CN220106446U - Wafer placing and soaking device - Google Patents
Wafer placing and soaking device Download PDFInfo
- Publication number
- CN220106446U CN220106446U CN202321544681.9U CN202321544681U CN220106446U CN 220106446 U CN220106446 U CN 220106446U CN 202321544681 U CN202321544681 U CN 202321544681U CN 220106446 U CN220106446 U CN 220106446U
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- soaking
- tank
- overflow
- groove
- pipe
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- 238000002791 soaking Methods 0.000 title claims abstract description 97
- 239000007788 liquid Substances 0.000 claims abstract description 63
- 235000012431 wafers Nutrition 0.000 claims abstract description 52
- 238000007599 discharging Methods 0.000 claims abstract description 16
- 238000007654 immersion Methods 0.000 claims description 12
- 239000011159 matrix material Substances 0.000 claims description 5
- 230000000694 effects Effects 0.000 abstract description 4
- 238000005192 partition Methods 0.000 description 13
- 238000004140 cleaning Methods 0.000 description 8
- 210000005056 cell body Anatomy 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model relates to a wafer placing and soaking device which comprises a shell, a placing frame and a liquid discharging component, wherein the shell is internally provided with a tank body, the tank body comprises a soaking tank, at least one side of the soaking tank is provided with a plurality of overflow tanks, the tank bodies are distributed along the up-down direction, the placing frame is arranged in the soaking tank, the placing frame is used for placing wafers, the liquid discharging component comprises a liquid discharging pipe, the liquid discharging pipe is arranged at the bottom of the shell, the tank bodies are communicated with each other, the tank body positioned at the lowest layer of the tank bodies is communicated with the liquid discharging pipe, and the liquid discharging pipe is used for discharging the soaking solution in the soaking tank and/or the overflow tank. The device can fully submerge the wafer in the soaking solution, improves the soaking effect, can realize quick discharge of the soaking solution by arranging the liquid discharge assembly, can prevent potential safety hazards caused by overflow of the soaking solution by arranging the overflow groove, has simple integral structure, convenient operation, reduced cost and good adaptability, and is convenient to move and overhaul.
Description
Technical Field
The utility model belongs to the technical field of semiconductor processing, and particularly relates to a wafer placement soaking device.
Background
The wafer, i.e., a silicon wafer used for manufacturing semiconductor chip integrated circuits, can be made into an electronic component having a specific electrical function by manufacturing various circuit structures on the wafer surface. In the manufacturing process of semiconductor chips, most of the process steps require cleaning of the wafer to remove impurities adhering to or remaining on the wafer surface. The quality of the cleaning effect of the wafer directly influences the yield, the processing efficiency and the like of the subsequent process.
At present, a soaking type cleaning process is adopted in a part of cleaning process, namely, the wafer is required to be fully soaked in chemical liquid, so that the chemical liquid and the wafer are subjected to chemical reaction, and then the steps of rotary cleaning and the like are carried out, so that the cleaning effect is improved. However, in the prior art, an integrated cleaning apparatus is generally adopted, that is, the wafer soaking tank and the rotary cleaning mechanism are integrated on one apparatus, so that the apparatus is generally complicated in structure, inconvenient to operate, high in design and manufacturing difficulty, increased in equipment cost, poor in adaptability and inconvenient to overhaul when a fault occurs.
Disclosure of Invention
The utility model aims to provide a wafer placing and soaking device with simple structure and good adaptability.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a wafer placement immersion apparatus comprising:
a shell: the shell is internally provided with a tank body, the tank body comprises a soaking tank, the soaking tank is used for containing a soaking solution, at least one side of the soaking tank is provided with an overflow tank, and a plurality of tank bodies are distributed along the up-down direction;
and (3) placing a rack: the placing rack is arranged in the soaking tank and is used for placing wafers;
and a liquid discharging assembly: the liquid draining assembly comprises a liquid draining pipe, the liquid draining pipe is arranged at the bottom of the shell, a plurality of groove bodies are communicated with each other, the groove body at the lowest layer of the groove bodies is communicated with the liquid draining pipe, and the liquid draining pipe is used for draining the soaking solution in the soaking groove and/or the overflow groove.
Preferably, the liquid draining assembly further comprises a first connecting pipe, the overflow grooves of two adjacent tank bodies are communicated through the first connecting pipe, one end of the first connecting pipe is communicated with the overflow groove of the tank body positioned on the upper layer in the two adjacent tank bodies, and the other end of the first connecting pipe extends into the overflow groove of the tank body positioned on the lower layer in the two adjacent tank bodies.
Preferably, the liquid draining assembly further comprises a second connecting pipe, one end of the second connecting pipe is communicated with the soaking groove of the groove body positioned at the upper layer in the two adjacent groove bodies, and the other end of the second connecting pipe extends into the overflow groove of the groove body positioned at the lower layer in the two adjacent groove bodies.
Further preferably, the liquid draining assembly further comprises a first control valve, the first control valve is arranged on the second connecting pipe, and the first control valve is used for controlling on-off of the second connecting pipe.
Preferably, the liquid draining pipe comprises a first liquid draining pipe and a second liquid draining pipe, one end of the first liquid draining pipe is communicated with the overflow grooves of the grooves at the lowest layer of the grooves, the other end of the first liquid draining pipe is used for draining soaking solution, one end of the second liquid draining pipe is communicated with the soaking grooves of the grooves at the lowest layer of the grooves, and the other end of the second liquid draining pipe is communicated with the first liquid draining pipe.
Further preferably, the liquid draining assembly further comprises a second control valve, the second control valve is arranged on the second liquid draining pipe, and the second control valve is used for controlling on-off of the second liquid draining pipe.
Preferably, the shell further comprises an overflow plate, the overflow plate is arranged in the tank body, the overflow plate spaces the tank body and forms the soaking tank and the overflow tank, and the top of the overflow plate is wavy.
Preferably, a partition board is arranged in the soaking tank, the partition board partitions the soaking tank in the vertical direction, through holes are formed in the partition board, and the placing frame is arranged on the partition board.
Further preferably, a plurality of through holes are provided, and the plurality of through holes are distributed on the partition board in a matrix shape.
Preferably, the placing frame comprises a pair of side plates, the pair of side plates are connected through a first connecting plate and a second connecting plate, clamping grooves are respectively formed in the pair of side plates, and a wafer slot for placing wafers is formed by the two clamping grooves together.
Preferably, a plurality of placing frames are arranged, and the plurality of placing frames are distributed in the soaking tank in a matrix shape.
Preferably, the bottom of the shell is provided with a plurality of supporting piece supporting legs and rollers, the supporting legs and the rollers are respectively distributed on the periphery of the bottom of the shell, and the supporting legs can stretch along the up-down direction.
Due to the application of the technical scheme, compared with the prior art, the utility model has the following advantages:
the wafer placing and soaking device disclosed by the utility model can fully submerge the wafer in the soaking solution, the soaking effect is improved, the soaking solution can be rapidly discharged by arranging the liquid discharging component, potential safety hazards caused by overflow of the soaking solution can be prevented by arranging the overflow groove, the whole structure of the device is simple, the operation is convenient, the cost is reduced, the adaptability is good, and the device is convenient to move and overhaul.
Drawings
Fig. 1 is a schematic perspective view of a wafer placement and soaking device according to the present embodiment;
fig. 2 is a schematic perspective view of the wafer placement and soaking device according to the first embodiment with a part of the housing removed;
fig. 3 is a schematic perspective view of the wafer placement and soaking device according to the second embodiment after removing a part of the housing;
FIG. 4 is a schematic front view of the wafer placement and soaking device according to the present embodiment with a portion of the housing removed;
fig. 5 is a schematic perspective view of the rack of the present embodiment;
fig. 6 is a schematic top view of the rack of the present embodiment.
In the above figures:
1. a housing; 10. a tank body; 101. a soaking tank; 102. an overflow trough; 11. an overflow plate; 12. a partition plate; 120. a through hole; 13. a first tank body; 14. a second tank body; 15. a support leg; 16. a roller; 2. a placing rack; 20. a wafer slot; 21. a side plate; 210. a clamping groove; 22. a first connection plate; 23. a second connecting plate; 3. a liquid discharge assembly; 30. a liquid discharge pipe; 301. a first liquid discharge pipe; 302. a second liquid discharge pipe; 31. a first connection pipe; 32. a second connection pipe; 33. a first control valve; 34. and a second control valve.
Detailed Description
The following description of the embodiments of the present utility model will be made apparent and fully in view of the accompanying drawings, in which some, but not all embodiments of the utility model are shown. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
The utility model provides a soaking device is placed to wafer, as shown in fig. 1, includes casing 1, rack 2 and flowing back subassembly 3, has cell body 10 in the casing 1, and cell body 10 can be used to hold the soaking solution, and rack 2 sets up in cell body 10, and rack 2 is used for placing the wafer, flowing back subassembly 3 and cell body 10 intercommunication, and flowing back subassembly 3 is used for discharging the soaking solution in the cell body 10.
The following details of each component and its connection relation are described in detail:
the tank body 10 comprises a soaking tank 101 and an overflow tank 102, wherein the overflow tank 102 is arranged on at least one side of the soaking tank 101, the soaking tank 101 is used for containing soaking solution, and the overflow tank 102 is used for containing soaking solution overflowed from the soaking tank 101, in particular: as shown in fig. 2 and 3, an overflow plate 11 is provided in the tank body 10, and the overflow plate 11 spaces the tank body 10 in the left-right direction and forms a soaking tank 101 and an overflow tank 102; the top of the overflow plate 11 is wavy, and the height of the overflow plate 11 is smaller than the depth of the tank 10. In this embodiment: the overflow plates 11 are provided in two, and the two overflow plates 11 form overflow grooves 102 on opposite sides of the soaking tank 101.
As shown in fig. 1, a plurality of the tanks 10 are provided, and the plurality of tanks 10 are distributed in the up-down direction. In this embodiment: the two groove bodies 10 are arranged, namely the groove body 10 comprises a first groove body 13 and a second groove body 14, and the first groove body 13 is positioned above the second groove body 14; the top of the shell 1 is open and is communicated with the first tank body 13, so that the soaking solution can be directly added into the soaking tank 101 of the first tank body 13 from the top of the shell 1; the side of the shell 1 is provided with an opening, the opening is positioned between the first tank body 13 and the second tank body 14, and the opening is communicated with the second tank body 14, so that the soaking solution can be directly added into the soaking tank 101 of the second tank body 14 from the opening of the shell 1.
In addition, as shown in fig. 1, the bottom of the shell 1 is provided with a plurality of rollers 16, the plurality of rollers 16 are distributed around the bottom of the shell 1, and the rollers 16 are used for driving the shell 1 to move so as to facilitate moving the wafer placing and soaking device; as shown in fig. 1, the bottom of the housing 1 is further provided with a plurality of legs 15, the plurality of legs 15 are distributed around the bottom of the housing 1, the legs 15 can stretch in the up-down direction, and when the roller 16 drives the housing 1 to move to a designated position, the legs 15 stretch downwards and are supported on the ground, so that the position of the housing 1 is kept fixed.
The rest 2 is arranged inside the soaking tank 101, in particular: as shown in fig. 2 and 4, a partition plate 12 is provided in the soaking tank 101, the partition plate 12 partitions the soaking tank 101 in the up-down direction, and the rack 2 is provided on the partition plate 12; the partition board 12 is provided with a through hole 120 which is penetrated, and the through hole 120 enables the spaces at two sides of the partition board 12 to be communicated with each other; the through holes 120 may be provided in plurality, and the plurality of through holes 120 are uniformly distributed on the separator 12 in a matrix shape.
As shown in fig. 1 and 2, a plurality of racks 2 are provided, and the plurality of racks 2 are uniformly distributed in a matrix in the soaking tank 101. As shown in fig. 5 and 6, the placement frame 2 specifically includes a pair of side plates 21, a first connecting plate 22 and a second connecting plate 23, where the pair of side plates 21 are disposed opposite to each other, and the pair of side plates 21 are connected by the first connecting plate 22 and the second connecting plate 23, that is, the pair of side plates 21, the first connecting plate 22 and the second connecting plate 23 are connected to each other and form the placement frame 2 that penetrates up and down; the inner side walls of the pair of side plates 21 are respectively provided with a clamping groove 210, and the two clamping grooves 210 jointly form a wafer slot 20 for placing a wafer, specifically: the side plates 21 comprise a first plate section, a second plate section and a third plate section, the first plate section, the second plate section and the third plate section are sequentially connected, the first plate section and the third plate section extend along the up-down direction, the second plate section extends obliquely, grooves are formed in the first plate section, the second plate section and the third plate section, the grooves of the first plate section, the second plate section and the third plate section jointly form a clamping groove 210, the distance between the first plate section of the pair of side plates 21 is larger than the distance between the first plate section of the pair of side plates 21 and the third plate section of the pair of side plates 21, namely, the grooves of the third plate section can form stable support for a wafer; the wafer slots 20 are provided in plurality, and the plurality of wafer slots 20 are uniformly distributed along the width direction of the side plate 21, i.e., one rack 2 can simultaneously place a plurality of wafers.
As shown in fig. 3 and 4, the drain assembly 3 includes a drain pipe 30, a first connection pipe 31, and a second connection pipe 32, the drain pipe 30 is disposed at the bottom of the housing 1, and the plurality of tanks 10 are mutually communicated through the first connection pipe 31 and the second connection pipe 32, specifically:
as shown in fig. 3 and 4, the overflow grooves 102 of two adjacent tank bodies 10 are communicated through a first connecting pipe 31, namely, one end of the first connecting pipe 31 is communicated with the bottom of the overflow groove 102 of the tank body 10 positioned at the upper layer in the two adjacent tank bodies 10, and the other end of the first connecting pipe 31 extends into the overflow groove 102 of the tank body 10 positioned at the lower layer in the two adjacent tank bodies 10; the soaking tank 101 of the tank body 10 positioned at the upper layer in the two adjacent tank bodies 10 and the overflow tank 102 of the tank body 10 positioned at the lower layer in the two adjacent tank bodies 10 are communicated through the second connecting pipe 32, namely one end of the second connecting pipe 32 is communicated with the bottom of the soaking tank 101 of the tank body 10 positioned at the upper layer in the two adjacent tank bodies 10, and the other end of the second connecting pipe 32 extends into the overflow tank 102 of the tank body 10 positioned at the lower layer in the two adjacent tank bodies 10.
In this embodiment: the overflow groove 102 on one side of the first groove body 13 is communicated with the overflow groove 102 on one side of the second groove body 14 through a first connecting pipe 31, and the overflow groove 102 on the other side of the first groove body 13 is also communicated with the overflow groove 102 on the other side of the second groove body 14 through the first connecting pipe 31; the overflow grooves 102 on both sides of the second tank 14 are respectively communicated with the soaking groove 101 of the first tank 13 through the second connecting pipe 32.
As shown in fig. 3 and 4, the tank 10 located at the lowermost layer among the plurality of tanks 10 is communicated with a drain pipe 30, and the drain pipe 30 is used for discharging the soaking solution in the soaking tank 101 and/or the overflow tank 102, specifically: the drain pipe 30 includes a first drain pipe 301 and a second drain pipe 302, one end of the first drain pipe 301 is communicated with the overflow tank 102 of the tank 10 located at the lowest layer among the plurality of tanks 10, the other end of the first drain pipe 301 is used for discharging the immersion solution, one end of the second drain pipe 302 is communicated with the immersion tank 101 of the tank 10 located at the lowest layer among the plurality of tanks 10, and the other end of the second drain pipe 302 is communicated with the first drain pipe 301.
In this embodiment: one end of the second liquid discharge pipe 302 is provided with two inlets which are communicated with the soaking tank 101 of the second tank body 14, and the other end of the second liquid discharge pipe 302 is communicated with the first liquid discharge pipe 301; one end of the first drain 301 has two inlets which are respectively communicated with the overflow tanks 102 on both sides of the second tank 14, and the other end of the first drain 301 is used for discharging the soaking solution.
In addition, as shown in fig. 3 and 4, the drain assembly 3 further includes a first control valve 33 and a second control valve 34, the first control valve 33 is disposed on the second connection pipe 32, and the first control valve 33 is used for controlling on-off of the second connection pipe 32; the second control valve 34 is disposed on the second liquid drain pipe 302, and the second control valve 34 is used for controlling on-off of the second liquid drain pipe 302.
The wafer placement and soaking device of the embodiment is used in the process of using: placing the wafer on the placement frame 2, i.e., inserting the wafer into the wafer slot 20 of the placement frame 2; adding a soaking solution into the soaking tank 101 of the first tank body 13 and the soaking tank 101 of the second tank body 14, and if the soaking solution overflows from the soaking tank 101 to the overflow tank 102, enabling the soaking solution in the overflow tank 102 of the first tank body 13 to flow into the overflow tank 102 of the second tank body 14 through the first connecting pipe 31 and then discharging through the first liquid discharge pipe 301; if the soaking solution in the soaking tank 101 of the first tank body 13 and the soaking solution in the soaking tank 101 of the second tank body 14 need to be discharged, the first control valve 33 and the second control valve 34 are opened, so that the soaking solution in the soaking tank 101 of the first tank body 13 flows into the overflow tank 102 of the second tank body 14 through the second connecting pipe 32, flows into the first liquid discharge pipe 301 and is discharged, and meanwhile, the soaking solution in the soaking tank 101 of the second tank body 14 directly flows into the first liquid discharge pipe 301 through the second liquid discharge pipe 302 and is discharged.
The above embodiments are provided to illustrate the technical concept and features of the present utility model and are intended to enable those skilled in the art to understand the content of the present utility model and implement the same, and are not intended to limit the scope of the present utility model. All equivalent changes or modifications made in accordance with the spirit of the present utility model should be construed to be included in the scope of the present utility model.
Claims (10)
1. The wafer placing and soaking device is characterized in that: comprising the following steps:
a shell: the shell is internally provided with a tank body, the tank body comprises a soaking tank, the soaking tank is used for containing a soaking solution, at least one side of the soaking tank is provided with an overflow tank, and a plurality of tank bodies are distributed along the up-down direction;
and (3) placing a rack: the placing rack is arranged in the soaking tank and is used for placing wafers;
and a liquid discharging assembly: the liquid draining assembly comprises a liquid draining pipe, the liquid draining pipe is arranged at the bottom of the shell, a plurality of groove bodies are communicated with each other, the groove body at the lowest layer of the groove bodies is communicated with the liquid draining pipe, and the liquid draining pipe is used for draining the soaking solution in the soaking groove and/or the overflow groove.
2. The wafer placement immersion device according to claim 1, wherein: the liquid draining assembly further comprises a first connecting pipe, two adjacent overflow grooves of the groove bodies are communicated through the first connecting pipe, one end of the first connecting pipe is communicated with the overflow groove of the groove body located on the upper layer in the two adjacent groove bodies, and the other end of the first connecting pipe extends into the overflow groove of the groove body located on the lower layer in the two adjacent groove bodies.
3. The wafer placement immersion device according to claim 1, wherein: the liquid draining assembly further comprises a second connecting pipe, one end of the second connecting pipe is communicated with the soaking grooves of the upper groove bodies of the two adjacent groove bodies, and the other end of the second connecting pipe extends into the overflow grooves of the lower groove bodies of the two adjacent groove bodies.
4. A wafer placement immersion apparatus according to claim 3, wherein: the liquid draining assembly further comprises a first control valve, the first control valve is arranged on the second connecting pipe, and the first control valve is used for controlling the on-off of the second connecting pipe.
5. The wafer placement immersion device according to claim 1, wherein: the liquid discharge pipe comprises a first liquid discharge pipe and a second liquid discharge pipe, one end of the first liquid discharge pipe is communicated with a plurality of overflow grooves of the groove body positioned at the lowest layer, the other end of the first liquid discharge pipe is used for discharging soaking solution, one end of the second liquid discharge pipe is communicated with a plurality of soaking grooves of the groove body positioned at the lowest layer, and the other end of the second liquid discharge pipe is communicated with the first liquid discharge pipe.
6. The wafer placement immersion device according to claim 5, wherein: the liquid draining assembly further comprises a second control valve, the second control valve is arranged on the second liquid draining pipe, and the second control valve is used for controlling the on-off of the second liquid draining pipe.
7. The wafer placement immersion device according to claim 1, wherein: the shell also comprises overflow plates, the overflow plates are arranged in the groove bodies, the overflow plates space the groove bodies and form the soaking groove and the overflow groove, and the tops of the overflow plates are wavy.
8. The wafer placement immersion device according to claim 1, wherein: the soaking tank in be provided with the baffle, the baffle with the soaking tank go on the interval in upper and lower direction, the baffle on set up the through-hole that runs through, the rack set up on the baffle.
9. The wafer placement immersion device according to claim 1, wherein: the rack comprises a pair of side plates, wherein the side plates are connected through a first connecting plate and a second connecting plate, clamping grooves are respectively formed in the side plates, and two clamping grooves jointly form a wafer slot for placing wafers.
10. The wafer placement immersion device according to claim 1, wherein: the plurality of placing frames are arranged and are distributed in the soaking tank in a matrix shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321544681.9U CN220106446U (en) | 2023-06-16 | 2023-06-16 | Wafer placing and soaking device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321544681.9U CN220106446U (en) | 2023-06-16 | 2023-06-16 | Wafer placing and soaking device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220106446U true CN220106446U (en) | 2023-11-28 |
Family
ID=88840845
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321544681.9U Active CN220106446U (en) | 2023-06-16 | 2023-06-16 | Wafer placing and soaking device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220106446U (en) |
-
2023
- 2023-06-16 CN CN202321544681.9U patent/CN220106446U/en active Active
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