CN217563849U

CN217563849U - High-heat-dissipation double-layer PCB assembly

Info

Publication number: CN217563849U
Application number: CN202221394023.1U
Authority: CN
Inventors: 陈加志; 张君超
Original assignee: Suzhou Verali Electronic Technology Co ltd
Current assignee: Suzhou Verali Electronic Technology Co ltd
Priority date: 2022-06-07
Filing date: 2022-06-07
Publication date: 2022-10-11
Anticipated expiration: 2032-06-07

Abstract

The utility model discloses a high radiating double-deck PCB board subassembly, including an upper fixed plate, an under fixed plate, all be equipped with the installation cavity in upper fixed plate and the under fixed plate, the inside a week of installation cavity all is equipped with the heat conduction framed panel, and the inside of heat conduction framed panel is equipped with first PCB board and second PCB board respectively, rotate the inside that inhales outside cold wind to the cold wind chamber through the dustproof air intake that sets up at miniature cooling fan, the cold wind that will get into to cold wind intracavity portion through miniature cooling fan's suction after external cold wind gets into to the cold wind chamber exports from the air inlet through-hole that sets up, and blow the radiating effect of cooling down on first PCB board and the second PCB board with the cold wind through dustproof play tuber plate, and can spread the heat on first PCB board and the second PCB board fast to the outside, can also blow away the dust removal effect to the dust on the PCB board subassembly simultaneously, thereby avoid the heat to spread too slowly and lead to the problem that the appearance high temperature of first PCB board and second PCB board burns out the short circuit.

Description

High-heat-dissipation double-layer PCB assembly

Technical Field

The utility model belongs to the technical field of the PCB board, concretely relates to high radiating double-deck PCB board subassembly.

Background

Double-deck PCB board subassembly is carrying out the use, because the structure is comparatively fixed between the double-deck PCB board, produces a large amount of heats easily in the middle part of the double-deck PCB board, and is unfavorable for the heat dissipation, leads to double-deck PCB board performance and durability to reduce.

Therefore, the high-heat-dissipation double-layer PCB assembly with the bulletin number of CN210298195U comprises an upper PCB, wherein a lower PCB is arranged on the lower portion of the upper PCB, mounting plates are arranged on the edges of the upper PCB and the lower PCB, and the mounting plates, the upper PCB and the lower PCB are of an integrated structure.

To above-mentioned this high radiating double-deck PCB board subassembly, though through last PCB board and down set up connecting piece and fixing base between the PCB board, be convenient for nimble distance of adjusting between PCB board and the lower PCB board, make the heat dissipation between PCB board and the lower PCB board separate the sky layer and can dispel the heat fast to the heat, but its still has following comparatively obvious defect in the use: the PCB assembly only utilizes the heat dissipation spacing layer which is arranged by the PCB assembly to dissipate heat through natural wind, the heat dissipation cooling mode is slow in heat diffusion and discharge of the PCB assembly, the heat dissipation efficiency is low, and therefore the problem that the PCB assembly is overheated and burns out faults can be caused.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a high radiating double-deck PCB board subassembly to solve the problem that proposes in the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a high radiating double-deck PCB board subassembly, includes upper fixed plate, bottom plate, all be equipped with the installation cavity in upper fixed plate and the bottom plate, inside a week of installation cavity all is equipped with the heat conduction framed bent, and the inside of heat conduction framed bent is equipped with first PCB board and second PCB board respectively, the both sides middle part of upper fixed plate is run through and is equipped with first bearing, the inside of first bearing all is equipped with the dwang, the inside screw thread chamber that all is equipped with in bottom of dwang, be equipped with accommodate the lead screw in the screw thread chamber, the surface of dwang all fixed the cup joint have the second bearing, the external fixation of second bearing has the adapter sleeve, one side of adapter sleeve all is fixed with the grafting piece, the equal activity of going up of grafting piece has assembled plug-in, assembly plug-in medial extremity is fixed with heat dissipation mechanism.

The heat dissipation mechanism comprises an insulating heat dissipation box, a cavity is arranged inside the insulating heat dissipation box, double-layer partition plates are arranged inside the cavity, a cold air cavity is arranged inside the double-layer partition plates, dustproof air inlets are formed in the left end and the right end of the inside of the cold air cavity in a penetrating mode, air inlet through holes are formed in the upper end and the lower end of the inside of the cold air cavity in equal intervals, miniature heat dissipation fans are installed at the upper end and the lower end of the outside of the double-layer partition plates, dustproof air outlet plates are arranged in the upper end and the lower end of the inside of the insulating heat dissipation box in a penetrating mode, when high temperature occurs to a first PCB and a second PCB, the miniature heat dissipation fans are started, the upper end and the lower end of the double-layer partition plates are all arranged, the miniature heat dissipation fans rotate to suck outside cold air into the cold air cavity through the dustproof air inlets, cold air entering the cold air cavity to the cold air cavity through the miniature heat dissipation fans is output from the air inlet through the arranged air through the air outlet holes, the cold air inlet through the dustproof plates blow the cold air to the first PCB and the second PCB, heat dissipation plates can be quickly diffused to the PCB, and accordingly, the PCB can be blown to the PCB, the PCB can be quickly diffused to prolong the service life of the PCB, and the PCB can be quickly blown to the PCB.

The utility model discloses a heat dissipation mechanism, including heat dissipation mechanism, first PCB board and second PCB board, the equal symmetry of upper and lower extreme avris of heat dissipation mechanism is equipped with rubber anticollision piece, the both ends of heat dissipation mechanism and the inboard one end fixed connection who establishes the assembly plug-in components, this is moving up and down between first PCB board and second PCB board at heat dissipation mechanism and is adjusted the in-process, the rubber anticollision piece that the accessible set up avoids heat dissipation mechanism in the in-process that reciprocates and first PCB board and second PCB board be qualified for the next round of competitions the problem of striking, thereby play the effect that the protection was supported, and under heat dissipation mechanism mutually supported through assembly plug-in components and plug-in block, can be quick dismantlement to heat dissipation mechanism in the later stage, thereby realize the effect of clearing up its surperficial dust.

The bottom of an adjusting screw rod arranged in the threaded cavity is fixedly connected with the left side and the right side of the end face of the lower fixing plate, supporting strips are arranged on the two sides of the bottom of the lower fixing plate, the rotating rod enables the adjusting rod to rotate through a first bearing on an adjusting rod, and meanwhile, the upper fixing plate and the heat dissipation mechanism move downwards, so that the function of adjusting the distance between the first PCB and the second PCB can be achieved, and the cooling efficiency of the double-layer PCB assembly is improved.

One side of the assembly plug-in components is provided with an insertion groove, the inner wall of the insertion groove is provided with a damping layer, the assembly plug-in components are fixedly inserted and connected through damping matched between the damping layer and the insertion blocks, the heat dissipation mechanism can be disassembled and assembled through the assembly plug-in components, and the stability of the heat dissipation mechanism after installation can be improved through the arrangement of the damping layer.

The upper end face and the lower end face of the heat dissipation mechanism are respectively arranged corresponding to one face of the first PCB and one face of the second PCB, so that the first PCB and the second PCB can be quickly cooled, and the heat dissipation efficiency of the first PCB and the second PCB is improved.

The utility model discloses a technological effect and advantage: this high radiating double-deck PCB board subassembly, when high temperature appears in first PCB board and second PCB board, start the miniature cooling fan that the lower extreme all set up on the double-deck baffle, make its miniature cooling fan rotate and inhale outside cold wind to the inside in cold wind chamber through the dustproof air intake that sets up, the cold wind that gets into to cold wind intracavity portion will be exported from the air inlet through-hole that sets up through miniature cooling fan's suction after external cold wind gets into to the cold wind chamber, and blow the radiating effect of cooling down on first PCB board and the second PCB board through dustproof air-out board, and can spread the heat on first PCB board and the second PCB board to the outside fast, can also blow away the effect that removes dust to the dust on the PCB board subassembly simultaneously, thereby avoid the heat to spread too slowly and lead to the problem that the appearance high temperature of first PCB board and second PCB board burns out the short circuit, and then improve the quick refrigerated function of heat dissipation mechanism to this PCB board subassembly, and improve the life of PCB board subassembly simultaneously.

In the adjustment process that reciprocates is carried out at heat dissipation mechanism between first PCB board and second PCB board, the rubber anticollision piece that the accessible set up avoids heat dissipation mechanism at the in-process that reciprocates and the problem of the striking of being qualified for the next round of competitions of first PCB board and second PCB board, thereby play the effect that the protection was supported, and under heat dissipation mechanism mutually supported through assembly plug-in components and plug-in block, can be in the later stage to the quick dismantlement of heat dissipation mechanism, thereby realize the effect of clearing up its surperficial dust, heat dissipation mechanism carries out the function of dismouting to it through the assembly plug-in components, and can make heat dissipation mechanism improve stability after the installation through the setting on damping layer.

Drawings

Fig. 1 is a schematic structural view of the present invention;

FIG. 2 is a partial top view of the present invention;

FIG. 3 is a partial enlarged view of the heat dissipation mechanism of the present invention;

fig. 4 is a front view of the insertion block of the present invention.

In the figure: 1. an upper fixing plate; 2. a lower fixing plate; 3. a mounting cavity; 4. a heat conductive frame plate; 5. a first PCB board; 6. a second PCB board; 7. a first bearing; 8. rotating the rod; 9. a threaded cavity; 10. adjusting the screw rod; 11. a second bearing; 12. connecting sleeves; 13. an insertion block; 14. assembling the plug-in; 15. a heat dissipation mechanism; 16. an insulating heat dissipation box; 17. a cavity; 18. a double-layer partition plate; 19. a cold air chamber; 20. a dustproof air inlet; 21. an air inlet through hole; 22. a miniature heat radiation fan; 23. a dustproof air outlet plate; 24. a rubber anti-collision block; 25. supporting the ribbon board; 26. a damping layer.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides a technical solution: the utility model provides a high radiating double-deck PCB board subassembly, including an upper fixed plate 1, bottom plate 2, all be equipped with installation cavity 3 in upper fixed plate 1 and the bottom plate 2, installation cavity 3's inside a week all is equipped with heat conduction frame board 4, can adsorb the effect of deriving to the heat of double-deck PCB board subassembly itself, and the inside of heat conduction frame board 4 is equipped with first PCB board 5 and second PCB board 6 respectively, can be timely carry out the conduction to the heat of first PCB board 5 and second PCB board 6 and adsorb and exhaust effect, the upper and lower terminal surface of heat dissipation mechanism 15 respectively with establish first PCB board 5, the one side of second PCB board 6 is corresponding to be set up, the improvement is to the cooling heat dissipation of first PCB board 5 and second PCB board 6, the both sides middle part of upper fixed plate 1 runs through and is equipped with first bearing 7, can make dwang 8 carry out the pivoted effect in upper fixed plate 1 middle part.

The inside of first bearing 7 all is equipped with dwang 8, can adjust the interval between the double-deck PCB board subassembly, accelerate radiating effect, the inside screw thread chamber 9 that all is equipped with in bottom of dwang 8, can make accommodate the lead screw 10 and screw thread rotation between it, be equipped with accommodate the lead screw 10 in the screw thread chamber 9, can make dwang 8 carry out the screw thread and reciprocate, the bottom of accommodate the lead screw 10 that establishes in the screw thread chamber 9 and the terminal surface left and right sides fixed connection of bottom plate 2, and the bottom both sides of bottom plate 2 all are equipped with support slat 25, can avoid producing the problem of collision between the double-deck PCB board subassembly still and between the heat dissipation mechanism 15, the surface of dwang 8 all fixed cover has connect second bearing 11, and the external fixation of second bearing 11 has adapter sleeve 12, can effectively drive heat dissipation mechanism 15 and reciprocate.

One side of the connecting sleeve 12 is fixed with an inserting block 13, and an assembling plug-in 14 is movably inserted on the inserting block 13, the heat dissipation mechanism 15 can be disassembled, the sides of the upper end and the lower end of the heat dissipation mechanism 15 are symmetrically provided with rubber anti-collision blocks 24, which play a role in supporting and protecting the double-layer PCB assembly, two ends of the heat dissipation mechanism 15 are fixedly connected with one end of the inner side of the assembling plug-in 14, one side of the assembling plug-in 14 is provided with an inserting groove, the inner wall of the inserting groove is provided with a damping layer 26, which can improve the stability after the heat dissipation mechanism 15 is combined, and can be disassembled and cleaned, the assembling plug-in 14 is fixedly inserted and connected with the inserting block 13 through the damping layer 26 in a matched damping manner, the inner end of the assembling plug-in 14 is fixed with the heat dissipation mechanism 15, which realizes the heat dissipation function of the double-layer PCB assembly, the heat dissipation mechanism 15 comprises an insulating heat dissipation box 16, a cavity 17 is arranged inside the insulating heat dissipation box 16, which is convenient for arranging the micro heat dissipation fan 22, a double-layer partition plate 18 is arranged inside the cavity 17, and plays a role in installing and fixing the relative direction of the two groups of the micro heat dissipation fan 22.

Inside cold wind chamber 19 that is equipped with of double-deck baffle 18, can make outside cold wind get into to wherein, the inside left and right ends in cold wind chamber 19 all runs through and is equipped with dustproof air intake 20, play and carry out the effect of blockking of dust to the cold wind that gets into, air inlet through-hole 21 has been seted up to the equal equidistance in inside upper and lower end in cold wind chamber 19, can be to the effect that cold wind was carried, miniature cooling fan 22 is all installed to the lower extreme on the outside of double-deck baffle 18, the lower extreme all runs through on the inside of insulating heat dissipation case 16 and is equipped with dustproof air-out plate 23, can the entering effect of the inside dust of effective control heat dissipation mechanism 15.

Specifically, when high temperature appears in first PCB board 5 and second PCB board 6 during the use, start the miniature cooling fan 22 that the lower extreme all set up on double-deck baffle 18, make its miniature cooling fan 22 rotate and inhale outside cold wind to the inside of cold wind chamber 19 through dustproof air intake 20 that sets up, cold wind that gets into to cold wind chamber 19 after external cold wind gets into to cold wind chamber 19 will get into to the inside cold wind of cold wind chamber 19 exports from the air inlet through-hole 21 that sets up through miniature cooling fan 22's suction, and blow the radiating effect of cooling down on first PCB board 5 and the second PCB board 6 through dustproof tuber plate 23 with cold wind, and can spread the heat on first PCB board 5 and the second PCB board 6 to the outside fast, can also blow away the effect of dust removal to the dust removal on the PCB board subassembly simultaneously, thereby avoid the heat to spread too slowly and lead to the problem that first PCB board 5 and second PCB board 6 appear high temperature and burn the short circuit, and then improve heat dissipation mechanism 15 to this quick refrigerated function of PCB board subassembly, and improve the life of PCB board subassembly simultaneously.

In the adjustment process that reciprocates at heat dissipation mechanism 15 between first PCB board 5 and second PCB board 6, the rubber anticollision piece 24 that the accessible set up avoids heat dissipation mechanism 15 at the in-process that reciprocates with first PCB board 5 and the problem of second PCB board 6 line impact, thereby play the effect that the protection was supported, and heat dissipation mechanism 15 is through assembling under 14 and the mutually supporting of grafting piece 13, can be in the later stage to the quick dismantlement of heat dissipation mechanism 15, thereby realize the effect of clearing up its surperficial dust, heat dissipation mechanism 15 carries out the function of dismouting to it through assembling plug-in 14, and can make heat dissipation mechanism 15 improve stability after the installation through setting up of damping layer 26.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications and variations can be made in the embodiments or in part of the technical features of the embodiments without departing from the spirit and the scope of the invention.

Claims

1. The utility model provides a high radiating double-deck PCB board subassembly, includes an upper fixed plate (1), bottom plate (2), its characterized in that: all be equipped with installation cavity (3) in upper fixed plate (1) and bottom plate (2), inside a week of installation cavity (3) all is equipped with heat conduction frame board (4), and the inside of heat conduction frame board (4) is equipped with first PCB board (5) and second PCB board (6) respectively, run through in the middle part of the both sides of upper fixed plate (1) and be equipped with first bearing (7), the inside of first bearing (7) all is equipped with dwang (8), the bottom inside of dwang (8) all is equipped with threaded cavity (9), be equipped with accommodate the lead screw (10) in threaded cavity (9), the surface of dwang (8) is all fixed with second bearing (11), the external fixation of second bearing (11) has adapter sleeve (12), one side of adapter sleeve (12) all is fixed with and inserts piece (13), it has assembly plug-in components (14) to peg graft all to move about on plug-in piece (13), assembly plug-in components (14) medial extremity is fixed with heat dissipation mechanism (15).

2. The high heat dissipation double-layer PCB board assembly of claim 1, wherein: radiating mechanism (15) are including insulating heat dissipation case (16), the inside of insulating heat dissipation case (16) is equipped with cavity (17), the inside of cavity (17) is equipped with double-deck baffle (18), double-deck baffle (18) inside is equipped with cold wind chamber (19), the inside left and right ends in cold wind chamber (19) all run through and are equipped with dustproof air intake (20), air inlet through-hole (21) have been seted up to the equal equidistance in the inside of cold wind chamber (19) lower extreme, miniature cooling fan (22) are all installed to the outside upper and lower extreme of double-deck baffle (18), the inside upper and lower extreme of insulating heat dissipation case (16) all runs through and is equipped with dustproof air-out board (23).

3. The high heat dissipation double-layer PCB board assembly of claim 1, wherein: the upper end edge side and the lower end edge side of the heat dissipation mechanism (15) are symmetrically provided with rubber anti-collision blocks (24), and two ends of the heat dissipation mechanism (15) are fixedly connected with one end of the inner side of the assembly plug-in (14).

4. A high heat dissipation double-layer PCB board assembly as recited in claim 1, wherein: the bottom of an adjusting screw rod (10) arranged in the threaded cavity (9) is fixedly connected with the left side and the right side of the end surface of the lower fixing plate (2), and supporting strips (25) are arranged on the two sides of the bottom of the lower fixing plate (2).

5. The high heat dissipation double-layer PCB board assembly of claim 1, wherein: one side of the assembly plug-in (14) is provided with a plug-in groove, the inner wall of the plug-in groove is provided with a damping layer (26), and the assembly plug-in (14) is fixedly connected with the plug-in block (13) in a matched damping plug-in manner.

6. A high heat dissipation double-layer PCB board assembly as recited in claim 1, wherein: the upper end face and the lower end face of the heat dissipation mechanism (15) are respectively arranged corresponding to one face of the first PCB (5) and one face of the second PCB (6).