CN113238632A

CN113238632A - Computer heat dissipation mainframe box

Info

Publication number: CN113238632A
Application number: CN202110540456.7A
Authority: CN
Inventors: 王永真
Original assignee: Xuchang University
Current assignee: Xuchang University
Priority date: 2021-05-18
Filing date: 2021-05-18
Publication date: 2021-08-10

Abstract

The invention discloses a computer heat dissipation main case, which relates to the field of computers and includes a case shell, and further comprises: a wind power cooling assembly arranged in the case shell, and used for cooling the inside of the case shell by wind power, the wind power cooling assembly includes an air inlet Mechanism and air exhaust mechanism; a water-cooled heat-dissipating assembly arranged in the casing of the case, the water-cooled heat-dissipating assembly is arranged on the air blowing path of the wind-cooled heat-dissipating assembly, and is used to blow out cold air from the wind-powered heat-dissipating assembly; the forced cooling assembly is connected with the water-cooling heat-dissipating assembly and used In order to make the wind cooling assembly blow out low-temperature cold air, the forced cooling assembly includes a cooling source, a liquid cooling conduction mechanism and an extrusion flow guiding mechanism. By setting the forced cooling assembly, the present invention can cooperate with the wind cooling assembly to blow out low-temperature cold air, thereby realizing strong cooling. It can effectively cool down, and can realize the control of low temperature conduction through the extrusion diversion mechanism, can adapt to different cooling requirements, and has a good cooling effect on the inside of the computer main box.

Description

Computer heat dissipation mainframe box

Technical Field

The invention relates to the field of computers, in particular to a computer heat dissipation mainframe box.

Background

At present, a large number of integrated circuits are used in computer components, as is known, high temperature is a large enemy of the integrated circuits, the high temperature can not only cause unstable system operation and shortened service life, but also can even cause some components to be burnt out, so that high-temperature heat is not from the outside of a computer but inside the computer or inside the integrated circuits, and the radiator is used for absorbing the heat and then radiating the heat into a case or outside the case, so as to ensure that the temperature of the computer components is normal.

At present, most computer radiators adopt a single radiating fan to radiate heat, and poor radiating effect easily causes overhigh temperature in a host, computer crash and damage to partial electronic elements.

Disclosure of Invention

The invention provides a computer heat-dissipation mainframe box, which solves the problems in the prior art.

In order to achieve the purpose, the invention provides the following technical scheme:

the utility model provides a computer heat dissipation mainframe box, includes chassis exterior, and a plurality of mounting brackets of chassis exterior's inside wall fixed connection still include:

the wind power heat dissipation component and the water cooling heat dissipation component are arranged in the case shell and used for dissipating heat of wind power inside the case shell;

the forced cooling assembly is matched with the wind power heat dissipation assembly to blow out low-temperature cold air, the forced cooling assembly comprises a refrigeration source, a liquid cooling conduction mechanism and an extrusion flow guide mechanism, the refrigeration source supplies cold for the liquid cooling conduction mechanism, and the extrusion flow guide mechanism realizes low-temperature conduction in a mode of extruding the liquid cooling conduction mechanism.

As a preferred technical scheme of the invention, the wind power heat dissipation assembly comprises an air inlet mechanism and an air exhaust mechanism.

As a preferred technical scheme of the invention, the air inlet mechanism comprises a refrigeration box arranged in a case shell, a plurality of induced draft fans are fixedly arranged on the outer side of the refrigeration box, one side of the refrigeration box is fixedly connected with an air inlet column, an air inlet end is arranged on the case shell, an air inlet is arranged at the air inlet end, and an air inlet cover is fixedly connected between the air inlet column and the air inlet.

As a preferred technical scheme of the invention, the water-cooling heat dissipation assembly is arranged on a blowing path of the wind-power heat dissipation assembly.

As a preferred technical scheme of the invention, the water-cooling heat dissipation assembly comprises a circulating pipe arranged in the case shell, two ends of the circulating pipe are fixedly connected with heat exchange discs, the heat exchange discs are positioned in the refrigeration box, and a communicating pipe is fixedly connected between the two heat exchange discs.

As a preferred technical scheme of the invention, the exhaust mechanism comprises an exhaust fan, a mounting sleeve is fixedly connected between the exhaust fan and the circulating pipe, an exhaust end is arranged on the chassis shell, an air outlet is arranged at the exhaust end, and the exhaust fan is positioned at one side of the air outlet.

As a preferred technical scheme of the present invention, the liquid cooling conduction mechanism includes a refrigeration cover disposed on the heat exchange plate, the refrigeration cover includes an outer cover body and an inner cover body fixedly disposed on the heat exchange plate, the outer cover body is sleeved outside the inner cover body, a refrigeration cavity is disposed between the outer cover body and the inner cover body, and the refrigeration cavity is communicated with the interior of the heat exchange plate.

As a preferred technical scheme of the invention, the extrusion flow guide mechanism comprises an inner fixing frame fixedly arranged on the inner wall of the refrigeration box, a moving rod penetrates through and is connected with the inner fixing frame in a sliding manner, two ends of the moving rod are respectively and fixedly connected with a pressing cover and a pressing plate, a cam is arranged on one side of the pressing plate, a first elastic piece is fixedly connected between the pressing plate and the inner fixing frame, and a driving piece for driving the cam is arranged outside the refrigeration box.

As a preferred technical scheme of the invention, the refrigeration source comprises a semiconductor refrigeration piece fixedly arranged on the refrigeration box, the cold end of the semiconductor refrigeration piece is fixedly connected with a refrigeration plate, and the refrigeration plate extends into the refrigeration cavity.

The invention has the following advantages: according to the invention, the forced cooling component is arranged, so that low-temperature cold air can be blown out by matching with the wind power heat dissipation component, further, the forced cooling is realized, the control on low-temperature conduction can be realized by extruding the flow guide mechanism, different cooling requirements can be met, and the cooling effect on the interior of the computer mainframe box is good.

Drawings

Fig. 1 is a schematic structural diagram of a heat dissipation main chassis of a computer.

Fig. 2 is a schematic structural diagram of the inside of a refrigeration box in a computer heat dissipation mainframe box.

Fig. 3 is a schematic structural diagram of a cooling source in a computer heat dissipation mainframe box.

Fig. 4 is a schematic structural diagram of an extrusion flow guide mechanism in a computer heat dissipation mainframe box.

In the figure: 1. a chassis housing; 2. a mounting frame; 3. a refrigeration case; 4. an induced draft fan; 5. an air inlet column; 6. an air inlet cover; 7. an air inlet filter screen; 8. a circulation pipe; 9. a discharge fan; 10. installing a sleeve; 11. an exhaust filter screen; 12. a drive member; 13. a heat exchange plate; 14. mounting a plate; 15. mounting a rod; 16. a communicating pipe; 17. a refrigeration shell; 18. an inner fixing frame; 19. a travel bar; 20. pressing the cover; 21. pressing a plate; 22. a cam; 23. a first elastic member; 24. a refrigeration source; 25. a semiconductor refrigeration sheet; 26. a refrigeration plate; 27. a heat dissipation main board; 28. a heat dissipation support plate; 29. a circulation pump; 30. an outer cover body; 31. an inner cover body; 32. a telescopic pipe; 33. a second elastic member.

Detailed Description

The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are described herein for the purpose of illustration and explanation and not limitation.

It should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.

Example 1

Referring to fig. 1-4, a computer heat dissipation main chassis includes a chassis housing 1, and a plurality of mounting frames 2 are fixedly connected to an inner side wall of the chassis housing 1, and further includes:

the wind power heat dissipation assembly is arranged in the case shell 1 and used for dissipating heat of wind power inside the case shell 1, and comprises an air inlet mechanism and an air exhaust mechanism;

the water-cooling heat dissipation component is arranged in the case shell 1, is arranged on a blowing path of the wind power heat dissipation component and is used for blowing cold air out of the wind power heat dissipation component;

the forced cooling assembly is matched with the wind power heat dissipation assembly to blow out low-temperature cold wind and perform forced refrigeration, wherein the forced cooling assembly comprises a refrigerating source 24, a liquid cooling conduction mechanism and an extrusion flow guide mechanism, the refrigerating source 24 supplies cold for the liquid cooling conduction mechanism, and the extrusion flow guide mechanism is utilized to press the liquid cooling conduction mechanism to promote low-temperature conduction.

The air inlet mechanism is including setting up refrigeration case 3 in chassis exterior 1, and the outside of refrigeration case 3 is fixed to be equipped with a plurality of draught fans 4, and the air-out direction of draught fan 4 is corresponding with the position of mounting bracket 2, and one side fixed connection inlet air post 5 of refrigeration case 3 is equipped with the air inlet end on chassis exterior 1, and the air inlet end is equipped with the air intake, fixed connection inlet air cover 6 between inlet air post 5 and the air intake.

In a better embodiment, the air inlet is internally clamped or fixedly connected with an air inlet filter screen 7, so that external impurities can be prevented from being sucked into the case shell 1.

The water-cooling heat dissipation assembly comprises a circulating pipe 8 arranged in the case shell 1, two ends of the circulating pipe 8 are fixedly connected with heat exchange discs 13, dense air vents are formed in the heat exchange discs 13, air can conveniently flow through the heat exchange discs 13, the heat exchange discs 13 are located in the refrigerating box 3, and a communicating pipe 16 is fixedly connected between the two heat exchange discs 13. The heat exchange plate 13 and the communicating pipe 16 are provided with cooling liquid therein. A circulating pump 29 is arranged on the refrigeration tank 3, the input end and the output end of the circulating pump 29 are both connected with the circulating pipe 8, and the circulating pump 29 is started to drive the cooling liquid in the circulating pipe 8, the heat exchange plate and the communicating pipe 16 to circularly flow

In a better embodiment, the side edge in the refrigeration box 3 is fixedly connected with a mounting rod 15, the end part of the mounting rod 15 is highly connected with a mounting plate 14, and the heat exchange plate 13 is fixedly arranged on the mounting plate 14.

The exhaust mechanism comprises an exhaust fan 9, a mounting sleeve 10 is fixedly connected between the exhaust fan 9 and the circulating pipe 8, an exhaust end is arranged on the chassis shell 1, an air outlet is arranged at the exhaust end, and the exhaust fan 9 is positioned on one side of the air outlet.

In a more preferred embodiment, an exhaust filter 11 is provided in the exhaust outlet to prevent foreign matters from entering the casing 1.

The liquid cooling conduction mechanism comprises a refrigeration cover 17 arranged on the heat exchange disc 13, the refrigeration cover 17 comprises an outer cover body 30 and an inner cover body 31 which are fixedly arranged on the heat exchange disc 13, the outer cover body 30 is sleeved outside the inner cover body 31, a refrigeration cavity is arranged between the outer cover body 30 and the inner cover body 31, and the refrigeration cavity is communicated with the interior of the heat exchange disc 13.

In a better embodiment, a plurality of second elastic members 33 are arranged inside the refrigeration cavity, two ends of the second elastic members 33 are respectively and fixedly connected with the outer cover 30 and the inner cover 31, the inner cover 31 is connected and communicated with an extension tube 32, wherein the extension tube 32 can be a rubber extension tube 32, when the outer cover 30 is pressed by the pressure cover 20 to deform, the cooling liquid can push the extension tube 32 to expand and extend under pressure, and meanwhile, the low-temperature cooling liquid can be extruded into the heat exchange plate 13, so that the low-temperature conduction effect is increased.

The extrusion flow guide mechanism comprises an inner fixing frame 18 fixedly arranged on the inner wall of the refrigeration box 3, a moving rod 19 penetrates through and is connected with the inner fixing frame 18 in a sliding mode, two ends of the moving rod 19 are respectively and fixedly connected with a pressure cover 20 and a pressure plate 21, a cam 22 is arranged on one side of the pressure plate 21, a first elastic part 23 is fixedly connected between the pressure plate 21 and the inner fixing frame 18, a driving part 12 used for driving the cam 22 is arranged outside the refrigeration box 3, and the driving part 12 can be a servo motor.

Both the first elastic member 23 and the second elastic member 33 may be springs.

Example 2

Referring to fig. 1 to 4, the other contents of the present embodiment are the same as embodiment 1, except that: the refrigeration source 24 comprises a semiconductor refrigeration piece 25 fixedly arranged on the refrigeration box 3, the cold end of the semiconductor refrigeration piece 25 is fixedly connected with a refrigeration plate 26, and the refrigeration plate 26 extends into the refrigeration cavity. Semiconductor refrigeration piece 25's hot junction fixed connection heat dissipation mainboard 27, a plurality of heat dissipation extension boards 28 of fixed connection on the heat dissipation mainboard 27, outside heat dissipation extension board 28 extended to chassis exterior 1, after circular telegram semiconductor refrigeration piece 25, its cold junction can refrigerate the cooling rapidly, utilize the conduction of refrigeration board 26 to cool down the refrigeration to the coolant liquid in the refrigeration intracavity, the coolant liquid can cool down the air in chassis exterior 1 when flowing in circulating pipe 8 and heat transfer dish 13.

In the implementation process of the invention, the induced draft fan 4 is started, outside air is driven to enter the air inlet column 5 from the air inlet cover 6 and then enter the refrigeration box 3, and finally is discharged from the output end of the induced draft fan 4 to dissipate heat of electronic components installed in the mechanical shell after passing through the heat exchange disc 13, and the exhaust fan 9 is started to exhaust hot air from the air outlet. When refrigeration effect is strengthened to needs, control semiconductor refrigeration piece 25 circular telegram and start, refrigeration board 26 makes the coolant liquid cool down rapidly under the conduction effect, obtains rapid cooling after blowing heat transfer dish 13, then cools down the refrigeration to chassis exterior 1 in, cooling response speed is fast.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A computer heat dissipation main box, comprising a chassis shell, and the inner side wall of the chassis shell is fixedly connected with a plurality of mounting frames, it is characterized in that, also comprises:

The wind cooling component and the water cooling cooling component arranged in the case shell are used for wind cooling inside the case shell;

The forced cooling component cooperates with the wind cooling component to blow out low-temperature cold air. The forced cooling component includes a cooling source, a liquid cooling conduction mechanism and an extrusion guide mechanism. The cooling source is the liquid cooling conduction mechanism for cooling, and the extrusion guide mechanism passes through the extrusion The low temperature conduction is realized by means of the hydraulic cooling conduction mechanism.

2 . The computer cooling main chassis according to claim 1 , wherein the wind cooling assembly comprises an air intake mechanism and an air exhaust mechanism. 3 .

3. The computer heat dissipation main chassis according to claim 2, wherein the air intake mechanism comprises a refrigeration box arranged in the casing of the chassis, and a plurality of induced draft fans are fixed on the outside of the refrigeration box, and one side of the refrigeration box is The air inlet column is fixedly connected, the case shell is provided with an air inlet end, the air inlet end is provided with an air inlet, and the air inlet hood is fixedly connected between the air inlet column and the air inlet.

4 . The computer heat dissipation main chassis according to claim 2 , wherein the water-cooled heat dissipation assembly is arranged on the air blowing path of the wind power dissipation assembly. 5 .

5. The computer heat dissipation main chassis according to claim 4, wherein the water-cooled heat dissipation assembly comprises a circulation pipe arranged in the casing of the case, and both ends of the circulation pipe are fixedly connected with a heat exchange plate, and the heat exchange plate is located at the In the refrigeration box, a communication pipe is fixedly connected between the two heat exchange disks.

6 . The computer heat dissipation main chassis according to claim 5 , wherein the air exhaust mechanism comprises an exhaust fan, an installation sleeve is fixedly connected between the exhaust fan and the circulation pipe, and an exhaust end is provided on the casing of the chassis to exhaust air. 7 . The end is provided with an exhaust port, and the exhaust fan is located on one side of the exhaust port.

7 . The computer heat dissipation main box according to claim 4 or 5 , wherein the liquid cooling conduction mechanism comprises a refrigeration cover arranged on the heat exchange plate, and the refrigeration cover comprises a cooling cover fixedly arranged on the heat exchange plate 7 . An outer cover body and an inner cover body, the outer cover body is sleeved outside the inner cover body, a refrigeration cavity is arranged between the outer cover body and the inner cover body, and the refrigeration cavity is communicated with the inside of the heat exchange plate.

8 . The computer heat dissipation main box according to claim 7 , wherein the extrusion guide mechanism comprises an inner fixing frame fixedly arranged on the inner wall of the refrigerating box, the inner fixing frame penetrates through and is slidably connected to a moving rod, and the moving rod The two ends are respectively fixedly connected to the pressure cover and the pressure plate, one side of the pressure plate is provided with a cam, the first elastic piece is fixedly connected between the pressure plate and the inner fixing frame, and the outside of the refrigeration box is provided with a driving piece for driving the cam.

9 . The computer heat-dissipating main chassis according to claim 7 , wherein the cooling source comprises a semiconductor refrigerating sheet fixedly arranged on the refrigerating box, the cold end of the semiconductor refrigerating sheet is fixedly connected to a refrigerating plate, and the refrigerating plate extends to the cooling plate. 10 . intracavity.