CN220074742U - Electrostatic chuck jig suitable for teaching position of mechanical arm in semiconductor equipment - Google Patents
Electrostatic chuck jig suitable for teaching position of mechanical arm in semiconductor equipment Download PDFInfo
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- CN220074742U CN220074742U CN202320886142.7U CN202320886142U CN220074742U CN 220074742 U CN220074742 U CN 220074742U CN 202320886142 U CN202320886142 U CN 202320886142U CN 220074742 U CN220074742 U CN 220074742U
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 34
- 239000012780 transparent material Substances 0.000 claims description 11
- 230000000903 blocking effect Effects 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 8
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
The utility model provides an electrostatic chuck jig suitable for teaching the position of a mechanical arm in semiconductor equipment, which is a jig suitable for teaching the position of the mechanical arm in the semiconductor equipment, and is suitable for teaching the effective position of a wafer, so that the accuracy of the wafer in the teaching position of the mechanical arm is ensured, and the running requirement of the semiconductor equipment is met. The electrostatic chuck jig suitable for teaching the position of the mechanical arm in the semiconductor equipment comprises a transparent wafer jig, a wafer positioning jig and an electrostatic chuck positioning jig, wherein the wafer positioning jig is used for positioning a wafer, the transparent wafer jig is used for clamping the wafer, and the electrostatic chuck positioning jig is used for positioning the center position of the electrostatic chuck.
Description
Technical Field
The utility model belongs to the technical field of semiconductor equipment, and particularly relates to an electrostatic chuck jig suitable for teaching the position of a mechanical arm in semiconductor equipment.
Background
The Robot arm (Robot) is a moving Robot (or an automated mechanical structure) in the cavity of the semiconductor device for transporting (or carrying) the wafer, which can carry the wafer to different fixed positions in the cavity of the semiconductor device, each position needs to correspond to a fixed point, each point needs to carry out point teaching on the Robot arm once, so that the wafer is accurately carried to each required fixed position, the accuracy of point teaching determines the accuracy of carrying the wafer to a designated position each time, and if the accuracy of carrying positions is insufficient, the production process of the wafer or the wafer collision is affected, and the wafer breakage and other serial consequences are caused.
At present, aiming at the mechanical arm mechanism of the type, a teaching jig matched with the mechanical arm mechanism is also used for teaching different positions, and the teaching jig mainly depends on human eye observation and the like, so that the teaching precision of the positions is often insufficient, the production process of the wafer is influenced, or the wafer is collided to cause a series of problems such as broken pieces and the like.
Disclosure of Invention
Based on the problems existing in the prior art, the utility model provides an electrostatic chuck jig suitable for teaching the position of a mechanical arm in semiconductor equipment.
According to the technical scheme, the utility model provides the electrostatic chuck jig suitable for teaching the position of the mechanical arm in the semiconductor equipment, which is suitable for teaching the position of the mechanical arm in the semiconductor equipment, and is suitable for teaching the effective position of a wafer, so that the accuracy of the wafer in the teaching position of the mechanical arm is ensured, and the running requirement of the semiconductor equipment is met.
The jig suitable for teaching the position of the mechanical arm inside the semiconductor equipment comprises a transparent material jig, a wafer positioning jig and an electrostatic chuck jig, wherein the wafer positioning jig is used for positioning a wafer, the transparent material jig is used for clamping the wafer, and the electrostatic chuck jig is used for positioning the center position of the electrostatic chuck.
Further, the transparent wafer jig is similar to the wafer in shape, is a flat plate shape of a perfect wafer shape, and is provided with a center hole at a center position. The center hole of the transparent wafer jig is used for positioning the transparent wafer jig, and the transparent material is beneficial to conveniently searching the center hole of the electrostatic chuck jig during teaching; there are no protrusions on the outer circumference of the transparent wafer jig, which are completely consistent with the wafer and applied to the wafer cluster tool without blocking.
In addition, the wafer positioning jig comprises an arc-shaped holding frame. The wafer positioning jig with the arc-shaped holding frame is of a triangle plate-shaped structure. Preferably, the first frame of the wafer positioning jig with the arc-shaped holding frame is arc-shaped, the arc of the first frame is directly identical to the straight line of the transparent material jig, and the transparent material jig is flatly leaned against the arc edge of the first frame in the use process.
Further, the second frame and the third frame of the wafer positioning jig with the circular-arc-shaped holding frame are straight-edge frames, the second frame and the third frame are connected with the bottom rectangular part of the jig with the circular-arc-shaped holding frame, and the second frame and the third frame form the same included angle with the short sides of the bottom rectangular part.
Specifically, the diameter of a groove on the electrostatic chuck jig is 296mm, the diameter of the groove is the same as that of the electrostatic chuck, the wall thickness of the groove is 3mm, and the groove can be matched with the excircle of the electrostatic chuck; the diameter of the cylindrical step is 100mm, the height is 12mm, and the diameter of the central hole is 2mm.
Compared with the prior art, the electrostatic chuck jig suitable for teaching the position of the mechanical arm in the semiconductor equipment has the following beneficial technical effects:
(1) The electrostatic chuck jig can greatly improve the teaching precision of operators when teaching different positions, and can also save the teaching time of the electrostatic chuck to a great extent.
(2) The electrostatic chuck jig is used for positioning the central position of the electrostatic chuck, the electrostatic chuck jig groove in the electrostatic chuck jig can clamp the electrostatic chuck, and the central hole site is arranged on the electrostatic chuck jig, so that the teaching efficiency of the electrostatic chuck position is greatly improved.
Drawings
Fig. 1 is a schematic view of a first structure of an electrostatic chuck in which a position is to be taught in accordance with the present utility model.
Fig. 2 is a second structural schematic diagram of an electrostatic chuck in which a position is to be taught in accordance with the present utility model.
Fig. 3 is a schematic diagram of a first structure of an electrostatic chuck jig to which the position teaching jig of the present utility model is applied.
Fig. 4 is a cross-sectional view of a first structure of an electrostatic chuck jig to which the position teaching jig of the present utility model is applied.
Fig. 5 is a schematic front view of the electrostatic chuck jig applied to the position teaching jig of the present utility model, and the view is a front view.
Fig. 6 is a schematic rear view of the electrostatic chuck jig applied to the position teaching jig of the present utility model, the view being a rear view.
Fig. 7 is a schematic left side view of the electrostatic chuck jig applied to the position teaching jig of the present utility model, the view being the left side view.
Fig. 8 is a schematic half-sectional view of an electrostatic chuck fixture on which the position teaching fixture of the present utility model is applied.
Fig. 9 is a schematic diagram of an electrostatic chuck fixture to which the position teaching fixture of the present utility model is applied, clamped on an electrostatic chuck.
Fig. 10 is a schematic diagram of a fixture for teaching a position of a robot arm, to which the position teaching fixture of the present utility model is applied, the fixture for teaching a position of a robot arm being clamped on the robot arm.
FIG. 11 is a schematic diagram of the jig for teaching the position of the robot arm shown in FIG. 10 and an application of a transparent wafer jig that rests flat on the jig for teaching the position of the robot arm.
Fig. 12 is a schematic diagram of the robot position teaching tool shown in fig. 10 and the robot applied to move toward the electrostatic chuck with the transparent wafer tool to perform the position teaching.
Fig. 13 is a schematic diagram of the fixture for teaching the position of the robot arm shown in fig. 10 and the robot arm applied to move toward the electrostatic chuck with the transparent wafer fixture for teaching the position, wherein the center hole of the transparent wafer fixture is concentric with the center hole of the electrostatic chuck fixture.
Reference numerals in the drawings illustrate:
in fig. 2: reference numerals 2-1, 2-2 and 2-3 are wafer support columns on the electrostatic chuck, which are a first wafer support column 2-1, a second wafer support column 2-2, a third wafer support column 2-3, respectively;
in fig. 3: reference numerals 3-1, 3-2 and 3-3 are through holes on the electrostatic chuck jig avoiding the wafer support column, which are a first through hole 3-1, a second through hole 3-2 and a third through hole 3-3, respectively; a central hole 3-4 of the electrostatic chuck jig;
in fig. 4: the inner wall 4-1 of the wall of the upper groove of the electrostatic chuck jig;
in fig. 10: reference numeral 10-1 is a jig for teaching the position of the mechanical arm, which is clamped on the mechanical arm;
in fig. 11: reference numeral 11-1 is a transparent wafer jig, which is a jig for teaching the position of a robot arm; 11-2 is a center hole on the transparent wafer jig.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the present utility model more apparent, the technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings, and it is apparent that the described embodiments are some embodiments of the present utility model, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
It should be noted that, for convenience of description, only the portions related to the present utility model are shown in the drawings. Embodiments of the utility model and features of the embodiments may be combined with each other without conflict.
It should be noted that the terms "first," "second," and the like herein are merely used for distinguishing between different devices, modules, or units and not for limiting the order or interdependence of the functions performed by such devices, modules, or units.
It should be noted that references to "one", "a plurality" and "a plurality" in this disclosure are intended to be illustrative rather than limiting, and those skilled in the art will appreciate that "one or more" is intended to be construed as "one or more" unless the context clearly indicates otherwise.
The utility model provides an electrostatic chuck jig suitable for teaching the position of a mechanical arm in semiconductor equipment, which is a jig suitable for teaching the position of the mechanical arm in the semiconductor equipment and is suitable for teaching the effective position of a wafer, so that the accuracy of the wafer in the teaching position of the mechanical arm is ensured, and the running requirement of the semiconductor equipment is met. The electrostatic chuck jig suitable for teaching the position of the mechanical arm in the semiconductor equipment comprises a transparent wafer jig, a wafer positioning jig and an electrostatic chuck positioning jig, wherein the wafer positioning jig is used for positioning a wafer, the transparent wafer jig is used for clamping the wafer, and the electrostatic chuck positioning jig is used for positioning the center position of the electrostatic chuck.
Further, the transparent wafer jig is similar to the wafer in shape, is a flat plate shape of a perfect wafer shape, and is provided with a center hole at a center position. The center hole of the transparent wafer jig is used for positioning the transparent wafer jig, and the transparent material of the transparent wafer jig is beneficial to finding the center hole position of the electrostatic chuck positioning jig during teaching; there are no protrusions on the outer circumference of the transparent wafer jig, which are completely consistent with the wafer and applied to the wafer cluster tool without blocking.
In addition, the wafer positioning jig comprises an arc-shaped holding frame. The wafer positioning jig with the arc-shaped holding frame is of a triangle plate-shaped structure. Preferably, the first frame of the wafer positioning jig with the arc-shaped holding frame is arc-shaped, the arc of the first frame is directly identical with the straight line of the transparent wafer jig, and the transparent material jig is flatly leaned against the arc edge of the first frame in the use process.
Further, the wafer positioning jig is provided with an arc-shaped holding frame, the second frame and the third frame of the wafer positioning jig with the arc-shaped holding frame are straight-edge frames, the second frame and the third frame are connected with the bottom rectangular part of the jig with the arc-shaped holding frame, and the second frame and the third frame form the same included angle with the short sides of the bottom rectangular part.
Specifically, as shown in fig. 6, the diameter of the groove of the electrostatic chuck positioning jig is 296mm (the maximum diameter of the inner wall of the groove of the electrostatic chuck positioning jig), the same as the diameter of the electrostatic chuck, the wall thickness is 3mm, and the maximum diameter of the outer wall of the groove of the electrostatic chuck positioning jig is 302mm; the groove can be matched with the excircle of the electrostatic chuck; the diameter of the cylindrical step is 100mm, the height is 12mm, and the diameter of the central hole is 2mm. The jig is suitable for teaching the position of the mechanical arm in the semiconductor equipment, is suitable for teaching the effective position of the wafer, ensures the accuracy of the wafer in teaching the position of the mechanical arm, and meets the operation requirement of the semiconductor equipment.
The present utility model will be described in further detail with reference to the accompanying drawings. FIG. 1 is a first schematic view of an electrostatic chuck in a shape of a right circular disk with a plurality of positioning holes according to the present utility model in which a position to be taught is desired; FIG. 2 is a schematic diagram of a second structure of an electrostatic chuck according to the present utility model, in which the electrostatic chuck includes a plurality of wafer support columns, and the plurality of wafer support columns are arranged in a central symmetry around the center of the electrostatic chuck. As shown in fig. 2, the electrostatic chuck includes 3 wafer support columns, which are a first wafer support column 2-1, a second wafer support column 2-2, and a third wafer support column 2-3, respectively. Fig. 3 is a schematic view of a first structure of an electrostatic chuck jig to which the position teaching jig of the present utility model is applied, and fig. 4 is a sectional view of a first structure of an electrostatic chuck jig to which the position teaching jig of the present utility model is applied; FIG. 5 is a schematic front view of the electrostatic chuck jig applied to the position teaching jig of the present utility model, the view being a front view; fig. 6 is a schematic rear view of the electrostatic chuck jig applied to the position teaching jig of the present utility model, the view being a rear view; fig. 7 is a schematic left side view of the electrostatic chuck jig applied to the position teaching jig of the present utility model, the view being the left side view.
The utility model is suitable for teaching the position from a mechanical arm in semiconductor equipment to an electrostatic chuck, which can be simply called as an electrostatic chuck jig, as shown in fig. 3 and 4, wherein the electrostatic chuck jig is in a perfect circle shape, a central hole 3-4 with the aperture of 2mm is arranged at the central position of the electrostatic chuck jig, and the central hole is used for positioning a transparent wafer jig; more specifically, the electrostatic chuck jig is a circular disc having a center circular boss, the center hole 3-4 is provided at the center of the center circular boss, and preferably, the diameter of the boss is 100mm; around the center circular boss, a plurality of through holes are provided at the periphery of the center circular boss. In a preferred embodiment of the utility model, 3 through holes are provided, namely a first through hole 3-1, a second through hole 3-2, a third through hole 3-3. Further, the center of the transparent wafer jig is provided with a hole, and the transparent material is favorable for finding the center hole position of the electrostatic chuck jig in teaching. There are no protrusions on the outer circumference of the transparent wafer jig, which are completely consistent with the wafer and applied to the wafer cluster tool without blocking.
As shown in fig. 3 and 4, the electrostatic chuck fixture suitable for teaching the position of the mechanical arm in the semiconductor device according to the present utility model further includes a through hole on the electrostatic chuck fixture for avoiding the wafer support column, and a groove structure clamped on the electrostatic chuck. For example, as shown in FIG. 3, the electrostatic chuck jig includes a first through hole 3-1, a second through hole 3-2, and a third through hole 3-3. Specifically, the through hole of the wafer support column is avoided from being concentric with the wafer support column on the electrostatic chuck jig, the diameter of the through hole is larger than that of the wafer support column, after the groove on the electrostatic chuck jig is clamped on the electrostatic chuck, the inner wall 4-1 of the groove on the electrostatic chuck jig coincides with the edge of the outer wall of the electrostatic chuck, and the center hole on the electrostatic chuck jig is the center of the electrostatic chuck, so that the center position of the electrostatic chuck can be positioned. The walls of the groove on the electrostatic chuck jig comprise an inner wall 4-1 and an outer wall corresponding to the inner wall 4-1.
As shown in fig. 11, 12 and 13, the robot arm moves toward the electrostatic chuck with the transparent wafer jig until the center hole on the transparent wafer jig is concentric with the center hole of the electrostatic chuck positioning jig, thereby completing the teaching of the robot arm to the electrostatic chuck position. More specifically, the thickness of the electrostatic chuck jig for positioning the center of the electrostatic chuck, the diameter and the like are shown in fig. 5, 6, 7 and 8 of the accompanying drawings, the diameter of the outer wall corresponding to the inner wall 4-1 of the electrostatic chuck jig is 302mm, the diameter of the groove is 296mm, the wall thickness of the electrostatic chuck jig is 3mm, and the depth of the groove is 5mm; the electrostatic chuck jig is provided with a first through hole 3-1, a second through hole 3-2 and a third through hole 3-3 which avoid a wafer supporting column, and the diameters of the first through hole 3-1, the second through hole 3-2 and the third through hole 3-3 are 10mm; the thickness of the cylindrical step of the electrostatic chuck jig is 12mm, and the diameter of the cylindrical step is 100mm; the diameter of the center hole 3-4 of the electrostatic chuck jig is 2mm.
In the utility model, the groove of the electrostatic chuck jig is clamped on the electrostatic chuck, the central hole of the electrostatic chuck is the central position of the electrostatic chuck, and the teaching of the mechanical arm on the position of the electrostatic chuck can be completed by moving the central hole of the transparent wafer jig to the central hole of the electrostatic chuck jig.
More specifically, fig. 8 shows a schematic half-section of the electrostatic chuck fixture clamped on the electrostatic chuck, so that it is possible to visually observe how the electrostatic chuck fixture is clamped on the electrostatic chuck. Fig. 9 shows the electrostatic chuck jig clamped on the electrostatic chuck, and also a final state in which the electrostatic chuck and the electrostatic chuck jig are used in cooperation when teaching the electrostatic chuck position. FIG. 10 shows a jig 10-1 for teaching the position of a robot arm clamped on the robot arm. As shown in FIG. 11, a transparent wafer jig 11-1 is provided with a center hole 11-2, which is flat against a jig for teaching the robot arm position. As shown in fig. 12, the robot arm applied to the position teaching jig of the present utility model moves toward the electrostatic chuck with the transparent wafer jig, and performs position teaching. As shown in fig. 13, the robot arm is moved to the electrostatic chuck position by moving the robot arm to bring the transparent wafer jig to the center hole of the transparent wafer jig and the center hole of the electrostatic chuck jig to be concentric, thereby completing the teaching from the robot arm to the electrostatic chuck position.
As shown in fig. 10-13, the wafer positioning jig includes an arc-shaped holding frame, and the wafer positioning jig having the arc-shaped holding frame has a triangular plate structure. Preferably, the first frame of the wafer positioning jig with the arc-shaped holding frame is arc-shaped, the arc of the first frame is directly identical to the straight line of the transparent material jig, and the transparent material jig is flatly leaned against the arc edge of the first frame in the use process. The second frame and the third frame of the circular arc-shaped wafer positioning jig with the frame are straight-edge frames, the straight-edge frames are connected with the bottom rectangular part of the circular arc-shaped wafer positioning jig with the frame, and the second frame and the third frame form the same included angle with the short sides of the bottom rectangular part. The circular arc-shaped frame holding jig is provided with a circular arc-shaped frame, and the circular arc diameter of the circular arc-shaped frame is 300mm; the first short bevel edge and the second short bevel edge which are connected with the circular arc-shaped frame are the same in size, and the length of the first short bevel edge and the second short bevel edge is 5mm. The long hypotenuse connecting the first short hypotenuse and the second short hypotenuse is the first long hypotenuse and the second long hypotenuse, respectively, the long hypotenuses being the same size and being 78.71mm in length. The vertical frames connecting the first long bevel edge and the second long bevel edge are respectively a first vertical frame and a second vertical frame, the vertical frames are the same in size, and the length of the vertical frames is 23mm; the connecting vertical frame is the bottom short side, which is 60mm in length.
As shown in fig. 11, the transparent wafer jig is horizontally leaned against the mechanical arm position teaching jig, and the mechanical arm carries the transparent wafer jig to move the position of the wafer adjuster jig until the central hole on the transparent wafer jig is concentric with the central hole on the wafer adjuster jig, so that the teaching from the mechanical arm to the position of the wafer adjuster jig is completed. As shown in fig. 12, the robot arm moves toward the wafer adjuster jig with the transparent wafer jig, and performs position teaching. As shown in fig. 13, the teaching from the robot arm to the position of the wafer adjuster jig is completed by moving the robot arm to move toward the position of the wafer adjuster jig so that the center hole of the wafer adjuster jig is concentric with the center hole of the wafer adjuster jig.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present utility model, and are not limiting; although the utility model has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present utility model.
Claims (8)
1. The electrostatic chuck jig is suitable for teaching the position of the mechanical arm in the semiconductor equipment, and is characterized by being suitable for teaching the position of the mechanical arm in the semiconductor equipment, and being suitable for teaching the effective position of a wafer, so that the accuracy of the wafer in the teaching position of the mechanical arm is ensured, and the running requirement of the semiconductor equipment is met; the electrostatic chuck jig suitable for teaching the position of the mechanical arm in the semiconductor equipment comprises a transparent wafer jig, a wafer positioning jig and an electrostatic chuck positioning jig, wherein the wafer positioning jig is used for positioning a wafer, the transparent wafer jig is used for clamping the wafer, and the electrostatic chuck positioning jig is used for positioning the center position of the electrostatic chuck.
2. The electrostatic chuck jig for teaching of the position of the robot arm inside a semiconductor device according to claim 1, wherein the transparent wafer jig is shaped like a wafer, is a flat plate shape of a perfect circle, and is provided with a center hole at a center position.
3. The electrostatic chuck fixture for teaching a position of a robot arm inside a semiconductor device according to claim 2, wherein the central hole of the transparent wafer fixture is used for positioning the transparent wafer fixture, and the transparent material is helpful for finding a central hole position of the electrostatic chuck fixture during teaching; there are no protrusions on the outer circumference of the transparent wafer jig, which are completely consistent with the wafer and applied to the wafer cluster tool without blocking.
4. The electrostatic chuck jig for teaching a position of a robot arm inside a semiconductor device as recited in claim 3, wherein the wafer positioning jig comprises an arc-shaped holding frame; the wafer positioning jig with the arc-shaped holding frame is of a triangle plate-shaped structure.
5. An electrostatic chuck jig for teaching the position of a robot arm inside a semiconductor device according to any one of claims 1 to 4, wherein the first frame of the wafer positioning jig having the frame in the shape of an arc is in the shape of an arc, the arc of the first frame is directly the same as the straight line of the transparent jig, and the transparent jig is flat against the arc edge of the first frame during use.
6. The electrostatic chuck jig according to any one of claims 1 to 4, wherein the second frame and the third frame of the wafer positioning jig having the circular-arc-shaped holding frame are straight-edge frames connected to the bottom rectangular portion of the jig having the circular-arc-shaped holding frame, and the second frame and the third frame form the same included angle with the short sides of the bottom rectangular portion.
7. The electrostatic chuck fixture for teaching the position of a robot arm inside a semiconductor device according to claim 6, wherein the diameter of the groove on the electrostatic chuck fixture is 296mm, which is the same as the diameter of the electrostatic chuck, and the wall thickness is 3mm, and the groove can be matched with the outer circle of the electrostatic chuck.
8. The electrostatic chuck jig for teaching of a position of a robot arm inside a semiconductor device according to claim 6, wherein the diameter of the cylindrical step is 100mm, the height is 12mm, and the diameter of the central hole is 2mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320886142.7U CN220074742U (en) | 2023-04-19 | 2023-04-19 | Electrostatic chuck jig suitable for teaching position of mechanical arm in semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320886142.7U CN220074742U (en) | 2023-04-19 | 2023-04-19 | Electrostatic chuck jig suitable for teaching position of mechanical arm in semiconductor equipment |
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| Publication Number | Publication Date |
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| CN220074742U true CN220074742U (en) | 2023-11-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320886142.7U Active CN220074742U (en) | 2023-04-19 | 2023-04-19 | Electrostatic chuck jig suitable for teaching position of mechanical arm in semiconductor equipment |
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| Country | Link |
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| CN (1) | CN220074742U (en) |
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