CN220172118U

CN220172118U - Delamination-preventing lead frame, semiconductor package device, and semiconductor module

Info

Publication number: CN220172118U
Application number: CN202321716857.4U
Authority: CN
Inventors: 葛永飞
Original assignee: Shenzhen Shangyangtong Technology Co ltd
Current assignee: Shenzhen Shangyangtong Technology Co ltd
Priority date: 2023-07-03
Filing date: 2023-07-03
Publication date: 2023-12-12
Anticipated expiration: 2033-07-03

Abstract

The embodiment of the utility model relates to the technical field of device packaging, and discloses an anti-layering lead frame, a semiconductor packaging device and a semiconductor module. The delamination-preventing lead frame comprises a main body part, a lead part and a supporting part; the main body part is provided with a first surface and a second surface which are oppositely arranged, the first surface is used for bearing the chip, and the edge of the second surface is provided with non-flat structures which are distributed in a linear manner; the pin part protrudes outwards from the edge of the main body part or is arranged adjacent to the main body part; the support part protrudes outwards from the edge of the main body part and is positioned at the different side of the main body part from the pin part. The delamination-preventing lead frame, the semiconductor packaging device and the semiconductor module provided by the embodiment of the utility model ensure the waterproofness of the semiconductor packaging device.

Description

Delamination-preventing lead frame, semiconductor package device, and semiconductor module

Technical Field

The embodiment of the utility model relates to the technical field of device packaging, in particular to a delamination-preventing lead frame, a semiconductor packaging device and a semiconductor module.

Background

With the continuous development of integrated circuit technology, the demand for semiconductor package devices is also increasing. By integrating different semiconductor devices in a module, different circuit functions can be realized. In the manufacturing process of the semiconductor packaging device, sensitive electronic components in the semiconductor packaging device are packaged to protect the sensitive electronic components from being easily influenced by external environment interference. Among them, as various packaging technologies are developed, many different types of packaging forms have been derived.

However, whatever the packaging form is adopted, for the semiconductor packaged device, the quality of the packaging effect seriously affects the actual working performance of the product. Particularly, when the semiconductor packaging device is applied under the condition of complex working conditions and environments, the waterproof performance of the semiconductor packaging device needs to meet certain requirements. Therefore, how to secure the waterproof property of the semiconductor package device is an important issue.

Disclosure of Invention

The purpose of the present utility model is to provide a delamination-preventing lead frame, a semiconductor package device, and a semiconductor module, which can ensure the waterproof property of the semiconductor package device.

In order to solve the technical problems, an embodiment of the present utility model provides an anti-delamination lead frame, which includes a main body portion, a lead portion, and a supporting portion; the main body part is provided with a first surface and a second surface which are oppositely arranged, the first surface is used for bearing the chip, and the edge of the second surface is provided with non-flat structures which are distributed in a linear manner; the pin part protrudes outwards from the edge of the main body part or is arranged adjacent to the main body part; the support part protrudes outwards from the edge of the main body part and is positioned at the different side of the main body part from the pin part.

The embodiment of the utility model also provides a semiconductor packaging device, which comprises a chip, the delamination-preventing lead frame and a plastic package body, wherein the chip is arranged on the first surface of the delamination-preventing lead frame, and the plastic package body is coated on the chip and the delamination-preventing lead frame.

The embodiment of the utility model also provides a semiconductor module, which comprises the semiconductor packaging device.

According to the anti-layering lead frame, the semiconductor packaging device and the semiconductor module provided by the embodiment of the utility model, the uneven structure is arranged at the edge of the lead frame stage, so that the edge of the lead frame stage generates a mode locking structure. Therefore, when the semiconductor power device product is in plastic packaging, the plastic packaging material can be tightly combined with the edge of the lead frame carrier. Therefore, annular protection is formed on the edge of the lead frame with the larger carrying platform, the combination of plastic packaging materials and the carrying edge of the lead frame is ensured, the delamination prevention capability of the edge of the lead frame is effectively improved, and the waterproofness of the semiconductor packaging device is ensured.

In some embodiments, the non-planar structures are distributed around the edge of the second surface.

In some embodiments, the non-planar structures are distributed in a direction parallel to the edge extension direction of the second surface.

In some embodiments, the non-planar structure is a groove recessed from the second surface toward the first surface.

In some embodiments, the directions of extension of adjacent two grooves intersect each other.

In some embodiments, the recess size of each groove is 20% to 80% of the thickness of the body portion.

In some embodiments, the pin portion includes a first type of pin disposed to protrude outwardly from an edge of the body portion.

In some embodiments, the pin portion further includes a second type of pin disposed adjacent the body portion and disposed on opposite sides of the body portion from the first type of pin.

Drawings

One or more embodiments are illustrated by way of example and not limitation in the figures of the accompanying drawings, in which like references indicate similar elements, and in which the figures of the drawings are not to be taken in a limiting sense, unless otherwise indicated.

Fig. 1 is a schematic bottom view of a prior art lead frame;

fig. 2 is a schematic bottom view of a delamination-preventing leadframe according to some embodiments of the utility model.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the following detailed description of the embodiments of the present utility model will be given with reference to the accompanying drawings. However, those of ordinary skill in the art will understand that in various embodiments of the present utility model, numerous technical details have been set forth in order to provide a better understanding of the present utility model. However, the claimed utility model may be practiced without these specific details and with various changes and modifications based on the following embodiments. The following embodiments are divided for convenience of description, and should not be construed as limiting the specific implementation of the present utility model, and the embodiments can be mutually combined and referred to without contradiction.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model; the terms "comprising" and "having" and any variations thereof in the description of the utility model and the claims and the description of the drawings above are intended to cover a non-exclusive inclusion.

In the description of embodiments of the present utility model, the technical terms "first," "second," and the like are used merely to distinguish between different objects and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated, a particular order or a primary or secondary relationship. In the description of the embodiments of the present utility model, the meaning of "plurality" is two or more unless explicitly defined otherwise.

In the description of the embodiments of the present utility model, the term "and/or" is merely an association relationship describing an association object, and indicates that three relationships may exist, for example, a and/or B may indicate: a exists alone, A and B exist together, and B exists alone. In addition, the character "/" herein generally indicates that the front and rear associated objects are an "or" relationship.

In the description of the embodiments of the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "coupled," and the like should be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally formed; or may be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the embodiments of the present utility model will be understood by those of ordinary skill in the art according to specific circumstances.

The semiconductor package device relates to a semiconductor chip, a lead frame containing a stage structure, high-viscosity EMC (Epoxy Molding Compound, epoxy resin molding compound), a power MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor, metal Oxide semiconductor field effect transistor) product and the like. Semiconductor package device products containing heat sink structures are relatively sensitive to moisture, and especially mounting type devices are required to meet MSL3 (Moisture Sensitivity Level, moisture sensitivity) grades, vehicle regulations are required to meet MSL1 grades, and the like.

However, in the conventional product having a lead frame with a large stage, delamination of the stage edge is likely to occur in the reliability test, and moisture easily intrudes into the product along the stage edge of the carrier frame. As shown in fig. 1, the stage edge of the prior art lead frame 100 is a flat surface, and moisture is most likely to intrude into the product interior along the stage edge of the slide lead frame 100. Therefore, there is a need for improved lead frame structures to facilitate improved vapor resistance of the product, which can actually delay vapor intrusion and improve product quality and reliability.

To this end, some embodiments of the present utility model provide an anti-delamination leadframe that includes a stage edge non-planar structure. When the lead frame is designed, a half corrosion process is carried out on the edge of the lead frame stage, so that a mold locking structure is generated on the edge of the lead frame stage. Therefore, when the semiconductor power device product is in plastic packaging, EMC materials can be tightly combined with the edge of the lead frame carrier. Therefore, annular protection is formed on the edge of the lead frame with the larger slide glass stage, the combination of EMC materials and the lead frame carrying edge is ensured, the delamination prevention capability of the lead frame edge is effectively improved, and the waterproofness of the semiconductor packaging device is ensured.

The anti-delamination leadframe structure provided by some embodiments of the present utility model is described below with reference to fig. 2.

As shown in fig. 2, the delamination-preventing leadframe according to some embodiments of the present utility model includes a main body 11, a lead 12, and a support 13; the main body 11 has a first surface and a second surface 112 which are oppositely arranged, the first surface is used for bearing chips, and non-flat structures 14 which are linearly distributed are arranged at the edge of the second surface 112; the lead part 12 protrudes outwards from the edge of the main body part 11 or is arranged adjacent to the main body part 11; the support portion 13 protrudes outward from the edge of the main body portion 11 and is located on a different side of the main body portion 11 from the lead portion 12.

The main body 11 is a main part of the slide lead frame, and the first surface of the main body 11 may be used for carrying and fixing a chip, and the second surface 112 of the main body 11 may be used for performing a heat dissipation function. Meanwhile, the non-flat structure 14 disposed at the edge of the second surface 112 may provide a receiving space for the molding material during the molding process. And, the non-flat structures 14 are linearly distributed at the edge of the second surface 112, so as to enhance the bonding with the plastic package material from the periphery of the second surface 112. The non-planar structures 14 may be in the form of grooves, holes, or elongated grooves.

The leads 12 may be electrically connected to different electrodes of the chip, thereby ultimately making electrical connection with external components. The lead portion 12 may be directly connected to the main body portion 11, or may be provided adjacent to the main body portion 11 and connected to a molding frame outside the main body portion 11. In practical situations, the lead portion 12 may be located on the same plane as the main body portion 11, or may be designed in a bent shape, so that the plane of the lead portion 12 and the plane of the main body portion 11 are offset. That is, the body portion 11 may be sunk with respect to the lead portion 12 of the peripheral portion, forming a recessed structure. Therefore, the occupied volume of the chip after plastic packaging can be reduced, and the miniaturization of the packaged semiconductor power device is realized. The number of the pin portions 12 is not limited to 8 shown in fig. 2, and may be any number required, for example, 5, 7, or 10.

The supporting portion 13 is located at the edge of the main body portion 11, and can be used for forming an integral molding structure with other lead frames, so that after packaging molding of the semiconductor power devices is finished in batches, separation of the semiconductor power devices is finished through rib cutting molding.

Some embodiments of the present utility model provide an anti-delamination slide leadframe having a non-planar structure 14 disposed at the leadframe mount edge such that the leadframe mount edge creates a mold-locking structure. Therefore, when the semiconductor power device product is in plastic packaging, the plastic packaging material can be tightly combined with the edge of the lead frame carrier. Therefore, annular protection is formed on the edge of the lead frame with the larger carrying platform, the combination of plastic packaging materials and the carrying edge of the lead frame is ensured, the delamination prevention capability of the edge of the lead frame is effectively improved, and the waterproofness of the semiconductor packaging device is ensured.

As shown in fig. 2, non-planar structures 14 may be distributed around the edges of second surface 112.

Thus, the mold locking effect can be achieved from the periphery of the lead frame main body part 11, and the plastic packaging material is beneficial to being tightly connected to the lead frame. The phenomenon of layering easily occurs between the plastic package body and the lead frame is avoided, and the waterproofness of the semiconductor packaging device is ensured.

In some embodiments, the direction of distribution of non-planar structures 14 may be parallel to the direction of edge extension of second surface 112.

As shown in fig. 2, the body 11 is provided in a rectangular parallelepiped shape as a whole, and the second surface 112 of the body 11 is rectangular or square. The non-planar structure 14 is disposed proximate an edge of the second surface 112, thereby enhancing the bond between the leadframe and the molding compound at the edge of the second surface 112.

In addition, non-planar structure 14 may be a groove recessed from second surface 112 toward the first surface.

The recess can provide accommodation space for plastic envelope material to make in the plastic envelope in-process, plastic envelope material can fill in the recess. So that the cured plastic package can be locked on the lead frame and maintain good bonding with the edge of the lead frame body 11.

That is, the lengthwise direction of the grooves may be maintained in a non-parallel state. In this way, each groove can exert a locking force on the filled molding material from different directions. So that the entire plastic package material can maintain tight connectivity with the lead frame in all directions. In practical situations, the extending directions of two adjacent grooves can also be kept in a parallel state.

In addition, the concave dimension of each groove is 20% to 80% of the thickness of the main body portion 11.

That is, the recess depth of the groove on the second surface 112 may be 20% to 80% of the thickness of the body portion 11, for example, the recess depth of the groove may be 20%, 30%, 40%, 50%, 60%, 70% or 80% of the thickness of the body portion 11.

The lead portion 12 includes a first type of lead 121, and the first type of lead 121 is disposed to protrude outward from the edge of the main body portion 11.

The first type of pins 121 may be drain pins, and the number of the first type of pins 121 may be set according to actual needs. For example, the number of first type pins 121 may be 4, 6, or 8.

In addition, the lead portion 12 may further include a second type of lead 122, where the second type of lead 122 is disposed adjacent to the body portion 11 and is disposed on opposite sides of the body portion 11 from the first type of lead 121.

One portion of the second type of pins 122 may be source pins and another portion may be gate pins. The second type pins 122 are distributed on two sides of the main body 11 opposite to the first type pins 121. Meanwhile, the second type pins 122 may not be directly connected with the body portion 11, but may be disposed adjacent to the body portion 11.

Some embodiments of the present utility model further provide a semiconductor package device, where the semiconductor package device includes a chip, the delamination preventing lead frame, and a plastic package body, the chip is disposed on the first surface of the delamination preventing lead frame, and the plastic package body is coated on the chip and the delamination preventing lead frame.

The chip is a core control part of the semiconductor package device, and includes a transistor therein. The different electrodes of the chip are electrically connected with the external parts through different pin parts in the lead frame, and the pin parts of the lead frame can be electrically connected with the external parts after being electrically connected with the chip. Typically, portions of the lead portions are exposed from the molding compound.

The plastic package body is a part for packaging the chip and is formed by curing a plastic package material. The plastic package body forms a wrapping effect on the chip, so that the chip is prevented from being easily affected by interference of external environment, and the service life of the chip is prolonged.

Some embodiments of the present utility model further provide a semiconductor module including the semiconductor package device described above.

By the aid of the edge half-corrosion structural design of the integrated lead frame stage, the conventional packaging production line equipment and materials are fully utilized by combining a power MOSFET assembly process and a low-stress EMC molding technology, and key performances of realizing moisture sensitivity level of products can be excavated under the condition that product cost is not increased.

It will be understood by those of ordinary skill in the art that the foregoing embodiments are specific examples of carrying out the utility model and that various changes in form and details may be made therein without departing from the spirit and scope of the utility model.

Claims

1. A delamination-resistant lead frame, comprising:

the main body part is provided with a first surface and a second surface which are oppositely arranged, the first surface is used for bearing the chip, and the edge of the second surface is provided with non-flat structures which are distributed linearly;

the lead part protrudes outwards from the edge of the main body part or is arranged adjacent to the main body part;

and the supporting part protrudes outwards from the edge of the main body part and is positioned on the different side of the main body part from the lead part.

2. The delamination prevention leadframe of claim 1, wherein the non-planar structures are circumferentially distributed at an edge of the second surface.

3. The delamination-resistant leadframe of claim 2, wherein the non-planar structures are distributed in a direction parallel to an edge extension of the second surface.

4. A delamination-resistant leadframe as recited in any one of claims 1 to 3, wherein the non-planar structure is a groove recessed from the second surface toward the first surface.

5. The delamination-resistant leadframe of claim 4 wherein the directions of extension of adjacent two of said grooves intersect each other.

6. The delamination preventing leadframe of claim 4 wherein each of said grooves has a recess dimension of 20% to 80% of a thickness of said body portion.

7. The delamination prevention leadframe of claim 1, wherein the lead portion comprises a first type of lead protruding outwardly from an edge of the body portion.

8. The delamination prevention leadframe of claim 7, wherein the lead portions further comprise a second type of leads disposed adjacent to the body portion and distributed on opposite sides of the body portion from the first type of leads.

9. A semiconductor package device comprising a chip, the delamination preventing lead frame of any one of claims 1 to 8, and a plastic package, wherein the chip is disposed on a first surface of the delamination preventing lead frame, and the plastic package is coated on the chip and the delamination preventing lead frame.

10. A semiconductor module comprising the semiconductor package device of claim 9.