an embodiment of the present utility model;

FIG. 2 is a schematic left-hand view of the water plating apparatus of FIG. 1 with the conductive film removed;

FIG. 3 is a schematic cross-sectional view of the water plating apparatus of FIG. 1;

FIG. 4 is an enlarged partial schematic view of the portion F shown in FIG. 3;

fig. 5 and 6 are schematic views showing the structure of a plating module of the water plating apparatus shown in fig. 1.

Reference numerals illustrate:

10. plating bath;

20. a mounting frame; 22. a support plate; 24. a through hole; 26. a magnetic plate;

32. a drive roll; 33. driven roller; 34. film-feeding belt; 36. a first motor;

40. titanium basket; 42. an L-shaped pull rod;

52. a liquid poking plate; 54. a connecting shaft; 56. a second motor;

60. a mounting plate;

70. a conductive roller;

80. a liquid scraping plate;

90. a guide roller;

200. a conductive film.

Detailed Description

The conception, specific structure, and technical effects produced by the present utility model will be clearly and completely described below with reference to the embodiments and the drawings to fully understand the objects, features, and effects of the present utility model. It is apparent that the described embodiments are only some embodiments of the present utility model, but not all embodiments, and that other embodiments obtained by those skilled in the art without inventive effort are within the scope of the present utility model based on the embodiments of the present utility model. In addition, all the coupling/connection relationships referred to in the patent are not direct connection of the single-finger members, but rather, it means that a better coupling structure can be formed by adding or subtracting coupling aids depending on the specific implementation. The technical features in the utility model can be interactively combined on the premise of no contradiction and conflict.

Referring to fig. 1 to 6, an apparatus for electroplating water according to an embodiment of the present utility model includes an electroplating tank 10 and an electroplating assembly disposed in the electroplating tank 10. The plating vessel 10 is used for containing a plating solution.

The electroplating assembly comprises a plurality of mounting frames 20, the plurality of mounting frames 20 are arranged at intervals along the length direction of the electroplating bath 10, and the length direction of the mounting frames 20 is the same as the length direction of the electroplating bath 10. In this embodiment, the number of the mounting frames 20 is two, and it is understood that the number of the mounting frames 20 can be set according to practical situations. The mounting frame 20 is open at both ends and at the top end.

The mounting frame 20 is provided with two film feeding mechanisms which are arranged in an up-down symmetrical mode, specifically, the film feeding mechanisms comprise a driving roller 32, a driven roller 33, a film feeding belt 34 and a first motor 36, the driving roller 32 and the driven roller 33 are arranged at intervals along the length direction of the electroplating bath 10, and the driving roller 32 and the driven roller 33 are respectively and rotatably arranged in the mounting frame 20, specifically: both ends of the driving roller 32 and both ends of the driven roller 33 are rotatably provided on both side inner walls (i.e., a front side inner wall, a rear side inner wall) of the mount 20, respectively. The length direction of the driving roller 32 and the driven roller 33 is the same as the width direction of the plating tank 10, the driving roller 32 and the driven roller 33 are respectively close to the two ends of the mounting frame 20, and the driving roller 32 and the driven roller 33 are respectively close to the top end of the mounting frame 20. The film feeding belt 34 is sleeved on the peripheries of the driving roller 32 and the driven roller 33, and the film feeding belts 34 of the two film feeding mechanisms are respectively used for being attached to two sides of the conductive film 200. The first motor 36 is disposed on one side outer wall (i.e., the front side outer wall) of the mounting frame 20 and is connected to one end of the driving roller 32 through a coupling to drive the driving roller 32 to rotate (only the first motor 36 of the upper film feeding mechanism is shown in the drawing, the first motor 36 of the lower film feeding mechanism is not shown in the drawing), and the coupling is disposed in a through hole on one side outer wall (i.e., the front side outer wall) of the mounting frame 20. The film feeding belt 34 corresponds to a synchronous belt, and when the first motor 36 drives the driving roller 32 to rotate, the rotation of the driving roller 32 can drive the driven roller 33 to synchronously rotate under the drive of the film feeding belt 34. In this embodiment, there are two film running belts 34, and the two film running belts 34 correspond to two ends of the driving roller 32 and the driven roller 33, respectively, and it can be understood that the number of the film running belts 34 can be set according to practical situations.

In this embodiment, the film feeding mechanisms on the two mounting frames 20 are symmetrically arranged.

Two mounting plates 60 are arranged between two adjacent mounting frames 20, the mounting plates 60 are approximately of an inverted T-shaped structure, the two mounting plates 60 are arranged at intervals along the width direction of the electroplating bath 10, and the top ends of the two mounting plates 60 are located above the electroplating bath 10. Two conductive rollers 70 are rotatably disposed between the two mounting plates 60, specifically: both ends of the two conductive rollers 70 are rotatably provided inside the two mounting plates 60 (inside, i.e., the side where the two mounting plates 60 are close to each other), respectively. Two conductive rollers 70 are near the top ends of the two mounting plates 60, and the two conductive rollers 70 are located above the plating tank 10. The two conductive rollers 70 are respectively used for contacting both sides of the conductive film 200 and respectively used for connecting with the negative electrode of the power supply. The length direction of the conductive roller 70 is the same as the width direction of the plating tank 10.

The mounting frames 20 positioned at the left sides of the two mounting plates 60 are respectively named as a first mounting frame 20, the mounting frames 20 positioned at the right sides of the two mounting plates 60 are named as a second mounting frame 20, and when the electroplating bath 10 is actually applied, the conductive film 200 is driven to move rightwards by the friction force between the film conveying belts 34 of the two film conveying mechanisms on the first mounting frame 20 and the two surfaces of the conductive film 200, and then passes between the two conductive rollers 70 and then passes between the film conveying belts 34 of the two film conveying mechanisms on the second mounting frame 20, and then comes out from the right end of the electroplating bath 10, in the process, the film conveying belts 34 of the two film conveying mechanisms on each mounting frame 20 are respectively attached to the two surfaces of the conductive film 200, and the conductive film 200 can be driven to move rightwards by the friction force between the film conveying belts 34 of the two film conveying mechanisms and the two surfaces of the conductive film 200, so that the two surfaces of the conductive film 200 can be conductive, and the two surfaces of the conductive film 200 can be conductive, namely the two surfaces of the conductive film 200 can be electroplated, and the metal layers on the two surfaces of the conductive film 200 can be realized. The utility model adopts the two film moving belts 34 of the film moving mechanisms which are vertically symmetrically arranged to be attached to two sides of the conductive film 200 to drive the conductive film 200 to move, thereby realizing the limit of the conductive film 200, reducing the vertical floating of the conductive film 200 in the electroplating process, improving the electroplating quality, simultaneously arranging the conductive roller 70 above the electroplating bath 10, reducing the contact between the conductive roller 70 and the electroplating solution, reducing the electroplating reaction between the electroplating solution and the conductive roller 70, reducing the plating reaction of the metal layer plated on the conductive roller 70, avoiding the condition that the conductive film 200 is pierced by the metal layer on the conductive roller 70, and further improving the electroplating quality of the conductive film 200.

The support plate 22 is disposed below the two film feeding mechanisms in the mounting frame 20, a first end of the support plate 22 is disposed on one side inner wall (i.e., a rear side inner wall) of the mounting frame 20, and a second end of the support plate 22 extends from a through hole 24 on the other side inner wall (i.e., a front side inner wall) of the mounting frame 20 and abuts against one side inner wall (i.e., a front side inner wall) of the electroplating tank 10, as shown in fig. 2. The top of the supporting plate 22 is provided with a titanium basket 40, the titanium basket 40 is used for being connected with a positive electrode of a power supply, the titanium basket 40 is of a box-shaped structure with an open top, as shown in fig. 3, the titanium basket 40 is used for placing copper balls, when electroplating is performed, the titanium basket 40 is an electroplating anode, the copper balls are electroplating anode substances and can be dissolved into copper ions, thereby supplementing copper ions into electroplating solution, the two sides of the conductive film 200 are respectively electroplating cathodes, electroplating reaction can be performed between the electroplating solution and the two sides of the conductive film 200, namely, copper ions in the electroplating solution are deposited on the two sides of the conductive film 200, and thus, the two sides of the conductive film 200 can be respectively plated with metal layers. Titanium basket 40 corresponds to throughbore 24 and titanium basket 40 is movable between a first end and a second end of support plate 22. Through this kind of structure, when the copper ball in the titanium basket 40 is consumed, need add the copper ball to titanium basket 40 in, first pull titanium basket 40 towards the direction that is close to the second end of backup pad 22, make titanium basket 40's top part expose in the outside of mounting bracket 20, then place the copper ball can in titanium basket 40 through titanium basket 40's top, after finishing, push titanium basket 40 towards the direction that is close to the first end of backup pad 22, make titanium basket 40 return to initial position can. The provision of the through holes 24 provides a passageway for movement of the titanium basket 40.

In this embodiment, the number of the support plates 22 is plural, for example, three, it is understood that the number of the support plates 22 may be other, for example, one, two, etc., and the number of the support plates 22 may be set according to practical situations.

An L-shaped pull rod 42 is arranged on one side of the titanium basket 40, which is close to the through hole 24, and part of the L-shaped pull rod 42 extends out of the through hole 24 and is positioned in the electroplating bath 10, and the top end of the L-shaped pull rod 42 extends out of the electroplating bath 10 and is positioned outside the electroplating bath 10. In practical application, the titanium basket 40 can be pulled by pulling the top end of the L-shaped pull rod 42 in the direction close to the second end of the support plate 22, the titanium basket 40 can be pushed by pushing the top end of the L-shaped pull rod 42 in the direction close to the first end of the support plate 22, and the provided L-shaped pull rod 42 is convenient for pulling the titanium basket 40 and pushing the titanium basket 40, so that the titanium basket 40 is convenient to use.

The top end of the supporting plate 22 is provided with a sliding rail extending along the length direction, and the bottom end of the titanium basket 40 is provided with a sliding block in sliding fit with the sliding rail. Through the sliding rail and the sliding block, the movement of the titanium basket 40 is guided, and the movement of the titanium basket 40 is lighter and more stable.

The titanium basket 40 and two are walked and are equipped with magnetic force between the membrane mechanism and shelter from the mechanism, in this embodiment, magnetic force shelter from the mechanism and is used for blockking the magnetic force line including magnetic force shielding plate 26, magnetic force shielding plate 26's both ends set up respectively on the both sides inner wall of mounting bracket 20 (i.e. front side inner wall, rear side inner wall), magnetic force shielding plate 26 has along its length direction extended fretwork vacancy, fretwork vacancy is dislocation set about two of membrane mechanism walked membrane area 34 with walk, in this embodiment, the fretwork vacancy is three, three fretwork vacancy is along the width direction interval setting of magnetic force shielding plate 26, and be located and walk between the membrane area 34 of membrane mechanism, the fretwork that sets up is convenient for copper ion towards conductive film 200 removal. In the electroplating process, the titanium basket 40 is used as an electroplating anode and is connected with the positive electrode of the power supply, so that the titanium basket 40 is electrified with the positive electrode, the conductive roller 70 is connected with the negative electrode of the power supply, and the conductive roller 70 is electrified with the negative electrode, so that a magnetic field is generated between the titanium basket 40 and the conductive roller 70, copper ions in electroplating liquid can move towards the conductive film 200 under the action of magnetic force lines of the magnetic field, and can be deposited on the film-moving belt 34, so that a metal layer can be plated on the film-moving belt 34, the magnetic shielding plate 26 plays a role of blocking the magnetic force lines, and copper ions can be prevented from moving towards the film-moving belt 34 due to the fact that the hollow positions and the film-moving belt 34 are arranged in a vertically staggered mode, so that copper ions can be prevented from depositing on the film-moving belt 34, and the metal layer can be prevented from being plated on the film-moving belt 34, and the magnetic shielding plate 26 can also prevent the conductive film 200 from floating downwards.

A liquid-pulling assembly is provided in the mounting frame 20, and is located below the support plate 22. The liquid subassembly is dialled including dialling liquid board 52, connecting axle 54 and second motor 56, and connecting axle 54 rotationally sets up in mounting bracket 20, specifically: the both ends of the connection shaft 54 are rotatably provided on both side inner walls (i.e., front side inner wall, rear side inner wall) of the mounting bracket 20, respectively. The liquid pulling plate 52 is sleeved on the outer periphery of the connecting shaft 54. The second motor 56 is disposed on one side outer wall (i.e., the front side outer wall) of the mounting frame 20 and is connected with one end of the connecting shaft 54 through a coupling to drive the connecting shaft 54 to rotate, the rotation of the connecting shaft 54 can drive the liquid-pulling plate 52 to rotate, the rotation of the liquid-pulling plate 52 can enable the electroplating liquid to move from bottom to top, so that copper ions in the electroplating liquid can conveniently contact with two sides of the conductive film 200 to generate electroplating reaction, and electroplating quality is further improved. The coupling is inserted into a through hole formed in one side outer wall (i.e., the front side outer wall) of the mounting bracket 20.

In this embodiment, there are two liquid-pulling assemblies, and the two liquid-pulling assemblies are disposed at intervals along the length direction of the plating tank 10, and it can be understood that the number of liquid-pulling assemblies can be set according to practical situations.

In this embodiment, the first motor 36 and the second motor 56 are both sealed motors, so that the sealing effect is good.

Further, two scraping plates 80 are disposed between the two mounting plates 60, and two ends of the two scraping plates 80 are disposed inside the two mounting plates 60 respectively. The two scraping plates 80 are located below the two conductive rollers 70, a gap for the conductive film 200 to pass is formed between the two scraping plates 80, and the two scraping plates 80 are respectively used for scraping off redundant electroplating liquid on two sides of the conductive film 200, so that electroplating reaction between the electroplating liquid and the conductive rollers 70 can be reduced. The two scraping plates 80 are located between the two conductive rollers 70 and the first mounting frame 20, and in practical application, after the conductive film 200 comes out from between the film feeding belts 34 of the two film feeding mechanisms on the first mounting frame 20, the conductive film passes between the two scraping plates 80, then passes between the two conductive rollers 70, and the two scraping plates 80 are symmetrical with respect to the conductive film 200.

In this embodiment, both the scraping plates 80 are disposed obliquely downward and form a V-shaped structure, as shown in fig. 3. This configuration facilitates scraping of the plating solution on both sides of the conductive film 200.

Further, two guide rollers 90 are rotatably disposed between the two mounting plates 60, specifically: both ends of the two guide rollers 90 are rotatably provided inside the two mounting plates 60, respectively. Two guide rollers 90 are respectively located below the two conductive rollers 70 and are respectively located at both sides of the two conductive rollers 70, that is, one guide roller 90 is located between the first mounting frame 20 and the two doctor plates 80, and the other guide roller 90 is located between the two conductive rollers 70 and the second mounting frame 20. The two guide rollers 90 are preferably aligned with the drive roller 32, driven roller 33. The two guide rollers 90 guide the conductive film 200, and in practical application, the conductive film 200 passes through the guide rollers 90 between the first mounting frame 20 and the two scraping plates 80, then passes through the guide rollers 70 between the two conductive rollers 70, and then passes through the guide rollers 90 between the two conductive rollers 70 and the second mounting frame 20 after coming out from between the film feeding belts 34 of the two film feeding mechanisms on the first mounting frame 20. Since the two guide rollers 90 are respectively located at two sides of the two conductive rollers 70 and below the two conductive rollers 70, the two guide rollers 90 and the two conductive rollers 70 form a triangle structure, which can enable the conductive film 200 to be V-shaped, and when the conductive film 200 moves, part of the plating solution on the conductive film 200 can drop under the action of gravity, so that the plating solution attached to the conductive film 200 can be reduced, and the plating reaction between the plating solution and the conductive rollers 70 can be reduced.

While the preferred embodiment of the present utility model has been described in detail, the present utility model is not limited to the embodiments, and those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present utility model, and these equivalent modifications or substitutions are included in the scope of the present utility model as defined in the appended claims.

Claims (9)

1. The utility model provides a water and electricity plating device, includes plating bath and sets up the electroplating subassembly in the plating bath, its characterized in that, electroplating subassembly includes along a plurality of mounting brackets of length direction interval setting of plating bath, the both ends of mounting bracket all open-ended, be equipped with two on the mounting bracket and be the mechanism of going the membrane of upper and lower symmetry setting, it includes drive roll, driven voller, go membrane area and first motor to go the membrane mechanism, drive roll and driven voller follow length direction interval setting of plating bath and rotationally set up respectively in the mounting bracket, it cup joints in drive roll and driven voller's periphery to go the membrane area, the membrane area of going of two membrane mechanisms is used for laminating mutually with the two sides of conductive film respectively, first motor sets up on the outer wall of one side of mounting bracket and with one end of drive roll is connected in order to drive this drive roll rotation. Two mounting plates are arranged between two adjacent mounting frames, the two mounting plates are arranged at intervals along the width direction of the electroplating bath, two conductive rollers are rotatably arranged between the two mounting plates, the two conductive rollers are arranged symmetrically up and down and are positioned above the electroplating bath, and the two conductive rollers are respectively used for being in contact with two sides of a conductive film.

2. The electroplating device according to claim 1, wherein two scraping plates are arranged between the two mounting plates, the two scraping plates are positioned below the two conductive rollers, a gap for the conductive film to pass through is formed between the two scraping plates, and the two scraping plates are respectively used for scraping off redundant electroplating liquid on two sides of the conductive film.

3. The plating apparatus according to claim 2, wherein both of the two wiper plates are disposed obliquely downward and both of them form a V-shaped structure.

4. The hydropower plating device according to claim 1, wherein a support plate is arranged in the mounting frame, the support plate is located below the two film feeding mechanisms, a first end of the support plate is arranged on one side inner wall of the mounting frame, a second end of the support plate extends out of a through hole in the other side inner wall of the mounting frame and is abutted to one side inner wall of the plating tank, a titanium basket is arranged at the top end of the support plate, an opening is formed in the top end of the titanium basket, the titanium basket corresponds to the through hole, and the titanium basket can move between the first end and the second end of the support plate.

5. The plating apparatus according to claim 4, wherein an L-shaped tie rod is provided on a side of the titanium basket adjacent to the through hole, the L-shaped tie rod portion extends from the through hole and is located in the plating tank, and a top end of the L-shaped tie rod extends from a top end of the plating tank and is located outside the plating tank.

6. The plating apparatus according to claim 4, wherein the top end of the support plate is provided with a slide rail extending along the length direction thereof, and the bottom end of the titanium basket is provided with a slider slidingly engaged with the slide rail.

7. The plating apparatus according to claim 4, wherein a liquid-pulling assembly is provided in the mounting frame, the liquid-pulling assembly is located below the supporting plate, the liquid-pulling assembly includes a liquid-pulling plate, a connecting shaft and a second motor, the connecting shaft is rotatably provided in the mounting frame, the liquid-pulling plate is sleeved on the periphery of the connecting shaft, and the second motor is provided on an outer wall of one side of the mounting frame and connected with one end of the connecting shaft to drive the connecting shaft to rotate.

8. The hydropower plating device according to claim 4, wherein a magnetic shielding mechanism is arranged between the titanium basket and the two film feeding mechanisms, the magnetic shielding mechanism comprises a magnetic shielding plate, the magnetic shielding plate is used for blocking magnetic force lines, two ends of the magnetic shielding plate are respectively arranged on two side inner walls of the mounting frame, the magnetic shielding plate is provided with hollow spaces extending along the length direction of the magnetic shielding plate, and the hollow spaces and the film feeding belts of the film feeding mechanisms are arranged in an up-down dislocation mode.

9. The plating apparatus according to claim 1, wherein two guide rollers are rotatably provided between the two mounting plates, the two guide rollers being located on both sides of the two conductive rollers, respectively, and below the two conductive rollers, respectively.