CN220108544U

CN220108544U - Quick heat dissipation type multilayer PCB board

Info

Publication number: CN220108544U
Application number: CN202321165749.2U
Authority: CN
Inventors: 陈晓芳
Original assignee: Wuxi Kailianwei Electronic Technology Co ltd
Current assignee: Wuxi Kailianwei Electronic Technology Co ltd
Priority date: 2023-05-16
Filing date: 2023-05-16
Publication date: 2023-11-28
Anticipated expiration: 2033-05-16

Abstract

The utility model belongs to the technical field of PCB boards, in particular to a rapid heat dissipation type multilayer PCB board, which comprises a mounting seat, wherein the mounting seat is U-shaped, a plurality of slots are formed in the side wall of the mounting seat from top to bottom, a PCB circuit board is inserted into the slots, a heat dissipation assembly is arranged on the side wall of the mounting seat, and the heat dissipation assembly comprises a hollow tube; according to the utility model, the air flow enters the interior of the air supply pipe along the hollow pipe through the operation of the fan, and is sprayed out through the vent holes to radiate the upper surface and the lower surface of the PCB circuit board, and the driver operates the air supply pipe to circularly move to radiate the PCB circuit board relatively comprehensively.

Description

Quick heat dissipation type multilayer PCB board

Technical Field

The utility model relates to the technical field of PCB boards, in particular to a rapid heat dissipation type multilayer PCB board.

Background

The printed board is cut into a certain size by taking an insulating board as a base material, at least one conductive pattern is attached on the insulating board, and holes (such as element holes, fastening holes, metallized holes and the like) are distributed on the insulating board to replace a chassis of an electronic component of the traditional device and realize interconnection between the electronic components. Such boards are known as "printed" circuit boards because they are made using electronic printing. It is not exact to refer to "printed wiring board" as "printed circuit board" because there are no "printed elements" on the printed board and only wiring. The multilayer printed PCB circuit board can not carry out timely heat dissipation in the in-process of using, leads to radiating effect not good, and the circuit board at middle part damages when needs changing, is difficult to take out.

The current chinese patent with bulletin number CN213403628U discloses a multilayer printed PCB circuit board capable of fast heat dissipation, a fixed block, the inside fixedly connected with of fixed block is responsible for, one side fixedly connected with branch pipe of being responsible for, the tip fixedly connected with air-supply line of branch pipe, one side fixedly connected with strap of fixed block, the top fixedly connected with fixture block of strap, the top joint of fixture block has the circuit board, the top joint of circuit board has the block. The utility model has the advantages that: the exhaust fan of the output end of the main pipe is started, heat between circuit boards can be extracted through the air inlet pipe, the air inlet pipes on the left side and the right side of the same layer of circuit boards are respectively provided with the air inlet pipe, the air inlet pipes on the left side and the right side are simultaneously started, the cooling efficiency can be improved, the purpose of better cooling and heat dissipation is achieved, the circuit boards on each layer can be fixedly installed through the set caps, and the circuit boards on each layer can be independently detached, so that the purpose of convenient use is achieved.

With respect to the above and related art, the inventors believe that there are often the following drawbacks: the device extracts heat between the circuit boards through the exhaust fan and the air inlet pipe, the air inlet pipe is arranged at the edge of the PCB circuit board, and aiming at the region of the center of the PCB circuit board, which is far away from the pipe orifice of the air inlet pipe, the extraction effect is weaker than that of the region of the edge of the PCB circuit board, which is near to the pipe orifice of the air inlet pipe, so that the PCB circuit board cannot be well and comprehensively cooled, the use effect is poor, and improvement is needed; therefore, a fast heat dissipation type multi-layer PCB board is proposed to solve the above problems.

Disclosure of Invention

In order to overcome the defects in the prior art and solve the technical problems, the utility model provides a rapid heat dissipation type multilayer PCB.

The technical scheme adopted for solving the technical problems is as follows: the utility model discloses a rapid heat dissipation type multilayer PCB, which comprises a mounting seat, wherein the mounting seat is U-shaped, a plurality of slots are formed in the side wall of the mounting seat from top to bottom, a PCB circuit board is inserted in the slots, a heat dissipation component is mounted on the side wall of the mounting seat and comprises a hollow pipe, the hollow pipe is in sliding connection with the mounting seat, fans are fixedly connected to the upper part and the lower part of the inner part of the hollow pipe respectively, a fixing component is mounted at an opening of the mounting seat and comprises a fixing wall, and the fixing wall is rotationally connected with the mounting seat through a rotating shaft.

Preferably, the upper and lower sides of the hollow tube are respectively fixedly connected with a dust screen, and the center of the interior of the hollow tube is fixedly connected with a separation layer.

Preferably, the side wall fixedly connected with a plurality of blast pipe and a plurality of through-hole of cavity pipe, blast pipe and PCB circuit board alternately distribute, the through-hole has offered the side wall of mount pad from top to bottom, and the blast pipe passes the through-hole.

Preferably, the side wall of the hollow tube is connected with a reciprocating screw rod in a threaded manner, the reciprocating screw rod is rotationally connected with the mounting seat, the side wall of the mounting seat is fixedly connected with a driver, and the driving end of the driver is fixedly connected with one end of the reciprocating screw rod.

Preferably, a plurality of ventilation holes are respectively formed in the upper part and the lower part of the air supply pipe.

Preferably, a thread groove is formed in the top of the fixing wall.

Preferably, the fixing assembly further comprises a connecting seat, the connecting seat is fixedly installed at the top of the installation seat, an installation opening is formed in the connecting seat, and bolts are inserted into the installation opening.

The utility model has the advantages that:

1. according to the utility model, the air flow enters the interior of the air supply pipe along the hollow pipe through the operation of the fan, and is sprayed out through the vent holes to radiate the upper surface and the lower surface of the PCB circuit board, and the driver operates the air supply pipe to circularly move to radiate the PCB circuit board relatively comprehensively.

2. According to the utility model, the PCB circuit board is inserted into the slot, and then the fixing wall is quickly connected with the mounting seat through the bolts, so that the multilayer PCB circuit board can be quickly fixed, the mounting or dismounting is convenient, the multilayer PCB circuit board is not required to be mounted next to each other, and the mounting or dismounting time is saved.

Drawings

In order to more clearly illustrate the embodiments of the utility model or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the utility model, and that other drawings can be obtained from these drawings without inventive faculty for a person skilled in the art.

FIG. 1 is a schematic diagram of the overall structure of the present utility model;

FIG. 2 is a schematic view of the expanded structure of FIG. 1 according to the present utility model;

FIG. 3 is a schematic diagram of a heat dissipating assembly according to the present utility model;

FIG. 4 is an exploded view of a hollow tube according to the present utility model;

FIG. 5 is a schematic view of a fixing assembly according to the present utility model.

In the figure: 1. a mounting base; 2. a slot; 3. a PCB circuit board; 4. a heat dissipation assembly; 41. a hollow tube; 42. a blower; 43. an air supply pipe; 44. a through hole; 45. a reciprocating screw; 46. a vent hole; 47. a dust screen; 5. a fixing assembly; 51. a fixed wall; 52. a thread groove; 53. a connecting seat; 54. a mounting port; 55. a bolt; 6. a driver.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-5, a fast heat dissipation type multi-layer PCB board includes a mounting base 1, the mounting base 1 is set to be U-shaped, a plurality of slots 2 are formed in the side wall of the mounting base 1 from top to bottom, a PCB circuit board 3 is inserted in the slot 2, a heat dissipation component 4 is mounted on the side wall of the mounting base 1, the heat dissipation component 4 includes a hollow tube 41, the hollow tube 41 is slidably connected with the mounting base 1, a fan 42 is fixedly connected to the upper and lower sides of the interior of the hollow tube 41, a fixing component 5 is mounted at the opening of the mounting base 1, the fixing component 5 includes a fixing wall 51, the fixing wall 51 is rotationally connected with the mounting base 1 through a rotating shaft, and air flows enter the interior of an air supply pipe 43 through the fan 42, and are ejected through a vent 46 to dissipate heat from the upper and lower sides of the PCB circuit board 3.

The upper and lower parts of the hollow tube 41 are fixedly connected with a dust screen 47 respectively, the center inside the hollow tube 41 is fixedly connected with a separation layer, and dust is filtered through the dust screen 47.

The side wall of the hollow tube 41 is fixedly connected with a plurality of air supply pipes 43 and a plurality of through openings 44, the air supply pipes 43 and the PCB 3 are distributed in a crossed mode, the through openings 44 are formed in the side wall of the mounting seat 1 from top to bottom, and the air supply pipes 43 penetrate through the through openings 44.

The side wall threaded connection of hollow pipe 41 has reciprocating screw 45, and reciprocating screw 45 rotates with mount pad 1 to be connected, the lateral wall fixedly connected with driver 6 of mount pad 1, and the drive end of driver 6 and the one end fixed connection of reciprocating screw 45 drive reciprocating screw 45 through driver 6 and rotate, make the reciprocal slip of hollow pipe 41, and then make send the pipe to carry out relatively comprehensive heat dissipation operation to PCB circuit board 3 that can circulate and remove, compared in prior art, the radiating range is bigger, improve printed PCB circuit board 3 and dispel the heat effect in the in-process of use.

A plurality of ventilation holes 46 are respectively formed in the upper and lower sides of the blast pipe 43.

The screw thread groove 52 has been seted up at the top of fixed wall 51, through the inside with PCB circuit board 3 insert slot 2, later through bolt 55 with fixed wall 51 and mount pad 1 quick connect, and then can the fixed multilayer PCB circuit board 3 fast, easy to assemble or dismantle, and then need not to install multilayer PCB circuit board 3 next, saves installation or dismantlement time.

The fixing component 5 further comprises a connecting seat 53, the connecting seat 53 is fixedly arranged at the top of the mounting seat 1, a mounting opening 54 is formed in the connecting seat 53, a bolt 55 is inserted into the mounting opening 54, and the bolt 55 is in threaded connection with the thread groove 52.

The working principle is that the air flow enters the interior of the air supply pipe 43 along the hollow pipe 41 through the operation of the fan 42, and is sprayed out through the vent hole 46 to radiate heat on the upper surface and the lower surface of the PCB circuit board 3, dust is filtered by the dust screen 47 to prevent dust from entering, the reciprocating screw 45 is driven to rotate through the driver 6, so that the hollow pipe 41 slides reciprocally, and the air supply pipe can move circularly to radiate heat relatively comprehensively on the PCB circuit board 3;

through the inside with PCB circuit board 3 insert slot 2, later through bolt 55 with fixed wall 51 and mount pad 1 quick connect, and then can fix multilayer PCB circuit board 3 fast, easy to assemble or dismantle, and then need not to install multilayer PCB circuit board 3 next, saves installation or dismantlement time.

In the description of the present specification, the descriptions of the terms "one embodiment," "example," "specific example," and the like, mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The foregoing has shown and described the basic principles, principal features and advantages of the utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims.

Claims

1. The utility model provides a quick heat dissipation formula multilayer PCB board, includes mount pad (1), its characterized in that: the utility model discloses a PCB circuit board, including mount pad (1), fixed subassembly (5) are installed in the opening part of mount pad (1), and fixed subassembly (51) are installed in the inside grafting of slot (2) has PCB circuit board (3), radiator unit (4) are installed to the lateral wall of mount pad (1), radiator unit (4) include hollow tube (41), hollow tube (41) and mount pad (1) sliding connection, fixedly connected with fan (42) respectively above and below the inside of hollow tube (41), fixed subassembly (5) are installed in the opening part of mount pad (1), fixed subassembly (5) are including fixed wall (51), fixed wall (51) are connected through pivot and mount pad (1) rotation.

2. The rapid thermal dissipation type multilayer PCB of claim 1, wherein: the dustproof nets (47) are fixedly connected to the upper portion and the lower portion of the hollow tube (41) respectively, and a separation layer is fixedly connected to the center of the inside of the hollow tube (41).

3. The rapid thermal dissipation type multilayer PCB of claim 1, wherein: the side wall fixedly connected with a plurality of blast pipes (43) and a plurality of through openings (44) of hollow tube (41), blast pipes (43) and PCB circuit board (3) alternately distribute, the lateral wall of mount pad (1) has been seted up from top to bottom to through opening (44), and blast pipes (43) pass through opening (44).

4. The rapid thermal dissipation type multilayer PCB of claim 1, wherein: the side wall threaded connection of cavity pipe (41) has reciprocating screw (45), and reciprocating screw (45) and mount pad (1) rotate to be connected, the lateral wall fixedly connected with driver (6) of mount pad (1), and the drive end and the one end fixed connection of reciprocating screw (45) of driver (6).

5. A fast cooling multi-layer PCB according to claim 3, wherein: a plurality of ventilation holes (46) are respectively formed in the upper part and the lower part of the air supply pipe (43).

6. The rapid thermal dissipation type multilayer PCB of claim 1, wherein: a thread groove (52) is formed in the top of the fixed wall (51).

7. The rapid thermal dissipation type multilayer PCB of claim 1, wherein: the fixing assembly (5) further comprises a connecting seat (53), the connecting seat (53) is fixedly installed at the top of the installation seat (1), an installation opening (54) is formed in the connecting seat (53), and bolts (55) are inserted into the installation opening (54).