CN220172119U

CN220172119U - Lead frame, semiconductor power device and semiconductor module

Info

Publication number: CN220172119U
Application number: CN202321716873.3U
Authority: CN
Inventors: 葛永飞
Original assignee: Shenzhen Shangyangtong Technology Co ltd
Current assignee: Shenzhen Shangyangtong Technology Co ltd
Priority date: 2023-07-03
Filing date: 2023-07-03
Publication date: 2023-12-12
Anticipated expiration: 2033-07-03

Abstract

The embodiment of the utility model relates to the technical field of device packaging, and discloses a lead frame, a semiconductor power device and a semiconductor module. The lead frame comprises a main body part, a supporting part and a lead part; the main body part is provided with a chip bearing table; the support part protrudes outwards from the edge of the main body part, and is provided with a groove; the pin part protrudes outwards from the edge of the main body part or is arranged adjacent to the main body part, and the pin part and the supporting part are positioned on different sides of the main body part. The lead frame, the semiconductor power device and the semiconductor module provided by the embodiment of the utility model can ensure the combination property between the lead frame and the plastic packaging material during packaging.

Description

Lead frame, semiconductor power device and semiconductor module

Technical Field

The embodiment of the utility model relates to the technical field of device packaging, in particular to a lead frame, a semiconductor power device and a semiconductor module.

Background

With the continuous development of high-power electronic devices, the requirements for semiconductor power devices are also increasing. Moreover, as the volume of devices such as mobile communications becomes smaller, smaller semiconductor power devices are required to be manufactured so that the devices can accommodate the manufacturing process of the devices. The lead frame is the basis of device packaging, not only can provide mechanical support for the chip, but also can realize the electrical connection between the chip and external parts.

The bonding property between the lead frame and the interface of the plastic packaging material during packaging plays an important role in the product performance of the semiconductor power device. Particularly, as layering occurs between the lead frame and the molding material, the waterproof property of the semiconductor power device is seriously affected. Therefore, how to ensure the bonding property between the lead frame and the molding material at the time of packaging is an important issue.

Disclosure of Invention

The utility model provides a lead frame, a semiconductor power device and a semiconductor module, which can ensure the bonding property between the lead frame and a plastic package material when the lead frame is packaged.

In order to solve the above technical problems, embodiments of the present utility model provide a lead frame, which includes a main body portion, a supporting portion, and a lead portion; the main body part is provided with a chip bearing table; the support part protrudes outwards from the edge of the main body part, and is provided with a groove; the pin part protrudes outwards from the edge of the main body part or is arranged adjacent to the main body part, and the pin part and the supporting part are positioned on different sides of the main body part.

The embodiment of the utility model also provides a semiconductor power device which comprises the lead frame.

The embodiment of the utility model also provides a semiconductor module which comprises the semiconductor power device.

According to the lead frame, the semiconductor power device and the semiconductor module provided by the embodiment of the utility model, the groove structure is added on the frame supporting part in the lead frame design, so that the plastic package material of the semiconductor power device product can be tightly combined with the groove on the supporting part of the lead frame during plastic package. Meanwhile, the groove area can be easily broken when the rib is cut, formed and pulled, so that the mechanical stress born by a semiconductor power device product in the separation and pulling process is effectively reduced, and the combination property between the lead frame and the plastic packaging material can be ensured.

In some embodiments, the support portion is provided in plurality, and the plurality of support portions are provided on both sides of the main body portion.

In some embodiments, the direction of extension of the groove is perpendicular to the direction of protrusion of the support.

In some embodiments, the cross-sectional shape of the groove is V-shaped, U-shaped, rectangular, or circular arc.

In some embodiments, the groove size is 20% to 50% of the thickness of the support.

In some embodiments, the groove is disposed adjacent the body portion.

In some embodiments, the support portion is provided in an elongated shape.

In some embodiments, the body portion, the support portion, and the lead portion are an integrally formed structure.

Drawings

One or more embodiments are illustrated by way of example and not limitation in the figures of the accompanying drawings, in which like references indicate similar elements, and in which the figures of the drawings are not to be taken in a limiting sense, unless otherwise indicated.

Fig. 1 is a schematic view of a prior art lead frame;

fig. 2 is a schematic structural diagram of a lead frame according to some embodiments of the present utility model.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the following detailed description of the embodiments of the present utility model will be given with reference to the accompanying drawings. However, those of ordinary skill in the art will understand that in various embodiments of the present utility model, numerous technical details have been set forth in order to provide a better understanding of the present utility model. However, the claimed utility model may be practiced without these specific details and with various changes and modifications based on the following embodiments. The following embodiments are divided for convenience of description, and should not be construed as limiting the specific implementation of the present utility model, and the embodiments can be mutually combined and referred to without contradiction.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model; the terms "comprising" and "having" and any variations thereof in the description of the utility model and the claims and the description of the drawings above are intended to cover a non-exclusive inclusion.

In the description of embodiments of the present utility model, the technical terms "first," "second," and the like are used merely to distinguish between different objects and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated, a particular order or a primary or secondary relationship. In the description of the embodiments of the present utility model, the meaning of "plurality" is two or more unless explicitly defined otherwise.

In the description of the embodiments of the present utility model, the term "and/or" is merely an association relationship describing an association object, and indicates that three relationships may exist, for example, a and/or B may indicate: a exists alone, A and B exist together, and B exists alone. In addition, the character "/" herein generally indicates that the front and rear associated objects are an "or" relationship.

In the description of the embodiments of the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "coupled," and the like should be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally formed; or may be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the embodiments of the present utility model will be understood by those of ordinary skill in the art according to specific circumstances.

The semiconductor power device relates to a semiconductor chip, a lead frame containing a slide holder structure, high-viscosity EMC (Epoxy Molding Compound, epoxy resin molding compound), a power MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor, metal Oxide semiconductor field effect transistor) product and the like. The semiconductor power device product containing the radiating fin structure is sensitive to water vapor, and particularly, the mounting type device is required to meet the MSL3 (Moisture Sensitivity Level, moisture sensitivity) grade, and the vehicle rule is required to meet the MSL1 grade and the like. As shown in fig. 1, a supporting portion 200 is provided at an edge of a main body portion 100 of a conventional lead frame, and semiconductor power device products including such a lead frame are separated by hard pulling of a die in a dicing step. This easily causes side breakage of the plastic package, delamination of the lead frame and EMC material, and moisture easily intrudes into the inside of the product along the notch of the plastic package. Therefore, there is a need for improved lead frame structures to facilitate improved vapor resistance of the product, which can actually delay vapor intrusion and improve product quality and reliability.

To this end, some embodiments of the present utility model provide a leadframe having a recessed structure at a support location and a stage structure. The groove structure is added on the frame supporting part in the lead frame design, so that the EMC material can be tightly combined with the groove on the supporting part of the lead frame when the semiconductor power device product is packaged. Meanwhile, the groove area can be easily broken when the rib is cut, formed and pulled, so that the mechanical stress borne by the semiconductor power device product in the separation and pulling process is effectively reduced, the influence on the combination property between an EMC material and a lead frame is avoided, and the semiconductor power device product is promoted to exert the product performance for a longer time.

The following describes leadframe structures provided by some embodiments of the present utility model with reference to fig. 2.

As shown in fig. 2, some embodiments of the present utility model provide a lead frame including a main body 11, a supporting portion 12, and a lead portion 13; the main body 11 is provided with a chip mount 111; the supporting part 12 protrudes outwards from the edge of the main body part 11, and the supporting part 12 is provided with a groove 121; the lead portion 13 protrudes outward from the edge of the main body portion 11 or is disposed adjacent to the main body portion 11, and the lead portion 13 and the support portion 12 are located on different sides of the main body portion 11.

The main body 11 is a main part of the lead frame, and the chip carrier 111 of the main body 11 can be used for carrying and fixing chips. The supporting portion 12 is located at the edge of the main body portion 11, and can be used for forming an integral molding structure with other lead frames, so that after packaging molding of the semiconductor power devices is finished in batches, separation of the semiconductor power devices is finished through rib cutting molding. The grooves 121 provided on the support 12 not only provide space for filling of the molding material, but also provide convenience for rib cutting molding.

The lead portion 13 can be electrically connected with different electrodes of the chip, so that electrical connection with external components is finally achieved. The lead portion 13 may be directly connected to the main body portion 11, or may be provided adjacent to the main body portion 11 and connected to a molding frame outside the main body portion 11. In practical situations, the lead portion 13 may be located on the same plane as the main body portion 11, or may be designed in a bent shape, so that the plane of the lead portion 13 and the plane of the main body portion 11 are offset. That is, the body portion 11 may be sunk with respect to the lead portion 13 of the peripheral portion, forming a recessed structure. Therefore, the occupied volume of the chip after plastic packaging can be reduced, and the miniaturization of the packaged semiconductor power device is realized. The number of the pin portions 13 is not limited to 8 as shown in fig. 2, and may be any number as required, for example, 5, 7, or 10.

In the lead frame provided by some embodiments of the present utility model, the groove 121 structure is added on the frame support portion 12 in the lead frame design, so that the plastic packaging material can be tightly combined with the groove 121 on the support portion 12 of the lead frame during plastic packaging of the semiconductor power device product. Meanwhile, the groove 121 area can be easily broken when the rib is cut, formed and pulled, so that the mechanical stress born by the semiconductor power device product in the process of separating and pulling is effectively reduced, and the combination property between the lead frame and the plastic packaging material can be ensured.

As shown in fig. 2, the support portion 12 may be provided in plurality, and the plurality of support portions 12 are provided on both sides of the main body portion 11.

In actual cases, the number of the supporting parts 12 may be two, three, four or five. The plurality of supporting parts 12 may be disposed at both sides of the body part 11, so that the integrally formed plurality of lead frames may be connected to each other in the same direction, which is advantageous for mass production of semiconductor power devices.

In some embodiments, the direction of extension of the groove 121 is perpendicular to the protruding direction of the support 12.

In this way, the grooves 121 can reduce the separation resistance to a greater extent when separating the semiconductor power device product from the protruding direction of the support bar, so that the mechanical force required to be applied can be effectively reduced. And further effectively reduces the mechanical stress to which the semiconductor power device product is subjected.

In addition, the cross-sectional shape of the groove 121 may be provided in a V shape, a U shape, a rectangular shape, or a circular arc shape.

That is, in actual cases, the cross-sectional shape of the groove 121 may be designed into various different abnormal shapes such as a rectangle, a trapezoid, or a circle. Meanwhile, the groove 121 may be integrally provided around the support 12, may be provided around the support 12 in a segmented manner, or may be provided on the front or rear of the support 12 alone.

In some embodiments, the recess 121 may be sized to be 20% to 50% of the thickness of the support 12.

In practice, the size of the recess 121 may be 20%, 30%, 40% or 50% of the thickness of the support 12.

As shown in fig. 2, the recess 121 may be provided adjacent to the body portion 11.

In this way, the size of the support 12 left on the lead frame after separation can be reduced, which is advantageous for ensuring the overall aesthetic appearance of the semiconductor power device.

In some embodiments, the support 12 may be provided in an elongated shape.

The main body 11, the support 12, and the lead 13 may be integrally formed.

By adopting the integrated structure, the integral strength of the lead frame can be ensured, and the lead frame is prevented from being damaged easily when being influenced by external force.

Some embodiments of the present utility model further provide a semiconductor power device, where the semiconductor power device includes a chip, the above-mentioned lead frame, and a plastic package body, the chip is disposed on a chip carrier of a main body portion of the lead frame, and the plastic package body is wrapped on the chip and the lead frame.

The chip is a core control part of the semiconductor package device, and includes a transistor therein. The different electrodes of the chip are electrically connected with the external parts through different pin parts in the lead frame, and the pin parts of the lead frame can be electrically connected with the external parts after being electrically connected with the chip. Typically, portions of the lead portions are exposed from the molding compound.

The plastic package body is a part for packaging the chip and is formed by curing a plastic package material. The plastic package body forms a wrapping effect on the chip, so that the chip is prevented from being easily affected by interference of external environment, and the service life of the chip is prolonged.

Some embodiments of the present utility model further provide a semiconductor module, where the semiconductor module includes the semiconductor power device described above.

Through the design of the groove structure on the supporting part of the integrated lead frame stage, the existing packaging production line equipment and materials are fully utilized by combining the power MOSFET assembly process and the low-stress EMC molding technology, so that the mechanical damage during product separation can be reduced under the condition of not increasing the product cost, and the combination property between the plastic packaging material and the lead frame in the whole product is ensured.

It will be understood by those of ordinary skill in the art that the foregoing embodiments are specific examples of carrying out the utility model and that various changes in form and details may be made therein without departing from the spirit and scope of the utility model.

Claims

1. A lead frame, comprising:

a main body part provided with a chip bearing table;

the supporting part protrudes outwards from the edge of the main body part, and the supporting part is provided with a groove;

the lead part protrudes outwards from the edge of the main body part or is arranged adjacent to the main body part, and the lead part and the supporting part are positioned on different sides of the main body part.

2. The lead frame according to claim 1, wherein a plurality of the supporting portions are provided, the plurality of supporting portions being disposed opposite to each other on both sides of the main body portion.

3. The lead frame according to claim 1 or 2, wherein an extending direction of the groove is perpendicular to a protruding direction of the supporting portion.

4. A lead frame according to claim 3, wherein the cross-sectional shape of the groove is V-shaped, U-shaped, rectangular or circular arc.

5. The leadframe of claim 4, wherein the groove dimension is 20% to 50% of the thickness of the support portion.

6. The leadframe of claim 1, wherein the recess is disposed adjacent the body portion.

7. The lead frame according to claim 1, wherein the supporting portion is provided in a long strip shape.

8. The leadframe of claim 1, wherein the body portion, the support portion, and the lead portion are an integrally formed structure.

9. A semiconductor power device, comprising a chip, the lead frame of any one of claims 1 to 8, and a plastic package, wherein the chip is disposed on a chip carrier of a main body of the lead frame, and the plastic package is coated on the chip and the lead frame.

10. A semiconductor module comprising the semiconductor power device of claim 9.