CN220137317U - Aging test device - Google Patents

Abstract

The disclosure provides an aging test device, and relates to the technical field of aging test. The aging test device comprises a radiator, a bearing piece and a pressing piece. The radiator and the pressing piece are respectively connected with the bearing piece. The bearing piece is used for bearing the circuit board to be tested, and the pressing piece is used for limiting the circuit board to be tested to be separated from the bearing piece in a mode of pressing the circuit board to be tested. The radiator is arranged near the bearing position of the circuit board on the bearing piece. The aging test device provided by the disclosure not only can radiate heat of the circuit board to be tested so that the working time of the circuit board to be tested meets the requirement, but also can fix the circuit board to be tested in a compacting manner so as to realize quick assembly and disassembly of the circuit board to be tested.

Description

Aging test device

Technical Field

The disclosure relates to the technical field of burn-in testing, and in particular relates to a burn-in testing device.

Background

In electronic devices such as a laser camera and a robot, a circuit board having electronic devices such as an integrated processor and a resistor is provided therein, and before the circuit board is mounted on the electronic device, it is necessary to perform tests such as a power-on test and a burn-in test. The burn-in test refers to that the circuit board works in a test environment with variable temperature for a certain period of time, the power consumption of the circuit board changes during the period, if the circuit board can work normally, the performance of the circuit board meets the requirement, otherwise, the circuit board is opposite.

In the related art, wiring and power-on testing are performed on a circuit board to be tested manually. However, during the burn-in test, the temperature of the circuit board gradually increases, which may cause the circuit board to fail to operate normally and/or the operation time of the circuit board is less than the required time, and the burn-in test cannot be completed.

Therefore, how to ensure that the circuit board is burn-in tested is a critical issue.

Disclosure of Invention

The utility model provides a burn-in test device, this burn-in test device dispels the heat and fixes the circuit board of waiting to test through the mode that compresses tightly through the radiator to the circuit board of waiting to test, thereby not only can realize the burn-in test of circuit board of waiting to test, but also can improve the speed that centre gripping or loosen the circuit board of waiting to test thereby improve efficiency of software testing.

In order to achieve the above object, the present disclosure provides the following technical solutions:

the disclosure provides an aging test device, which comprises a radiator, a bearing piece and a pressing piece; the radiator and the pressing piece are respectively connected with the bearing piece; the pressing piece is used for limiting the circuit board to be tested to be separated from the bearing piece in a mode of pressing the circuit board to be tested; the radiator is arranged close to a bearing position of the circuit board on the bearing piece.

In one possible implementation manner of the aging test apparatus, the pressing member includes a pressing structure movably connected to the carrier member and a locking structure connected between the pressing structure and the carrier member; the pressing structure approaches to or moves away from the circuit board bearing position in a manner of moving relative to the bearing piece; the locking structure is configured to limit movement of the hold-down structure away from the circuit board to be tested when the hold-down structure is pressed against the circuit board to be tested.

In a possible implementation manner of the burn-in device, the first end of the pressing structure is hinged with the bearing piece, and the locking structure comprises a locking handle and a locking rod; the first end of the locking handle is hinged with the second end of the pressing structure, the second end of the locking handle is hinged with one end of the locking rod piece, and the other end of the locking rod piece is hinged with the bearing piece; the bearing piece is parallel to the hinge centers of the pressing structure and the locking rod piece and the hinge center line of the locking handle, the pressing structure and the locking rod piece.

In one possible implementation manner of the above burn-in testing apparatus, when the pressing structure presses against the circuit board to be tested, the heat sink and the pressing structure are located on opposite sides of the heat sink respectively along a first direction, and a projection of the heat sink overlaps with a projection portion of the pressing structure.

In a possible implementation manner of the burn-in apparatus, the carrier includes a bottom plate portion and two bracket portions; the two bracket parts are arranged on the same side of the bottom plate part and are arranged at intervals along a second direction, a positioning structure is arranged between each bracket part and the circuit board to be tested, and the positioning structure is used for positioning the relative positions of the bracket parts and the circuit board to be tested in the second direction and the third direction; wherein the first direction, the second direction and the third direction are perpendicular to each other; the bottom plate part is provided with the circuit board bearing position, and the radiator and the pressing piece are respectively connected with the bottom plate part.

In one possible implementation manner of the burn-in testing device, the positioning structure includes a positioning notch disposed on the support portion, and the positioning notch is used for accommodating a portion of the circuit board to be tested.

In a possible implementation manner of the above burn-in device, each of the stand portions includes a horizontal section and at least two vertical sections; the horizontal section is fixedly connected to the surface of the bottom plate part; the at least two vertical sections are positioned on the same side of the horizontal section and are arranged at intervals along the third direction, one end of each vertical section is connected with the horizontal section, and the other end of each vertical section comprises the positioning notch.

In one possible implementation manner of the burn-in apparatus, when the circuit board to be tested is placed on the carrier, the heat sink is disposed facing the processor of the circuit board to be tested along the first direction, and the projection of the heat sink covers the projection of the processor of the circuit board to be tested.

In a possible implementation manner of the burn-in apparatus, the burn-in apparatus further includes a fan connected to the carrier and configured to blow air toward the heat sink when testing the circuit board to be tested.

In one possible implementation manner of the burn-in device, the heat spreader includes a plurality of strip-shaped grooves extending along a third direction and penetrating the heat spreader; along the third direction, the fan and the radiator are arranged side by side, and the air supply direction of the fan is parallel to the third direction.

In one possible implementation manner of the burn-in apparatus, the burn-in apparatus further includes a power supply member for supplying power to or disconnecting power from at least one of the fan or the circuit board to be tested.

The aging test device comprises a radiator, a bearing piece and a pressing piece. The radiator and the pressing piece are respectively connected with the bearing piece. The bearing piece is used for bearing the circuit board to be tested, and the pressing piece is used for limiting the circuit board to be tested to be separated from the bearing piece in a mode of pressing the circuit board to be tested. The radiator is arranged near the bearing position of the circuit board on the bearing piece. In the aging test process of the circuit board to be tested, the heat radiator can improve the heat exchange area of the circuit board to be tested and air, so that the heat radiation capacity of the circuit board to be tested is improved, and the working time of the circuit board to be tested can be ensured to meet the time requirement of the aging test. In addition, the compressing piece is used for fixing the circuit board to be tested on the bearing piece in a compressing mode, so that the circuit board to be tested can be prevented from shaking in the testing process, and the speed of loading or unloading the circuit board to be tested by the aging testing device can be improved, and the testing efficiency is improved.

Drawings

In order to more clearly illustrate the embodiments of the present disclosure or the solutions in the prior art, a brief description will be given below of the drawings that are needed in the embodiments or the description of the prior art, it being obvious that the drawings in the following description are some embodiments of the present disclosure, and that other drawings may be obtained from these drawings without inventive effort to a person of ordinary skill in the art.

Fig. 1 is a schematic perspective view of an aging test apparatus according to an embodiment of the present disclosure;

FIG. 2 is a left side view of the burn-in apparatus of FIG. 1;

FIG. 3 is a schematic view of another compression member different from the compression member of FIG. 1 provided in accordance with an embodiment of the present disclosure;

FIG. 4 is a left side view of the burn-in apparatus of FIG. 1;

FIG. 5 is a schematic view of yet another compression member different from the compression member of FIG. 1 provided by an embodiment of the present disclosure;

FIG. 6 is a schematic perspective view of the carrier of FIG. 1;

FIG. 7 is a front view of the burn-in apparatus of FIG. 1;

fig. 8 is a schematic perspective view of the heat sink of fig. 1.

Reference numerals illustrate:

100. a pressing member;

110. a compacting structure; 111. compressing the device; 1111. a flexible member; 1112. a pressing rod piece; 112. compressing the connecting piece; 113. a moving part; 114. a pressing part;

120. a locking structure; 121. a locking handle; 122. a locking rod piece; 123. a locking spring; 124. a locking shaft;

130. a connecting seat member;

200. a carrier; 210. a bottom plate portion; 220. a bracket part; 221. a horizontal section; 222. a vertical section; 230. a positioning structure;

300. a heat sink; 310. a body portion; 320. a plate-like portion; 330. a strip-shaped groove;

400. a fan;

500. a power supply member;

600. a circuit board; 610. a processor.

Detailed Description

In the related art, a circuit board to be tested is manually wired and placed in a test environment with variable temperature, and then is electrified for testing, so that the power consumption of the circuit board to be tested can be changed during the period of power supply, and different working modes of the circuit board to be tested are realized. However, during the burn-in test, the temperature of the circuit board to be tested gradually increases, which may cause the circuit board to fail to operate normally and/or the operation time of the circuit board is less than the required time, and the burn-in test cannot be completed. Therefore, how to ensure that the circuit board is burn-in tested is a critical issue.

In view of this, the embodiment of the disclosure provides a burn-in testing apparatus, which includes a heat sink 300, a carrier 200 and a pressing member 100. In the testing process, the heat spreader 300 is used to increase the heat exchange area between the circuit board 600 to be tested and air, so as to increase the heat dissipation capability of the circuit board 600 to be tested, and further ensure that the working time of the circuit board 600 to be tested meets the time requirement of the burn-in test. In addition, the pressing member 100 fixes the circuit board 600 to be tested on the carrier 200 in a pressing manner, so that the circuit board 600 to be tested can be prevented from shaking in the testing process, and the speed of loading or unloading the circuit board 600 to be tested by the burn-in testing device can be improved, thereby improving the testing efficiency.

The burn-in test apparatus according to the embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

Fig. 1 is a schematic perspective view of an aging test apparatus according to an embodiment of the disclosure. As shown in fig. 1, the burn-in test apparatus provided in the embodiment of the present disclosure includes a heat sink 300, a carrier 200, and a pressing member 100. Wherein the heat sink 300 and the compressing member 100 are respectively connected to the carrier 200. The carrier 200 is used for carrying the circuit board 600 to be tested, and the pressing member 100 is used for limiting the circuit board 600 to be tested from being separated from the carrier 200 by pressing the circuit board 600 to be tested. The heat sink 300 is disposed proximate to a circuit board carrying location on the carrier 200.

In the disclosed embodiment, the circuit board bearing position refers to an area where the carrier 200 contacts the circuit board 600 to be tested.

In the disclosed embodiment, the placement of the heat sink 300 near the circuit board bearing location on the carrier 200 means that the heat sink 300 is placed near the location where the carrier 200 contacts the circuit board 600 to be tested.

In the embodiment of the present disclosure, the carrier 200 plays a supporting role, in other words, the carrier 200 corresponds to a supporting table for supporting the circuit board 600 to be tested.

In the embodiment of the present disclosure, limiting the circuit board 600 to be tested from being separated from the carrier 200 by the pressing member 100 means that the pressing member 100 applies a pressing force to the circuit board 600 to be tested such that the circuit board 600 to be tested is respectively abutted with the carrier 200 and the pressing member 100, whereby the circuit board 600 to be tested is firmly fixed.

In order to meet the requirements of burn-in testing, it is necessary to place the burn-in testing apparatus in a test environment with a variable temperature, such as an incubator, so that the ambient temperature in which the circuit board 600 to be tested is located can be changed during the test.

When the burn-in test device provided by the embodiment of the disclosure performs the burn-in test on the circuit board 600 to be tested in the test environment with variable temperature, the heat radiator 300 can increase the heat exchange area between the circuit board 600 to be tested and air, so as to increase the heat dissipation capacity of the circuit board 600 to be tested, and further ensure that the working time of the circuit board 600 to be tested meets the time requirement of the burn-in test. In addition, the pressing member 100 fixes the circuit board 600 to be tested on the carrier 200 in a pressing manner, so that the circuit board 600 to be tested can be prevented from shaking in the testing process, and the speed of loading or unloading the circuit board 600 to be tested by the burn-in testing device can be improved, thereby improving the testing efficiency.

Fig. 2 is a left side view of the burn-in test apparatus of fig. 1. Referring to fig. 2, in the embodiment of the present disclosure, the pressing member 100 includes a pressing structure 110 and a locking structure 120. The pressing structure 110 is movably connected with the carrier 200, and the locking structure 120 is connected between the pressing structure 110 and the carrier 200. The hold down structure 110 moves toward and away from the circuit board carrying position by moving relative to the carrier 200. The locking structure 120 is configured to limit movement of the hold-down structure 110 away from the circuit board 600 to be tested when the hold-down structure 110 is pressed against the circuit board 600 to be tested.

The pressing structure 110 presses against the circuit board 600 to be tested means that the pressing structure 110 is abutted against the circuit board 600 to be tested, so that the pressing structure 110 applies a pressing force acting on the circuit board 600 to be tested, and the circuit board 600 to be tested is fixed at the circuit board bearing position.

When the pressing structure 110 presses against the circuit board 600 to be tested, the locking structure 120 limits the pressing structure 110 to move away from the circuit board 600 to be tested, so that the pressing structure 110 always presses against the circuit board 600 to be tested, so as to prevent the circuit board 600 to be tested from shaking.

In the embodiment of the disclosure, when the pressing structure 110 approaches the circuit board bearing position relative to the bearing member 200, the gap between the pressing structure 110 and the circuit board 600 to be tested is continuously reduced until the pressing structure 110 contacts the circuit board 600 to be tested, and finally the circuit board 600 to be tested is pressed against the bearing member 200 under the limitation of the locking structure 120.

In the embodiment of the disclosure, when the pressing structure 110 is away from the circuit board bearing position relative to the carrier 200, the locking structure 120 does not limit the movement of the pressing structure 110 away from the circuit board 600 to be tested, so that the pressing structure 110 can release the pressing of the circuit board 600 to be tested, and further remove the circuit board 600 to be tested from the circuit board bearing position or place the circuit board 600 to be tested in the circuit board bearing position.

In the embodiment of the present disclosure, the specific manner in which the pressing structure 110 is movably connected to the carrier 200 is not limited herein.

In the presently disclosed embodiments, no limitation is placed herein on the specific configuration of the compression structure 110 and the locking structure 120. Depending on the manner in which the compression structure 110 and the locking structure 120 cooperate.

In one embodiment, with continued reference to FIG. 2, the first end of the compression structure 110 is hinged to the carrier 200, and the locking structure 120 includes a locking handle 121 and a locking lever 122. Wherein, the first end of the locking handle 121 is hinged with the second end of the compressing structure 110, the second end of the locking handle 121 is hinged with one end of the locking bar 122, and the other end of the locking bar 122 is hinged with the carrier 200. The hinge center lines (perpendicular to the first direction) of the carrier 200 and the pressing structure 110 and the locking bar 122, and the hinge center lines (perpendicular to the first direction) of the locking handle 121 and the pressing structure 110 and the locking bar 122 are parallel to each other.

In the disclosed embodiment, as shown in fig. 2, the pressing structure 110, the carrier 200, the locking handle 121, and the locking lever 122 may constitute a four bar mechanism. When the hinge center lines of the locking lever 122 and the locking handle 121 and the carrier 200 and the hinge center lines of the pressing structure 110 and the locking handle 121 are almost on the same plane or on the same plane, in other words, when the hinge points of the locking lever 122 and the locking handle 121 and the carrier 200 and the hinge points of the locking handle 121 and the locking lever 122 are almost on the same straight line, the pressing structure 110 cannot move relative to the circuit board 600 to be tested, so that the state that the pressing structure 110 presses against the circuit board 600 to be tested does not change.

Fig. 3 is a schematic structural view of another pressing member different from the pressing member in fig. 1 provided in the embodiment of the present disclosure. In one embodiment, the first end of the pressing structure 110 is hinged to the carrier 200, and the second end of the pressing structure 110 is used for pressing against the circuit board 600 to be tested, as shown in fig. 3, and the locking structure 120 includes the locking spring 123. One end of the locking spring 123 is connected to the third end of the pressing structure 110, and the other end of the locking spring 123 is connected to the carrier 200. When the pressing structure 110 presses against the circuit board 600 to be tested, the locking spring 123 is located between the pressing structure 110 and the carrier 200 and is in a stretched state, so that the locking spring 123 applies a pulling force to the pressing structure 110, and the pulling force makes the pressing structure 110 always press against the circuit board 600 to be tested.

Fig. 4 is a left side view of the burn-in test apparatus of fig. 1. In the disclosed embodiment, as shown in fig. 4, the compression structure 110 includes a compression device 111 and a compression connector 112. Wherein a first end of the compression connector 112 is connected to the compression device 111, and a second end of the compression connector 112 is hinged to the carrier 200. When the pressing connection piece 112 rotates relative to the carrier 200, the pressing device 111 is driven to approach or depart from the circuit board carrying position, so as to take or place the circuit board 600 to be tested.

In one embodiment, with continued reference to FIG. 4, to avoid damage to the circuit board 600 being tested, the compression device 111 may include a flexible member 1111 and a compression bar 1112. The flexible member 1111 is connected to one end of the pressing bar 1112 and is used to press against the circuit board 600 to be tested. Compression bar 1112 is coupled to a first end of compression connector 112.

Fig. 5 is a schematic structural view of yet another pressing member different from the pressing member in fig. 1 provided in the embodiment of the present disclosure. In one embodiment, as shown in fig. 5, the pressing structure 110 may also include a moving portion 113 and a pressing portion 114. The moving part 113 is movably connected with the carrier 200 and is in threaded connection with the pressing part 114, and the moving part 113 is used for driving the pressing part 114 to be far away from or close to the circuit board carrying position. When the pressing part 114 rotates relative to the moving part 113, the pressing part 114 approaches or separates from the circuit board 600 to be tested, so that the pressing part 114 presses or releases the circuit board 600 to be tested. The locking structure 120 is connected to the moving portion 113 and the carrier 200, and the locking structure 120 is used for limiting the moving portion 113 to move relative to the carrier 200, so that the pressing portion 114 always presses against the circuit board 600 to be tested.

Here, the specific structure of the locking structure 120 is not limited. Illustratively, as shown in fig. 5, the locking structure 120 includes a locking shaft 124, the moving portion 113 includes a locking hole for passing the locking shaft 124 therethrough, the carrier 200 includes a locking groove for accommodating the locking shaft 124, the locking shaft 124 is disposed in the locking hole, and one end is disposed in the locking groove, so that the moving portion 113 is prevented from moving relative to the carrier 200.

In summary, the presently disclosed embodiments describe the structure and mating structure of the locking structure 120 and the compression structure 110, but this is not limiting of the locking structure 120 and the compression structure 110.

In a possible implementation manner, as shown in fig. 1 and fig. 2, the pressing member 100 may further include a connection seat member 130, the pressing structure 110 is movably connected to the connection seat member 130, the locking structure 120 is connected between the pressing structure 110 and the connection seat member 130, and the connection seat member 130 is detachably connected to the carrier member 200. By the connecting seat 130, the pressing member 100 can be formed as a single component, so that assembling steps are reduced in the assembling process of the burn-in tester, thereby improving the assembling efficiency.

In a possible implementation manner, as shown in fig. 4, when the pressing structure 110 presses against the circuit board 600 to be tested, the heat spreader 300 and the pressing structure 110 are respectively located on two opposite sides of the heat spreader 300 along the first direction (e.g., the X direction in fig. 4), and the projection of the heat spreader 300 overlaps with the projection portion of the pressing structure 110.

According to the burn-in testing device provided by the embodiment of the present disclosure, the projection of the heat sink 300 along the first direction overlaps with the projection of the pressing structure 110, so that the heat sink 300 can share the pressing force applied by the pressing structure 110 borne by the circuit board 600 to be tested, and the pressing structure 110 can be prevented from crushing the circuit board 600 to be tested or causing the circuit board 600 to be tested to be shaped.

Fig. 6 is a schematic perspective view of the carrier of fig. 1. In one possible implementation, as shown in connection with fig. 1 above and referring to fig. 6, the carrier 200 includes a floor portion 210 and two bracket portions 220. Wherein, the two stand portions 220 are disposed on the same side of the bottom plate portion 210 and are arranged at intervals along the second direction (e.g., Y direction in fig. 6), and a positioning structure 230 is disposed between each stand portion 220 and the circuit board 600 to be tested, and the positioning structure 230 is used for positioning the relative positions of the stand portion 220 and the circuit board 600 to be tested in the second direction and the third direction (e.g., Z direction in fig. 6). Wherein the first direction (X direction in fig. 6), the second direction and the third direction are perpendicular to each other. The bottom plate portion 210 has a circuit board bearing position, and the heat sink 300 and the pressing member 100 are connected to the bottom plate portion 210, respectively.

When the carrier 200 formed by the bottom plate portion 210 and the two bracket portions 220 carries the circuit board 600 to be tested, the gap between the two bracket portions 220 along the second direction may be used for air flow, so as to increase the contact area between the circuit board 600 to be tested and air, and further improve the heat exchange area of the circuit board 600 to be tested.

The positioning structure 230 is used for positioning the relative positions of the support portion 220 and the circuit board 600 to be tested in the second direction and the third direction, so that the difficulty of matching the support portion 220 with the circuit board 600 to be tested can be reduced, and the circuit board 600 to be tested does not need to be adjusted when being placed on the support portion 220, thereby improving the efficiency of placing the circuit board 600 to be tested.

In one embodiment, as described above in connection with fig. 1, and with continued reference to fig. 6, the positioning structure 230 may include a positioning notch provided in the stand portion 220 for receiving a portion of the circuit board 600 to be tested.

Accordingly, the burn-in testing device provided in the embodiment of the present disclosure accommodates the portion of the circuit board 600 to be tested through the positioning notch, which not only can achieve the purpose of positioning the relative positions of the bracket portion 220 and the circuit board 600 to be tested, but also can avoid additional processing of the circuit board 600 to be tested and reduce the processing difficulty of the bracket portion 220.

In one embodiment, each bracket portion 220 includes a horizontal section 221 and at least two vertical sections 222. The horizontal segment 221 is fixedly coupled to a surface of the bottom plate portion 210. At least two vertical sections 222 are located at the same side of the horizontal section 221 and are arranged at intervals along the third direction, one end of each vertical section 222 is connected with the horizontal section 221, and the other end of each vertical section 222 comprises a positioning notch.

Illustratively, as shown in fig. 6, one of the bracket parts 220 includes a horizontal section 221 and two vertical sections 222, and the other ends of the two vertical sections 222 are connected to opposite ends of the horizontal section 221, respectively. The other bracket part 220 includes a horizontal section 221 and three vertical sections 222, the other ends of the three vertical sections 222 are respectively connected to the horizontal section 221, and the three vertical sections 222 are arranged at intervals in the third direction.

Accordingly, the burn-in testing device provided in the embodiment of the present disclosure supports the circuit board 600 to be tested through the support portion 220 formed by the horizontal section 221 and the at least two vertical sections 222, so that not only can air in all directions of the circuit board 600 to be tested be contacted to improve the heat dissipation speed, but also the contact area between the circuit board 600 to be tested and the support portion 220 can be improved to improve the supporting strength.

Of course, the carrier 200 may have other structures than the carrier 200 composed of the stand portion 220 and the bottom plate portion 210 to carry the circuit board 600 to be tested. Illustratively, the carrier 200 includes a bottom plate portion 210 and at least two columnar portions (not shown in the drawings), one ends of the at least two columnar portions are connected to the same side of the bottom plate portion 210, the other ends of the columnar portions are configured to be disposed in through holes of the circuit board 600 to be tested, and an outer wall of the other ends of the columnar portions includes a step surface for abutting against the circuit board 600 to be tested.

In the embodiment of the disclosure, as shown in fig. 4, the heat sink 300 is disposed between the two stand portions 220, so that not only can the heat dissipation of the circuit board 600 to be tested by the heat sink 300 be realized, but also the volume of the burn-in device can be increased, thereby facilitating the miniaturization of the burn-in device.

Fig. 7 is a front view of the burn-in test apparatus of fig. 1. In a possible implementation, as shown in fig. 7, when the circuit board 600 to be tested is placed on the carrier 200, the heat sink 300 is disposed facing the processor 610 of the circuit board 600 to be tested along the first direction, and the projection of the heat sink 300 covers the projection of the processor 610 of the circuit board 600 to be tested.

Accordingly, the burn-in testing apparatus provided in the embodiments of the present disclosure makes the temperature of the processor 610 within a reasonable range by making the heat sink 300 face the processor 610 of the circuit board 600 to be tested along the first direction and covering the projection of the processor 610 of the circuit board 600 to be tested along the projection of the heat sink 300 along the first direction, so as to ensure that the working time of the circuit board 600 to be tested meets the requirement.

In the embodiment of the present disclosure, along the first direction, the projection of the heat sink 300 covering the processor 610 of the circuit board 600 to be tested may be understood as the area of the heat sink 300 is greater than or equal to the area of the processor 610. Of course, the larger the area of the heat sink 300, the better the heat generated by the processor 610 can be taken away, and the heat generated by the heat generating device near the processor 610 can be taken away.

In the embodiment of the present disclosure, no limitation is made here with respect to the specific structure of the heat sink 300.

Fig. 8 is a schematic perspective view of the heat sink of fig. 1. Illustratively, as shown in fig. 8, the heat sink 300 includes a body portion 310 and a plurality of plate-like portions 320. Wherein, the plurality of plate-shaped portions 320 are disposed on the same side of the body portion 310 and are arranged at intervals along the second direction. Along the second direction, two adjacent plate-like portions 320 and the body portion 310 together enclose a strip-shaped groove 330 extending along the third direction. When the circuit board 600 to be tested is placed on the carrier 200, the body portion 310 is located between the circuit board 600 to be tested and the plurality of plate-like portions 320 along the first direction.

In a possible implementation, as shown in connection with fig. 7 above, the burn-in apparatus may further include a fan 400, where the fan 400 is connected to the carrier 200 and is used to blow air toward the heat sink 300 when testing the circuit board 600 to be tested.

Accordingly, the aging testing device provided by the embodiment of the present disclosure performs air cooling on the radiator 300 through the fan 400, so that the air flow rapidly takes away the heat on the radiator 300, so as to reduce the temperature of the radiator 300, thereby improving the heat dissipation capacity of the radiator 300, and further improving the heat dissipation capacity of the circuit board to be cooled.

In the embodiment of the present disclosure, there is no limitation in the structure of the fan 400. For example, the fan 400 may be an axial fan, a centrifugal fan, or the like.

The fan 400 is an axial flow fan, and the axis of the fan 400 is parallel to the third direction and spaced apart from the heat sink 300 along the second direction. As shown in fig. 7, in the third direction, the projection of the fan 400 partially overlaps the circuit board 600 to be tested, so that the fan 400 can perform not only the fan 400 but also air cooling of the circuit board 600 to be tested to improve the heat dissipation capability of the circuit board 600 to be tested.

In a possible implementation, as shown in fig. 4 and 7, the heat sink 300 has a plurality of strip-shaped grooves 330, and the strip-shaped grooves 330 extend in the third direction and penetrate the heat sink 300. Along the third direction, the fan 400 is disposed side by side with the radiator 300, and the air supply direction of the fan 400 is parallel to the third direction.

Accordingly, the fan 400 of the burn-in testing device provided in the embodiment of the present disclosure blows air toward the heat sink 300 along the third direction, so that the air in the strip-shaped groove 330 can flow, thereby improving the heat dissipation capability of the heat sink 300.

In a possible implementation manner, as shown in connection with fig. 7 above, the burn-in testing apparatus may further include a power supply member 500, where the power supply member 500 is configured to supply power to at least one of the circuit board 600 and the fan 400 to be tested or disconnect power to at least one of the circuit board 600 and the fan 400 to be tested.

In the embodiment of the present disclosure, no limitation is made here with respect to the specific structure of the power supply member 500. In one embodiment, the power supply 500 includes a power module having a power source, and the power supply 500 may power the circuit board 600 and/or the fan 400 to be tested or disconnect the circuit board 600 and/or the fan 400 to be tested. Alternatively, in one embodiment, the power supply 500 includes conductive elements for electrically connecting an external power source to the circuit board 600 and the fan 400 to be tested, respectively, such that the external power source supplies power to the circuit board 600 and/or the fan 400 to be tested or disconnects power to the circuit board 600 and/or the fan 400 to be tested.

The parallel, vertical, numerical and numerical ranges involved in embodiments of the present utility model are approximations, and may be subject to a range of errors, which may be considered negligible by those skilled in the art, due to the manufacturing process.

In the description of the embodiments of the present disclosure, it should be understood that the terms "top," "bottom," "upper," "lower," "left," "right," "vertical," "horizontal," and the like, if any, indicate or imply, however, the particular orientations and operations of the device or element being referred to, and are not intended to limit the embodiments of the present disclosure, unless indicated or implied by the fact that the orientation or positional relationship is based on that shown in the drawings, merely to facilitate description of the embodiments of the present disclosure and simplify the description.

In describing embodiments of the present disclosure, it will be understood that the terms "comprises" and "comprising," and any variations thereof, as used herein, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements that are expressly listed or inherent to such process, method, article, or apparatus.

Unless specifically stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally formed; can be directly connected or indirectly connected through an intermediate medium, and can lead the interior of two elements to be communicated or lead the two elements to be in interaction relationship. The specific meaning of the above terms in the embodiments of the present disclosure will be understood by those of ordinary skill in the art according to specific circumstances. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present disclosure, and not for limiting the same; although the present disclosure has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present disclosure.

Claims (10)

1. The aging test device is characterized by comprising a radiator, a bearing piece and a pressing piece;

the radiator and the pressing piece are respectively connected with the bearing piece;

the pressing piece is used for limiting the circuit board to be tested to be separated from the bearing piece in a mode of pressing the circuit board to be tested;

the radiator is arranged close to a bearing position of the circuit board on the bearing piece.

2. The burn-in apparatus of claim 1 wherein the hold-down member comprises a hold-down structure movably coupled to the carrier member and a locking structure coupled between the hold-down structure and the carrier member;

the pressing structure approaches to or moves away from the circuit board bearing position in a manner of moving relative to the bearing piece;

the locking structure is configured to limit movement of the hold-down structure away from the circuit board to be tested when the hold-down structure is pressed against the circuit board to be tested.

3. The burn-in apparatus of claim 2 wherein the first end of the compression structure is hinged to the carrier, the locking structure comprising a locking handle and a locking lever;

the first end of the locking handle is hinged with the second end of the pressing structure, the second end of the locking handle is hinged with one end of the locking rod piece, and the other end of the locking rod piece is hinged with the bearing piece;

the bearing piece is parallel to the hinge centers of the pressing structure and the locking rod piece and the hinge center line of the locking handle, the pressing structure and the locking rod piece.

4. The burn-in apparatus of claim 2, wherein the heat sink and the compression structure are located on opposite sides of the heat sink, respectively, in a first direction when the compression structure is pressed against the circuit board to be tested, and a projection of the heat sink partially overlaps a projection of the compression structure.

5. The burn-in apparatus of any one of claims 1-4 wherein the carrier comprises a floor portion and two bracket portions;

the two bracket parts are arranged on the same side of the bottom plate part and are arranged at intervals along a second direction, a positioning structure is arranged between each bracket part and the circuit board to be tested, and the positioning structure is used for positioning the relative positions of the bracket parts and the circuit board to be tested in the second direction and the third direction; wherein the first direction, the second direction and the third direction are perpendicular to each other;

the bottom plate part is provided with the circuit board bearing position, and the radiator and the pressing piece are respectively connected with the bottom plate part.

6. The burn-in apparatus of claim 5 wherein the positioning structure comprises a positioning notch disposed in the bracket portion for receiving a portion of the circuit board to be tested.

7. The burn-in apparatus of claim 6 wherein each of said bracket portions comprises a horizontal section and at least two vertical sections;

the horizontal section is fixedly connected to the surface of the bottom plate part;

the at least two vertical sections are positioned on the same side of the horizontal section and are arranged at intervals along the third direction, one end of each vertical section is connected with the horizontal section, and the other end of each vertical section comprises the positioning notch.

8. The burn-in apparatus of any of claims 1-4, wherein the heat sink is disposed facing the processor of the circuit board to be tested in a first direction when the circuit board to be tested is placed on the carrier, and a projection of the heat sink covers a projection of the processor of the circuit board to be tested.

9. The burn-in apparatus of any of claims 1-4 further comprising a fan coupled to the carrier and configured to blow air toward the heat sink when testing the circuit board under test.

10. The burn-in apparatus of claim 9 wherein the heat sink comprises a plurality of bar-shaped grooves extending in a third direction and through the heat sink;

along the third direction, the fan and the radiator are arranged side by side, and the air supply direction of the fan is parallel to the third direction.