CN220103845U

CN220103845U - Heat conduction assembly

Info

Publication number: CN220103845U
Application number: CN202223203014.2U
Authority: CN
Inventors: 陈胜静; 谢梦瑶; 周文强; 张伟
Original assignee: Haier Smart Home Co Ltd; Qingdao Haier Innovation Technology Co Ltd
Current assignee: Haier Smart Home Co Ltd; Qingdao Haier Innovation Technology Co Ltd
Priority date: 2022-12-01
Filing date: 2022-12-01
Publication date: 2023-11-28
Anticipated expiration: 2032-12-01

Abstract

The embodiment of the utility model discloses a heat conduction assembly, which comprises a first solid heat conduction layer, a second solid heat conduction layer and a substrate tube, wherein the direction of lamination arrangement of the first solid heat conduction layer and the second solid heat conduction layer is perpendicular to the inner wall of an inner container or an electric kettle. The heat of the bottom wall of the liner or the electric kettle is transferred to the first solid heat conduction layer connected with the bottom wall of the liner or the electric kettle, the first solid heat conduction layer connected with the bottom wall of the liner or the electric kettle transfers the heat to the first heat conduction layer connected with the side wall of the liner or the electric kettle, the first solid heat conduction layer transfers the heat to the substrate tube parallel to the bottom wall and the side wall of the liner or the electric kettle, and finally the substrate tube transfers the heat to the second solid heat conduction layer parallel to the bottom wall and the side wall of the liner or the electric kettle, so that substances in the liner or the electric kettle are heated. According to the heat conduction assembly disclosed by the utility model, the bottom wall of the liner or the electric kettle is led to the side wall, and substances in the liner or the electric kettle are heated through the bottom wall and the side wall, so that the heating efficiency is improved.

Description

Heat conduction assembly

Technical Field

The utility model relates to the technical field of household appliances, in particular to a heat conduction assembly.

Background

The household appliances such as the electric rice cooker or the electric kettle are generally heated by the base, and heat is only supplied to the bottom of the inner container of the electric rice cooker or the electric kettle through the base, and the heat is transferred upwards from the bottom of the household appliances such as the electric rice cooker or the electric kettle, so that the heating speed of the household appliances such as the electric rice cooker or the electric kettle is low.

Therefore, how to increase the heating speed of household appliances such as electric rice cookers and electric kettles is a technical problem to be solved urgently by those skilled in the art.

Disclosure of Invention

The utility model provides a heat conduction component which is used for improving the heating speed of household appliances such as an electric cooker or an electric kettle.

In order to achieve the above object, the present utility model provides a heat conduction assembly comprising:

the first solid heat conduction layer can be arranged on the bottom wall and the side wall of the liner or the electric kettle;

the second solid heat conduction layer is arranged on the first solid heat conduction layer in a layer-by-layer mode and is connected with one side, away from the inner container or the inner wall of the electric kettle, of the first solid heat conduction layer;

the base body pipe is positioned in the first solid heat conduction layer and/or the second solid heat conduction layer, the heat conduction coefficient of the base body pipe is higher than that of the first solid heat conduction layer, and the heat conduction coefficient of the first solid heat conduction layer is higher than that of the liner or the electric kettle.

Preferably, in the above heat conduction assembly, a surface of the first solid heat conduction layer facing the second solid heat conduction layer is a first wavy surface, a surface of the second solid heat conduction layer facing the first solid heat conduction layer is a second wavy surface, a peak of the first wavy surface is located in a trough of the second wavy surface, and a peak of the second wavy surface is located in a trough of the first wavy surface, so that the first wavy surface is attached to the second wavy surface.

Preferably, in the above heat conduction assembly, the base pipe is disposed at a position of the first solid heat conduction layer corresponding to a peak of the first wavy surface;

and/or the number of the groups of groups,

the substrate tube is arranged at the position of the second solid heat conduction layer corresponding to the wave crest of the second wavy surface.

Preferably, in the above heat conduction assembly, the base pipe located in the first solid heat conduction layer is parallel to the base pipe located in the second solid heat conduction layer.

Preferably, in the above heat conduction assembly, the base pipe located in the first solid heat conduction layer and the base pipe located in the second solid heat conduction layer are arranged in a staggered manner.

Preferably, in the above heat conduction assembly, the heat conductivity of the first solid heat conduction layer is equal to or different from the heat conductivity of the second solid heat conduction layer.

Preferably, in the above heat conduction assembly, the thickness of the first solid heat conduction layer is equal to or unequal to the thickness of the second solid heat conduction layer.

Preferably, in the above heat conduction assembly, the material of the first solid heat conduction layer is the same as or different from the material of the second solid heat conduction layer.

Preferably, in the above heat conduction assembly, the base pipe is a copper pipe or an aluminum pipe.

Preferably, in the above heat conduction assembly, the diameter of the base pipe is 0.1 to 0.5mm.

The heat conduction assembly provided by the embodiment of the utility model is arranged on the bottom wall and the side wall of the liner or the electric kettle and comprises a first solid heat conduction layer, a second solid heat conduction layer and a base tube. The direction in which the first solid heat conduction layer and the second solid heat conduction layer are arranged in a lamination mode is perpendicular to the inner wall of the liner or the inner wall of the electric kettle. The heat of the bottom wall of the liner or the electric kettle is firstly transferred to a first solid heat conduction layer connected with the bottom wall of the liner or the electric kettle, the first solid heat conduction layer connected with the bottom wall of the liner or the electric kettle transfers the heat to the first heat conduction layer connected with the side wall of the liner or the electric kettle, then the first solid heat conduction layer transfers the heat to a substrate tube parallel to the bottom wall and the side wall of the liner or the electric kettle, and finally the substrate tube transfers the heat to a second solid heat conduction layer parallel to the bottom wall and the side wall of the liner or the electric kettle so as to heat substances in the liner or the electric kettle. According to the heat conduction assembly disclosed by the utility model, the bottom wall of the liner or the electric kettle is led to the side wall, and substances in the liner or the electric kettle are heated through the bottom wall and the side wall, so that the heating efficiency is improved.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It is apparent that the drawings in the following description are only some examples or embodiments of the present utility model, and it is possible for those of ordinary skill in the art to obtain other drawings from the provided drawings without inventive effort, and to apply the present utility model to other similar situations from the provided drawings. Unless otherwise apparent from the context of the language or otherwise specified, like reference numerals in the figures refer to like structures or operations.

Fig. 1 is a schematic view of the structure of a heat conduction assembly of the present utility model.

Wherein:

1. the heat conducting device comprises a first solid heat conducting layer, a second solid heat conducting layer, a substrate tube and a substrate tube.

Detailed Description

The utility model is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the application and not limiting of the application. The described embodiments are only some, but not all, embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

It should be noted that, for convenience of description, only a portion related to the related application is shown in the drawings. Embodiments of the utility model and features of the embodiments may be combined with each other without conflict.

It is to be understood that the terms "system," "apparatus," "unit," and/or "module" as used herein are one means for distinguishing between different components, elements, parts, portions, or assemblies at different levels. However, if other words can achieve the same purpose, the word can be replaced by other expressions.

As used in the specification and in the claims, the terms "a," "an," "the," and/or "the" are not specific to a singular, but may include a plurality, unless the context clearly dictates otherwise. In general, the terms "comprises" and "comprising" merely indicate that the steps and elements are explicitly identified, and they do not constitute an exclusive list, as other steps or elements may be included in a method or apparatus. The inclusion of an element defined by the phrase "comprising one … …" does not exclude the presence of additional identical elements in a process, method, article, or apparatus that comprises an element.

Wherein, in the description of the embodiments of the present utility model, unless otherwise indicated, "/" means or, for example, a/B may represent a or B; "and/or" herein is merely an association relationship describing an association object, and means that three relationships may exist, for example, a and/or B may mean: a exists alone, A and B exist together, and B exists alone. In addition, in the description of the embodiments of the present utility model, "plurality" means two or more than two.

The terms "first" and "second" are used below for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature.

A flowchart is used in the present utility model to describe the operations performed by a system according to embodiments of the present utility model. It should be appreciated that the preceding or following operations are not necessarily performed in order precisely. Rather, the steps may be processed in reverse order or simultaneously. Also, other operations may be added to or removed from these processes.

Referring to fig. 1, some embodiments of the present utility model disclose a heat conduction assembly including a first solid heat conduction layer 1, a second solid heat conduction layer 2 and a base pipe 3.

The first solid heat conducting layer 1 and the second solid heat conducting layer 2 are arranged in a stacked manner, and the substrate tube 3 is positioned in the first solid heat conducting layer 1 and/or the second solid heat conducting layer 2.

Specifically, the heat conduction component is a double-layer structure formed by the first solid heat conduction layer 1 and the second solid heat conduction layer 2, and preferably, the shapes and the sizes of the first solid heat conduction layer 1 and the second solid heat conduction layer 2 are equal.

The first solid heat conduction layer 1 can be arranged on the bottom wall and the side wall of the liner or the electric kettle, and the second solid heat conduction layer 2 is connected with one side of the first solid heat conduction layer 1 far away from the inner wall of the liner or the electric kettle.

The substrate tube 3 is located in the first solid heat conduction layer 1 and the second solid heat conduction layer 2, the substrate tube 3 may be pre-buried in the first solid heat conduction layer 1 and/or the second solid heat conduction layer 2, and the substrate tube 3 may also be embedded in the first solid heat conduction layer 1 and/or the second solid heat conduction layer 2. The heat conductivity coefficient of the base tube 3 is higher than that of the first solid heat conducting layer 1, and the base tube 3 of the side wall of the liner or the electric kettle can be a solid tube or a hollow tube.

The thermal conductivity coefficients of the first solid thermal conductive layer 1 and the second solid thermal conductive layer 2 may be equal or unequal. In the embodiment in which the thermal conductivity of the first solid thermal conductive layer 1 and the second solid thermal conductive layer 2 are not equal, the thermal conductivity of the first solid thermal conductive layer 1, the base pipe 3, and the second solid thermal conductive layer 2 is changed stepwise in the order of heat conduction. Preferably, the second solid heat conducting layer 2 has a higher thermal conductivity than the base pipe 3, and the base pipe 3 has a higher thermal conductivity than the first solid heat conducting layer 1.

In the embodiment in which the substrate tubes 3 are disposed in the first solid heat conductive layer 1 and the second solid heat conductive layer 2, the heat conductivity coefficient of the substrate tube 3 disposed in the first solid heat conductive layer 1 may be the same as or different from the heat conductivity coefficient of the substrate tube 3 disposed in the second solid heat conductive layer 2, and the diameter and length of the substrate tube 3 disposed in the first solid heat conductive layer 1 may be equal to or different from the diameter and length of the substrate tube 3 disposed in the second solid heat conductive layer 2, which may be specifically selected according to actual needs.

The heat conduction component disclosed by the utility model is preferably arranged on the bottom wall and the side wall of the inner container or the electric kettle, and the direction in which the first solid heat conduction layer 1 and the second solid heat conduction layer 2 are arranged in a laminated way is vertical to the inner wall of the inner container or the electric kettle. The heat of the bottom wall of the liner or the electric kettle is firstly transferred to the first solid heat conduction layer 1 connected with the bottom wall of the liner or the electric kettle, the first solid heat conduction layer 1 connected with the bottom wall of the liner or the electric kettle transfers the heat to the first heat conduction layer connected with the side wall of the liner or the electric kettle, then the first solid heat conduction layer 1 transfers the heat to the base tube 3 parallel to the bottom wall and the side wall of the liner or the electric kettle, and finally the base tube 3 transfers the heat to the second solid heat conduction layer 2 parallel to the bottom wall and the side wall of the liner or the electric kettle, so that substances in the liner or the electric kettle are heated. According to the heat conduction assembly disclosed by the utility model, the bottom wall of the liner or the electric kettle is led to the side wall, and substances in the liner or the electric kettle are heated through the bottom wall and the side wall, so that the heating efficiency is improved.

The first solid heat conduction layer 1 and the second solid heat conduction layer 2 can be of planar structures with equal thickness everywhere, and correspondingly, the joint surfaces of the first solid heat conduction layer 1 and the second solid heat conduction layer 2 are of planar structures; the first solid heat conduction layer 1 and the second solid heat conduction layer 2 can be non-planar structures with unequal thicknesses at all positions, and only the joint surface is designed to be a non-planar structure, and after the first solid heat conduction layer 1 and the second solid heat conduction layer 2 are jointed, the integral structure formed by the first solid heat conduction layer 1 and the second solid heat conduction layer 2 is considered to be a planar structure.

In the embodiment in which the bonding surfaces of the first solid heat conducting layer 1 and the second solid heat conducting layer 2 are non-planar structures, as shown in fig. 1, the surface of the first solid heat conducting layer 1 bonded to the second solid heat conducting layer 2 is a first wavy surface, the surface of the first solid heat conducting layer 1 not bonded to the second solid heat conducting layer 2 is a plane, the surface of the second solid heat conducting layer 2 bonded to the first solid heat conducting layer 1 is a second wavy surface, the surface of the second solid heat conducting layer 2 not bonded to the first solid heat conducting layer 1 is a plane, the peak of the first wavy surface is located in the trough of the second wavy surface, and the peak of the second wavy surface is located in the trough of the first wavy surface.

The surface of the second solid heat conduction layer 2, which is not attached to the first solid heat conduction layer 1, is a plane, and after the first wavy surface of the first solid heat conduction layer 1 is attached to the second wavy surface of the second solid heat conduction layer 2, the first solid heat conduction layer 1 and the second solid heat conduction layer 2 integrally form a plane structure with uniform thickness at all positions.

The first wavy surface and the second wavy surface strengthen the connection area of the first solid heat conduction layer 1 and the second solid heat conduction layer 2, and strengthen the connection strength of the first solid heat conduction layer 1 and the second solid heat conduction layer 2.

The bonding surfaces of the first solid heat conducting layer 1 and the second solid heat conducting layer 2 may be wavy surfaces, zigzag surfaces, or bonding surfaces with other concave-convex structures, which are not particularly limited herein.

The surface, which is attached to the second solid heat conduction layer 2, of the first solid heat conduction layer 1 is a first wavy surface, so that the thicknesses of all parts of the first solid heat conduction layer 1 are unequal, the thickness of the position, corresponding to the wave crest of the first wavy surface, of the first solid heat conduction layer 1 is thick, the thickness of the position, corresponding to the wave trough of the first wavy surface, of the first solid heat conduction layer 1 is thin, and the substrate tube 3 is arranged at the position, where the wave crest is arranged, of the first solid heat conduction layer 1; and/or the number of the groups of groups,

the second solid heat conduction layer 2 is the second wave face towards the face that first solid heat conduction layer 1 laminated for the thickness is unequal everywhere on second solid heat conduction layer 2, and the second solid heat conduction layer 2 corresponds the position thickness of the crest of second wave face, and the position thickness of the trough of second solid heat conduction layer 2 corresponds the second wave face is thin, and base member pipe 3 sets up the position that sets up the crest at second solid heat conduction layer 2.

The base pipe 3 located in the first solid heat conducting layer 1 and the base pipe 3 located in the second solid heat conducting layer 2 are parallel or not parallel. In embodiments in which the base pipes 3 located in the first solid heat conducting layer 1 and the base pipes 3 located in the second solid heat conducting layer 2 are not parallel, the angle between the base pipes 3 located in the first solid heat conducting layer 1 and the base pipes 3 located in the second solid heat conducting layer 2 is not more than 30 °.

As shown in fig. 1, the substrate tube 3 located in the first solid heat conducting layer 1 and the substrate tube 3 located in the second solid heat conducting layer 2 are arranged in a staggered manner, so that uniformity of heat transferred to the first solid heat conducting layer 1 and the second solid heat conducting layer 2 is improved, and heat conduction effect is further improved.

The thickness of the first solid heat conduction layer 1 and the thickness of the second solid heat conduction layer 2 may be equal or unequal.

In order to increase the heat conduction speed, it is preferable that the thermal conductivity of the second solid thermal conductive layer 2 is greater than that of the first solid thermal conductive layer 1, and the thickness of the second solid thermal conductive layer 2 is smaller than that of the first solid thermal conductive layer 1.

The material of the first solid heat conduction layer 1 is the same as or different from the material of the second solid heat conduction layer 2.

In an embodiment where the material of the first solid heat conducting layer 1 is the same as the material of the second solid heat conducting layer 2, the heat conductivity coefficients of the first solid heat conducting layer 1 and the second solid heat conducting layer 2 are equal, in order that the heat conductivity speed of the second solid heat conducting layer 2 is greater than the heat conductivity speed of the first solid heat conducting layer 1, preferably, the thickness of the second solid heat conducting layer 2 is smaller than the thickness of the first solid heat conducting layer 1.

In the embodiment where the material of the first solid heat conducting layer 1 is different from the material of the second solid heat conducting layer 2, the heat conductivity coefficients of the first solid heat conducting layer 1 and the second solid heat conducting layer 2 may be equal or unequal. In embodiments in which the thermal conductivity of the first solid thermally conductive layer 1 is equal to the thermal conductivity of the second solid thermally conductive layer 2, the thickness of the second solid thermally conductive layer 2 is less than the thickness of the first solid thermally conductive layer 1; in embodiments in which the thermal conductivity of the first solid thermally conductive layer 1 is not equal to the thermal conductivity of the second solid thermally conductive layer 2, the thermal conductivity of the second solid thermally conductive layer 2 is higher than the thermal conductivity of the first solid thermally conductive layer 1.

The base pipe 3 may be a metal pipe or a non-metal pipe.

In an embodiment in which the base pipe 3 is a metal pipe, the base pipe 3 is a copper pipe or an aluminum pipe.

The diameter of the base pipe 3 is 0.1-0.5mm.

The above description is only illustrative of the preferred embodiments of the present utility model and the technical principles applied, and is not intended to limit the present utility model. Various modifications and variations of the present utility model will be apparent to those skilled in the art. The scope of the present utility model is not limited to the specific combination of the above technical features, but also includes other technical features formed by any combination of the above technical features or their equivalents without departing from the spirit of the present utility model. Such as the above-mentioned features and the technical features disclosed in the present utility model (but not limited to) having similar functions are replaced with each other.

Claims

1. A heat transfer assembly, comprising:

the first solid heat conduction layer (1) can be arranged on the bottom wall and the side wall of the liner or the electric kettle;

the second solid heat conduction layer (2) is arranged in a lamination way with the first solid heat conduction layer (1) and is connected with one side of the first solid heat conduction layer (1) far away from the inner container or the inner wall of the electric kettle;

the base body tube (3) is positioned in the first solid heat conduction layer (1) and/or the second solid heat conduction layer (2), the heat conduction coefficient of the base body tube (3) is higher than that of the first solid heat conduction layer (1), and the heat conduction coefficient of the first solid heat conduction layer (1) is higher than that of the inner container or the electric kettle.

2. The heat conduction assembly of claim 1, wherein a side of the first solid heat conduction layer (1) facing the second solid heat conduction layer (2) is a first wavy surface, a side of the second solid heat conduction layer (2) facing the first solid heat conduction layer (1) is a second wavy surface, a peak of the first wavy surface is located in a trough of the second wavy surface, and a peak of the second wavy surface is located in a trough of the first wavy surface so as to make the first wavy surface fit with the second wavy surface.

3. The heat conduction assembly according to claim 2, wherein the base pipe (3) is provided at a position of the first solid heat conduction layer (1) corresponding to a peak of the first wavy surface;

and/or the number of the groups of groups,

the substrate tube (3) is arranged at the position of the second solid heat conduction layer (2) corresponding to the wave crest of the second wavy surface.

4. The heat conduction assembly according to claim 1, characterized in that the base pipe (3) at the first solid heat conduction layer (1) is parallel to the base pipe (3) at the second solid heat conduction layer (2).

5. The heat conduction assembly according to claim 4, characterized in that the base pipe (3) located in the first solid heat conduction layer (1) is arranged offset from the base pipe (3) located in the second solid heat conduction layer (2).

6. The heat conducting assembly according to any of the claims 1-5, characterized in that the thermal conductivity of the first solid heat conducting layer (1) is equal or unequal to the thermal conductivity of the second solid heat conducting layer (2).

7. The heat conducting assembly according to any of the claims 1-5, characterized in that the thickness of the first solid heat conducting layer (1) is equal or unequal to the thickness of the second solid heat conducting layer (2).

8. The heat conducting assembly according to any of the claims 1-5, characterized in that the material of the first solid heat conducting layer (1) is the same or different from the material of the second solid heat conducting layer (2).

9. A heat transfer assembly according to any one of claims 1-5, wherein the base pipe (3) is a copper or aluminum pipe.

10. A heat transfer assembly according to any one of claims 1-5, characterized in that the base pipe (3) has a diameter of 0.1-0.5mm.