CN220079168U - Evaporation equipment - Google Patents
Evaporation equipment Download PDFInfo
- Publication number
- CN220079168U CN220079168U CN202321334150.7U CN202321334150U CN220079168U CN 220079168 U CN220079168 U CN 220079168U CN 202321334150 U CN202321334150 U CN 202321334150U CN 220079168 U CN220079168 U CN 220079168U
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- cavity
- vapor
- chamber
- vapor deposition
- film forming
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- 230000008020 evaporation Effects 0.000 title claims abstract description 48
- 238000001704 evaporation Methods 0.000 title claims abstract description 48
- 239000000463 material Substances 0.000 claims abstract description 48
- 239000012808 vapor phase Substances 0.000 claims abstract description 29
- 239000000758 substrate Substances 0.000 claims abstract description 28
- 238000010438 heat treatment Methods 0.000 claims abstract description 10
- 238000004891 communication Methods 0.000 claims abstract description 5
- 238000007740 vapor deposition Methods 0.000 claims description 44
- 230000008021 deposition Effects 0.000 claims description 4
- 230000007306 turnover Effects 0.000 claims description 4
- 239000010408 film Substances 0.000 description 59
- 239000012535 impurity Substances 0.000 description 9
- 238000000151 deposition Methods 0.000 description 5
- 238000000746 purification Methods 0.000 description 5
- 238000002203 pretreatment Methods 0.000 description 4
- 238000011109 contamination Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000000859 sublimation Methods 0.000 description 1
- 230000008022 sublimation Effects 0.000 description 1
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- Physical Vapour Deposition (AREA)
Abstract
The utility model provides evaporation equipment, which comprises a first cavity; the first evaporation component is arranged in the first cavity and is suitable for heating the film forming material to form a first vapor phase vapor flow; a second cavity, the second cavity being in selective communication with the first cavity; the second evaporation component is arranged in the second cavity, the first vapor phase vapor flow enters the first cavity to be deposited on the second evaporation component to form a pretreatment film layer, and the second evaporation component is suitable for heating the pretreatment film layer to form a second vapor phase vapor flow; and a film forming assembly disposed within the second chamber, the film forming assembly comprising a substrate adapted to deposit a second vapor phase vapor stream. Thus, the purity of the film forming material finally deposited on the substrate is improved, and the quality of the finally formed film is improved.
Description
Technical Field
The utility model relates to the technical field of evaporation, in particular to evaporation equipment.
Background
The vapor deposition equipment in the related art directly heats the film forming material for vapor deposition, and impurities in the film forming material are deposited on the substrate to influence the quality of a film layer formed by final vapor deposition.
Disclosure of Invention
The present utility model aims to solve at least one of the technical problems in the related art to some extent. To this end, an object of the present utility model is to propose an evaporation apparatus comprising: a first cavity; the first evaporation component is arranged in the first cavity and is suitable for heating the film forming material to form a first vapor phase vapor flow; a second cavity, the second cavity being in selective communication with the first cavity; the second evaporation component is arranged in the second cavity, the first vapor phase vapor flow enters the first cavity to be deposited on the second evaporation component to form a pretreatment film layer, and the second evaporation component is suitable for heating the pretreatment film layer to form a second vapor phase vapor flow; a film forming assembly disposed within the second chamber, the film forming assembly comprising a substrate adapted to deposit the second vapor phase vapor stream.
The vapor deposition equipment comprises two vapor deposition chambers, wherein the vapor deposition chambers can perform vapor deposition on a film forming material twice, a first vapor phase vapor flow formed after the first heating enters a second cavity to be deposited on a second vapor deposition assembly, impurities which are not easy to evaporate are left on the first vapor deposition assembly so as to perform first purification on the film forming material, the film forming material in the second vapor deposition assembly is heated for the second time, and impurities which are not easy to evaporate are further left on the second vapor deposition assembly so as to perform second purification on the film forming material, so that the purity of the film forming material finally deposited on a substrate is improved, and the quality of a finally formed film is improved.
According to some embodiments of the utility model, the evaporation apparatus further comprises: and the third cavity is selectively communicated with the second cavity, and the film forming component is arranged in the third cavity.
According to some embodiments of the utility model, the first vapor deposition assembly comprises: a first crucible adapted to carry the film-forming material; a first heater adapted to heat the first crucible to form the first vapor phase vapor stream; a first vacuum pump adapted to evacuate the first cavity.
According to some embodiments of the utility model, the second vapor deposition assembly comprises: a support assembly rotatable toward or away from the first cavity; a second heater disposed on the support assembly and adapted to heat a second crucible; and a second crucible disposed on the second heater, the first vapor stream entering the second cavity for deposition on the second crucible.
According to some embodiments of the utility model, the support assembly comprises: a support frame; the turnover rod is arranged on the supporting frame and can rotate towards or away from the first cavity.
According to some embodiments of the utility model, the film forming assembly further comprises: the two ends of the moving rod in the extending direction are fixed on the inner wall of the third cavity; the base plate frame, the one end of base plate frame with movable rod sliding connection, the base plate with the base plate frame is connected and follows the base plate frame is in the movable rod slides.
According to some embodiments of the utility model, the first cavity is disposed inside the second cavity and the second cavity is disposed inside the third cavity.
According to some embodiments of the utility model, a first gate valve is disposed on the first cavity, and the first cavity and the second cavity are communicated through the first gate valve.
According to some embodiments of the utility model, a second gate valve is arranged on the second cavity, and the second cavity and the third cavity are communicated through the second gate valve.
According to some embodiments of the utility model, the evaporation apparatus further comprises: and the third vacuum pump is arranged in the third cavity and is suitable for vacuumizing the third cavity.
Drawings
The foregoing and/or additional aspects and advantages of the utility model will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:
fig. 1 shows a schematic structural diagram of an evaporation apparatus according to an embodiment of the present utility model.
Reference numerals:
1: an evaporation device; 11: a first cavity; 111: a first vapor deposition assembly; 1111: a first heater; 1112: a first vacuum pump; 112: a first gate valve; 12: a second cavity; 1211: a support assembly; 1212: a second crucible; 1213: a second heater; 1214: a support frame; 1215: turning over the rod; 1216: a second vacuum pump; 122: a second gate valve; 13: a third cavity; 131: a film forming assembly; 1311: a substrate; 1312: a moving rod; 1313: a substrate frame; 1314: and a third vacuum pump.
Detailed Description
Embodiments of the present utility model are described in detail below. The following examples are illustrative only and are not to be construed as limiting the utility model. The examples are not to be construed as limiting the specific techniques or conditions described in the literature in this field or as per the specifications of the product. The reagents or apparatus used were conventional products commercially available without the manufacturer's attention.
In one aspect of the present utility model, an evaporation apparatus 1 is presented, which comprises a first chamber 11 and a second chamber 12, with reference to fig. 1.
The first chamber 11 includes a first vapor deposition assembly 111, and the first vapor deposition assembly 111 is adapted to heat a film forming material to form a first vapor phase vapor stream.
The second cavity 12 is optionally in communication with the first cavity 11, a second vapor deposition component is included in the second cavity 12, the first vapor deposition flow enters the second cavity 12 to deposit on the second vapor deposition component to form a pre-treatment film layer, the second vapor deposition component is adapted to heat the pre-treatment film layer to form a second vapor deposition flow, a film forming component 131 is further included in the second cavity 12, the film forming component 131 includes a substrate 1311, and the second vapor deposition flow is deposited on the substrate 1311.
The evaporation equipment 1 comprises two evaporation chambers, wherein the two evaporation chambers can perform twice evaporation on a film forming material, a first vapor phase vapor flow formed after the first heating enters a second chamber 12 to be deposited on a second evaporation component, impurities which are not easy to evaporate are remained on the first evaporation component 111 so as to perform first purification on the film forming material, the film forming material in the second evaporation component is subjected to second heating, a second vapor phase vapor flow is deposited on a substrate 1311, impurities which are not easy to evaporate are further remained on the second evaporation component so as to perform second purification on the film forming material, and therefore, the purity of the film forming material finally deposited on the substrate 1311 is improved, and the quality of a finally formed film is improved. In addition, the two evaporation sources are concentrated in one device, so that the use of other sublimation and purification devices can be reduced, and the evaporation efficiency is improved.
According to some embodiments of the present utility model, referring to fig. 1, the evaporation apparatus 1 may further include a third cavity 13, the third cavity 13 being optionally in communication with the second cavity 12, and the film forming assembly 131 being disposed within the third cavity 13. During evaporation, the second vapor phase vapor stream enters the third chamber 13 for deposition on the substrate 1311.
According to some embodiments of the utility model, referring to fig. 1, the first vapor deposition assembly 111 includes: a first crucible (not shown) adapted to carry the film-forming material; a first heater 1111, the first heater 1111 adapted to heat the first crucible to form the first vapor phase vapor stream; a first vacuum pump 1112, said first vacuum pump 1112 being adapted to evacuate said first chamber 11. Specifically, the film forming material is placed in the first crucible, the first vacuum pump 1112 is turned on to vacuumize the first cavity 11, when the vacuum degree reaches the requirement, the first crucible is heated by the first heater 1111, after the evaporation rate of the film forming material tends to be stable, the first vapor phase vapor flow enters the second cavity 12 to deposit on the second vapor deposition component to form a pre-treatment film layer, after enough film forming material is deposited on the second vapor deposition component, the heating function of the second vapor deposition component is turned on to heat the pre-treatment film layer to form a second vapor phase vapor flow, and after the second vapor phase vapor flow tends to be stable, the second vapor phase vapor flow enters the third cavity 13 to form a vapor film layer on the substrate 1311. Thus, the film-forming material is purified by vapor deposition twice, and impurities in the film-forming material are prevented from depositing on the substrate 1311, thereby improving the quality of the finally formed thin film. At the same time, the contamination of the second cavity 12 and the third cavity 13 by impurities in the film forming material can be reduced.
According to some embodiments of the utility model, referring to fig. 1, the second vapor deposition assembly may include: a support assembly 1211, the support assembly 1211 being rotatable toward or away from the first chamber 11; a second heater 1213, the second heater 1213 being disposed on the support assembly 1211 and adapted to heat the second crucible 1212; a second crucible 1212, the second crucible 1212 being disposed on the second heater 1213, the first vapor phase vapor stream entering the second cavity 12 for deposition on the second crucible 1212. Specifically, a film forming material is placed in a first crucible, a first vacuum pump 1112 is started to vacuumize the first cavity 11, when the vacuum degree reaches the requirement, the first crucible is heated by a first heater 1111, after the evaporation rate of the film forming material tends to be stable, a first vapor flow enters a second cavity 12, a supporting component 1211 rotates towards the first cavity 11 to enable the first vapor flow to be deposited on a second crucible 1212 to form a pre-treated film layer, after enough film forming material is deposited on the second crucible 1212, the supporting component 1211 rotates towards a direction away from the first cavity 11, the second heater 1213 heats the film forming material in the second crucible 1212 to perform second evaporation, and after the evaporation rate of the film forming material tends to be stable, the second vapor flow enters a third cavity 13 to be deposited on a substrate 1311 to form a final evaporation film layer. Thus, the film-forming material is purified by vapor deposition twice, and impurities in the film-forming material are prevented from depositing on the substrate 1311, thereby improving the quality of the finally formed thin film. At the same time, the contamination of the second cavity 12 and the third cavity 13 by impurities in the film forming material can be reduced.
According to some embodiments of the utility model, referring to fig. 1, the support assembly 1211 may include: a support rack 1214; a flip rod 1215, the flip rod 1215 being disposed on the support rack 1214, the flip rod 1215 being rotatable toward or away from the first cavity 11. Specifically, when the first heater 1111 is disposed below the second heater 1213, the second heater 1213 is disposed on the flipping rod 1215, the second crucible 1212 is disposed on a side of the second heater 1213 facing away from the flipping rod 1215, the second crucible 1212 can be caused to face downward against the first vapor phase vapor stream vaporized in the first cavity 11 when the flipping rod 1215 is rotated toward the first cavity 11, and the second crucible 1212 faces upward when the flipping rod 1215 is rotated toward a direction facing away from the first cavity 11, the second crucible 1212 heats the second crucible 1212 to form a second vapor phase vapor stream.
According to some embodiments of the utility model, the support assembly 1211 further comprises: a control system (not shown) which regulates the rotation of the flip rod 1215. Thereby, the turnover of the turnover rod 1215 is automatically controlled by the control system, and the convenience of the vapor deposition apparatus 1 is improved.
According to some embodiments of the utility model, referring to fig. 1, the film forming assembly 131 may further include: a moving rod 1312, wherein two ends of the moving rod 1312 in the extending direction are fixed on the inner wall of the third cavity 13; a substrate frame 1313, one end of the substrate frame 1313 is slidably connected to the moving bar 1312, and the substrate 1311 is connected to the substrate frame 1313 and slides on the moving bar 1312 with the substrate frame 1313. Specifically, a film forming material is placed in a first crucible, a first vacuum pump 1112 is started to vacuumize the first cavity 11, when the vacuum degree reaches the requirement, the first crucible is heated by a first heater 1111, after the evaporation rate of the film forming material tends to be stable, a first vapor stream enters a second cavity 12, a supporting component 1211 rotates towards the first cavity 11, so that the first vapor stream is deposited on a second crucible 1212 to form a pre-treated film layer, after enough film forming material is deposited on the second crucible 1212, the supporting component 1211 rotates towards a direction away from the first cavity 11, the second heater 1213 heats the film forming material in the second crucible 1212 to perform second evaporation, after the evaporation rate of the film forming material tends to be stable, the second vapor stream enters a third cavity 13, and the movement speed of a moving rod 1312 is controlled, so that a substrate 1313 carries the substrate 1311 to move at a uniform speed, and the second vapor stream is uniformly deposited on the substrate 1311, thereby completing film coating. Thus, the moving substrate 1311 is used for plating, so that the uniformity of the finally formed vapor deposition film layer can be improved, and the area of the region where plating can be performed on the substrate 1311 can be increased.
According to some embodiments of the present utility model, the relative positional relationship among the first cavity 11, the second cavity 12, and the third cavity 13 is not particularly limited, and for example, three cavities may be independent cavities, the second cavity 12 being located above the first cavity 11, and the third cavity 13 being located above the second cavity 12. In particular to the present utility model, referring to fig. 1, the three cavities may be one piece, for example, the first cavity 11 is disposed inside the second cavity 12, and the second cavity 12 is disposed inside the third cavity 13. Thereby, the volume of the vapor deposition apparatus 1 is reduced, and the space occupied by the vapor deposition apparatus 1 is reduced.
According to some embodiments of the present utility model, referring to fig. 1, a first gate valve 112 is disposed on the first cavity 11, and the first cavity 11 and the second cavity 12 are communicated through the first gate valve 112. Specifically, after the evaporation rate of the film forming material in the first cavity 11 tends to be stable, the first gate valve 112 is opened, a first opening is formed in the first cavity 11, the first cavity 11 is communicated with the second cavity 12, and the first vapor flow can enter the second cavity 12 through the first opening. After sufficient film forming material has been deposited on the second crucible 1212, the gate valve can be closed.
According to some embodiments of the present utility model, referring to fig. 1, a second gate valve 122 may be further disposed on the second cavity 12, and the second cavity 12 and the third cavity 13 may be communicated through the second gate valve 122. Specifically, after the first vapor phase vapor stream enters the second chamber 12, the second crucible 1212 is rotated to face the first opening to deposit the film forming material on the second crucible 1212, after enough film forming material is deposited on the second crucible 1212, the second crucible 1212 is rotated to face upward, the second heater 1213 heats the film forming material in the second crucible 1212 to perform the second evaporation, after the evaporation rate of the film forming material tends to be stable, the second gate valve 122 is opened to form the second opening on the second chamber 12, the second chamber 12 communicates with the third chamber 13, and the second vapor phase vapor stream enters the third chamber 13 through the second opening to deposit on the substrate 1311.
According to some embodiments of the utility model, referring to fig. 1, the evaporation apparatus 1 may further include: a third vacuum pump 1314, said third vacuum pump 1314 being disposed within said third chamber 13 and being adapted to evacuate said third chamber 13. Specifically, the film forming material is placed in the first crucible, the first vacuum pump 1112 is turned on to vacuum the first cavity 11, and meanwhile, in order to reduce the time of vacuum pumping, the second vacuum pump 1216 and the third vacuum pump 1314 may be turned on at the same time to respectively vacuum the second cavity 12 and the third cavity 13, so as to improve the working efficiency.
In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present utility model.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present utility model, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present utility model, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present utility model. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.
While embodiments of the present utility model have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the utility model, and that variations, modifications, alternatives and variations may be made to the above embodiments by one of ordinary skill in the art within the scope of the utility model.
Claims (10)
1. An evaporation apparatus, comprising:
a first cavity;
the first evaporation component is arranged in the first cavity and is suitable for heating the film forming material to form a first vapor phase vapor flow;
a second cavity, the second cavity being in selective communication with the first cavity;
the second evaporation component is arranged in the second cavity, the first vapor phase vapor flow enters the first cavity to be deposited on the second evaporation component to form a pretreatment film layer, and the second evaporation component is suitable for heating the pretreatment film layer to form a second vapor phase vapor flow;
a film forming assembly disposed within the second chamber, the film forming assembly comprising a substrate adapted to deposit the second vapor phase vapor stream.
2. The vapor deposition apparatus according to claim 1, characterized by further comprising: and the third cavity is selectively communicated with the second cavity, and the film forming component is arranged in the third cavity.
3. The vapor deposition apparatus of claim 2, wherein the first vapor deposition assembly comprises:
a first crucible adapted to carry the film-forming material;
a first heater adapted to heat the first crucible to form the first vapor phase vapor stream;
a first vacuum pump adapted to evacuate the first cavity.
4. The vapor deposition apparatus according to claim 3, wherein the second vapor deposition assembly comprises:
a support assembly rotatable toward or away from the first cavity;
a second heater disposed on the support assembly and adapted to heat a second crucible;
and a second crucible disposed on the second heater, the first vapor stream entering the second cavity for deposition on the second crucible.
5. The vapor deposition apparatus of claim 4, wherein the support assembly comprises:
a support frame;
the turnover rod is arranged on the supporting frame and can rotate towards or away from the first cavity.
6. The vapor deposition apparatus according to claim 2, wherein the film forming assembly further comprises:
the two ends of the moving rod in the extending direction are fixed on the inner wall of the third cavity;
the base plate frame, the one end of base plate frame with movable rod sliding connection, the base plate with the base plate frame is connected and follows the base plate frame is in the movable rod slides.
7. The vapor deposition apparatus according to claim 2, wherein the first chamber is provided inside the second chamber, and the second chamber is provided inside the third chamber.
8. The vapor deposition apparatus according to claim 7, wherein a first gate valve is provided on the first chamber, and the first chamber and the second chamber are communicated through the first gate valve.
9. The vapor deposition apparatus according to claim 8, wherein a second gate valve is provided on the second chamber, and the second chamber and the third chamber are communicated through the second gate valve.
10. The vapor deposition apparatus according to claim 3, characterized by further comprising: and the third vacuum pump is arranged in the third cavity and is suitable for vacuumizing the third cavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321334150.7U CN220079168U (en) | 2023-05-29 | 2023-05-29 | Evaporation equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321334150.7U CN220079168U (en) | 2023-05-29 | 2023-05-29 | Evaporation equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220079168U true CN220079168U (en) | 2023-11-24 |
Family
ID=88819770
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321334150.7U Active CN220079168U (en) | 2023-05-29 | 2023-05-29 | Evaporation equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220079168U (en) |
-
2023
- 2023-05-29 CN CN202321334150.7U patent/CN220079168U/en active Active
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