CN220171939U - Multilayer chip type ceramic dielectric capacitor voltage processing device - Google Patents
Multilayer chip type ceramic dielectric capacitor voltage processing device Download PDFInfo
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- CN220171939U CN220171939U CN202321580250.8U CN202321580250U CN220171939U CN 220171939 U CN220171939 U CN 220171939U CN 202321580250 U CN202321580250 U CN 202321580250U CN 220171939 U CN220171939 U CN 220171939U
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- 238000012545 processing Methods 0.000 title claims abstract description 27
- 239000003990 capacitor Substances 0.000 title abstract description 10
- 239000000919 ceramic Substances 0.000 title abstract description 5
- 239000000523 sample Substances 0.000 claims abstract description 51
- 229910052802 copper Inorganic materials 0.000 claims abstract description 46
- 239000010949 copper Substances 0.000 claims abstract description 46
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 44
- 239000003985 ceramic capacitor Substances 0.000 claims abstract description 23
- 239000011159 matrix material Substances 0.000 claims abstract description 12
- 230000032683 aging Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 5
- 230000001681 protective effect Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000001514 detection method Methods 0.000 description 2
- 206010063385 Intellectualisation Diseases 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
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Abstract
The utility model discloses a voltage processing device of a multilayer chip ceramic capacitor, which comprises a bottom plate, wherein positioning rods are distributed on the bottom plate in a staggered manner, and a lower electrode lead-out plate, a product loading table, an upper electrode lead-in plate and a cover plate sequentially penetrate through the positioning rods to be pressed on the bottom plate and are fixed by fastening handles; the lower electrode lead-out plate is provided with electrode points in matrix arrangement, all the electrode points are led out to the electrode lead-out points after being connected in parallel, the upper electrode lead-in plate is provided with probe loading holes and copper pipe loading holes in parallel, and is respectively connected with an elastic probe and a copper pipe, a safety tube is inserted into the copper pipe again, and the spring probe is led out to the electrode lead-in points after being connected in series with the safety tube in parallel again. When the device is used for voltage treatment of the capacitor, the voltage treatment can be carried out on a plurality of products at one time, and the device can realize the voltage treatment of the multi-layer chip ceramic dielectric capacitor with various dimensions by adjusting the size of the loading hole on the product loading table, meanwhile, the products can be rapidly loaded, and the time and the space are effectively saved.
Description
Technical Field
The utility model belongs to the technical field of capacitor voltage processing devices, and particularly relates to a multilayer chip ceramic capacitor voltage processing device.
Background
The multi-layer ceramic capacitor is formed by overlapping dielectric films printed with inner electrodes in a staggered lamination mode and sealing upper electrodes at two ends, and has the characteristics of no polarity, high reliability, high precision, high integration, high frequency, intellectualization, low power consumption, large capacity, miniaturization, low cost and the like, and is widely applied to various electronic fields. In the voltage treatment process in the manufacturing process of the multi-layer chip ceramic capacitor, a certain direct current voltage is required to be applied to the capacitor at the upper limit class temperature of the product, and the capacitor is kept for a period of time, so that early unqualified products are removed. Because the multilayer chip ceramic capacitor is smaller in size, the production quantity of each batch is more, the product specification is various, the size difference of different products is larger, and a great amount of time is consumed in the voltage processing process.
The utility model discloses a batch ageing anchor clamps of condenser for CN207164085U, it is rational in infrastructure, the station is many, can realize batch operation, conveniently carry out contact situation test, including last anchor clamps and lower anchor clamps, lower anchor clamps include the anchor clamps lower plate, be equipped with at least one ageing board on the anchor clamps lower plate, the ageing station of having arranged on the ageing board, ageing station includes the component groove, the contact is including setting up the lower contact at the component groove bottom, go up the anchor clamps and include the anchor clamps upper plate, go up contact and lower contact cooperation centre gripping condenser, lower anchor clamps still include the lower PCB board of installing at anchor clamps lower extreme, be equipped with detection circuitry corresponding every ageing station on the lower PCB board, detection circuitry includes the protection resistance respectively, first test point and second test point, the second test point is parallel connection respectively, the condenser passes through the contact respectively and constitutes the return circuit with first test point and second test point and protection resistance. However, each product contacted by the clamp is independent, whether the product is damaged or not needs to be judged through measurement, and the clamp is not suitable for mass production.
Disclosure of Invention
In order to solve the above problems, the present utility model is directed to a voltage processing apparatus for a multilayered chip type porcelain capacitor,
in order to achieve the above purpose, the present utility model adopts the following technical scheme: the voltage processing device of the multilayer chip type ceramic capacitor comprises a bottom plate, wherein positioning rods are distributed on the bottom plate in a staggered manner, and a lower electrode lead-out plate, a product loading table, an upper electrode lead-in plate and a cover plate sequentially penetrate through the positioning rods to be pressed on the bottom plate and are fixed by fastening handles;
the lower electrode lead-out plate is provided with electrode points in matrix arrangement, all the electrode points are led out to the electrode lead-out points after being connected in parallel, the upper electrode lead-in plate is provided with probe loading holes and copper pipe loading holes in parallel, the upper electrode lead-in plate is respectively connected with an elastic probe and a copper pipe, the copper pipe is inserted with a safety tube again, and the spring probe is led out to the electrode lead-in points after being connected in series with the safety tube again in parallel.
The product loading platform comprises steps, loading holes are arranged at the bottoms of the steps in a matrix mode, and the positions and the number of the loading holes are in one-to-one correspondence with electrode points on the lower electrode lead-out plate.
The upper electrode lead-in plate is provided with probe loading holes in a matrix arrangement, and the number and the positions of the probe loading holes are in one-to-one correspondence with the electrode points; the number of the copper pipe loading holes is equal to twice of that of the probe loading holes, one probe loading hole is arranged between the two copper pipe loading holes, and the surfaces of the probe loading holes and the copper pipe loading holes are covered with copper.
The elastic probes are matched with the probe loading holes, one ends of the elastic probes are soldered on the probe loading holes, and the other ends of the elastic probes are arranged on the loading holes of the product loading table.
Copper tubes are arranged on the copper tube loading holes, each copper tube corresponds to the copper tube loading holes and is divided into two groups, and each group of copper tubes is connected with two pins of the safety tube.
The upper half part of the loading hole of the product loading table is in a horn hole shape, the safety tube and the corresponding loading hole are provided with serial number labels,
each probe loading hole on the upper electrode lead-in plate is respectively connected with one hole in a corresponding group of copper pipe loading holes in series, the other hole is used as an input point, and all the input points are led out to the electrode lead-in point after being connected in parallel.
A gasket is arranged below the upper electrode lead-in plate, after the upper electrode lead-in plate is pressed with the product loading table, a cavity is reserved by the gasket support, and a product cavity is reserved between the elastic probe end and the lower electrode lead-out plate.
The lower electrode lead-out plate, the product loading table, the upper electrode lead-in plate and the cover plate are respectively provided with a positioning hole a, a positioning hole b, a positioning hole c and a positioning hole d which correspond to the positioning rod, and the positioning rod sequentially passes through the positioning rod to be pressed;
the fastening handle penetrates through the through hole g on the cover plate, the through hole f of the upper electrode lead-in plate, the through hole d of the product loading table and the through hole b of the lower electrode lead-out plate, and is screwed into the threaded hole b of the bottom plate to fixedly connect the whole device.
The cover plate and the upper electrode lead-in plate are respectively provided with a threaded hole c and a through hole e, and pass through the fixed electrode lead-in plate and the cover plate to form a group through screws;
the product loading platform, the lower electrode lead-out plate and the bottom plate are respectively provided with a through hole c, a through hole a and a threaded hole a, and screws penetrate through the through holes c and the through holes a and are screwed into the threaded holes a to fix the product loading platform, the lower electrode lead-out plate and the bottom plate into a group.
Compared with the prior art, the utility model has the following advantages:
1. the product loading holes are arranged in a matrix, and the electrode input/output points of each product are connected in parallel to one point for leading out, so that voltage treatment can be performed on a plurality of products at one time, the working efficiency is improved, and the working time is saved.
2. The upper part of the product loading hole is in a horn mouth shape, step interception products are arranged around the product loading holes in matrix arrangement, a plurality of products are placed on the product loading plate when the products are loaded, and most of the products can be loaded into the product loading holes by left and right shaking, so that the time is saved, and the efficiency is effectively improved. Meanwhile, the product loading holes can be changed according to the size of the product, and the products with different sizes can be subjected to voltage treatment only by replacing the loading plate.
3. The device can meet the voltage processing treatment of various multilayer chip ceramic dielectric capacitors, each part adopts a vertical overlapping mode and is provided with a staggered positioning rod and a staggered positioning hole, the direction cannot be confused during assembly, and the whole device is easy to assemble and disassemble.
4. The protective tube is installed in a mode that pins are inserted into copper tubes, damaged protective tubes are easy to replace in use, meanwhile, the protective tubes are arranged in one-to-one correspondence with product loading holes, serial number labels are punched on each protective tube and the corresponding product loading holes, and therefore damaged products after voltage treatment are conveniently identified.
Drawings
In order to more clearly illustrate the technical solutions of specific embodiments of the present utility model, the drawings that are needed in the description of the embodiments will be briefly described below, and it is obvious that the drawings described below are only some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort to a person of ordinary skill in the art.
FIG. 1 is an exploded view of a voltage processing device for a multilayer chip ceramic capacitor according to the present utility model;
FIG. 2 is an isometric view of a voltage processing device for a multi-layer chip ceramic capacitor in accordance with the present utility model;
FIG. 3 is a front view of a voltage processing device for a multi-layered chip ceramic capacitor according to the present utility model;
FIG. 4 is a top view of a voltage processing apparatus for a multi-layered chip ceramic capacitor according to the present utility model;
in the figure, 1-a bottom plate; 2-positioning rods; 3-a threaded hole a; 4-a threaded hole b; 5-a lower electrode lead-out plate; 6-electrode points; 7-electrode lead-out points; 8-positioning holes a; 9-through hole a; 10-through holes b; 11-a product loading station; 12-steps; 13-loading holes; 14-a through hole c; 15-positioning holes b; 16-through hole d; 17-upper electrode lead-in plate; 18-probe loading holes; 19-copper pipe loading holes; 20-electrode introduction point; 21-positioning holes c; 22-through holes e; 23-through hole f; 24-a gasket; 25-elastic probes; 26-copper pipe; 27-cover plate; 28-positioning holes d; 29-a threaded hole c; 30-through holes g; 31-a protective tube; 32-fastening a handle.
Detailed Description
The present utility model will be further described with reference to the drawings and the specific embodiments, but it should not be construed that the scope of the subject matter of the present utility model is limited to the following embodiments, and various modifications, substitutions and alterations made according to the ordinary skill and familiar means of the art to which this utility model pertains are included within the scope of the present utility model without departing from the above technical idea of the utility model.
Referring to fig. 1-4, a voltage processing device for a multi-layer chip ceramic capacitor comprises a bottom plate 1, wherein positioning rods 2 are distributed on the bottom plate 1 in a staggered manner, positioning holes a8, b15, c21 and d28 corresponding to the positioning rods 2 are respectively formed in a lower electrode lead-out plate 5, a product loading table 11, an upper electrode lead-in plate 17 and a cover plate 27, and the positioning rods 2 sequentially penetrate through and are pressed; the fastening handle 32 passes through the through hole g30 on the cover plate (27), the through hole f23 of the upper electrode lead-in plate 17, the through hole d16 of the product loading table 11 and the through hole b10 of the lower electrode lead-out plate 5, and is screwed into the threaded hole b) of the bottom plate 1 to fixedly connect the whole device.
The lower electrode lead-out plate 5 is provided with electrode points 6 in matrix arrangement, all the electrode points 6 are led out to electrode lead-out points 7 after being connected in parallel, and the lower electrode lead-out plate 5 is made of a copper-clad plate, so that a circuit is easy to print; the product loading table 11 comprises steps 12, loading holes 13 are arranged at the bottoms of the steps 12 in a matrix, the loading holes 13 are round holes with horn-shaped upper half portions, and the product loading plate 11 is made of glass fiber plates and is corrosion-resistant, high-temperature-resistant and insulating. The positions and the number of the loading holes 13 are in one-to-one correspondence with the electrode points 6 on the lower electrode lead-out plate 5.
The product loading table 11, the lower electrode lead-out plate 5 and the bottom plate 1 are respectively provided with a through hole c14, a through hole a9 and a threaded hole a3 through the matching assembly of the positioning hole a8 on the lower electrode lead-out plate 5 and the positioning hole b10 on the product loading plate 11 and the positioning rod 2 on the bottom plate 1, and the product loading table 11, the lower electrode lead-out plate 5 and the bottom plate 1 are fixed into a group by screwing screws into the threaded hole a3 through the through holes c14 and the through holes a 9. When the device is used, a plurality of products are placed in the steps 12 of the product loading plate 11, and most of the products can be vertically dropped into the loading holes 13 by slightly shaking the device, so that quick loading is realized.
The upper electrode lead-in plate 17 is provided with probe loading holes 18 and copper pipe loading holes 19 which are respectively connected with an elastic probe 25 and a copper pipe 26, the copper pipe 26 is further inserted with a safety tube 31, the probe loading holes 18 are arranged in a matrix, and the number and the positions of the probe loading holes 18 are in one-to-one correspondence with the electrode points 6; the number of the copper pipe loading holes 19 is twice as large as that of the probe loading holes 18, one probe loading hole 18 is arranged between the two copper pipe loading holes 19, and the surfaces of the probe loading holes 18 and the copper pipe loading holes 19 are coated with copper.
An elastic probe 25 is matched on the probe loading hole 18, one end of the elastic probe 25 is soldered on the probe loading hole 18, and the other end of the elastic probe 25 is arranged on the loading hole 13 of the product loading table 11; copper tubes 26 are arranged on the copper tube loading holes 19, each copper tube 26 corresponds to the copper tube loading holes 19 and is divided into two groups, and each group of copper tubes 26 is connected with two pins of the safety tube 31. The cover plate 27 and the upper electrode lead-in plate 17 are respectively provided with a threaded hole c29 and a through hole e22, and a group of the cover plate 27 and the upper electrode lead-in plate 17 are penetrated through a fixed electrode through screw;
each probe loading hole 18 on the upper electrode lead-in plate 17 is respectively connected in series with one hole in a corresponding group of copper pipe loading holes 19, the other hole is used as an input point, and all the input points are led out to an electrode lead-in point 20 after being connected in parallel. The upper electrode lead-in plate 17 is made of copper-clad plate, and is easy to print a circuit. The safety tube 31 and its corresponding loading hole 13 are provided with a serial number label,
a gasket 24 is arranged below the upper electrode lead-in plate 17, after the upper electrode lead-in plate 17 is pressed with the product loading table 11, a cavity 33 is supported and reserved by the gasket 24, and a product cavity 34 is reserved between the end of the elastic probe 25 and the lower electrode lead-out plate 5.
The operation process comprises the following steps: after the loading holes 13 on the product loading table 11 are filled with products, the upper electrode lead-out plate 17 and the cover plate 27 are assembled on the product loading table 11 by the cooperation of the positioning rod 2 with the positioning holes c21 and d28, and the whole device is fixedly connected by the fastening handle 32. At this time, the electrode points 6, the loading holes 13, the elastic probes 25 and the safety tubes 31 on the lower electrode lead-out plate 5 are in one-to-one correspondence, and the product cavity 33 is reserved for just storing products, and two electrodes of the products are respectively contacted with the electrode points 6 and the elastic probes 25. The voltage processing operation of the ceramic capacitor can be started by applying a specified voltage to both ends of the electrode lead-in point 7 and the electrode lead-in point 20, namely, the same voltage is applied to each product in the loading hole 13, and the cavity 34 generated by the gasket 24 is used for ventilation, so that each product is heated uniformly. Each safety tube 31 is numbered with the corresponding loading hole 13, and after the voltage treatment process is finished, damaged products in the voltage treatment process are rapidly removed through the damage of the safety tube 31. The loading holes 13 on the product loading table can be designed to be in a size according to the size of the product, each designed product corresponds to one product loading table 13, and voltage processing is carried out on the ceramic dielectric capacitors in various sizes by replacing the loading plate.
The voltage processing device of the multilayer chip ceramic capacitor provided by the utility model is described in detail, and specific examples are applied to illustrate the structure and the working principle of the utility model, and the description of the above embodiments is only used for helping to understand the method and the core idea of the utility model. It should be noted that it will be apparent to those skilled in the art that various improvements and modifications can be made to the present utility model without departing from the principles of the utility model, and such improvements and modifications fall within the scope of the appended claims.
Claims (10)
1. A voltage processing device of a multilayer chip ceramic capacitor is characterized in that: the device comprises a bottom plate (1), wherein positioning rods (2) are distributed on the bottom plate (1) in a staggered manner, and a lower electrode lead-out plate (5), a product loading table (11), an upper electrode lead-in plate (17) and a cover plate (27) sequentially penetrate through the positioning rods (2) to be pressed on the bottom plate (1) and are fixed by fastening handles (32);
electrode points (6) are arranged on the lower electrode lead-out plate (5) in a matrix, all the electrode points (6) are led out to electrode lead-out points (7) after being connected in parallel, probe loading holes (18) and copper pipe loading holes (19) are arranged on the upper electrode lead-in plate (17), elastic probes (25) and copper pipes (26) are respectively connected, a safety tube (31) is inserted into the copper pipes (26), and the spring probes (25) are led out to electrode lead-in points (20) after being connected in series with the safety tube (31) in parallel after being connected in a centralized mode.
2. The voltage processing device for a multilayer chip ceramic capacitor according to claim 1, wherein: the product loading table (11) comprises steps (12), loading holes (13) are arranged at the bottoms of the steps (12) in a matrix, and the positions and the number of the loading holes (13) are in one-to-one correspondence with electrode points (6) on the lower electrode lead-out plate (5).
3. The voltage processing device for a multilayer chip ceramic capacitor according to claim 1, wherein: the upper electrode lead-in plate (17) is provided with probe loading holes (18) in a matrix array, and the number and the positions of the probe loading holes (18) are in one-to-one correspondence with the electrode points (6); every two copper pipe loading holes (19) are in a group, the number of the copper pipe loading holes is equal to twice of that of the probe loading holes (18), one probe loading hole (18) is arranged between the two copper pipe loading holes (19), and the surfaces of the probe loading holes (18) and the copper pipe loading holes (19) are coated with copper.
4. The voltage processing device for a multilayer chip ceramic capacitor according to claim 1, wherein: elastic probes (25) are matched on the probe loading holes (18), one ends of the elastic probes (25) are soldered on the probe loading holes (18), and the other ends of the elastic probes are arranged on the loading holes (13) of the product loading table (11).
5. The voltage processing device for a multilayer chip ceramic capacitor according to claim 1, wherein: copper tubes (26) are arranged on the copper tube loading holes (19), each copper tube (26) corresponds to the copper tube loading holes (19) and is divided into two groups, and each group of copper tubes (26) is connected with two pins of the safety tube (31).
6. The voltage processing device for a multilayer chip ceramic capacitor according to claim 1, wherein: the upper half part of the loading hole (13) of the product loading table (11) is in a horn hole shape, and the safety tube (31) and the corresponding loading hole (13) are provided with serial number labels.
7. The voltage processing device for a multilayer chip ceramic capacitor according to claim 1, wherein: each probe loading hole (18) on the upper electrode lead-in plate (17) is respectively connected with one hole in a corresponding group of copper pipe loading holes (19) in series, the other hole is used as an input point, and all the input points are led out to an electrode lead-in point (20) after being connected in parallel.
8. The voltage processing device for a multilayer chip ceramic capacitor according to claim 1, wherein: a gasket (24) is arranged below the upper electrode lead-in plate (17), after the upper electrode lead-in plate (17) is pressed with the product loading table (11), a cavity (33) is reserved by the gasket (24), and a product cavity (34) is reserved between the end head of the elastic probe (25) and the lower electrode lead-out plate (5).
9. The voltage processing device for a multilayer chip ceramic capacitor according to claim 1, wherein: the lower electrode lead-out plate (5), the product loading table (11), the upper electrode lead-in plate (17) and the cover plate (27) are respectively provided with a positioning hole a (8), a positioning hole b (15), a positioning hole c (21) and a positioning hole d (28) which correspond to the positioning rod (2), and the positioning rod (2) sequentially passes through for pressing;
the fastening handle (32) penetrates through a through hole g (30) on the cover plate (27), a through hole f (23) of the upper electrode lead-in plate (17), a through hole d (16) of the product loading table (11) and a through hole b (10) of the lower electrode lead-out plate (5), and is screwed into a threaded hole b (4) of the bottom plate (1) to fixedly connect the whole device.
10. The voltage processing device for a multilayer chip ceramic capacitor according to claim 1, wherein: the cover plate (27) and the upper electrode lead-in plate (17) are respectively provided with a threaded hole c (29) and a through hole e (22), and the cover plate (27) and the cover plate (17) are fixed by screws in a group;
the product loading table (11), the lower electrode lead-out plate (5) and the bottom plate (1) are respectively provided with a through hole c (14), a through hole a (9) and a threaded hole a (3), and screws penetrate through the through hole c (14) and the through hole a (9) and are screwed into the threaded hole a (3) to fix the product loading table (11), the lower electrode lead-out plate (5) and the bottom plate (1) into a group.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321580250.8U CN220171939U (en) | 2023-06-20 | 2023-06-20 | Multilayer chip type ceramic dielectric capacitor voltage processing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321580250.8U CN220171939U (en) | 2023-06-20 | 2023-06-20 | Multilayer chip type ceramic dielectric capacitor voltage processing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220171939U true CN220171939U (en) | 2023-12-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321580250.8U Active CN220171939U (en) | 2023-06-20 | 2023-06-20 | Multilayer chip type ceramic dielectric capacitor voltage processing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220171939U (en) |
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2023
- 2023-06-20 CN CN202321580250.8U patent/CN220171939U/en active Active
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