CN220040631U

CN220040631U - Testing device for semiconductor chip

Info

Publication number: CN220040631U
Application number: CN202321425578.2U
Authority: CN
Inventors: 高淮宇; 谢锴
Original assignee: Shenzhen Weijianda Electronic Technology Co ltd
Current assignee: Shenzhen Weijianda Electronic Technology Co ltd
Priority date: 2023-06-06
Filing date: 2023-06-06
Publication date: 2023-11-17
Anticipated expiration: 2033-06-06

Abstract

The utility model relates to a testing device of a semiconductor chip, which comprises a testing table, wherein testing mechanisms for improving the testing effect of picking and placing are arranged on the front side and the rear side of the testing table, conveying mechanisms for improving the testing conveying effect of the semiconductor chip are arranged on the left side and the right side of the testing table, the testing mechanisms comprise supporting frames fixed on the front side and the rear side of the testing table, and a linear module is fixed on the inner top wall of each supporting frame. This testing arrangement of semiconductor chip, through having set up testing mechanism, through mutually supporting between support frame, straight line module, electronic sucking disc and testing arrangement main part and the limiting plate etc. stretch out through the cylinder output shaft and drive electronic sucking disc and move down through electronic sucking disc absorption chip then cooperate straight line module and position sensor with the chip removal to testing arrangement main part top, stretch out the promotion chip through the cylinder output shaft simultaneously and remove the chip through the limiting plate and fix a position the chip and carry and push down to testing arrangement main part upper cover through the chip and close so that test in batches and use.

Description

Testing device for semiconductor chip

Technical Field

The utility model relates to the technical field of semiconductor chips, in particular to a testing device of a semiconductor chip.

Background

The semiconductor chip is a semiconductor device which is etched and wired on a semiconductor sheet material and can realize certain functions, common semiconductor chips comprise a silicon chip, a gallium arsenide chip, a germanium chip and the like, and along with the development of technology, the semiconductor chip is widely applied to the field of various high-precision electronic products, and the semiconductor chip needs to be tested after the production process of the semiconductor chip so as to ensure whether the chip is qualified or not.

The utility model discloses a testing device for a semiconductor chip in China patent publication No. (CN 213181882U), concretely relates to the technical field of semiconductor chips, the testing device comprises a testing flat plate, cushion blocks are fixedly arranged on the left side and the right side of the bottom surface of the testing flat plate, a waste recycling box is detachably arranged at the left end of the top surface of the testing flat plate, a finished product containing box is detachably arranged at the right end of the top surface of the testing flat plate, a testing cylinder seat is inlaid in the middle of the top surface of the testing flat plate, and an electrode plate is inlaid at the bottom end of the testing cylinder seat.

Disclosure of Invention

Aiming at the defects of the prior art, the utility model provides a testing device for semiconductor chips, which has the advantages of good batch pick-and-place testing effect and the like, and solves the problem of poor batch pick-and-place testing effect on semiconductor chips in the prior art.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the testing device of the semiconductor chip comprises a testing table, wherein testing mechanisms for improving the testing effect of picking and placing are arranged on the front side and the rear side of the testing table, and conveying mechanisms for improving the testing conveying effect of the semiconductor chip are arranged on the left side and the right side of the testing table;

the testing mechanism comprises a supporting frame fixed on the front side and the rear side of the testing table, a linear module is fixed on the inner top wall of the supporting frame, an air cylinder is fixed on the lower surface of the linear module through a bolt, an electric sucking disc is fixed on the outer side of an output shaft of the air cylinder, a testing device main body is fixed on the upper surface of the testing table, and a limiting plate is fixed on the outer surface of the testing device main body.

Further, a controller is fixed on the upper surface of the test bench, and the length of the linear module is equal to that of the supporting frame.

Further, the limiting plate is L-shaped, the width of the supporting frame is equal to that of the test bench, and a position sensor is fixed on the front face of the air cylinder.

Further, the output shaft of the air cylinder and the testing device main body are positioned on the same central shaft, and the outer diameter of the electric sucking disc is smaller than that of the testing device main body.

Further, conveying mechanism is including fixing the fixed plate in the testboard left and right sides, the right side the upper surface of fixed plate is fixed with first conveying platform, and the left side the upper surface of fixed plate is fixed with the second conveying platform, the left side of first conveying platform upper surface is fixed with the baffle, both sides all are fixed with the baffle around the first conveying platform upper surface.

Further, the width of the first conveying platform is equal to that of the test bench, and the width of the second conveying platform is equal to that of the first conveying platform.

Further, the right side of baffle is fixed with the blotter, the width of baffle equals with first conveying platform's width.

Compared with the prior art, the technical scheme of the utility model has the following beneficial effects:

1. this testing arrangement of semiconductor chip, through having set up testing mechanism, through support frame, sharp module, the cylinder, electric sucking disc and testing arrangement main part and limiting plate etc. mutually support, stretch out through the cylinder output shaft and drive electric sucking disc and move down through electric sucking disc adsorption chip then cooperate sharp module and position sensor with the chip removal to testing arrangement main part top, stretch out the promotion chip through the cylinder output shaft simultaneously and remove the chip through the limiting plate and fix a position the chip and carry and push down to testing arrangement main part upper cover through the chip and close so that test in batches and use.

2. This testing arrangement of semiconductor chip, through having set up conveying mechanism, through mutually supporting between fixed plate, first delivery platform, second delivery platform and baffle and the baffle etc. can utilize first delivery platform to carry the semiconductor chip of non-test, and can carry out spacing transport to the front and back both sides of chip through the baffle to can carry the unloading to the semiconductor chip after the test through the second delivery platform after the test is finished, with this transport test that improves batch chip uses.

Drawings

FIG. 1 is a schematic diagram of the structure of the present utility model;

FIG. 2 is a schematic diagram of a testing mechanism according to the present utility model;

FIG. 3 is a schematic view of a conveyor mechanism according to the present utility model.

In the figure: 1 test bench, 2 testing mechanism, 201 support frame, 202 straight line module, 203 cylinder, 204 electric sucker, 205 testing device main body, 206 limiting plate, 3 conveying mechanism, 301 fixed plate, 302 first conveying platform, 303 second conveying platform, 304 baffle, 305 baffle, 306 blotter.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1, a testing device for semiconductor chips in this embodiment includes a testing table 1, wherein testing mechanisms 2 for improving the testing effect of picking and placing are disposed on front and rear sides of the testing table 1, and conveying mechanisms 3 for improving the testing conveying effect of the semiconductor chips are disposed on left and right sides of the testing table 1.

Referring to fig. 2, in order to perform improved batch test on semiconductor chips, the test mechanism 2 in this embodiment includes a support frame 201 fixed on the front and rear sides of the test bench 1, a linear module 202 is fixed on the inner top wall of the support frame 201, an air cylinder 203 is fixed on the lower surface of the linear module 202 through a bolt, an electric suction cup 204 is fixed on the outer side of an output shaft of the air cylinder 203, the air cylinder 203 is driven by the linear module 202 to perform horizontal linear movement so as to drive the electric suction cup 204 to perform electric pick-and-place on the semiconductor chips on the conveying mechanism 3, a test device main body 205 is fixed on the upper surface of the test bench 1, a limiting plate 206 is fixed on the outer surface of the test device main body 205, and the output shaft of the air cylinder 203 stretches out to drive the electric suction cup 204 to move downwards to adsorb the chips through the electric suction cup 204 and then move the chips to the upper side of the test device main body 205 in cooperation with the linear module 202 and a position sensor.

In this embodiment, the upper surface of the test bench 1 is fixed with a controller, the length of the linear module 202 is equal to the length of the support frame 201, the shape of the limiting plate 206 is L-shaped, the width of the support frame 201 is equal to the width of the test bench 1, the front surface of the air cylinder 203 is fixed with a position sensor, the output shaft of the air cylinder 203 and the main body 205 of the test device are located on the same central shaft, the outer diameter of the electric sucking disc 204 is smaller than the outer diameter of the main body 205 of the test device, and the output shaft of the air cylinder 203 stretches out to push the chip to move through the limiting plate 206 to position and convey the chip, and the chip is pressed down onto the main body 205 of the test device to be covered for batch test.

Referring to fig. 3, in order to improve the conveying test effect of the semiconductor chips, the conveying mechanism 3 in this embodiment includes a fixing plate 301 fixed on the left and right sides of the test bench 1, a first conveying platform 302 is fixed on the upper surface of the right fixing plate 301, the first conveying platform 302 is used to convey the untested semiconductor chips, a second conveying platform 303 is fixed on the upper surface of the left fixing plate 301, a baffle 304 is fixed on the left side of the upper surface of the first conveying platform 302, and a partition 305 is fixed on the front and rear sides of the upper surface of the first conveying platform 302, so that the front and rear sides of the chips can be conveyed in a limited manner through the partition 305.

In this embodiment, the width of the first conveying platform 302 is equal to the width of the test bench 1, the width of the second conveying platform 303 is equal to the width of the first conveying platform 302, a buffer pad 306 is fixed on the right side of the baffle 304, the baffle 304 is matched with the buffer pad 306 to intercept the chip position, so that the electric sucking disc 204 can conveniently suck the chip for use, the width of the baffle 304 is equal to the width of the first conveying platform 302, and after the test is finished, the second conveying platform 303 can convey and discharge the tested semiconductor chips, so that the conveying test use of the batch of chips is improved.

The working principle of the embodiment is as follows:

(1) When the semiconductor chips are used for improving batch test, the linear module 202 is utilized to drive the air cylinder 203 to move horizontally and linearly so as to drive the electric sucking disc 204 to the conveying mechanism 3 to electrically pick and place the semiconductor chips, the output shaft of the air cylinder 203 stretches out to drive the electric sucking disc 204 to move downwards to adsorb the chips through the electric sucking disc 204 and then move the chips above the main body 205 of the testing device by matching with the linear module 202 and the position sensor, and meanwhile, the output shaft of the air cylinder 203 stretches out to push the chips to move, and the chips are positioned and conveyed through the limiting plate 206 and then are pressed onto the main body 205 of the testing device to be covered so as to facilitate batch test.

(2) When the semiconductor chip conveying test effect is improved, the first conveying platform 302 is utilized to convey the untested semiconductor chips, limiting conveying can be carried out on the front side and the rear side of the chips through the partition plate 305, meanwhile, the blocking plate 304 is matched with the buffer pad 306 to intercept the positions of the chips, so that the electric sucking disc 204 can conveniently suck the chips for use, and after the test is finished, the tested semiconductor chips can be conveyed and discharged through the second conveying platform 303, so that the conveying test use of batch chips is improved.

It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.

Standard parts used in the document of the utility model can be purchased from market, and can be customized according to the description of the specification and the drawings, the specific connection modes of the parts adopt conventional means such as mature bolts, rivets, welding and the like in the prior art, the machines, the parts and the equipment adopt conventional models in the prior art, the control modes are automatically controlled by a controller, and a control circuit of the controller can be realized by simple programming of a person skilled in the art, and the utility model does not explain the control modes and circuit connection in detail.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The semiconductor chip testing device comprises a testing table (1), and is characterized in that: the front side and the rear side of the test bench (1) are provided with test mechanisms (2) for improving the test effect of picking and placing, and the left side and the right side of the test bench (1) are provided with conveying mechanisms (3) for improving the test conveying effect of semiconductor chips;

the testing mechanism (2) comprises a supporting frame (201) fixed on the front side and the rear side of the testing table (1), a linear module (202) is fixed on the inner top wall of the supporting frame (201), an air cylinder (203) is fixed on the lower surface of the linear module (202) through bolts, an electric sucking disc (204) is fixed on the outer side of an output shaft of the air cylinder (203), a testing device main body (205) is fixed on the upper surface of the testing table (1), and a limiting plate (206) is fixed on the outer surface of the testing device main body (205).

2. The semiconductor chip testing apparatus according to claim 1, wherein: the upper surface of the test bench (1) is fixedly provided with a controller, and the length of the linear module (202) is equal to that of the supporting frame (201).

3. The semiconductor chip testing apparatus according to claim 1, wherein: the limiting plate (206) is L-shaped, the width of the supporting frame (201) is equal to that of the test bench (1), and a position sensor is fixed on the front face of the air cylinder (203).

4. The semiconductor chip testing apparatus according to claim 1, wherein: the output shaft of the air cylinder (203) and the testing device main body (205) are positioned on the same central shaft, and the outer diameter of the electric sucking disc (204) is smaller than the outer diameter of the testing device main body (205).

5. The semiconductor chip testing apparatus according to claim 1, wherein: conveying mechanism (3) are including fixing fixed plate (301) in testboard (1) left and right sides, and the right side the upper surface of fixed plate (301) is fixed with first conveying platform (302), and the left side the upper surface of fixed plate (301) is fixed with second conveying platform (303), the left side of first conveying platform (302) upper surface is fixed with baffle (304), both sides all are fixed with baffle (305) around first conveying platform (302) upper surface.

6. The semiconductor chip testing apparatus according to claim 5, wherein: the width of the first conveying platform (302) is equal to that of the test bench (1), and the width of the second conveying platform (303) is equal to that of the first conveying platform (302).

7. The semiconductor chip testing apparatus according to claim 5, wherein: the right side of the baffle plate (304) is fixedly provided with a buffer pad (306), and the width of the baffle plate (304) is equal to that of the first conveying platform (302).