CN220139268U - Charging management chip - Google Patents

Abstract

The utility model relates to the technical field of chips and discloses a charging management chip which comprises a chip body and connecting pins, wherein the connecting pins are symmetrically arranged on two sides of the chip body, a release preventing mechanism is movably arranged on the connecting pins and comprises a pressing frame, a pressing rod and a rubber insulating column, the pressing frame is of a -shaped structure, the pressing frame is pressed on the surface of the connecting pins, the pressing rods are integrally formed on the side walls of the pressing frame, the pressing rods are equidistantly arranged on the side walls of the pressing frame, and the pressing rods are of right-angle structures. This charge management chip presses frame both ends to run through circuit board chamber wall to fix through soldering tin, press the spacing draw-in groove card on frame surface on the connection stitch, can carry the installation accuracy of frame that presses, press the depression bar tip of frame lateral wall to pass through rubber insulation post butt at the connection stitch surface, can play spacing effect to the connection stitch through the depression bar, can avoid the connection stitch to take place to take off the welding phenomenon, can promote the stability to the installation of chip body.

Description

Charging management chip

Technical Field

The utility model relates to the technical field of chips, in particular to a charging management chip.

Background

The power management chip is a chip which plays roles in converting, distributing and detecting electric energy and managing other electric energy in the electronic equipment system, and is mainly responsible for identifying the power supply amplitude of the CPU, generating corresponding short moment waves and pushing the rear-stage circuit to output power. Common power management chips are LMG3410R050, UCC12050, BQ25790, HIP6301, IS6537, RT9237, ADP3168, KA7500, TL494, etc.

According to the disclosure of the patent network (the grant publication number is CN 113270920A), the utility model discloses a power supply charging management chip which comprises an RC electronic oscillator, a crystal oscillator, a spread spectrum phase-locked loop clock, a second power converter, a first power converter, a third power converter, a CPU, an I2C slave device, a first high-broadband bus bridge, a power supply management unit, a first full-bridge boosting circuit, a second full-bridge boosting circuit, a third full-bridge boosting circuit, a first bus, a static random access memory, a vector interrupt controller, CPUROM & SPIFsh, a second high-speed bus bridge, a second bus, a first I2C interface, a timer, a serial port, a single/multiple programming memory, a low-speed ADC, an amplitude offset adjustment DDM, a pulse modulation/frequency offset adjustment module, a second I2C interface, a power supply management module, a CC physical layer port of a C-type USB interface, a first USBDPHY, a C-type USB port, a A-type USB port and a second USBDPHY. The utility model integrates the control parts of TypeCPD3.0, typeABC1.2 and Qia1.2.4 together.

With respect to the above description, the applicant believes that the following problems exist:

in the use process, the charging management chip is welded through the connecting pins, when working in a vibration environment, vibration is transmitted to the circuit board, and the joint of the connecting pins and the circuit board is easy to be subjected to a desoldering phenomenon in the vibration process, so that the virtual connection of the power management chip is caused, and the charging management chip is needed to be changed into the charging management chip to solve the problems.

Disclosure of Invention

The present utility model is directed to a charging management chip, which solves the above-mentioned problems in the prior art.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the charging management chip comprises a chip body and connecting pins, wherein the connecting pins are symmetrically arranged on two sides of the chip body;

the movable anti-disengaging mechanism that is equipped with on the connection stitch, anti-disengaging mechanism is including pressing frame, depression bar and rubber insulation post, it is font structure to press the frame, press the frame to press at the connection stitch surface, press frame lateral wall integrated into one piece to have the depression bar, the depression bar equidistance is arranged and is pressing the frame lateral wall, and the depression bar is right angle structure, depression bar one end is connected with the rubber insulation post, rubber insulation post tip butt is on the connection stitch surface.

Preferably, a limiting clamping groove is formed in the position, corresponding to the position of the connecting pin, of the lower surface of the pressing frame, and the limiting clamping groove is clamped with the connecting pin.

Preferably, the upper surface of the chip body is movably provided with a heat dissipation mechanism, the heat dissipation mechanism comprises a heat dissipation fin and a heat dissipation fin, and the heat dissipation fin is attached to the upper surface of the chip body.

Preferably, the radiating fins are integrally formed on the surface of the radiating fin.

Preferably, the surface of the chip body is coated with heat dissipation silicone grease, and the heat dissipation silicone grease is used for connecting the chip body and the radiating fins.

Preferably, the two sides of the radiating fin are symmetrically provided with rotary connecting belts, and the rotary connecting belts are provided with positioning pins.

Preferably, positioning holes are symmetrically formed in the surfaces of two sides of the chip body, and the positioning pins are mutually inserted into the positioning holes.

Compared with the prior art, the utility model provides a charging management chip, which has the following beneficial effects:

1. this charge management chip presses frame both ends to run through circuit board chamber wall to fix through soldering tin, press the spacing draw-in groove card on frame surface on the connection stitch, can carry the installation accuracy of frame that presses, press the depression bar tip of frame lateral wall to pass through rubber insulation post butt at the connection stitch surface, can play spacing effect to the connection stitch through the depression bar, can avoid the connection stitch to take place to take off the welding phenomenon, can promote the stability to the installation of chip body.

2. This charge management chip, fin laminating is at chip body surface, and heat dissipation silicone grease has stronger thermal conductivity, can with the chip body on the heat transfer that the during operation produced the fin, can realize the quick heat dissipation to the chip body through fin and fin mutually supporting, promotes the stability of chip body operation.

Drawings

For a clearer description of the technical solutions of the embodiments of the present utility model, the drawings that are needed in the description of the embodiments will be briefly described below, it will be apparent that the drawings in the description below are only some embodiments of the present utility model, and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art:

FIG. 1 is a schematic view of the appearance structure of the present utility model;

FIG. 2 is a schematic diagram of a chip body according to the present utility model;

FIG. 3 is a schematic diagram of a heat sink mounting structure according to the present utility model;

fig. 4 is a schematic view of a press frame structure according to the present utility model.

In the figure: 1. a chip body; 2. a connection pin; 3. pressing a frame; 4. a compression bar; 5. a rubber insulating column; 6. a limit clamping groove; 7. a heat sink; 8. a heat radiation fin; 9. rotating the connecting belt; 10. a positioning pin; 11. positioning holes; 12. heat dissipation silicone grease.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

Embodiment one:

referring to fig. 1-4, the present utility model provides a technical solution: the charging management chip comprises a chip body 1 and connecting pins 2, wherein the connecting pins 2 are symmetrically arranged on two sides of the chip body 1;

the utility model discloses a chip, including connecting stitch 2, connecting stitch 2 is gone up the activity and is equipped with the anti-disengaging mechanism, the anti-disengaging mechanism includes presses frame 3, depression bar 4 and rubber insulation post 5, press frame 3 to be font structure, press frame 3 to press at connecting stitch 2 surface, press frame 3 lateral wall integrated into one piece has depression bar 4, depression bar 4 equidistance is arranged at press frame 3 lateral wall, and depression bar 4 is right angle structure, depression bar 4 one end is connected with rubber insulation post 5, rubber insulation post 5 tip butt is on connecting stitch 2 surface, and chip body 1 both sides pass through connecting stitch 2 welding on the circuit board, press frame 3 with font to press on connecting stitch 2, press frame 3 both ends run through circuit board chamber wall to fix through soldering tin, press frame 3 lateral wall's depression bar 4 tip can play spacing effect through rubber insulation post 5 butt at connecting stitch 2 surface through depression bar 4, can avoid connecting stitch 2 to take place the effect of disengaging phenomenon, can promote the stability to chip body 1 installation, rubber insulation post 5 has the insulating property, can avoid connecting stitch 2 on electric current to pass through depression bar 4 to pass through other on.

Further, the lower surface of the pressing frame 3 is provided with a limiting clamping groove 6 at the position corresponding to the position of the connecting pin 2, the limiting clamping groove 6 is clamped with the connecting pin 2, and the limiting clamping groove 6 on the surface of the pressing frame 3 is clamped on the connecting pin 2, so that the installation accuracy of the pressing frame 3 can be improved.

Embodiment two:

please refer to fig. 3, and further obtain in combination with the first embodiment, preferably, the upper surface of the chip body 1 is movably provided with a heat dissipation mechanism, the heat dissipation mechanism includes a heat dissipation fin 7 and a heat dissipation fin 8, the heat dissipation fin 7 is attached to the upper surface of the chip body 1, the heat dissipation fin 8 is integrally formed on the surface of the heat dissipation fin 7, and the heat dissipation of the chip body 1 can be achieved through the mutual cooperation of the heat dissipation fin 7 and the heat dissipation fin 8, so that the running stability of the chip body 1 is improved.

Further, the surface of the chip body 1 is coated with heat dissipation silicone grease 12, the heat dissipation silicone grease 12 is used for connecting the chip body 1 and the heat dissipation fins 7, and the heat dissipation silicone grease 12 has strong heat conductivity and can transfer heat generated by the chip body 1 during working to the heat dissipation fins 7.

Further, the two sides of the radiating fin 7 are symmetrically provided with the rotary connecting bands 9, the rotary connecting bands 9 are provided with the positioning pins 10, the two side surfaces of the chip body 1 are symmetrically provided with the positioning holes 11, the positioning pins 10 are mutually inserted into the positioning holes 11, the end parts of the rotary connecting bands 9 are mutually inserted into the positioning holes 11 through the positioning pins 10, the radiating fin 7 can be fixed, and the quick disassembly of the radiating mechanism can be realized after the positioning pins 10 are separated from the positioning holes 11.

In actual operation, when this device was used, the chip body 1 both sides pass through the connection pin 2 welding on the circuit board, press the pressure frame 3 of font on connection pin 2, pressure frame 3 both ends run through circuit board chamber wall, and fix through soldering tin, spacing draw-in groove 6 card on pressure frame 3 surface is on connection pin 2, the installation accuracy of pressure frame 3 can be promoted, the depression bar 4 tip of pressure frame 3 lateral wall passes through rubber insulation post 5 butt at connection pin 2 surface, can play spacing effect to connection pin 2 through depression bar 4, can avoid connection pin 2 to take place the desoldering phenomenon, can promote the stability of installing chip body 1, rubber insulation post 5 has the insulating nature, can avoid the electric current on the connection pin 2 to pass through depression bar 4 and transmit other pins, heat dissipation silicone grease 12 is smeared on chip body 1 surface, the fin 7 laminating is on chip body 1 surface, heat dissipation grease 12 has stronger thermal conductivity, can be with chip body 1 in during operation produced heat transfer to fin 7, can realize promoting chip body 1's surface through fin 7 and the fin 8 butt joint each other, can realize the quick-lift chip 1's 1 surface, can be carried out the locating pin 10 and the locating pin is fixed to the locating pin 10 through the rotatory, can be dismantled the locating pin 11, the locating pin is fixed to the locating pin is fast with the position.

It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises an element.

Claims (7)

1. The utility model provides a charge management chip, includes chip body (1) and connection pin (2), its characterized in that: the connecting pins (2) are symmetrically arranged at two sides of the chip body (1);

the utility model discloses a rubber insulation column, including connecting stitch (2), the activity is equipped with the anticreep mechanism on connecting stitch (2), the anticreep mechanism is including pressing frame (3), depression bar (4) and rubber insulation column (5), it is font structure to press frame (3), press frame (3) to press on connecting stitch (2) surface, press frame (3) lateral wall integrated into one piece to have depression bar (4), depression bar (4) equidistance is arranged in pressing frame (3) lateral wall, and depression bar (4) are right angle structure, depression bar (4) one end is connected with rubber insulation column (5), rubber insulation column (5) tip butt is on connecting stitch (2) surface.

2. The charge management chip of claim 1, wherein: and a limiting clamping groove (6) is formed in the position, corresponding to the position of the connecting pin (2), of the lower surface of the pressing frame (3), and the limiting clamping groove (6) is clamped with the connecting pin (2).

3. The charge management chip of claim 1, wherein: the chip comprises a chip body (1), wherein a heat dissipation mechanism is movably arranged on the upper surface of the chip body (1), the heat dissipation mechanism comprises heat dissipation fins (7) and heat dissipation fins (8), and the heat dissipation fins (7) are attached to the upper surface of the chip body (1).

4. A charge management chip according to claim 3, wherein: and the surface of the radiating fin (7) is integrally formed with radiating fins (8).

5. The charge management chip of claim 4, wherein: the surface of the chip body (1) is coated with heat dissipation silicone grease (12), and the heat dissipation silicone grease (12) is used for connecting the chip body (1) and the radiating fins (7).

6. The charge management chip of claim 4, wherein: the cooling fin (7) both sides symmetry is equipped with swivelling joint area (9), be equipped with locating pin (10) on swivelling joint area (9).

7. The charge management chip of claim 6, wherein: positioning holes (11) are symmetrically formed in the surfaces of two sides of the chip body (1), and the positioning pins (10) are mutually inserted into the positioning holes (11).