CN220807455U - Jig suitable for teaching position of mechanical arm in semiconductor equipment - Google Patents
Jig suitable for teaching position of mechanical arm in semiconductor equipment Download PDFInfo
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- CN220807455U CN220807455U CN202320886055.1U CN202320886055U CN220807455U CN 220807455 U CN220807455 U CN 220807455U CN 202320886055 U CN202320886055 U CN 202320886055U CN 220807455 U CN220807455 U CN 220807455U
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 26
- 239000012780 transparent material Substances 0.000 claims description 10
- 230000000903 blocking effect Effects 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 3
- 230000008569 process Effects 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 10
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 230000003014 reinforcing effect Effects 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
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- 238000012986 modification Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
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Abstract
The utility model provides a jig suitable for teaching the position of a mechanical arm in semiconductor equipment, wherein a center hole is formed in the wafer adjusting jig; the wafer adjusting jig is in a right circular shape, and the center hole is used for positioning the transparent wafer jig; the wafer adjusting jig is a circular disc with a plane hollow hole; the center point of the right circular disc is provided with a center hole, the center aperture is preferably 1mm, the center hole is a hole which is vertically penetrated, and the interface of the center hole and the disc is an included angle of 15-30 degrees. The wafer adjusting jig ensures the accuracy of the teaching position of the mechanical arm and meets the operation requirement of semiconductor equipment.
Description
Technical Field
The utility model belongs to the technical field of semiconductor equipment, and particularly relates to a jig suitable for teaching the position of a mechanical arm in semiconductor equipment.
Background
The Robot arm (Robot) is a moving Robot (or an automated mechanical structure) in the cavity of the semiconductor device for transporting (or carrying) the wafer, which can carry the wafer to different fixed positions in the cavity of the semiconductor device, each position needs to correspond to a fixed point, each point needs to carry out point teaching on the Robot arm once, so that the wafer is accurately carried to each required fixed position, the accuracy of point teaching determines the accuracy of carrying the wafer to a designated position each time, and if the accuracy of carrying positions is insufficient, the production process of the wafer or the wafer collision is affected, and the wafer breakage and other serial consequences are caused.
At present, aiming at the mechanical arm mechanism of the type, the teaching tool matched with the mechanical arm mechanism is matched to help teaching at different positions, but the teaching tool matched with the mechanical arm mechanism at present mainly depends on human eye observation and the like, so that the teaching precision of the position is often insufficient, the production process of a wafer is influenced or the wafer is collided to cause series of problems such as broken pieces and the like.
Disclosure of utility model
Based on the problems existing in the prior art, the utility model provides a jig suitable for teaching the position of a mechanical arm (Robot) in semiconductor equipment.
According to the technical scheme, the utility model provides the jig suitable for teaching the position of the mechanical arm in the semiconductor equipment, which is used for adjusting the wafer, and the wafer adjusting jig ensures the accuracy of the teaching position of the mechanical arm and meets the operation requirement of the semiconductor equipment. The wafer adjusting jig is provided with a central hole.
Further, the wafer adjusting jig is in a right circular shape, and a central hole is formed in the central position and used for positioning the transparent wafer jig; the wafer adjusting jig is a circular disc with a plane hollow hole; the center point of the right circular disc is provided with a center hole, the center aperture is 1mm, the center hole is a hole which is vertically penetrated, and the interface of the center hole and the disc is an included angle of 15-30 degrees.
Preferably, the central hole of the transparent wafer jig is used for positioning the transparent wafer jig, and the transparent material is beneficial to conveniently searching the electrostatic chuck jig and the central hole site during teaching; there are no protrusions on the outer circumference of the transparent wafer jig, which are completely consistent with the wafer and applied to the wafer cluster tool without blocking.
Further, the wafer positioning jig comprises an arc-shaped holding frame. The wafer positioning jig with the arc-shaped holding frame is of a triangle plate-shaped structure.
Furthermore, the first frame of the wafer positioning jig with the arc-shaped holding frame is arc-shaped, the arc of the first frame is directly identical with the straight line of the transparent material jig, and the transparent material jig is flatly leaned against the arc edge of the first frame in the use process.
Preferably, the second frame and the third frame of the wafer positioning jig with the circular-arc-shaped holding frame are straight-edge frames, the straight-edge frames are connected with the bottom rectangular part of the jig with the circular-arc-shaped holding frame, and the second frame and the third frame form the same included angle with the short sides of the bottom rectangular part.
More preferably, the jig for holding the frame in an arc shape has an arc-shaped frame, the arc diameter of which is 300mm; the first short bevel edge and the second short bevel edge which are connected with the circular arc-shaped frame are the same in size, and the length of the first short bevel edge and the second short bevel edge is 5mm.
Preferably, the long hypotenuse connecting the first short hypotenuse and the second short hypotenuse is the first long hypotenuse and the second long hypotenuse, respectively, the long hypotenuses being the same size and being 78.71mm in length.
Compared with the prior art, the wafer adjusting jig suitable for teaching the position of the mechanical arm (Robot) in the semiconductor equipment has the following beneficial technical effects:
(1) The utility model can greatly improve the teaching precision of operators when teaching different positions, and can also save the teaching time to a great extent. The wafer adjusting jig ensures the accuracy of the teaching position of the mechanical arm and meets the operation requirement of semiconductor equipment.
(2) The wafer positioning jig for positioning the transparent wafer can position the wafer, wherein the wafer positioning jig with the circular arc-shaped holding frame can clamp the wafer, and the production efficiency is greatly improved.
Drawings
Fig. 1 is a schematic diagram of a first structure of a wafer adjusting tool according to the present utility model, which requires a teaching position.
Fig. 2 is a schematic diagram of a second structure of a wafer adjusting tool according to the present utility model, which requires teaching positions.
Fig. 3 is a schematic diagram of a robot position teaching tool used by the wafer adjustment tool, which is clamped on the robot.
Fig. 4 is a schematic diagram of a transparent wafer jig applied to a wafer adjustment jig, which rests flat against a jig for robot position teaching.
Fig. 5 is a schematic diagram showing a robot arm used for the wafer adjustment tool moving toward the wafer adjustment tool with the transparent wafer tool to perform position teaching.
Fig. 6 is a schematic diagram of a robot arm with a transparent wafer jig, moving toward the position of the wafer jig, and teaching the position, wherein the center hole of the transparent wafer jig is concentric with the center hole of the wafer jig.
Reference numerals in the drawings illustrate:
In fig. 2: the mark 2-1 is a center hole of the wafer adjusting jig.
In fig. 3: the mark 3-1 is a jig for teaching the position of the mechanical arm, and is clamped on the mechanical arm;
In fig. 4: the mark 4-1 is a transparent wafer jig and is horizontally leaned on the mechanical arm position teaching jig, and the mark 4-2 is a central hole on the transparent wafer jig.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the present utility model more apparent, the technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings, and it is apparent that the described embodiments are some embodiments of the present utility model, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
It should be noted that, for convenience of description, only the portions related to the present utility model are shown in the drawings. Embodiments of the utility model and features of the embodiments may be combined with each other without conflict.
It should be noted that the terms "first," "second," and the like herein are merely used for distinguishing between different devices, modules, or units and not for limiting the order or interdependence of the functions performed by such devices, modules, or units.
It should be noted that references to "one", "a plurality" and "a plurality" in this disclosure are intended to be illustrative rather than limiting, and those skilled in the art will appreciate that "one or more" is intended to be construed as "one or more" unless the context clearly indicates otherwise.
The utility model provides a wafer adjusting jig which is suitable for teaching the position of a mechanical arm (Robot) in semiconductor equipment, and the wafer adjusting jig ensures the accuracy of the teaching position of the mechanical arm and meets the operation requirement of the semiconductor equipment.
The wafer adjusting jig suitable for teaching the position of a Robot arm (Robot) in semiconductor equipment is shown in fig. 2 and 1, and fig. 1 is a plan view of a wafer adjusting jig, and the wafer adjusting jig is provided with a central hole, so that an additional jig is not required to be manufactured to determine the central position of the wafer adjusting jig. Fig. 2 is a perspective view of a wafer adjustment jig, and reference numeral 2-1 is a center hole of the wafer adjustment jig. The wafer adjusting jig is in a right circular shape, and a central hole is formed in the central position and used for positioning the transparent wafer jig; the central hole of the transparent wafer jig is used for positioning the transparent wafer jig, and the transparent material is beneficial to conveniently searching the electrostatic chuck jig and the central hole position during teaching; there are no protrusions on the outer circumference of the transparent wafer jig, which are completely consistent with the wafer and applied to the wafer cluster tool without blocking. Further, the center of the transparent wafer jig is provided with a hole (as shown in fig. 4), and the transparent material of the transparent wafer jig is helpful to find the center hole position of the wafer adjusting jig when teaching the position. There are no protrusions on the outer circumference of the transparent wafer jig, which are completely consistent with the wafer and applied to the wafer cluster tool without blocking. The wafer size of transparent wafer tool adaptation is: the diameter is 300mm and the central aperture is 1mm. The wafer dimensions adapted as shown in fig. 4 are: the diameter is 300mm and the thickness is 2mm.
As shown in fig. 1, the wafer adjusting jig is provided with a center hole for positioning the wafer adjusting jig; compared with the prior art, the wafer adjusting jig does not need to be manufactured to be additionally provided with the jig, so that the center position of the wafer adjusting jig is determined. In the embodiment of the utility model, the wafer adjusting jig is a circular disc with a plane hollow hole, a central hole is arranged at the central point of the circular disc, the central hole diameter is preferably 1mm, the central hole is a vertically through hole, an included angle of 15-30 degrees is formed at the interface of the central hole and the disc, and the included angle is an included angle between the horizontal plane of the disc and the inclined plane of the hole. The planar hollow holes are uniformly distributed on the disc surface of the wafer adjusting jig, preferably 4 to 8 planar hollow holes, in a preferred embodiment, 6 planar hollow holes are connected with each other, reinforcing ribs are arranged between adjacent planar hollow holes, and the reinforcing ribs are integrally formed with annular ribs at the edge of the disc of the wafer adjusting jig. For the balance adjustment of the wafer adjusting jig, fixing holes are set in the annular rib, preferably the number of the fixing holes is equal to that of the plane hollow holes, and the fixing holes set in the annular rib are arranged in the middle positions of the adjacent plane hollow holes. The plane hollow holes of the wafer adjusting jig are circumferentially arranged around the central hole, and an inner periphery polygonal flat plate is arranged between the central hole and the plane hollow holes. Preferably, the distance between the center point of the ground plane hollowed-out hole and the center hole 2-1 is equal. The planar hollowed-out hole is preferably approximately right trapezoid in shape, with its long base adjacent to the circular rib and its short base adjacent to the inner peripheral polygonal plate. Furthermore, the inner periphery polygonal flat plate is provided with 3 positioning and fixing holes, each positioning and fixing hole is concave, namely, a vertically through hole of the positioning and fixing hole is connected with the plane of the inner periphery polygonal flat plate through a slope surface, and an included angle of 60 degrees is formed between the slope surface and the plane of the inner periphery polygonal flat plate. In the utility model, the adoption of 3 positioning fixing holes is an independent innovation point of the utility model, which not only is convenient for positioning the wafer adjusting jig, but also is convenient for adjusting the momentum balance of the wafer adjusting jig when the wafer adjusting jig rotates, and can carry out fine adjustment of the balance degree of the wafer adjusting jig after loading the wafer.
Fig. 3 is a schematic diagram of a robot position teaching tool, specifically a wafer positioning tool 3-1, which is clamped on a robot. Fig. 4 is a schematic diagram of a transparent wafer jig applied to a wafer adjustment jig, which rests flat against a jig for robot position teaching. Fig. 5 is a schematic diagram showing a robot arm used for the wafer adjustment tool moving toward the wafer adjustment tool with the transparent wafer tool to perform position teaching. Fig. 6 is a schematic diagram of a robot arm with a transparent wafer jig, moving toward the position of the wafer jig, and teaching the position, wherein the center hole of the transparent wafer jig is concentric with the center hole of the wafer jig.
As shown in fig. 3, the wafer positioning jig 3-1 includes an arc-shaped holding frame, and the wafer positioning jig having the arc-shaped holding frame has a triangular plate structure. Preferably, the first frame of the wafer positioning jig with the arc-shaped holding frame is arc-shaped, the arc of the first frame is directly identical to the straight line of the transparent material jig, and the transparent material jig is flatly leaned against the arc edge of the first frame in the use process. The second frame and the third frame of the circular arc-shaped wafer positioning jig with the frame are straight-edge frames, the straight-edge frames are connected with the bottom rectangular part of the circular arc-shaped wafer positioning jig with the frame, and the second frame and the third frame form the same included angle with the short sides of the bottom rectangular part. The circular arc-shaped frame holding jig is provided with a circular arc-shaped frame, and the circular arc diameter of the circular arc-shaped frame is 300mm; the first short bevel edge and the second short bevel edge which are connected with the circular arc-shaped frame are the same in size, and the length of the first short bevel edge and the second short bevel edge is 5mm. The long hypotenuse connecting the first short hypotenuse and the second short hypotenuse is the first long hypotenuse and the second long hypotenuse, respectively, the long hypotenuses being the same size and being 78.71mm in length. The vertical frames connecting the first long bevel edge and the second long bevel edge are respectively a first vertical frame and a second vertical frame, the vertical frames are the same in size, and the length of the vertical frames is 23mm; the connecting vertical frame is the bottom short side, which is 60mm in length.
As shown in fig. 4, the transparent wafer jig 4-1 is horizontally leaned against the mechanical arm position teaching jig, and the mechanical arm carries the transparent wafer jig to carry out the position movement of the wafer adjusting jig until the central hole position 4-2 on the transparent wafer jig is concentric with the central hole 2-1 on the wafer adjusting jig, so that the teaching from the mechanical arm to the wafer adjusting jig position is completed.
As shown in fig. 5, the robot arm moves toward the wafer adjustment jig with the transparent wafer jig, and performs position teaching. As shown in fig. 6, the robot arm is moved to move toward the wafer adjustment tool by moving the robot arm to make the center hole of the wafer adjustment tool concentric with the center hole of the wafer adjustment tool, thereby completing the teaching from the robot arm to the wafer adjustment tool.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present utility model, and are not limiting; although the utility model has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present utility model.
Claims (10)
1. The utility model provides a tool that is fit for inside robotic arm position teaching of semiconductor device for wafer adjustment, its characterized in that, wafer adjustment tool is the perfect circle shape, is provided with the centre bore in the central position, the centre bore is used for fixing a position transparent wafer tool, the centre bore is 1mm and the centre bore is the hole that link up perpendicularly, be 15 ~ 30 contained angle between hole inclined plane and the horizontal plane of disc.
2. The jig for teaching the position of the mechanical arm in the semiconductor device according to claim 1, wherein the wafer adjusting jig is provided with a central hole.
3. The jig for teaching the position of the mechanical arm in the semiconductor device according to claim 2, wherein the wafer adjusting jig is a circular disc with a plane hollow hole.
4. The jig for teaching the position of the mechanical arm in the semiconductor device according to claim 3, wherein the central hole of the transparent wafer jig can be used for positioning the transparent wafer jig, and the transparent material is helpful for finding the electrostatic chuck jig and the central hole site during teaching; there are no protrusions on the outer circumference of the transparent wafer jig, which are completely consistent with the wafer and applied to the wafer cluster tool without blocking.
5. The jig for teaching the position of the robot arm in the semiconductor device according to claim 4, wherein the wafer positioning jig comprises an arc-shaped holding frame.
6. The jig for teaching the position of the mechanical arm in the semiconductor device according to claim 4, wherein the wafer positioning jig with the circular arc-shaped holding frame has a triangular plate-shaped structure.
7. The jig for teaching the position of the mechanical arm in the semiconductor device according to claim 6, wherein the first frame of the wafer positioning jig with the circular-arc-shaped holding frame is circular-arc-shaped, the circular arc of the first frame is directly identical to the straight line of the transparent material jig, and the transparent material jig is flatly leaned against the circular arc edge of the first frame in the use process.
8. The jig for teaching the position of the mechanical arm inside the semiconductor device according to claim 6, wherein the second frame and the third frame of the wafer positioning jig with circular-arc-shaped holding frames are straight-edge frames, which are connected with the bottom rectangular part of the jig with circular-arc-shaped holding frames, and the second frame and the third frame form the same included angle with the short sides of the bottom rectangular part.
9. The jig for teaching the position of the mechanical arm in the semiconductor equipment according to claim 6, wherein the jig for holding the frame in the shape of an arc has a frame in the shape of an arc, and the diameter of the arc is 300mm; the first short bevel edge and the second short bevel edge which are connected with the circular arc-shaped frame are the same in size, and the length of the first short bevel edge and the second short bevel edge is 5mm.
10. The jig for teaching the position of the robot arm inside the semiconductor device according to claim 9, wherein the long hypotenuse connecting the first short hypotenuse and the second short hypotenuse can be the first long hypotenuse and the second long hypotenuse, respectively, the long hypotenuse being the same in size and being 78.71mm in length.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320886055.1U CN220807455U (en) | 2023-04-19 | 2023-04-19 | Jig suitable for teaching position of mechanical arm in semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320886055.1U CN220807455U (en) | 2023-04-19 | 2023-04-19 | Jig suitable for teaching position of mechanical arm in semiconductor equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220807455U true CN220807455U (en) | 2024-04-19 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320886055.1U Active CN220807455U (en) | 2023-04-19 | 2023-04-19 | Jig suitable for teaching position of mechanical arm in semiconductor equipment |
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| Country | Link |
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| CN (1) | CN220807455U (en) |
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- 2023-04-19 CN CN202320886055.1U patent/CN220807455U/en active Active
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