CN215735025U - Novel PCB multilayer circuit board - Google Patents
Novel PCB multilayer circuit board Download PDFInfo
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- CN215735025U CN215735025U CN202122283222.7U CN202122283222U CN215735025U CN 215735025 U CN215735025 U CN 215735025U CN 202122283222 U CN202122283222 U CN 202122283222U CN 215735025 U CN215735025 U CN 215735025U
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- circuit board
- multilayer circuit
- novel pcb
- pcb multilayer
- fixed plate
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Abstract
The utility model discloses a novel PCB multilayer circuit board, which comprises a fixed plate, wherein a supporting plate is detachably arranged in the fixed plate, a circuit board is arranged at the upper end of the supporting plate, a bottom frame is detachably arranged on the lower end surface of the fixed plate, a limiting plate is fixedly arranged on the inner side wall of the bottom frame, and a heat dissipation mechanism is detachably arranged on the inner bottom wall of the bottom frame. And the connection relation among all parts is simple, the disassembly and the assembly are convenient, and the maintenance and the overhaul are facilitated.
Description
Technical Field
The utility model belongs to the technical field of multilayer circuit boards, and particularly relates to a novel PCB multilayer circuit board.
Background
The multilayer board is a multilayer wiring layer, and a dielectric layer is arranged between every two layers and can be made very thin. The multilayer circuit board has at least three conductive layers, two of which are on the outer surface and the remaining one is incorporated in an insulating board. The electrical connection between them is usually achieved by means of plated-through holes in the cross-section of the circuit board
However, various multilayer circuit boards in the market still have various problems, for example, the circuit boards in the prior art are difficult to dissipate heat in the actual using process, seriously affect the service life of the circuit board, and have great limitations, and therefore, a novel PCB multilayer circuit board is provided.
Disclosure of Invention
The present invention is directed to a novel PCB multi-layer circuit board to solve the above problems.
In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a novel PCB multilayer circuit board, includes the fixed plate, the inside demountable installation of fixed plate has the layer board, the circuit board is installed to the upper end of layer board, the lower terminal surface demountable installation of fixed plate has the chassis, the inside wall fixed mounting of chassis has the limiting plate, the interior diapire demountable installation of chassis has heat dissipation mechanism.
Preferably, the fixed plate is internally provided with a through groove and a mounting groove, the circuit board forms sliding connection with the fixed plate through the through groove, and the supporting plate mounting groove forms sliding connection with the fixed plate.
Preferably, the supporting plate is of an L-shaped structure, the inner bottom walls at the two ends of the circuit board are provided with clamping grooves, the circuit board is buckled with the supporting plate, and the outer end face of the supporting plate is provided with a handle groove.
Preferably, the circuit board is provided with at least four radiating holes, one radiating hole is formed in the circuit board, fifteen radiating holes are formed in the circuit board, and radiating fins are mounted in each radiating hole.
Preferably, the lower end face of the fixing plate is fixedly provided with a convex block, the upper end face of the bottom frame is provided with a clamping groove matched with the convex block in size, and the convex block is arranged in the clamping groove.
Preferably, the limiting plate is internally provided with a vent.
Preferably, the heat dissipation mechanism includes micro motor, the drive shaft is installed to micro motor's output, locating part and sleeve have been cup jointed by supreme down to the circumferential surface of drive shaft, locating part and telescopic up end equal fixed mounting have the flabellum, the bearing has been cup jointed to the upper end of drive shaft.
Preferably, the inner bottom wall of the bottom frame is provided with a mounting hole matched with the micro motor in size, and the micro motor is mounted in the mounting hole.
Preferably, the heat dissipation mechanism is symmetrically provided with three rows, and four rows.
Preferably, the fan blades adjacent to each other in the horizontal direction are arranged in a staggered manner.
Compared with the prior art, the utility model has the beneficial effects that:
(1) this novel PCB multilayer circuit board, can drive shaft and flabellum and be circular motion under micro motor's effect, and then can be toward the inside blast air of vent, the heat dissipation cooling purpose of circuit board can be realized to the cold wind of blowing, through setting up the locating part, sleeve and limiting plate can play the effect of protection flabellum, avoid droing of flabellum to cause the injury to the circuit board, and a circuit board sets up fifteen louvres, every louvre is inside all to install the fin, can realize radiating purpose through setting up the louvre, and at its inside promotion heat dispersion that installs the fin additional, the effect of use is good, and then can guarantee the life of circuit board effectively.
(2) This novel PCB multilayer circuit board, logical groove and mounting groove have been seted up to the inside of fixed plate, the circuit board forms sliding connection through leading to groove and fixed plate, layer board mounting groove forms sliding connection with the fixed plate, through setting up the installation stability that leads to the groove and can guarantee the circuit board, and be convenient for composite erection, the installation stability that can guarantee the layer board through setting up the mounting groove, and can guarantee the installation stability of circuit board under the effect of layer board, the lower terminal surface fixed mounting of fixed plate has the lug, the joint groove with lug size looks adaptation is seted up to the up end of chassis, the lug is installed at the joint inslot, can guarantee the stability of being connected of fixed plate and chassis through the lug with the cooperation in joint groove, and the dismouting of being convenient for.
Drawings
FIG. 1 is a perspective view of the present invention;
FIG. 2 is a front cross-sectional view of the present invention;
FIG. 3 is a perspective view of the connection between the circuit board and the supporting board according to the present invention;
fig. 4 is a perspective view of the heat dissipation mechanism of the present invention.
In the figure: 1. a fixing plate; 2. a support plate; 3. a circuit board; 4. heat dissipation holes; 5. a chassis; 6. a limiting plate; 7. a heat dissipation mechanism; 701. a micro motor; 702. a drive shaft; 703. a limiting member; 704. a sleeve; 705. a fan blade; 706. a bearing; 8. and a vent.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 to 4, the present invention provides a novel PCB multilayer circuit board, which includes a fixing plate 1, a supporting plate 2 detachably mounted inside the fixing plate 1, a circuit board 3 mounted at an upper end of the supporting plate 2, a bottom frame 5 detachably mounted at a lower end surface of the fixing plate 1, a limiting plate 6 fixedly mounted on an inner side wall of the bottom frame 5, and a heat dissipation mechanism 7 detachably mounted on an inner bottom wall of the bottom frame 5.
In this embodiment, preferably, logical groove and mounting groove have been seted up to the inside of fixed plate 1, circuit board 3 forms sliding connection through leading to groove and fixed plate 1, layer board 2 mounting groove forms sliding connection with fixed plate 1, lead to the installation stability that can guarantee circuit board 3 through setting up logical groove, and the aggregate erection of being convenient for, can guarantee the installation stability of layer board 2 through setting up the mounting groove, and can guarantee the installation stability of circuit board 3 under the effect of layer board 2, and the practicality is strong.
In this embodiment, it is preferred, layer board 2 is L type structure, and the inner diapire at circuit board 3's both ends is equipped with the joint groove, and circuit board 3 and layer board 2 looks lock joint can guarantee layer board 2 and circuit board 3's stability of being connected through setting up the joint groove, and the atress is even to can guarantee circuit board 3's installation stability, and layer board 2's outer terminal surface has seted up the handle groove, is convenient for take layer board 2 out through setting up the handle groove, thereby is convenient for realize circuit board 3's dismouting.
In this embodiment, preferably, the circuit board 3 is provided with at least four heat dissipation holes 4, one heat dissipation hole 4 is formed inside the circuit board 3, fifteen heat dissipation holes 4 are formed in one circuit board 3, and a heat dissipation fin is installed inside each heat dissipation hole 4, the purpose of heat dissipation can be achieved by arranging the heat dissipation holes 4, the heat dissipation performance can be further improved by installing the heat dissipation fins inside the heat dissipation holes, the use effect is good, and the service life of the circuit board 3 can be effectively guaranteed.
In this embodiment, preferably, the lower terminal surface fixed mounting of fixed plate 1 has the lug, and the joint groove with lug size looks adaptation is seted up to the up end of chassis 5, and the lug is installed at the joint inslot, can guarantee fixed plate 1 and chassis 5's stability of being connected through the lug with the cooperation in joint groove, and the dismouting of being convenient for, can guarantee the installation stability of heat dissipation mechanism 7 through setting up chassis 5 to radiating effect can be guaranteed effectively.
In this embodiment, preferably, vent 8 has been seted up to limiting plate 6's inside, is convenient for heat dissipation mechanism 7 toward circuit board 3 blast air through setting up vent 8 to be convenient for realize the heat dissipation cooling.
In this embodiment, preferably, the heat dissipation mechanism 7 includes a micro motor 701, a driving shaft 702 is installed at an output end of the micro motor 701, a limiting member 703 and a sleeve 704 are sleeved on a circumferential surface of the driving shaft 702 from bottom to top, fan blades 705 are fixedly installed on upper end surfaces of the limiting member 703 and the sleeve 704, a bearing 706 is sleeved on an upper end of the driving shaft 702, when the circuit board 3 is used, the micro motor 701 is started, the driving shaft 702 and the fan blades 705 can be driven to do circumferential motion under the action of the micro motor 701, and then air can be blown towards the inside of the vent 8, the purpose of heat dissipation and temperature reduction of the circuit board 3 can be achieved by blown cold air, and the limiting member 703, the sleeve 704 and the limiting plate 6 can play a role in protecting the fan blades 705, so that the circuit board 3 is prevented from being damaged due to falling of the fan blades 705.
In this embodiment, preferably, the mounting hole of micro motor 701 size looks adaptation is seted up to the inner bottom wall of chassis 5, and micro motor 701 installs in the mounting hole, can guarantee micro motor 701's installation stability through setting up the mounting hole, makes it can not take place to drop, can not influence actual result of use, and the practicality is strong.
In this embodiment, preferably, the heat dissipation mechanism 7 is symmetrically provided with three rows, and one row is provided with four, and the heat dissipation quality and effect can be ensured by arranging a plurality of heat dissipation mechanisms 7, so that the practicability is high.
In this embodiment, it is preferable that the blades 705 adjacent to each other in the horizontal direction are arranged in a staggered manner, and the influence of the collision between the blades 705 on the actual heat dissipation effect can be avoided by arranging the blades 705 in a staggered manner.
The working principle and the using process of the utility model are as follows: when the device is used, the circuit board 3 is inserted into the through groove of the fixing plate 1, the supporting plate 2 is inserted below the circuit board 3, the mounting stability of the circuit board 3 can be realized, the mounted components are inserted into the upper end of the bottom frame 5, and when the components need to be dismounted, the reverse operation is performed;
when the heat dissipation cooling needs to be carried out, micro motor 701 is started, the driving shaft 702 and fan blades 705 can be driven to do circular motion under the action of micro motor 701, and further internal blowing towards a ventilation opening 8 can be achieved, the heat dissipation cooling purpose of a circuit board 3 can be achieved through blown cold air, and the sleeve 704 and the limiting plate 6 can play the role of protecting the fan blades 705, the fan blades 705 are prevented from falling off to damage the circuit board 3, fifteen heat dissipation holes 4 are formed in one circuit board 3, cooling fins are arranged inside each heat dissipation hole 4, the heat dissipation purpose can be achieved through the heat dissipation holes 4, the heat dissipation performance can be further improved by additionally arranging the cooling fins inside the heat dissipation holes, the use effect is good, and the service life of the circuit board 3 can be effectively guaranteed.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. A novel PCB multilayer circuit board, includes fixed plate (1), its characterized in that: the inside demountable installation of fixed plate (1) has layer board (2), circuit board (3) are installed to the upper end of layer board (2), the lower terminal surface demountable installation of fixed plate (1) has chassis (5), the inside wall fixed mounting of chassis (5) has limiting plate (6), the interior diapire demountable installation of chassis (5) has heat dissipation mechanism (7).
2. A novel PCB multilayer circuit board according to claim 1, characterized in that: the inside of fixed plate (1) has been seted up and has been led to groove and mounting groove, circuit board (3) form sliding connection through leading to groove and fixed plate (1), layer board (2) mounting groove forms sliding connection with fixed plate (1).
3. A novel PCB multilayer circuit board according to claim 1, characterized in that: the supporting plate (2) is of an L-shaped structure, the inner bottom walls at two ends of the circuit board (3) are provided with clamping grooves, the circuit board (3) is buckled with the supporting plate (2), and the outer end face of the supporting plate (2) is provided with a handle groove.
4. A novel PCB multilayer circuit board according to claim 1, characterized in that: the circuit board (3) is provided with at least four radiating holes (4), one radiating hole (4) is formed in the circuit board (3), fifteen radiating holes (4) are formed in the circuit board (3), and radiating fins are arranged in each radiating hole (4).
5. A novel PCB multilayer circuit board according to claim 1, characterized in that: the lower end face of the fixing plate (1) is fixedly provided with a convex block, the upper end face of the bottom frame (5) is provided with a clamping groove matched with the size of the convex block, and the convex block is arranged in the clamping groove.
6. A novel PCB multilayer circuit board according to claim 1, characterized in that: and a ventilation opening (8) is formed in the limiting plate (6).
7. A novel PCB multilayer circuit board according to claim 1, characterized in that: the heat dissipation mechanism (7) comprises a micro motor (701), a driving shaft (702) is installed at the output end of the micro motor (701), a limiting piece (703) and a sleeve (704) are sleeved on the circumferential surface of the driving shaft (702) from bottom to top, fan blades (705) are fixedly installed on the upper end faces of the limiting piece (703) and the sleeve (704), and a bearing (706) is sleeved on the upper end of the driving shaft (702).
8. A novel PCB multilayer circuit board according to claim 1, characterized in that: the inner bottom wall of the bottom frame (5) is provided with a mounting hole matched with a micro motor (701) in size, and the micro motor (701) is mounted in the mounting hole.
9. A novel PCB multilayer circuit board according to claim 7, characterized in that: the heat dissipation mechanism (7) is symmetrically provided with three rows, and four rows.
10. A novel PCB multilayer circuit board according to claim 7, characterized in that: the fan blades (705) adjacent in the horizontal direction are arranged in a staggered mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122283222.7U CN215735025U (en) | 2021-09-22 | 2021-09-22 | Novel PCB multilayer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122283222.7U CN215735025U (en) | 2021-09-22 | 2021-09-22 | Novel PCB multilayer circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215735025U true CN215735025U (en) | 2022-02-01 |
Family
ID=80022845
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122283222.7U Active CN215735025U (en) | 2021-09-22 | 2021-09-22 | Novel PCB multilayer circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215735025U (en) |
-
2021
- 2021-09-22 CN CN202122283222.7U patent/CN215735025U/en active Active
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