CN220106567U - LED chip huge transfer device - Google Patents
LED chip huge transfer device Download PDFInfo
- Publication number
- CN220106567U CN220106567U CN202321327490.7U CN202321327490U CN220106567U CN 220106567 U CN220106567 U CN 220106567U CN 202321327490 U CN202321327490 U CN 202321327490U CN 220106567 U CN220106567 U CN 220106567U
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- CN
- China
- Prior art keywords
- adhesive layer
- led chip
- plate
- top plate
- elastic
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- 239000012790 adhesive layer Substances 0.000 claims abstract description 66
- 239000000758 substrate Substances 0.000 claims abstract description 18
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 4
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 230000004907 flux Effects 0.000 claims description 3
- 230000000694 effects Effects 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims description 2
- 235000013870 dimethyl polysiloxane Nutrition 0.000 claims 1
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 claims 1
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 abstract description 5
- 238000000034 method Methods 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 6
- 239000012530 fluid Substances 0.000 description 5
- 229920000915 polyvinyl chloride Polymers 0.000 description 4
- 239000004800 polyvinyl chloride Substances 0.000 description 4
- 230000005489 elastic deformation Effects 0.000 description 3
- 238000001338 self-assembly Methods 0.000 description 2
- 230000001276 controlling effect Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- -1 polydimethylsiloxane Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000010023 transfer printing Methods 0.000 description 1
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- Led Device Packages (AREA)
Abstract
The utility model provides an LED chip huge transfer device which comprises a top plate and a target substrate, wherein the top plate is movably arranged relative to the target substrate, one side of the top plate, which is close to the target substrate, is provided with more than one thimble, a fixed plate is arranged between the target substrate and the top, and one side, which is far away from the top plate, of the fixed plate is provided with an elastic first adhesive layer; more than one through hole is formed along the thickness direction of the fixing plate, and the thimble is arranged in the through hole in a penetrating way and extends towards the elastic first adhesive layer; an elastic piece is connected between the top plate and the fixed plate; a second adhesive layer is arranged on one side of the target substrate close to the fixed plate; the second adhesive layer has a higher adhesiveness to the LED chip than the first adhesive layer; downward pressure is applied to the top plate, and the ejector pin pushes the LED chip to approach the second adhesive layer; releasing the pressure on the top plate; under the combined action of the elastic piece and the elastic first adhesive layer, the top plate and the ejector pin are driven to be far away from the LED chip, so that the top plate and the ejector pin can be reset automatically.
Description
Technical Field
The utility model relates to the technical field of LED chip transfer, in particular to a huge LED chip transfer device.
Background
In the process of manufacturing Mini-LED devices and Micro-LED devices, the LED chips are required to be transferred to a target substrate, and in the prior art, the LED chips are transferred through an elastic seal technology, a fluid self-assembly technology and a roller transfer technology; the elastic seal technology finishes the picking and releasing of the chip by regulating and controlling the viscosity of the interface between the elastic seal and the chip, and the process needs to precisely control the moving speed and angle of the elastic seal, so that the control difficulty is high; the fluid self-assembly technology is that firstly, a chip is placed in a fluid, and the LED chip is transferred to a target substrate under the action of the movement and gravity of the fluid, but the chip is possibly damaged due to the introduction of the fluid in the transfer process; in the roller transfer printing technology, chips are required to be adhered to a roller, the roller is rotated, and the LED chips are placed on a target substrate, so that the method is difficult to operate.
In China application No. 201980002910.4, patent document with publication date 2020.4.21 discloses a carrier plate for mass transfer, a mass transfer device and a method thereof, comprising providing an adapter plate and a carrier plate, wherein a first adhesive layer is arranged on the carrier plate, and a second adhesive layer is arranged on the transfer plate; the second adhesive layer has a higher adhesion to the microdevice than the first adhesive layer, the microdevice is placed on the first adhesive layer, then the microdevice is driven to move downwards to be close to the carrier plate, and after the first adhesive layer is pressed with the second adhesive layer, the transfer plate is lifted to be separated from the carrier plate, so that the microdevice is transferred from the first adhesive layer to the second adhesive layer.
However, in the transfer device, the movement of the transfer plate needs to be actively controlled to separate the transfer plate from the carrier plate, and the transfer plate cannot be automatically reset; meanwhile, a limiting structure is not arranged before the transfer plate and the carrier plate, and when the downward movement distance of the transfer plate is too long, the micro-device can be pressed on the carrier plate, so that the micro-device is damaged.
Disclosure of Invention
The utility model provides a huge amount of LED chip transfer device, which limits the movement of a thimble, avoids damaging the LED chip, and simultaneously can realize automatic reset.
In order to achieve the above purpose, the technical scheme of the utility model is as follows: the utility model provides a huge transfer device of LED chip, includes the roof for transfer the LED chip to the target base plate on, the relative target base plate activity of roof sets up, and one side that the roof is close to the target base plate is equipped with more than one thimble, is equipped with the fixed plate between target base plate and top, is equipped with the first adhesive layer of elasticity in one side that the fixed plate kept away from the roof.
More than one through hole is formed along the thickness direction of the fixing plate, the through holes are correspondingly arranged with the ejector pins, the length of the ejector pins is greater than the depth of the through holes, and the ejector pins penetrate through the through holes and extend to the elastic first adhesive layer; an elastic piece is connected between the top plate and the fixed plate; a second adhesive layer is arranged on one side of the target substrate close to the fixed plate; the second adhesive layer has a higher adhesion to the LED chip than the first adhesive layer.
The ejector pin is arranged in the through hole in a penetrating way, when downward pressure is applied to the top plate, the top plate drives the ejector pin to move downwards, one end of the ejector pin stretches out and is arranged to contact with the elastic first adhesive layer, and the ejector pin enables the elastic first adhesive layer below the through hole to deform and push the LED chip to approach the second adhesive layer; after the LED chip is contacted with the second adhesive layer, releasing the pressure on the top plate; the elastic piece and the elastic first adhesive layer are reset under the action of the self elastic force, the elastic piece drives the top plate to ascend, and the elastic first adhesive layer recovers elastic deformation and further drives the ejector pin; under the combined action of the elastic piece and the elastic first adhesive layer, the top plate and the ejector pin are driven to be far away from the LED chip, so that the top plate and the ejector pin can be reset automatically.
Meanwhile, the ejector pins are movably arranged in the through holes, and the guide of the movement of the ejector pins is realized through the matching of the through holes and the ejector pins, so that the ejector pins are prevented from being biased in the moving process; meanwhile, one end of the thimble penetrates through the through hole, when the top plate is in contact with the fixed plate, the downward movement of the thimble is limited, so that the movement stroke of the thimble is limited, and the LED chip is prevented from being damaged under the pressure of the thimble and the target substrate.
Further, the width of the thimble is smaller than the width of the LED chip.
Due to the arrangement, since the width of the ejector pin is smaller than that of the LED chip, when the ejector pin pushes the LED chip to move downwards, the elastic first adhesive layer which is not contacted with the ejector pin can be separated from the LED chip; further reducing the elastic force of the first adhesive layer will result in a sticking force between the LED chip and the second adhesive layer, which facilitates the transfer of the LED chip to the second adhesive layer.
Further, the elastic element is a spring.
Further, the elastic first adhesive layer is one of PVC, PO, PDMS or TPU with an adhesive layer on one side.
Further, the second adhesive layer is one of solder paste, soldering flux or ACP.
Further, a mounting plate is arranged above the top plate, the mounting plate is fixedly arranged on the mounting frame, and more than one driving device is arranged in the mounting plate.
Above setting is provided with drive arrangement through setting up mounting panel and mounting panel on, and drive arrangement produces force for the roof for structural stability is good.
Further, the driving device comprises a driving motor, and a sleeve block is arranged at the output end of the driving motor.
Above setting, thereby drive the cover piece and stretch out when can making driving motor stretch out and give roof a pressure through setting up the cover piece to need not the manual work and give the power of roof.
Drawings
Fig. 1 is a schematic view of an LED chip adhered to a resilient first adhesive layer in the present utility model.
Fig. 2 is a schematic view of an LED chip in contact with a second adhesive layer in the present utility model.
Fig. 3 is an enlarged view of a in fig. 2.
Fig. 4 is a cross-sectional view of a fixing plate in the present utility model.
FIG. 5 is a schematic view of a portion of a mounting plate and a drive motor assembly according to the present utility model.
Detailed Description
The utility model is described in further detail below with reference to the drawings and the detailed description.
As shown in fig. 1 to 5, an LED chip mass transfer device includes a top plate 1, a target substrate 2, and a fixing plate 3, the fixing plate 3 being located between the target substrate 2 and the top plate 1.
An elastic piece 4 is connected between the top plate 1 and the fixed plate 3; the roof 1 is movably arranged relative to the fixed plate 3 and the target substrate 2, in an embodiment, the upper end of the roof 1 is provided with a mounting plate 9, the mounting plate 9 is fixed on a mounting frame 10, the mounting plate 9 is provided with more than one driving device 91, the fixed plate 3 is fixed on the mounting frame 10, the driving device 91 comprises a driving motor 911, the output end of the driving motor 911 is provided with a sleeve block 913, the sleeve block 913 is sleeved outside the output end, the sleeve block 913 is driven to extend when the output end of the driving motor 911 extends so as to generate thrust for the roof 1, the sleeve block 913 is driven to retract into the mounting plate 9 together when the output end of the driving motor 911 retracts, the driving motor 911 is a linear motor, and one side of the fixed plate 3 far away from the roof 1 is provided with an elastic first adhesive layer 5. A second adhesive layer 6 is arranged on one side of the target substrate 2 close to the fixed plate 3; the second adhesive layer 6 has a higher adhesion to the LED chip 8 than the first adhesive layer 5 has to the LED chip 8.
One side of the top plate 1, which is close to the target substrate 2, is provided with more than one thimble 7, more than one through hole 31 is formed along the thickness direction of the fixed plate 3, the through hole 31 is arranged corresponding to the thimble 7, the length of the thimble 7 is greater than the depth of the through hole 31, the thimble 7 is arranged in the through hole 31 in a penetrating way and extends towards the elastic first adhesive layer 5, one end of the thimble 7 is fixed in the top plate 1, and the other end of the thimble 7 extends out of the top plate 1 and into the through hole.
The ejector pin 7 is arranged in the through hole 31 in a penetrating way, when the driving device 91 applies downward pressure to the top plate 1, the top plate 1 drives the ejector pin 7 to move downwards, one end of the ejector pin 7 stretches out and is arranged to contact with the elastic first adhesive layer 5 in a penetrating way, and the ejector pin 7 enables the elastic first adhesive layer 5 below the through hole 31 to deform and push the LED chip 8 to approach the second adhesive layer 6; after the LED chip 8 is contacted with the second adhesive layer 6, the pressure on the top plate 1 is released; the elastic piece 4 and the elastic first adhesive layer 5 are reset under the action of own elasticity, the elastic piece 4 recovers elastic deformation so as to drive the top plate 1 to rise, and the elastic first adhesive layer 5 recovers elastic deformation so as to drive the ejector pin 7; under the combined action of the elastic piece 4 and the elastic first adhesive layer 5, the top plate 1 and the ejector pin 7 are driven to be far away from the LED chip 8, so that the top plate 1 and the ejector pin 7 are automatically reset, and in one embodiment, the top plate 1 is limited by contacting the mounting plate with the top plate 1.
Meanwhile, the thimble 7 is movably arranged in the through hole 31, and the thimble 7 is matched with the thimble 7 through the through hole 31, so that the movement guide of the thimble 7 is realized, and the thimble 7 is prevented from being biased in the movement process; meanwhile, as one end of the thimble 7 is connected with the top plate 1, when the top plate 1 is close to the fixed plate 3, the downward movement of the thimble 7 is limited, so that the movement stroke of the thimble 7 is limited, and the LED chip 8 is prevented from being damaged under the pressure of the thimble 7 and the target substrate 2.
The width L2 of the thimble is smaller than the width L1 of the LED chip, in this embodiment, the thimble 7 is a cylindrical thimble, and the diameter of the thimble 7 is smaller than the width L1 of the LED chip. When the ejector pin 7 pushes the LED chip 8 to move downwards, the elastic first adhesive layer 5 which is not contacted with the ejector pin 7 is separated from the LED chip 8; further reducing the adhesion between the resilient first adhesive layer 5 and the LED chip 8 facilitates the transfer of the LED chip 8 to the second adhesive layer 6.
In this embodiment, the elastic member 4 is a spring, and the elastic first adhesive layer 5 is one of PVC (polyvinyl chloride), PO (polyolefin), PDMS (polydimethylsiloxane) or TPU (polyurethane) provided with an adhesive layer on a side close to the chip 8; the second adhesive layer 6 is one of solder paste, flux, or ACP (anisotropic conductive paste). In this embodiment, the side of the elastic first adhesive layer 5 is provided with PVC of the adhesive layer; the second adhesive layer 6 is solder paste.
Claims (7)
1. The utility model provides a huge transfer device of LED chip, includes the roof for transfer the LED chip to the target base plate, the relative target base plate activity of roof sets up, and one side that the roof is close to the target base plate is equipped with more than one thimble, its characterized in that: a fixed plate is arranged between the target substrate and the top, and an elastic first adhesive layer is arranged on one side of the fixed plate far away from the top plate;
more than one through hole is formed along the thickness direction of the fixing plate, the through holes are correspondingly arranged with the ejector pins, the length of the ejector pins is greater than the depth of the through holes, and the ejector pins penetrate through the through holes and extend to the elastic first adhesive layer; an elastic piece is connected between the top plate and the fixed plate; a second adhesive layer is arranged on one side of the target substrate close to the fixed plate; the second adhesive layer has a higher adhesion to the LED chip than the first adhesive layer.
2. The LED chip macro transfer apparatus of claim 1, wherein: the width of the thimble is smaller than the width of the LED chip.
3. The LED chip macro transfer apparatus of claim 1, wherein: the elastic piece is a spring.
4. The LED chip macro transfer apparatus of claim 1, wherein: the elastic first adhesive layer is one of PVC, PO, PDMS or TPU with an adhesive layer on one side.
5. The LED chip macro transfer apparatus of claim 1, wherein: the second adhesive layer is one of solder paste, soldering flux or ACP.
6. The LED chip macro transfer apparatus of claim 1, wherein: a mounting plate is arranged above the top plate and fixedly mounted on the mounting frame, and more than one driving device is arranged in the mounting plate.
7. The LED chip macro-transferring apparatus according to claim 6, wherein: the thimble driving device comprises a driving motor, the driving motor drives the thimble to extend and retract, and a sleeve block is arranged at the output end of the driving motor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321327490.7U CN220106567U (en) | 2023-05-29 | 2023-05-29 | LED chip huge transfer device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321327490.7U CN220106567U (en) | 2023-05-29 | 2023-05-29 | LED chip huge transfer device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220106567U true CN220106567U (en) | 2023-11-28 |
Family
ID=88864275
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321327490.7U Active CN220106567U (en) | 2023-05-29 | 2023-05-29 | LED chip huge transfer device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220106567U (en) |
-
2023
- 2023-05-29 CN CN202321327490.7U patent/CN220106567U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |