CN217135768U - High stability high density interconnection lamination's pcb circuit board - Google Patents
High stability high density interconnection lamination's pcb circuit board Download PDFInfo
- Publication number
- CN217135768U CN217135768U CN202220766323.1U CN202220766323U CN217135768U CN 217135768 U CN217135768 U CN 217135768U CN 202220766323 U CN202220766323 U CN 202220766323U CN 217135768 U CN217135768 U CN 217135768U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- block
- board main
- main body
- supporting block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The utility model discloses a pcb circuit board of high stability high density interconnection lamination, including circuit board main part, circuit board main part's bottom is provided with the base plate, and it is provided with the supporting shoe to slide on the base plate, and one side of supporting shoe is provided with the extension, and the extension extends to circuit board main part's side, is provided with the briquetting on the extension, and circuit board main part is pushed down to the briquetting, all is provided with position adjustable location portion on the briquetting, is provided with a plurality of setpoint on the location portion, and part setpoint and circuit board are contradicted, are provided with in the setpoint and aggravate the chamber, aggravate the intracavity and be provided with the weighting thing, are fixed with the heat conduction piece on the setpoint. The circuit board of the utility model has good stabilizing effect, is not easy to loose and is more convenient to install when being installed; the heat dissipation effect of the circuit board is effectively improved.
Description
Technical Field
The utility model relates to a pcb circuit board field, concretely relates to pcb circuit board of high stability high density interconnection lamination.
Background
The PCB Printed Circuit Board, which is called a Printed Circuit Board in chinese, is an important electronic component, a support for electronic components, and a carrier for electrical interconnection of electronic components. It is called a "printed" circuit board because it is made using electronic printing.
A high-density interconnection lamination PCB circuit board is one of PCB circuit boards, but the circuit board has poor stability and defects in actual installation, and the performances of the circuit board such as heat dissipation and the like have improved spaces.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem that a pcb circuit board of the interconnected lamination of high stability high density that can solve above-mentioned problem.
The utility model discloses a realize through following technical scheme: the utility model provides a pcb circuit board of high stability high density interconnection lamination, including circuit board main part, the bottom of circuit board main part is provided with the base plate, it is provided with the supporting shoe to slide on the base plate, one side of supporting shoe is provided with the extension, the extension extends to the side of circuit board main part, be provided with the briquetting on the extension, circuit board main part is pushed down to the briquetting, all be provided with position adjustable location portion on the briquetting, be provided with a plurality of setpoint on the location portion, part setpoint and circuit board are contradicted, be provided with in the setpoint and aggravate the chamber, aggravate the intracavity and be provided with the weight, be fixed with the heat conduction piece on the setpoint.
As the preferred technical scheme, the base plate is made of heat-conducting metal, the base plate is fixed at the bottom of the circuit board through heat-conducting glue, the bottom of the base plate 2 is provided with a sliding groove, the sliding groove is of a dovetail groove structure, a matched sliding block is arranged in the sliding groove in a sliding mode, and a pressing block is fixed on the sliding block.
As the preferred technical scheme, the supporting block and the positioning points are made of colloid materials, and the supporting block is fixedly bonded on the sliding block.
As the preferred technical scheme, the pressing block, the extending part and the supporting block are made of the same material, and the pressing block, the extending part and the supporting block are of an integrated structure.
As preferred technical scheme, be provided with the jack on the briquetting, the interpolation has the adapter sleeve in the jack, and the inner wall of adapter sleeve is provided with the internal thread, is provided with connecting portion on the location portion, and the surface of connecting portion is provided with the external screw thread, and external screw thread and internal thread phase-match, connecting portion insert to the adapter sleeve in through the thread engagement.
The utility model has the advantages that: the circuit board of the utility model has good stabilizing effect, is not easy to loose and is more convenient to install when being installed; the heat dissipation effect of the circuit board is effectively improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a front view of the present invention;
FIG. 2 is a main sectional view of the present invention;
fig. 3 is a structure diagram of the positioning points of the present invention.
Detailed Description
All of the features disclosed in this specification, or all of the steps in any method or process so disclosed, may be combined in any combination, except combinations of features and/or steps that are mutually exclusive.
This specification includes any features disclosed in the appended claims, abstract and drawings, which are, unless expressly stated otherwise, replaceable with other equivalent or similarly purposed alternative features. That is, unless expressly stated otherwise, each feature is only an example of a generic series of equivalent or similar features.
In the description of the present invention, it is to be understood that the terms "one end", "the other end", "the outside", "upper", "inside", "horizontal", "coaxial", "central", "end", "length", "outer end", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
Furthermore, in the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
The use of terms herein such as "upper," "above," "lower," "below," and the like in describing relative spatial positions is for the purpose of facilitating description to describe one element or feature's relationship to another element or feature as illustrated in the figures. The spatially relative positional terms may be intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary term "below" can encompass both an orientation of above and below. The device may be otherwise oriented 90 degrees or at other orientations and the spatially relative descriptors used herein interpreted accordingly.
In the present invention, unless otherwise explicitly specified or limited, the terms "set", "coupled", "connected", "penetrating", "plugging", and the like are to be understood in a broad sense, and may be, for example, fixedly connected, detachably connected, or integrated; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
As shown in fig. 1 to 3, the printed circuit board comprises a circuit board main body 1, a substrate 2 is arranged at the bottom of the circuit board main body 1, a supporting block 12 is arranged on the substrate 2 in a sliding manner, an extending portion 11 is arranged on one side of the supporting block 12, the extending portion 11 extends to the side face of the circuit board main body 1, a pressing block 3 is arranged on the extending portion 11, the pressing block 3 presses the circuit board main body 1, positioning portions 6 with adjustable positions are arranged on the pressing block 3, a plurality of positioning points 7 are arranged on the positioning portions 6, part of the positioning points 7 are abutted to the circuit board main body 1, weighting cavities are arranged in the positioning points 7, weighting objects 10 are arranged in the weighting cavities, and heat conducting blocks 5 are fixed on the positioning points 7.
The substrate 2 is made of heat-conducting metal, the substrate 2 is fixed to the bottom of the circuit board main body 1 through heat-conducting glue, a sliding groove 17 is formed in the bottom of the substrate 2, the sliding groove 17 is of a dovetail groove structure, a matched sliding block 16 is arranged in the sliding groove 17 in a sliding mode, and a pressing block 3 is fixed to the sliding block 16. The slider and the spout are difficult to separate, and the slider bonds fixed briquetting, and the removal of slider can drive the removal of briquetting for the briquetting position can change.
Wherein, the supporting block 12 and the positioning point 7 are made of colloid materials, and the supporting block 12 is fixed on the sliding block 16 in a bonding way.
The pressing block 3, the extension part 11 and the supporting block 12 are made of the same material, and the pressing block 3, the extension part 11 and the supporting block 12 are of an integrated structure.
Wherein, be provided with the jack on the briquetting 3, the plug-in adapter sleeve 20 that has inserted in the jack, the inner wall of adapter sleeve 20 is provided with the internal thread, is provided with connecting portion 26 on the location portion 6, and the surface of connecting portion 26 is provided with the external screw thread, and external screw thread and internal thread phase-match, connecting portion 26 insert to pass through the thread engagement in the adapter sleeve 20. The connecting sleeve is bonded and fixed in the positioning portion, the connecting portion and the positioning portion are of an integrated structure and can be made of aluminum alloy or other materials, the positioning points are made of colloid materials and are unlimited in shape, the positioning points are fixed by waterproof glue, the heat conducting layer is made of heat conducting metal and can be fixed by the waterproof glue, and the weighting object can be made of sand and other substances.
When the technical scheme is used, the movement of the sliding block drives the bottom supporting block to move, so that the position of the supporting block can be adjusted, and the installation is more flexible. The substrate is used for absorbing heat at the bottom of the circuit board at the bottom, and heat dissipation of the circuit board is facilitated.
The support blocks increase the stability of the base.
The position of the extension part, the pressing block and the like can be adjusted due to the change of the position of the supporting block, and the extension part can be used for performing anti-collision protection on the side face of the circuit board.
When the positioning part is used, the positioning part can be adjusted in a rotating mode, so that the position of the positioning point can be changed, the positioning point is used for pressing the circuit board, the circuit board is favorably kept stable, and the operation is simple.
When the weight substance makes the setpoint and circuit board contact, do benefit to and more stably push down the circuit board for the circuit board is more stable, and the heat-conducting layer contradicts with the circuit board, is convenient for absorb the heat on the circuit board, and the weight substance drives the setpoint and pushes down, makes heat-conducting layer and circuit board contact more stable.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that are not thought of through the creative work should be covered within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope defined by the claims.
Claims (5)
1. The utility model provides a pcb circuit board of high stability high density interconnection lamination which characterized in that: the circuit board comprises a circuit board main body (1), a substrate (2) is arranged at the bottom of the circuit board main body (1), a supporting block (12) is arranged on the substrate (2) in a sliding mode, an extending portion (11) is arranged on one side of the supporting block (12), the extending portion (11) extends to the side face of the circuit board main body (1), a pressing block (3) is arranged on the extending portion (11), the circuit board main body (1) is pressed by the pressing block (3), a positioning portion (6) with an adjustable position is arranged on the pressing block (3), a plurality of positioning points (7) are arranged on the positioning portion (6), part of the positioning points (7) are abutted to the circuit board main body (1), a weighting cavity is arranged in the positioning points (7), a weighting object (10) is arranged in the weighting cavity, and a heat conducting block (5) is fixed on the positioning points (7).
2. The pcb board of claim 1, wherein: the substrate (2) is made of heat-conducting metal, the substrate (2) is fixed at the bottom of the circuit board main body (1) through heat-conducting glue, a sliding groove (17) is formed in the bottom of the substrate (2), the sliding groove (17) is of a dovetail groove structure, a matched sliding block (16) is arranged in the sliding groove (17) in a sliding mode, and a pressing block (3) is fixed on the sliding block (16).
3. The pcb board of claim 1, wherein: the supporting block (12) and the positioning point (7) are made of colloid materials, and the supporting block (12) is fixedly bonded on the sliding block (16).
4. The pcb board of claim 1, wherein: the pressing block (3), the extending part (11) and the supporting block (12) are made of the same material, and the pressing block (3), the extending part (11) and the supporting block (12) are of an integrated structure.
5. The pcb board of claim 1, wherein: be provided with the jack on briquetting (3), the adapter sleeve (20) has been inserted in the jack, and the inner wall of adapter sleeve (20) is provided with the internal thread, is provided with connecting portion (26) on location portion (6), and the surface of connecting portion (26) is provided with the external screw thread, and external screw thread and internal thread phase-match, connecting portion (26) insert to adapter sleeve (20) in through thread engagement.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220766323.1U CN217135768U (en) | 2022-04-06 | 2022-04-06 | High stability high density interconnection lamination's pcb circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220766323.1U CN217135768U (en) | 2022-04-06 | 2022-04-06 | High stability high density interconnection lamination's pcb circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217135768U true CN217135768U (en) | 2022-08-05 |
Family
ID=82646825
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220766323.1U Active CN217135768U (en) | 2022-04-06 | 2022-04-06 | High stability high density interconnection lamination's pcb circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217135768U (en) |
-
2022
- 2022-04-06 CN CN202220766323.1U patent/CN217135768U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110506455A (en) | Substrate, circuit structure and the electric connection box of subsidiary metal component | |
| CN217135768U (en) | High stability high density interconnection lamination's pcb circuit board | |
| CN212588610U (en) | Circuit board surface coating device for circuit board production | |
| CN216820413U (en) | Aluminum substrate with shock resistance and stability | |
| CN209472830U (en) | Copper-plated ceramic circuit board | |
| CN211584054U (en) | Adsorbability fixed table top structure | |
| CN216626179U (en) | Circuit fixing structure of PCB circuit board | |
| CN210042420U (en) | Circuit board clamp of multi-positioning system | |
| CN213938625U (en) | Circuit board structure of LED display screen | |
| CN211744866U (en) | Flexible copper-clad plate | |
| CN214123709U (en) | Capacitor with ceramic shell and convenient to replace | |
| CN218162994U (en) | Integrated circuit packaging structure for face recognition | |
| CN211897112U (en) | PCB sinks copper line lower plate auxiliary device | |
| CN217693815U (en) | Wireless integrated circuit board that fills | |
| CN214056856U (en) | Station fixing device for metallization of aluminum oxide ceramic | |
| CN215935177U (en) | PCB structure of circuit board convenient to device welding | |
| CN215379524U (en) | PCB positioning and metal bottom plate heat dissipation device of heating patch element | |
| CN214950131U (en) | A reflow soldering and wave soldering multipurpose tool for SMT paster | |
| CN212086616U (en) | PCB fixing device of SMT chip mounter | |
| CN217064096U (en) | Withstand voltage structure of HDI board | |
| CN218413330U (en) | Multi-angle supporting mechanism and radiator of electronic equipment | |
| CN218162983U (en) | Circuit ceramic substrate with strong heat dissipation capability | |
| CN217135767U (en) | Precision type high-density interconnection PCB circuit board | |
| CN210670822U (en) | PCB placing device for baking solder mask of PCB | |
| CN213716895U (en) | SMD lead frame |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |