CN220172090U

CN220172090U - Packaging equipment for multilayer stacked memory chips

Info

Publication number: CN220172090U
Application number: CN202321417652.6U
Authority: CN
Inventors: 吴江鹏
Original assignee: Chongqing Trute Technology Co ltd
Current assignee: Chongqing Trute Technology Co ltd
Priority date: 2023-06-06
Filing date: 2023-06-06
Publication date: 2023-12-12
Anticipated expiration: 2033-06-06

Abstract

The utility model discloses packaging equipment for multi-layer stacked memory chips, which comprises a base, wherein a supporting component is arranged on one side of the top of the base; the top of the supporting component is provided with a packaging shell; the top of the base is provided with a supporting seat, and the top of the supporting seat is provided with a taking assembly; the sliding mechanism is arranged at the top of the base and positioned at one side far away from the taking assembly; according to the utility model, the taking assembly is arranged, the block body can be taken out from the fixing seat by suction force generated by the air bag and the sucker, meanwhile, the packaging shell can be adsorbed by controlling the sucker, and parts for chip packaging can be conveniently transferred and operated by adsorption, so that the convenience degree is improved; according to the utility model, the cover body is arranged for protecting the components, so that the external accidental interference is reduced, and the electrostatic fan is arranged for reducing the interference from static electricity when the chip is packaged.

Description

Packaging equipment for multilayer stacked memory chips

Technical Field

The utility model relates to the technical field of chip packaging, in particular to packaging equipment for multi-layer stacked memory chips.

Background

The memory chip is a specific application of the concept of an embedded system chip in the memory industry, so that the system chip and the memory chip can realize multifunction and high performance and support for various protocols, various hardware and different applications by embedding software in a single chip.

Chinese patent No.: CN114566456a provides a packaging device for multi-layer stacked memory chips, which belongs to the field of chip packaging, and solves the problems that in the existing chip gold wire welding technology, the chip clamping is affected by the reaction force generated when the gold wire breaks, the subsequent gold wire welding of the chip is affected, the whole chip gold wire welding fails, and the subsequent welding is affected by factors such as low efficiency, residual temperature of the previous group of welding, etc. when multi-layer chip welding is performed; the technical scheme includes that the three-dimensional traction device comprises a main frame body, a three-dimensional traction device, a clamping device and a welding and sealing device, wherein the three-dimensional traction device is arranged on the main frame body and is used for traction of the clamping device and movement of the welding and sealing device in a three-dimensional coordinate system, the clamping device is used for self-centering clamping of a chip, the welding and sealing device is used for carrying out gold wire welding treatment on the chip body and chip pins, two groups of welding and sealing mechanisms are arranged, and the two groups of welding and sealing mechanisms are symmetrically arranged with respect to the chip clamped by the clamping device.

The above patent also has some defects that the chip is inconvenient to take parts for packaging the chip when the chip is packaged, so that the packaging device for multi-layer stacked memory chips is required.

Disclosure of Invention

The utility model aims to provide packaging equipment for multi-layer stacked memory chips, which has the advantage of being convenient for taking parts for chip packaging, so as to solve the problems in the prior art.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the packaging equipment for the multi-layer stacked memory chips comprises a base, wherein a supporting component is arranged on one side of the top of the base;

the top of the supporting component is provided with a packaging shell;

the top of the base is provided with a supporting seat, and the top of the supporting seat is provided with a taking assembly;

a sliding mechanism is arranged at the top of the base and at one side far away from the taking assembly, and a dispensing machine is arranged on the surface of the sliding mechanism in a sliding manner;

and the dispensing end of the dispensing machine is positioned above the packaging shell.

Preferably, the cover body is installed at the top of base, supporting component, slide mechanism, point gum machine and take the subassembly and all be located the inside of cover body.

Preferably, an electrostatic fan is installed at the top of the cover body, and the exhaust end of the electrostatic fan is located above the inner cavity of the cover body.

Preferably, the front of the cover body is in an opening shape, a window is formed in one side, far away from the dispensing machine, of the cover body, and a plate body is arranged in the window.

Preferably, the support assembly comprises a support column, the support column is arranged at the top of the base, the top of the support column is provided with a fixing seat, and the top of the fixing seat is slidably embedded with a block.

Preferably, the standing grooves are formed in two sides of the top of the block body, and the packaging shell is embedded in the standing grooves in a sliding mode.

Preferably, a suction plate is embedded at the top of the block body, and the suction plate is positioned between the two groups of placing grooves.

Preferably, the sliding mechanism comprises a sliding rod, the sliding rod is inserted into the bottom of the dispenser in a sliding manner, fixing blocks are mounted at two ends of the sliding rod, and the bottom of the fixing blocks is connected with the top of the base.

Preferably, the component of taking includes the sleeve, the sucking disc is installed to telescopic bottom, the top of sucking disc extends to telescopic inside, the top intercommunication of sucking disc has the tubule, the top intercommunication of tubule has the gasbag, the casing is installed at the top of base, the sucking disc is located the inside of casing.

Preferably, the outside slip grafting of telescopic has the depression bar, the one end slip of depression bar extends to telescopic inside and installs the clamp plate, one side and telescopic surface laminating of clamp plate, one side intercommunication of gasbag has the check valve, the exhaust end slip of check valve extends to telescopic outside.

Compared with the prior art, the utility model has the beneficial effects that:

1. according to the utility model, the taking assembly is arranged, the block body can be taken out from the fixing seat by the suction force generated by the air bag and the sucker, meanwhile, the packaging shell can be adsorbed by controlling the sucker, and the parts for chip packaging can be conveniently transferred and operated by adsorption, so that the convenience degree is improved.

2. According to the utility model, the cover body is arranged for protecting the components, so that the external accidental interference is reduced, and the electrostatic fan is arranged for reducing the interference from static electricity when the chip is packaged.

3. According to the utility model, the window is arranged, so that the packaged chip still needs to wait for the drying of the plating layer, and can be continuously positioned in the placing groove, after the block body is taken out from the fixing seat, the block body is temporarily stored on the plate body, and after the plating layer is dried, the chip can be taken out.

Drawings

FIG. 1 is a schematic diagram of the structure of the present utility model;

FIG. 2 is a schematic front view of a support assembly according to the present utility model;

FIG. 3 is an exploded view of the support assembly of the present utility model;

fig. 4 is a schematic cross-sectional view of the sleeve of the present utility model.

In the figure: 1. a base; 2. a package housing; 3. a support base; 4. a dispensing machine; 5. a cover body; 6. an electrostatic blower; 7. a window; 8. a plate body; 9. a support post; 10. a fixing seat; 11. a block; 12. a placement groove; 13. a suction plate; 14. a slide bar; 15. a fixed block; 16. a sleeve; 17. a suction cup; 18. a tubule; 19. an air bag; 20. a housing; 21. a compression bar; 22. a pressing plate; 23. a one-way valve.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-4, the present utility model provides a technical solution: the packaging equipment for the multi-layer stacked memory chips comprises a base 1, wherein a supporting component is arranged on one side of the top of the base 1; the top of the supporting component is provided with a packaging shell 2; the support assembly comprises a support column 9, the support column 9 is arranged at the top of the base 1, a fixing seat 10 is arranged at the top of the support column 9, and a block 11 is embedded in the top of the fixing seat 10 in a sliding manner.

Both sides at the top of the block 11 are provided with placing grooves 12, and the packaging shell 2 is embedded in the placing grooves 12 in a sliding manner. By providing the placement groove 12 for placing and defining the package housing 2, the placement thereof is offset, improving stability.

Specifically, the interference from static electricity can be reduced when the chip is packaged. Through setting up window 7, the chip after the encapsulation is accomplished still needs to wait for the coating film to dry, can make it continue to be located standing groove 12, takes out the block 11 from fixing base 10 after, temporary storage on plate 8, can take out the chip after drying its coating film again.

The top of the base 1 is provided with a supporting seat 3, and the top of the supporting seat 3 is provided with a taking component; a sliding mechanism is arranged at the top of the base 1 and at one side far away from the taking assembly, and a dispensing machine 4 is arranged on the surface of the sliding mechanism in a sliding manner; the sliding mechanism comprises a sliding rod 14, the sliding rod 14 is connected to the bottom of the dispensing machine 4 in a sliding mode, fixed blocks 15 are mounted at two ends of the sliding rod 14, the bottom of each fixed block 15 is connected with the top of the base 1, and the dispensing machine 4 can move on the surface of the sliding rod 14 through the sliding mechanism. The dispensing end of the dispenser 4 is positioned above the package housing 2, thereby facilitating removal of the dispensing end of the dispenser 4 from above the package housing 2.

Further, the cover body 5 is installed at the top of base 1, and supporting component, slide mechanism, point gum machine 4 and take the subassembly and all be located the inside of cover body 5. Through setting up the cover body 5 for protect above-mentioned part, reduce external unexpected interference.

An electrostatic fan 6 is arranged at the top of the cover body 5, and the exhaust end of the electrostatic fan 6 is positioned above the inner cavity of the cover body 5. The front of the cover body 5 is in an opening shape, a window 7 is formed in one side, far away from the dispensing machine 4, of the cover body 5, and a plate body 8 is arranged in the window 7. By starting the electrostatic blower 6, the electrostatic blower 6 can eliminate static electricity, prevent the fan of static pollution and destruction, can produce a large amount of airflows with positive and negative charges, can neutralize the charges carried on the object, when the charges carried on the surface of the object are negative charges, the charges in the airflows can be attracted, and when the charges carried on the surface of the object are positive charges, the charges in the airflows can be attracted, so that the static electricity on the surface of the object can be neutralized, and the purpose of eliminating static electricity is achieved.

It is worth noting that the picking assembly comprises a sleeve 16, a sucking disc 17 is installed at the bottom of the sleeve 16, the top of the sucking disc 17 extends to the inside of the sleeve 16, a thin pipe 18 is communicated with the top of the sucking disc 17, an air bag 19 is communicated with the top of the thin pipe 18, a shell 20 is installed at the top of the base 1, and the sucking disc 17 is located inside the shell 20. The outside of sleeve 16 has the depression bar 21 in the slip grafting, and the one end of depression bar 21 slides and extends to the inside of sleeve 16 and install clamp plate 22, and one side of clamp plate 22 is laminated with the surface of sleeve 16, and one side intercommunication of gasbag 19 has check valve 23, and the exhaust end of check valve 23 slides and extends to the outside of sleeve 16. The top of the block 11 is embedded with a suction plate 13, and the suction plate 13 is positioned between the two groups of placing grooves 12.

After the encapsulation shell 2 is glued, through holding sleeve 16, push down clamp plate 22 through depression bar 21 afterwards, clamp plate 22 extrudees gasbag 19, and gasbag 19 receives the extrusion back, presses sucking disc 17 on suction plate 13, unclamp depression bar 21 afterwards, and the suction that gasbag 19 and sucking disc 17 produced can take out block 11 from fixing base 10 in, simultaneously through controlling sucking disc 17, also can adsorb encapsulation shell 2, can conveniently shift and operate the spare part that the chip encapsulation was used through the absorption, has improved convenient degree.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. Packaging equipment for multi-layer stacked memory chips, comprising a base (1), characterized in that: a supporting component is arranged on one side of the top of the base (1);

the top of the supporting component is provided with a packaging shell (2);

a supporting seat (3) is arranged at the top of the base (1), and a taking assembly is arranged at the top of the supporting seat (3);

a sliding mechanism is arranged at the top of the base (1) and at one side far away from the taking assembly, and a dispensing machine (4) is arranged on the surface of the sliding mechanism in a sliding manner;

the dispensing end of the dispensing machine (4) is positioned above the packaging shell (2).

2. The packaging apparatus for a multi-layered stacked memory chip of claim 1, wherein: the top of base (1) is installed and is covered body (5), supporting component, slide mechanism, point gum machine (4) and take the inside that the subassembly all is located cover body (5).

3. The packaging apparatus for a multi-layered stacked memory chip of claim 2, wherein: an electrostatic fan (6) is arranged at the top of the cover body (5), and the exhaust end of the electrostatic fan (6) is positioned above the inner cavity of the cover body (5).

4. A packaging apparatus for a multi-layered stacked memory chip as claimed in claim 3, wherein: the front of the cover body (5) is in an opening-shaped arrangement, a window (7) is formed in one side, far away from the dispensing machine (4), of the cover body (5), and a plate body (8) is mounted in the window (7).

5. The packaging apparatus for a multi-layered stacked memory chip of claim 1, wherein: the support assembly comprises a support column (9), the support column (9) is arranged at the top of the base (1), a fixing seat (10) is arranged at the top of the support column (9), and a block body (11) is embedded in the top of the fixing seat (10) in a sliding mode.

6. The packaging apparatus for a multi-layered stacked memory chip of claim 5, wherein: the two sides of the top of the block body (11) are provided with placing grooves (12), and the packaging shell (2) is embedded in the placing grooves (12) in a sliding mode.

7. The packaging apparatus for a multi-layered stacked memory chip of claim 6, wherein: the top of the block body (11) is embedded with a suction plate (13), and the suction plate (13) is positioned between the two groups of placing grooves (12).

8. The packaging apparatus for a multi-layered stacked memory chip of claim 1, wherein: the sliding mechanism comprises a sliding rod (14), the sliding rod (14) is connected to the bottom of the dispensing machine (4) in a sliding mode, fixing blocks (15) are arranged at two ends of the sliding rod (14), and the bottom of each fixing block (15) is connected with the top of the base (1).

9. The packaging apparatus for a multi-layered stacked memory chip of claim 1, wherein: the assembly of taking includes sleeve (16), sucking disc (17) are installed to the bottom of sleeve (16), inside that the top of sucking disc (17) extends to sleeve (16), the top intercommunication of sucking disc (17) has tubule (18), the top intercommunication of tubule (18) has gasbag (19), casing (20) are installed at the top of base (1), sucking disc (17) are located the inside of casing (20).

10. The packaging apparatus for a multi-layered stacked memory chip of claim 9, wherein: the outside slip grafting of sleeve (16) has depression bar (21), the one end slip of depression bar (21) extends to the inside of sleeve (16) and installs clamp plate (22), one side of clamp plate (22) is laminated with the surface of sleeve (16), one side intercommunication of gasbag (19) has check valve (23), the exhaust end slip of check valve (23) extends to the outside of sleeve (16).