CN211531597U - High heat dissipation multilayer circuit board - Google Patents
High heat dissipation multilayer circuit board Download PDFInfo
- Publication number
- CN211531597U CN211531597U CN201921248832.XU CN201921248832U CN211531597U CN 211531597 U CN211531597 U CN 211531597U CN 201921248832 U CN201921248832 U CN 201921248832U CN 211531597 U CN211531597 U CN 211531597U
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- circuit board
- multilayer circuit
- heat dissipation
- fixed
- limiting frame
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Abstract
The utility model discloses a high heat dissipation multilayer circuit board, including multilayer circuit board body, multilayer circuit board body sets up the inside top at the supporting seat, the net frame is installed to the lateral wall intermediate position of supporting seat is inlayed, the inside top of supporting seat is fixed with the fixed station, the one end of bracing piece is rotated and is connected with supplementary blade, the exhaust vent has been seted up to the upper surface of fixed station, the top and the inside of mounting groove are fixed with spacing frame in surface and the spacing frame in inside respectively, the slider of multilayer circuit board body both sides installation passes through damping spring and connects in the spout, the inside of the spacing frame in surface and the spacing frame in inside all reserves the groove of wearing. According to the high-heat-dissipation multilayer circuit board, when the main blades are used for dissipating heat of the multilayer circuit board body in rotation, the auxiliary blades inside the fixed table can dissipate heat of a motor in operation, and at the moment, the auxiliary blades outside the fixed table can accelerate heat discharge of the heat dissipating fins in rotation.
Description
Technical Field
The utility model relates to a circuit board technical field specifically is a high heat dissipation multilayer circuit board.
Background
The multilayer circuit board is a multilayer wiring layer, a dielectric layer is arranged between every two layers, the dielectric layer can be made very thin, the multilayer circuit board is provided with at least three conductive layers, two of which are on the outer surface and the remaining one is incorporated in an insulating board, the electrical connections between which are usually made by means of plated-through holes in the cross-section of the board, the surface of the multilayer board being able to mount a plurality of electronic components, therefore, the multilayer circuit board will bear more heat dissipated by the electronic components, and most of the existing multilayer circuit boards need to be cooled by the heat dissipation device in the equipment when being installed in the equipment, so the efficiency is low, the heat dissipation fan does not have the heat dissipation function, and when the heat dissipation fan in the external equipment dissipates heat of the multilayer circuit board, because the wind that the cooling fan blew off has certain dynamics, also can make multilayer circuit board stability receive the influence. Aiming at the problems, the novel design is carried out on the basis of the original multilayer circuit board.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
The utility model provides a not enough to prior art, the utility model provides a high heat dissipation multilayer circuit board has solved present majority multilayer circuit board and has all need dispel the heat with the help of the heat abstractor in the equipment when installing in equipment, and efficiency is lower, and it self also has radiating function to heat dissipation fan in the external equipment is when dispelling the heat to multilayer circuit board, because the wind that the heat dissipation fan blew off has certain dynamics, also can make multilayer circuit board stability receive the problem of influence.
(II) technical scheme
In order to achieve the above object, the utility model provides a following technical scheme: a high-heat-dissipation multilayer circuit board comprises a multilayer circuit board body, wherein the multilayer circuit board body is arranged above the inner part of a supporting seat, heat dissipation fins are arranged at the bottom of the multilayer circuit board body, a net frame is embedded and installed at the middle position of the side wall of the supporting seat, heat dissipation ports symmetrically arranged on two sides of the net frame are formed in the inner side wall of the supporting seat, a fixed table is fixed above the inner part of the supporting seat, supporting rods are welded on the upper surface and the lower surface of the inner part of the fixed table, one end of each supporting rod is rotatably connected with an auxiliary blade, the surface of each supporting rod is provided with a connecting spring in a penetrating mode, an air outlet hole is formed in the upper surface of the fixed table, a main blade arranged at the middle position in the fixed table is rotatably installed on a motor fixed in an installation groove, the installation groove is formed in the, and the inner side walls of the surface limiting frame and the inner limiting frame are both provided with empty grooves, the inner springs mounted inside the empty grooves are fixedly welded with one ends of the supporting blocks, the sliding blocks mounted on two sides of the multilayer circuit board body are connected in the sliding grooves through damping springs, the sliding grooves are symmetrically formed above the inner side walls of the supporting seat, and penetrating grooves are reserved inside the surface limiting frame and the inner limiting frame.
Preferably, the multilayer circuit board body and the sliding block are of an integrated structure, the sliding block is elastically and slidably connected with the sliding groove through a damping spring, and the lower surface of the sliding groove is higher than the highest position of the upper surface of the fixing table.
Preferably, the longitudinal section of the heat dissipation port is in an inverted trapezoidal shape, and the heat dissipation port is located between the multilayer circuit board body and the fixing table.
Preferably, the longitudinal section of the fixed station is of a trapezoidal structure, the upper surface of the fixed station is arc-shaped, and the fixed station is communicated with the supporting seat through the air outlet.
Preferably, the number of the auxiliary blades is four, the auxiliary blades are arranged on the fixed table in pairs and are symmetrically arranged into a group on the inner surface and the outer surface of the fixed table respectively, the positions of the auxiliary blades arranged above the outer surface of the fixed table correspond to the positions of the radiating fins, and the positions of the auxiliary blades arranged on the inner surface of the fixed table correspond to the positions of the motors.
Preferably, the cross section of the surface limiting frame and the cross section of the inner limiting frame are both of circular ring structures, the inner diameter of the through groove formed in the surface limiting frame and the cross section of the inner limiting frame are larger than the length of the motor, and the motor is in through connection with the surface limiting frame and the inner limiting frame through the through groove.
Preferably, the empty groove and the through groove are communicated with each other, the empty groove and the abutting block form an elastic telescopic structure through an internal spring, and four groups of elastic telescopic structures are arranged on the inner side wall of the through groove at equal angles.
(III) advantageous effects
The utility model provides a high heat dissipation multilayer circuit board. The method has the following beneficial effects:
(1) this high heat dissipation multilayer circuit board, setting through damping spring, when multilayer circuit board body receives the vibration influence, damping spring and slider then can mutually support the stability of guaranteeing multilayer circuit board body, and also can not influenced by the vibration sense of motor when being rotated radiating by the blade in order to guarantee multilayer circuit board body, the motor is arranged in spacing frame, the piece of supporting of the inside extending structure of spacing frame can cushion the vibration sense of producing the motor under the elastic force of inside spring and offset, thereby make the device's overall stability better, avoid the motor to produce the influence to multilayer circuit board body.
(2) This high heat dissipation multilayer circuit board, setting through main blade and auxiliary vane, the main blade rotates under the drive of motor and produces wind-force, and give the auxiliary vane of the inside and outside installation of fixed station with wind-force transmission, this kind of setting makes main blade when rotating for the multilayer circuit board body is radiating, the inside auxiliary vane of fixed station can dispel the heat to the motor in service, and the outside auxiliary vane of fixed station also can accelerate the discharge of the heat on the fin in rotating this moment, this kind of setting makes the radiating efficiency of multilayer circuit board body obtain the improvement, the functionality is better.
Drawings
FIG. 1 is a schematic front sectional view of the present invention;
FIG. 2 is an enlarged schematic view of the structure at A of FIG. 1 according to the present invention;
FIG. 3 is an enlarged schematic view of the structure of FIG. 1 at B according to the present invention;
fig. 4 is a schematic view of the top cross-sectional structure of the limiting frame of the present invention.
In the figure: 1. a multilayer circuit board body; 2. a supporting seat; 3. a heat sink; 4. a screen frame; 5. a heat dissipation port; 6. a fixed table; 7. a support bar; 8. a connecting spring; 9. an auxiliary blade; 10. an air outlet; 11. a main blade; 12. mounting grooves; 13. a motor; 14. a surface limit frame; 15. an inner limiting frame; 16. an empty groove; 17. an inner spring; 18. a resisting block; 19. a slider; 20. a damping spring; 21. a chute; 22. and (6) penetrating through the groove.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
As shown in fig. 1-4, the utility model provides a technical solution: a high heat dissipation multilayer circuit board comprises a multilayer circuit board body 1, a supporting seat 2, a heat dissipation sheet 3, a net frame 4, a heat dissipation port 5, a fixed platform 6, a supporting rod 7, a connecting spring 8, an auxiliary blade 9, an air outlet 10, a main blade 11, a mounting groove 12, a motor 13, a surface limiting frame 14, an internal limiting frame 15, a hollow groove 16, an internal spring 17, a supporting block 18, a sliding block 19, a damping spring 20, a sliding groove 21 and a through groove 22, wherein the multilayer circuit board body 1 is arranged above the inside of the supporting seat 2, the heat dissipation sheet 3 is arranged at the bottom of the multilayer circuit board body 1, the net frame 4 is embedded and mounted at the middle position of the side wall of the supporting seat 2, the heat dissipation ports 5 symmetrically arranged at two sides of the net frame 4 are arranged on the internal side wall of the supporting seat 2, the fixed platform 6 is fixed above the inside of the supporting seat 2, the supporting rod 7 is welded on, the surface of the supporting rod 7 is provided with a connecting spring 8 in a penetrating way, the upper surface of the fixed table 6 is provided with an air outlet 10, a main blade 11 arranged in the middle of the inner part of the main blade is rotatably arranged on a motor 13 fixed in the mounting groove 12, the mounting groove 12 is arranged on the inner surface of the supporting seat 2, a surface limiting frame 14 and an inner limiting frame 15 are respectively fixed above and inside the mounting groove 12, the inner side walls of the surface limiting frame 14 and the inner limiting frame 15 are both provided with a hollow groove 16, an inner spring 17 arranged in the hollow groove 16 is welded and fixed with one end of a resisting block 18, sliding blocks 19 arranged on two sides of the multilayer circuit board body 1 are connected in a sliding groove 21 through damping springs 20, the sliding grooves 21 are symmetrically arranged above the inner side wall of the supporting seat 2, and penetrating grooves 22 are reserved in the surface limiting frame 14 and the;
the multilayer circuit board body 1 and the slide block 19 are of an integrated structure, the slide block 19 is elastically and slidably connected with the slide groove 21 through the damping spring 20, the lower surface of the slide groove 21 is higher than the highest position of the upper surface of the fixed table 6, and the arrangement ensures that the bottom of the multilayer circuit board body 1 does not generate the condition of attaching friction with the highest position of the fixed table 6;
the longitudinal section of the heat dissipation port 5 is in an inverted trapezoid shape, and the heat dissipation port 5 is positioned between the multilayer circuit board body 1 and the fixed table 6, so that the auxiliary blade 9 can discharge heat on the heat dissipation fins 3 from the heat dissipation port 5 in the rotation process;
the longitudinal section of the fixed platform 6 is in a trapezoidal structure, the upper surface of the fixed platform 6 is in an arc shape, the fixed platform 6 is communicated with the supporting seat 2 through the air outlet 10, and the wind energy blown out by the main blade 11 can be smoothly blown to the auxiliary blade 9 due to the shape;
the auxiliary blades 9 are arranged on the fixed table 6 in four, are symmetrical in pairs to form a group and are respectively arranged on the inner surface and the outer surface of the fixed table 6, the position of the auxiliary blade 9 arranged above the outer surface of the fixed table 6 corresponds to the position of the radiating fin 3, the position of the auxiliary blade 9 arranged on the inner surface of the fixed table 6 corresponds to the position of the motor 13, and the auxiliary blade 9 can rotate along with the rotation of the main blade 11 and cool the radiating fin 3 and the motor 13;
the cross sections of the surface limiting frame 14 and the inner limiting frame 15 are both in circular ring structures, the inner diameters of through grooves 22 formed in the surface limiting frame 14 and the inner limiting frame 15 are larger than the length of the motor 13, the motor 13 is in penetrating connection with the surface limiting frame 14 and the inner limiting frame 15 through the through grooves 22, and the limiting frames can play a role in limiting and stabilizing the motor 13;
the empty groove 16 is communicated with the through groove 22, the empty groove 16 and the abutting block 18 form an elastic telescopic structure through the internal spring 17, four groups of elastic telescopic structures are arranged on the inner side wall of the through groove 22 at equal angles, the abutting block 18 can be attached to the surface of the motor 13, and the shock generated by the motor 13 is buffered and offset under the elastic acting force of the internal spring 17.
When the device is used, the motor 13 is also connected with a related circuit after the device is installed at a proper position in equipment, when an electronic component on the multilayer circuit board body 1 runs, the motor 13 is opened, the motor 13 drives the main blade 11 to rotate, part of wind power generated in the rotation of the main blade 11 is blown to the bottom of the multilayer circuit board body 1 through the air outlet 10, the wind power can be blown to the auxiliary blades 9 in an inclined manner due to the arc-shaped structure on the upper surface of the fixed table 6, the auxiliary blades 9 arranged inside and outside the fixed table 6 rotate along with the rotation of the main blade 11, the heat on the radiating fins 3 is accelerated to be discharged during the rotation of the external auxiliary blades 9, and the heat dissipation and cooling of the motor 13 can be realized during the rotation of the internal auxiliary blades 9;
a certain vibration occurs during the operation of the motor 13, the sliding block 19 mounted on the multi-layer circuit board body 1 can slide up and down in the sliding groove 21 and is kept stable by the damping spring 20, and since the motor 13 is connected with the limiting frame through the through groove 22 and the outer side wall of the motor 13 is also attached to the abutting block 18, the abutting block 18 is subjected to the vibration pressure of the motor 13, so that the internal spring 17 is deformed, and the abutting block 18 can buffer and offset the vibration generated by the motor 13 under the elastic force of the internal spring 17, and the contents not described in detail in the present specification belong to the prior art known to those skilled in the art.
In conclusion, the high heat dissipation multilayer circuit board can be obtained, through the arrangement of the damping spring 20, when the multilayer circuit board body 1 is affected by vibration, the damping spring 20 and the sliding block 19 can be mutually matched to ensure the stability of the multilayer circuit board body 1, and in order to ensure that the multilayer circuit board body 1 is not affected by the vibration sense of the motor 13 while being rotated and dissipated heat by the blades, the motor 13 is positioned in the limiting frame, the abutting block 18 of the telescopic structure in the limiting frame can buffer and offset the vibration sense generated by the motor 13 under the elastic acting force of the internal spring 17, so that the overall stability of the device is better, the influence of the motor 13 on the multilayer circuit board body 1 is avoided, through the arrangement of the main blade 11 and the auxiliary blade 9, the main blade 11 is rotated under the driving of the motor 13 to generate wind power, and the wind power is transmitted to the auxiliary blade 9 installed inside and outside the fixing, the arrangement enables the main blades 11 to radiate heat of the multilayer circuit board body 1 in rotation, meanwhile, the auxiliary blades 9 inside the fixed table 6 can radiate heat of the running motor 13, and at the moment, the auxiliary blades 9 outside the fixed table 6 can accelerate heat discharge on the radiating fins 3 in rotation, so that the arrangement enables the radiating efficiency of the multilayer circuit board body 1 to be improved, and the functionality is good.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The utility model provides a high heat dissipation multilayer circuit board, includes multilayer circuit board body, its characterized in that: the multilayer circuit board body is arranged above the inside of the supporting seat, the bottom of the multilayer circuit board body is provided with radiating fins, the middle position of the side wall of the supporting seat is embedded with a net frame, radiating holes symmetrically arranged on two sides of the net frame are formed in the side wall of the inside of the supporting seat, a fixed table is fixed above the inside of the supporting seat, supporting rods are welded on the upper surface and the lower surface of the inside of the fixed table, one end of each supporting rod is rotatably connected with an auxiliary blade, the surface of each supporting rod is provided with a connecting spring in a penetrating manner, the upper surface of the fixed table is provided with an air outlet, a main blade arranged at the middle position of the inside of the fixed table is rotatably installed on a motor fixed in the mounting groove, the mounting groove is formed in the inside surface of the supporting seat, a surface limiting frame and an inside limiting frame are respectively fixed above and inside the, and the inner spring arranged in the empty groove is welded and fixed with one end of the abutting block, the sliding blocks arranged on two sides of the multilayer circuit board body are connected in the sliding groove through the damping spring, the sliding groove is symmetrically arranged above the inner side wall of the supporting seat, and penetrating grooves are reserved in the surface limiting frame and the inner limiting frame.
2. The high heat dissipation multilayer circuit board of claim 1, wherein: the multilayer circuit board body and the sliding block are of an integrated structure, the sliding block is elastically and slidably connected with the sliding groove through the damping spring, and the lower surface of the sliding groove is higher than the highest position of the upper surface of the fixing table.
3. The high heat dissipation multilayer circuit board of claim 1, wherein: the longitudinal section of the heat dissipation opening is in an inverted trapezoidal shape, and the heat dissipation opening is located between the multilayer circuit board body and the fixing table.
4. The high heat dissipation multilayer circuit board of claim 1, wherein: the longitudinal section of the fixed station is of a trapezoidal structure, the upper surface of the fixed station is arc-shaped, and the fixed station is communicated with the supporting seat through the air outlet hole.
5. The high heat dissipation multilayer circuit board of claim 1, wherein: the auxiliary blades are arranged on the fixed table in four, the auxiliary blades are symmetrical in pairs to form a group and are respectively arranged on the inner surface and the outer surface of the fixed table, the positions of the auxiliary blades arranged above the outer surface of the fixed table correspond to the positions of the radiating fins, and the positions of the auxiliary blades arranged on the inner surface of the fixed table correspond to the positions of the motors.
6. The high heat dissipation multilayer circuit board of claim 1, wherein: the cross section of the surface limiting frame and the cross section of the inner limiting frame are both of circular ring-shaped structures, the inner diameter of the through groove formed in the surface limiting frame and the cross section of the inner limiting frame are larger than the length of the motor, and the motor is in through connection with the surface limiting frame and the inner limiting frame through the through groove.
7. The high heat dissipation multilayer circuit board of claim 1, wherein: the dead slot and the through slot are communicated with each other, the dead slot and the abutting block form an elastic telescopic structure through an internal spring, and four groups of elastic telescopic structures are arranged on the inner side wall of the through slot at equal angles.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921248832.XU CN211531597U (en) | 2019-08-05 | 2019-08-05 | High heat dissipation multilayer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921248832.XU CN211531597U (en) | 2019-08-05 | 2019-08-05 | High heat dissipation multilayer circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211531597U true CN211531597U (en) | 2020-09-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921248832.XU Expired - Fee Related CN211531597U (en) | 2019-08-05 | 2019-08-05 | High heat dissipation multilayer circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211531597U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112636716A (en) * | 2020-12-28 | 2021-04-09 | 姜国强 | Quartz crystal filter with impact-resistant structure and use method thereof |
-
2019
- 2019-08-05 CN CN201921248832.XU patent/CN211531597U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112636716A (en) * | 2020-12-28 | 2021-04-09 | 姜国强 | Quartz crystal filter with impact-resistant structure and use method thereof |
| CN112636716B (en) * | 2020-12-28 | 2024-01-12 | 石家庄奥东电子科技有限公司 | Quartz crystal filter with impact-resistant structure and application method thereof |
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Legal Events
| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200918 Termination date: 20210805 |