CN217336027U

CN217336027U - Connect stable multilayer high density circuit board

Info

Publication number: CN217336027U
Application number: CN202220975256.4U
Authority: CN
Inventors: 周航; 王海霞
Original assignee: UNIMICRON TECHNOLOGY (SHENZHEN) CORP
Current assignee: UNIMICRON TECHNOLOGY (SHENZHEN) CORP
Priority date: 2022-04-26
Filing date: 2022-04-26
Publication date: 2022-08-30
Anticipated expiration: 2032-04-26

Abstract

The utility model discloses a connect stable multilayer high density circuit board, including multilayer density circuit board main part, still including the polylith snubber block, snubber block and multilayer density circuit board main part are connected, are provided with the slot on the snubber block, the side of multilayer density circuit board main part is inserted the slot in the back and is pressed from both sides tightly by the snubber block, be provided with a plurality of passageways on the snubber block, the push rod has been inserted in the passageway, be provided with the briquetting on the push rod, briquetting and snubber block are contradicted, connect through the connecting band between the push rod on the same snubber block, it is provided with connecting portion to slide on the connecting band, one side of connecting portion and snubber block is inconsistent. When the utility model is used, the stability and the shock resistance of the multilayer high-density circuit board after being installed are not easy to loosen when being installed on equipment in a motion state for a long time such as an automobile, and the unstable connection condition of electrical elements and the like is not easy to occur, thus being more suitable for use; the anti-collision and anti-aging effects of the circuit board are improved.

Description

Connect stable multilayer high density circuit board

Technical Field

The utility model relates to a high density circuit board field, concretely relates to connect stable multilayer high density circuit board.

Background

The high-density printed circuit board is a structural element formed by an insulating material supplemented with conductor wiring. When the final product is manufactured, integrated circuits, transistors, diodes, passive components such as: resistors, capacitors, connectors, and the like, and other various electronic components. By connecting with the conductive wire, the connection and the function of the electronic signal can be formed. Thus, the printed circuit board is a platform for providing component connection to receive the base of the contact component.

At present, part of high-density circuit boards are of a multilayer structure, when the circuit boards are used, a large number of electrical components are often mounted on the circuit boards, and a plurality of connecting wires are arranged on the circuit boards.

However, at present, part of multilayer high-density circuit boards are installed in equipment such as automobiles and machine tools which are in motion for a long time, but the self shock resistance of the circuit boards is poor, and the vibration sense and the like generated in the motion state of the equipment cause the connection between electrical elements, connecting lines and the like and the circuit boards to be loosened and unstable, so that the use of the circuit boards, the electrical elements and the like is influenced.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the technical problem that a can solve the stable multilayer high density circuit board of connection of above-mentioned problem.

The utility model discloses a realize through following technical scheme: the utility model provides a connect stable multilayer high density circuit board, including multilayer density circuit board main part, still including polylith snubber block, snubber block and multilayer density circuit board main part are connected, be provided with the slot on the snubber block, the side of multilayer density circuit board main part is inserted and is pressed from both sides tightly by the snubber block in the slot, be provided with a plurality of passageways on the snubber block, the push rod has been inserted in the passageway, be provided with the briquetting on the push rod, briquetting and snubber block are contradicted, connect through the connecting band between the push rod on the same snubber block, it is provided with connecting portion to slide on the connecting band, one side of connecting portion and snubber block is inconsistent, set up the heat-conducting layer on the snubber block, connect through heat-conducting glue between heat-conducting layer and the multilayer density circuit board main part.

As preferred technical scheme, the snubber block is made for elastic colloid material, and the surface of snubber block is provided with anti-skidding line, and one side that multilayer density circuit board main part was kept away from to the snubber block sets up a plurality of spacing grooves, the tip phase-match of spacing groove and connecting portion, and the tip of connecting portion inserts to the spacing inslot.

As the preferred technical scheme, the push rod and the pressing block are bonded and fixed.

As a preferred technical scheme, the diameter of the briquetting is larger than that of the channel.

As the preferred technical scheme, be fixed with the stereoplasm layer on the connecting band, be provided with the spout on the stereoplasm layer, the spout is the dovetail structure, and it sets up the slider to slide in the spout, is fixed with connecting portion on the slider.

As preferred technical scheme, the heat-conducting layer is made for the metal of heat conduction, sets up a plurality of recesses on the snubber block, sets up the portion of inserting on the heat-conducting layer, and the recess is the annular structure and distributes, inserts a portion of inserting in a recess.

The beneficial effects of the utility model are that: when the utility model is used, the stability and shock resistance of the multilayer high-density circuit board after being installed are not easy to loosen when being installed on equipment in a motion state for a long time such as an automobile, and unstable connection of electrical elements and the like is not easy to occur, thus being more suitable for use; the anti-collision and anti-aging effects of the circuit board are improved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

FIG. 1 is a general view of the principal direction of the present invention;

FIG. 2 is an enlarged view of the point A of the present invention;

fig. 3 is a top view of the present invention.

Detailed Description

All of the features disclosed in this specification, or all of the steps in any method or process so disclosed, may be combined in any combination, except combinations of features and/or steps that are mutually exclusive.

This specification includes any features disclosed in the appended claims, abstract and drawings, which are, unless expressly stated otherwise, replaceable with other equivalent or similarly purposed alternative features. That is, unless expressly stated otherwise, each feature is only an example of a generic series of equivalent or similar features.

In the description of the present invention, it is to be understood that the terms "one end", "the other end", "the outside", "upper", "inside", "horizontal", "coaxial", "central", "end", "length", "outer end", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Furthermore, in the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

The use of terms such as "upper," "lower," and the like in describing relative spatial positions herein is for the purpose of facilitating the description to describe one element or feature's relationship to another element or feature as illustrated in the figures. The spatially relative positional terms may be intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary term "below" can encompass both an orientation of above and below. The device may be otherwise oriented 90 degrees or at other orientations and the spatially relative descriptors used herein interpreted accordingly.

In the present invention, unless otherwise explicitly specified or limited, the terms "set", "coupled", "connected", "penetrating", "plugging", and the like are to be understood in a broad sense, and may be, for example, fixedly connected, detachably connected, or integrated; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

As shown in fig. 1 to 3, including multilayer density circuit board main body 1, still include polylith snubber block 2, snubber block 2 and multilayer density circuit board main body 1 are connected, be provided with slot 3 on snubber block 2, the side of multilayer density circuit board main body 1 is pressed from both sides tightly by snubber block 2 after inserting in slot 3, be provided with a plurality of passageways 5 on snubber block 2, push rod 6 has been inserted in the passageway 5, be provided with briquetting 7 on push rod 6, briquetting 7 and snubber block 2 conflict, connect through connecting band 8 between the push rod 6 on the same snubber block 2, the connecting band bonds and fixes on the push rod, it is provided with connecting portion 18 to slide on the connecting band 8, connecting portion 18 and one side of snubber block 2 conflict, set up heat-conducting layer 9 on snubber block 2, connect through heat-conducting glue 10 between heat-conducting layer 9 and the multilayer density circuit board main body 1.

Wherein, snubber block 2 is made for elastic colloid material, and the surface of snubber block 2 is provided with anti-skidding line, and one side that multilayer density circuit board main part 1 was kept away from to snubber block 2 sets up a plurality of spacing grooves 200, and the tip phase-match of spacing groove 200 and connecting portion 18, the tip of connecting portion 18 inserts to the spacing inslot 200.

Wherein, the push rod 6 and the pressing block 7 are bonded and fixed.

Wherein the diameter of the pressing block 7 is larger than that of the channel 5.

Wherein, be fixed with stereoplasm layer 11 on the connecting band 8, be provided with spout 110 on the stereoplasm layer 11, the spout is the dovetail structure, and the spout 110 slides and sets up slider 22, is fixed with connecting portion 18 on the slider 22, and connecting portion can be made for the metal, bonds on the slider, and the stereoplasm layer also can be the metal, bonds on the connecting band. The sliding groove is of a dovetail groove structure, so that the sliding block and the sliding groove are difficult to separate,

wherein, the heat conduction layer 9 is made of heat-conducting metal, the shock absorption block 2 is provided with a plurality of grooves 16, the heat conduction layer 9 is provided with an integrated insertion part 900, the grooves 16 are distributed in an annular structure, and one insertion part 900 is inserted into one groove 16. The position of the heat conduction layer can be adjusted, the groove at a proper position is selected to be inserted into the inserting portion, the heat conduction layer selects a proper position on the circuit board, the heat conduction layer presses the circuit board, the heat conduction layer and the circuit board are fixed through heat conduction glue, the heat conduction layer can absorb heat of the circuit board and can also press the circuit board, and the circuit board is favorably stabilized.

When the shock absorber is used, the circuit board is connected with the shock absorption block, and during installation, the shock absorption block improves the stability of the circuit board after installation and improves the shock resistance of electrical elements on the circuit board and the circuit board.

The shock absorption block, the connecting band and the like are positioned on the side face of the circuit board, so that the anti-collision, anti-falling and other effects on the side face of the circuit board are improved.

After circuit board and snubber block are connected, can promote the push rod for the briquetting is convenient for remove, extrudees the snubber block when the briquetting removes, and after the snubber block received the extrusion, the snubber block extrudeed the circuit board, and the snubber block presss from both sides tight circuit board, does benefit to the stability of circuit board.

The connecting part is inserted into the damping block and used for stabilizing the damping block.

When the circuit board is used, the circuit board is not easy to loosen through multiple stable circuit boards such as the heat conduction layer and the shock absorption block, and electrical components and the like on the circuit board are connected stably and not easy to loosen.

The above description is only a specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that are not thought of through the creative work should be covered within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope defined by the claims.

Claims

1. A connect stable multilayer high density circuit board which characterized in that: including multilayer density circuit board main part (1), still including polylith snubber block (2), snubber block (2) and multilayer density circuit board main part (1) are connected, be provided with slot (3) on snubber block (2), the side of multilayer density circuit board main part (1) is inserted and is pressed from both sides tightly by snubber block (2) in slot (3), be provided with a plurality of passageways (5) on snubber block (2), push rod (6) have been inserted in passageway (5), be provided with briquetting (7) on push rod (6), briquetting (7) and snubber block (2) conflict, connect through connecting band (8) between push rod (6) on same snubber block (2), it is provided with connecting portion (18) to slide on connecting band (8), one side of connecting portion (18) and snubber block (2) is inconsistent, set up on snubber block (2) (9), connect through heat-conducting adhesive (10) between heat-conducting layer (9) and multilayer density circuit board main part (1).

2. The connection-stabilized multilayer high-density wiring board according to claim 1, characterized in that: the damping block (2) is made of elastic colloid material, anti-skid grains are arranged on the surface of the damping block (2), a plurality of limiting grooves (200) are arranged on one side, away from the multi-layer density circuit board main body (1), of the damping block (2), the limiting grooves (200) are matched with the end portions of the connecting portions (18), and the end portions of the connecting portions (18) are inserted into the limiting grooves (200).

3. The connection-stabilized multilayer high-density wiring board according to claim 1, characterized in that: the push rod (6) and the pressing block (7) are fixed in a bonding mode.

4. The connection-stabilized multilayer high-density wiring board according to claim 1, characterized in that: the diameter of the pressing block (7) is larger than that of the channel (5).

5. The connection-stabilized multilayer high-density wiring board according to claim 1, characterized in that: a hard layer (11) is fixed on the connecting band (8), a sliding groove (110) is arranged on the hard layer (11), the sliding groove is of a dovetail groove structure, a sliding block (22) is arranged in the sliding groove (110) in a sliding mode, and a connecting portion (18) is fixed on the sliding block (22).

6. The connection-stabilized multilayer high-density wiring board according to claim 1, characterized in that: the heat conducting layer (9) is made of heat conducting metal, the shock absorption block (2) is provided with a plurality of grooves (16), the heat conducting layer (9) is provided with inserting portions (900), the grooves (16) are distributed in an annular structure, and one inserting portion (900) is inserted into one groove (16).