CN220189922U

CN220189922U - Single-layer and double-layer combined wire clamp capable of improving product characteristics

Info

Publication number: CN220189922U
Application number: CN202321393121.8U
Authority: CN
Inventors: 杨贵居; 程黎明; 花银昌
Original assignee: Qitai Precision Moulds Co ltd
Current assignee: Qitai Precision Moulds Co ltd
Priority date: 2023-06-02
Filing date: 2023-06-02
Publication date: 2023-12-15
Anticipated expiration: 2033-06-02

Abstract

The utility model relates to the technical field of wire clamps and discloses a single-double-layer combined wire clamp capable of improving product characteristics, which comprises a PCB (printed circuit board), wherein the upper end of the PCB is fixedly connected with a Type-C interface, the lower end of the PCB is connected with a wire clamp, the wire clamp comprises a substrate, a plurality of upper clamping heads are fixedly arranged at the positions, close to the upper ends, of two sides of the substrate, a plurality of lower clamping heads are fixedly arranged at the positions, close to the lower ends, of two sides of the substrate, the number of the lower clamping heads is smaller than that of the upper clamping heads, positioning holes are formed in two sides of the upper end face of the substrate, protruding rib positions are fixedly arranged on one side of each positioning hole, and the lower end of the PCB is clamped with the positioning holes. According to the utility model, a single-double-layer combined structure is formed, so that the clamping force and the holding force of the double-layer clamping head are maintained, the characteristic requirement is met, the rib position is added in the positioning hole, and the production and manufacturing precision requirement on the thickness of the PCB is lower.

Description

Single-layer and double-layer combined wire clamp capable of improving product characteristics

Technical Field

The utility model relates to the technical field of wire clamps, in particular to a single-layer and double-layer combined wire clamp capable of improving product characteristics.

Background

The wire clamp for fixing the rear end wire of the existing Type-C connector is generally two types, namely a single-layer wire clamp, as shown in fig. 6, a single-layer clamping head is used for clamping the wire and fixing the wire, or a double-layer wire clamp is used for fixing the wire, as shown in fig. 7, the clamping force and the holding force of the single-layer wire clamp are not strong enough, the problem of wire rollback is easy to occur, the clamping force and the holding force of the double-layer wire are strong, but the shielding layer of a high-speed wire needs to be shortened, and the requirement of USB4 on the wire characteristics is not easy to meet. Accordingly, one skilled in the art would be able to provide a single-layer or double-layer bonding clip that improves product characteristics to solve the above-mentioned problems.

Disclosure of Invention

The utility model aims to solve the defects in the prior art, and provides a single-double-layer combined wire clamp capable of improving the product characteristics.

In order to achieve the above purpose, the present utility model provides the following technical solutions:

the single-double-layer combined wire clamp comprises a PCB, wherein the upper end of the PCB is fixedly connected with a Type-C interface, and the lower end of the PCB is connected with a wire clamp;

the wire clamp comprises a substrate, wherein a plurality of upper-layer chucks are fixedly arranged at the positions, close to the upper ends, of two sides of the substrate, a plurality of lower-layer chucks are fixedly arranged at the positions, close to the lower ends, of two sides of the substrate, the number of the lower-layer chucks is smaller than that of the upper-layer chucks, positioning holes are formed in two sides of the upper end face of the substrate, protruding rib positions are fixedly arranged on one side of each positioning hole, and the lower ends of the PCB are clamped with the positioning holes;

through the technical scheme, the upper clamping head and the fewer lower clamping heads are arranged to form a single-double-layer combined structure, so that the clamping force and the holding force of the double-layer clamping heads are reserved, the problem that wires in the single-layer clamping heads retreat is not easy to occur, the requirement on characteristics is met, the shortening of the shielding layer is small, the rib positions arranged in the positioning holes are used for enabling the PCB to be not too loose in the state of being thinner, meanwhile, the contact area between the rib positions and the PCB is small, and the PCB is not too tight under the condition of being thicker.

Further, a wire is clamped at the outer side of the wire clamp, the wire comprises a single-stranded wire and a multi-stranded wire, the single-stranded wire is respectively clamped with the upper-layer clamping head and the lower-layer clamping head, and the multi-stranded wire is clamped with the upper-layer clamping head;

through above-mentioned technical scheme, when using, fix stranded wire and individual wire through upper chuck, the lower floor chuck of setting fixes the individual wire again.

Further, a shielding layer is fixedly sleeved at the outer ends of the stranded wires, and the shielding layer is made of copper foil;

through the technical scheme, the shielding layer manufactured by the copper foil has good shielding effect and strong reliability.

Further, the upper edge of the positioning hole is provided with a bevel;

through above-mentioned technical scheme, the bevel connection of setting is convenient for carry out the joint with PCB board and locating hole fixedly.

Further, the inner and outer edges of the upper layer chuck and the lower layer chuck are both circular arc-shaped;

through above-mentioned technical scheme, the upper chuck and the lower floor chuck edge transition that are convex that set up are smooth and easy, are convenient for let in the wire rod and fix, also are difficult for simultaneously cutting with the wire rod and rub.

Further, a plurality of welding spots are fixedly arranged on two sides of the PCB;

through the technical scheme, the welding spots are used for fixing the endpoints of the PCB and the wire rod through soldering tin.

Further, a terminal is fixedly arranged in the Type-C interface;

further, the base plate, the upper clamping head and the lower clamping head are integrally formed;

through the technical scheme, the integrated base plate, the upper clamping head and the lower clamping head are high in strength and high in reliability.

The utility model has the following beneficial effects:

1. the single-layer and double-layer combined wire clamp capable of improving the product characteristics provided by the utility model has the advantages that when the wire clamp is used, a single-layer and double-layer combined structure is formed through the upper-layer clamp and the fewer lower-layer clamps, the clamping force and the holding force of the double-layer clamp are reserved, the problem that wires in the single-layer clamp are retreated is not easy to occur, the characteristic requirements are met, the shortening of a shielding layer is small, and the practicability is strong.

2. According to the single-layer and double-layer combined wire clamp capable of improving product characteristics, when the wire clamp is used, the rib positions are added in the positioning holes, so that the PCB is not too loose in a state of being thinner, meanwhile, the contact area between the rib positions and the PCB is smaller, the PCB is not too tight in a state of being thicker, and the production and manufacturing precision requirements on the thickness of the PCB are lower.

Drawings

FIG. 1 is a schematic diagram of a single-layer and double-layer combined wire clip for improving product characteristics according to the present utility model;

FIG. 2 is a front view of FIG. 1;

FIG. 3 is a side view of FIG. 2;

FIG. 4 is a perspective view of a single-layer and double-layer bonding wire clip for improving product characteristics according to the present utility model;

FIG. 5 is a top view of a single-layer and double-layer bonding clip for improving product characteristics according to the present utility model;

FIG. 6 is a schematic view of a mounting structure of a single-layer wire clip;

fig. 7 is a schematic view of a mounting structure of a double-layer wire clip.

Legend description:

1. a PCB board; 2. Type-C interface; 3. a terminal; 4. welding spots; 5. a wire clamp; 501. a substrate; 502. an upper chuck; 503. a lower chuck; 504. positioning holes; 505. a bevel opening; 506. a rib position; 6. a wire rod; 601. a single strand; 602. a plurality of strands; 603. and a shielding layer.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-7, one embodiment provided by the present utility model is: the utility model provides a single double-deck combination fastener that can promote product characteristic, includes PCB board 1, the upper end fixedly connected with Type-C interface 2 of PCB board 1, and the lower extreme of PCB board 1 is connected with fastener 5.

The wire clamp 5 comprises a substrate 501, a plurality of upper clamping heads 502 are fixedly arranged at the positions, close to the upper ends, of two sides of the substrate 501, a plurality of lower clamping heads 503 are fixedly arranged at the positions, close to the lower ends, of two sides of the substrate 501, the number of the lower clamping heads 503 is smaller than that of the upper clamping heads 502, positioning holes 504 are formed in two sides of the upper end face of the substrate 501, protruding rib positions 506 are fixedly arranged on one side of each positioning hole 504, and the lower ends of the PCB 1 are clamped with the positioning holes 504.

The outside joint of fastener 5 has wire rod 6, and wire rod 6 includes individual wire 601 and multiple strand wire 602, and individual wire 601 respectively with upper chuck 502 and lower floor's chuck 503 joint, multiple strand wire 602 and upper chuck 502 joint, when using, fix individual wire 601 with multiple strand wire 602 through upper chuck 502, the lower floor's chuck 503 that sets up is fixed individual wire 601 again.

The shielding layer 603 is fixedly sleeved at the outer ends of the stranded wires 602, the shielding layer 603 is made of copper foil, and the shielding layer 603 made of copper foil is good in shielding effect and high in reliability.

The upper edge of the positioning hole 504 is provided with an inclined opening 505, and the arranged inclined opening 505 is convenient for clamping and fixing the PCB 1 and the positioning hole 504.

The inner and outer edges of the upper clamp 502 and the lower clamp 503 are both circular arc-shaped, the edges of the upper clamp 502 and the lower clamp 503 which are circular arc-shaped are in smooth transition, the wire 6 is conveniently introduced and fixed, and meanwhile, the wire 6 is not easy to scratch and scratch.

Both sides of the PCB 1 are fixedly provided with a plurality of welding spots 4, and the welding spots 4 are used for fixing the endpoints of the PCB 1 and the wire 6 through soldering tin.

The inside of Type-C interface 2 is fixedly provided with terminal 3.

The substrate 501, the upper chuck 502 and the lower chuck 503 are integrally formed, and the integrally formed substrate 501, upper chuck 502 and lower chuck 503 have high strength and high reliability.

Working principle: when the wire clamp is used, the upper clamp 502 and the lower clamp 503 with fewer numbers are arranged to form a single-double-layer combined structure, the single-layer wire 601 is clamped through the upper clamp 502 and the lower clamp 503, the multi-layer wire 602 is clamped through the upper clamp 502, the lower clamp 503 cannot occupy the space of the shielding layer 603, the clamping force and the holding force of the double-layer clamp are reserved, the problem that the wire 6 in the single-layer clamp retreats difficultly occurs, the characteristic requirement is met, the shielding layer 603 is shortened, the rib position 506 is increased in the positioning hole 504, the PCB 1 cannot be too loose after being mounted with the positioning hole 504 in a state with thinner thickness, the PCB 1 cannot be too tight under the condition of thicker thickness because the contact area of the rib position 506 and the PCB 1 is smaller, the stress surface is smaller and is not greatly influenced by the thickness of the PCB 1, and therefore the production precision requirement for the thickness of the PCB 1 is lower.

Finally, it should be noted that: the foregoing description is only illustrative of the preferred embodiments of the present utility model, and although the present utility model has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described, or equivalents may be substituted for elements thereof, and any modifications, equivalents, improvements or changes may be made without departing from the spirit and principles of the present utility model.

Claims

1. The utility model provides a single double-deck combination fastener that can promote product characteristic, includes PCB board (1), its characterized in that: the upper end of the PCB (1) is fixedly connected with a Type-C interface (2), and the lower end of the PCB (1) is connected with a wire clamp (5);

the wire clamp (5) comprises a substrate (501), a plurality of upper-layer chucks (502) are fixedly arranged at the upper ends of the two sides of the substrate (501), a plurality of lower-layer chucks (503) are fixedly arranged at the lower ends of the two sides of the substrate (501), the number of the lower-layer chucks (503) is less than that of the upper-layer chucks (502), positioning holes (504) are formed in the two sides of the upper end face of the substrate (501), protruding rib positions (506) are fixedly arranged on one side of each positioning hole (504), and the lower ends of the PCB (1) are clamped with the positioning holes (504).

2. The single-double layer bonding wire clip capable of improving product characteristics according to claim 1, wherein: the outside joint of fastener (5) has wire rod (6), wire rod (6) include individual wire (601) and stranded wire (602), individual wire (601) respectively with upper chuck (502) and lower floor's chuck (503) joint, stranded wire (602) and upper chuck (502) joint.

3. The single-double layer bonding wire clip for improving product characteristics according to claim 2, wherein: the outer end of the multi-strand wire (602) is fixedly sleeved with a shielding layer (603), and the shielding layer (603) is made of copper foil.

4. The single-double layer bonding wire clip capable of improving product characteristics according to claim 1, wherein: and a bevel (505) is arranged on the upper edge of the positioning hole (504).

5. The single-double layer bonding wire clip capable of improving product characteristics according to claim 1, wherein: the inner and outer edges of the upper clamp head (502) and the lower clamp head (503) are both circular arc-shaped.

6. The single-double layer bonding wire clip capable of improving product characteristics according to claim 1, wherein: a plurality of welding spots (4) are fixedly arranged on two sides of the PCB (1).

7. The single-double layer bonding wire clip capable of improving product characteristics according to claim 1, wherein: terminal (3) is fixedly arranged in Type-C interface (2).

8. The single-double layer bonding wire clip capable of improving product characteristics according to claim 1, wherein: the substrate (501) and the upper chuck (502) and the lower chuck (503) are integrally formed.