CN220023477U - Phase-change heat dissipation structure and display module - Google Patents
Phase-change heat dissipation structure and display module Download PDFInfo
- Publication number
- CN220023477U CN220023477U CN202321617755.7U CN202321617755U CN220023477U CN 220023477 U CN220023477 U CN 220023477U CN 202321617755 U CN202321617755 U CN 202321617755U CN 220023477 U CN220023477 U CN 220023477U
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- Prior art keywords
- phase
- circuit board
- change material
- heat dissipation
- dissipation structure
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 28
- 239000012782 phase change material Substances 0.000 claims abstract description 63
- 239000012188 paraffin wax Substances 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 239000007788 liquid Substances 0.000 abstract description 7
- 238000001816 cooling Methods 0.000 description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 239000000463 material Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 238000005338 heat storage Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000452 restraining effect Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a phase-change heat dissipation structure and a display module, wherein an opening is arranged on a shell, a circuit board is covered on the opening, a containing cavity is formed between the circuit board and the shell, a heat conduction pipe and a phase-change material are arranged in the containing cavity, the phase-change material is used for isolating the circuit board and the heat conduction pipe so as to prevent leakage liquid of the heat conduction pipe from corroding the circuit board, and the phase-change material is respectively attached to the circuit board and the heat conduction pipe so as to conduct heat of the circuit board to the heat conduction pipe, thereby realizing efficient heat dissipation of the circuit board.
Description
Technical Field
The utility model relates to the technical field of display equipment, in particular to a phase-change heat dissipation structure and a display module.
Background
A display device is a device constituted by using a large number of regularly arranged light emitting elements, and a plurality of different light emitting elements are combined to blink or light up to display a picture. In order to provide better display effects, display devices are gradually moving toward higher brightness and higher pixel density, but these properties directly lead to a steep increase in the amount of heat generated by the display devices. In order to efficiently cool the display device, a solution commonly used at present is to attach a liquid cooling tube to a heat source (i.e. the display device), wherein a flowing heat conducting medium is arranged in the liquid cooling tube. However, the joint of the liquid cooling pipe always has the risk of leakage of the heat conducting medium, and once leakage occurs in the liquid cooling pipe, the circuit board of the display device is extremely likely to be short-circuited, so that serious economic loss is caused.
Disclosure of Invention
In order to overcome the defects of the prior art, the utility model aims to provide a phase-change heat dissipation structure and a display module, so as to solve the problem that the current display equipment water cooling device is easy to cause circuit faults due to leakage of a liquid cooling pipe.
The utility model adopts the following technical scheme:
a phase-change heat dissipation structure comprises a circuit board and a hollow shell; the shell is provided with an opening, the circuit board is covered on the opening, a containing cavity is formed between the circuit board and the shell, a heat conducting pipe is arranged in the containing cavity, a phase change material for isolating the circuit board and the heat conducting pipe is arranged between the circuit board and the heat conducting pipe, and the phase change material is respectively attached to part or all of the outer side walls of the circuit board and the heat conducting pipe.
In some alternative embodiments, the storage cavity is filled with the phase change material.
In some optional embodiments, a gap is left between the heat conducting pipe and the circuit board, the phase change material is in a plate shape, one side of the phase change material is attached to the circuit board, and the other side of the phase change material is attached to the outer side wall of the heat conducting pipe.
In some alternative embodiments, the phase change material is tubular, an inner side wall of the phase change material is attached to an outer side wall of the heat conducting tube, and an outer side wall of the phase change material is attached to the circuit board.
In some alternative embodiments, the ends of the heat pipes are provided with connectors that extend outside the housing.
In some alternative embodiments, the number of the heat conducting pipes is plural, and plural heat conducting pipes are arranged in parallel with each other.
In some optional embodiments, a plurality of driving chips are disposed on the circuit board, and the phase change material is attached to the driving chips.
In certain alternative embodiments, the phase change material is paraffin wax.
In some alternative embodiments, the housing includes a bottom plate and a plurality of side plates, the plurality of side plates are connected end to end and are arranged at edges of the bottom plate, and the side plates and the bottom plate are arranged perpendicular to each other or are arranged obliquely to each other.
In order to solve the same technical problems, the utility model also provides a display module, which comprises a light-emitting element and the phase-change heat dissipation structure, wherein the light-emitting element is arranged on the front surface of the circuit board, and the back surface of the circuit board is covered on the opening.
Compared with the prior art, the utility model has the beneficial effects that:
the heat conducting pipe and the phase change material are arranged in the accommodating cavity between the circuit board and the shell, the phase change material is used for isolating the circuit board and the heat conducting pipe so as to prevent leakage liquid of the heat conducting pipe from corroding the circuit board, and the phase change material is respectively attached to the circuit board and the heat conducting pipe so as to conduct heat of the circuit board to the heat conducting pipe, so that efficient heat dissipation of the circuit board is realized.
Drawings
FIG. 1 is a schematic diagram of the overall structure of a phase-change heat dissipation structure of the utility model;
fig. 2 is a schematic cross-sectional view of the phase-change heat dissipation structure of embodiments 1 and 2;
FIG. 3 is a schematic diagram illustrating an internal structure of a phase-change heat dissipation structure according to the present utility model;
FIG. 4 is an enlarged schematic view of FIG. 1 at A;
FIG. 5 is an enlarged schematic view at B in FIG. 3;
FIG. 6 is a schematic partial cross-sectional view of a phase-change heat dissipation structure of embodiment 3;
FIG. 7 is a schematic partial cross-sectional view of a phase-change heat dissipation structure of embodiment 4;
in the figure: 10. a circuit board; 11. a driving chip; 20. a housing; 21. a bottom plate; 22. a side plate; 30. a receiving chamber; 40. a heat conduction pipe; 41. a joint; 50. a phase change material; 60. a light emitting element.
Detailed Description
In order that the utility model may be readily understood, a more complete description of the utility model will be rendered by reference to the appended drawings. Preferred embodiments of the present utility model are shown in the drawings. This utility model may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used herein in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
Example 1
Referring to fig. 1 to 5, a phase change heat dissipation structure of the present utility model is schematically shown, and includes a circuit board 10 and a housing 20, wherein the housing 20 is a hollow structure, and the housing 20 is made of a metal material or an engineering plastic material having sufficient supporting strength.
The casing 20 is provided with an opening, the opening is communicated with the inside of the casing 20, and the circuit board 10 is covered on the opening, so that a closed accommodating cavity 30 is formed between the circuit board 10 and the casing 20. Wherein the housing 20 and the circuit board 10 are fixed by screws so that the housing 20 and the circuit board 10 can be disassembled for maintenance. Specifically, the housing 20 includes a bottom plate 21 and a plurality of side plates 22, the plurality of side plates 22 are disposed end to end at the edge of the bottom plate 21, and the side plates 22 and the bottom plate 21 are disposed perpendicular to each other or inclined to each other, thereby forming a hollow housing 20.
As shown in fig. 2, a heat conducting pipe 40 is arranged in the accommodating cavity 30, and a heat conducting medium is arranged in the heat conducting pipe 40; the phase change material 50 for isolating the circuit board 10 and the heat conducting tube 40 is arranged between the circuit board 10 and the heat conducting tube 40, in other words, the phase change material 50 is arranged between the circuit board 10 and the heat conducting tube 40, and the phase change material 50 is blocked between the circuit board 10 and the heat conducting tube 40, even if the heat conducting tube 40 leaks heat conducting medium, the leaked heat conducting medium cannot contact the circuit board 10 due to the blocking of the phase change material 50, so that the circuit board 10 is prevented from being corroded and damaged, and meanwhile, the phase change material 50 is respectively attached to part or all of the outer side walls of the circuit board 10 and the heat conducting tube 40, so that heat generated by the circuit board 10 can be transferred to the heat conducting tube 40 through the phase change material 50, and heat transfer to the circuit board 10 is completed.
In this embodiment, the phase change material 50 is preferably paraffin wax. The phase change material 50 is solid before being heated, the phase change material 50 is in a molten state after being heated, and the phase change material 50 in the solid state or the molten state has no fluidity, so that the phase change material 50 arranged in the accommodating cavity 30 cannot overflow, and the shell 20 is used for not only bearing the circuit board 10, but also restraining and protecting the heat conduction pipe 40 and the phase change material 50. The phase change material 50 also has a heat storage function and can effectively cope with instantaneous thermal shock of the circuit board 10.
Further, as shown in fig. 4, the end of the heat conducting tube 40 is provided with a connector 41 penetrating to the outside of the housing 20, the connector 41 is communicated with the heat conducting tube 40, the connector 41 can be connected to an external water cooling machine outside the housing 20, and the water cooling machine can provide the circulating power of the heat conducting medium and can absorb the heat of the heat conducting medium.
In order to improve the heat dissipation effect, the number of the heat pipes 40 is plural, the heat pipes 40 are parallel to each other, and the heat pipes 40 transfer heat to the circuit board 10, so that the cooling can be performed more efficiently.
In this embodiment, as shown in fig. 5, a plurality of driving chips 11 are disposed on the circuit board 10, and the phase-change material 50 is adhered to the driving chips 11, so that the phase-change material 50 can transfer the heat of the driving chips 11 to the heat conducting tube 40.
Example 2
As shown in fig. 2, this embodiment differs from embodiment 1 in that: the accommodating cavity 30 is filled with the phase change material 50, so that a larger volume of the phase change material 50 can absorb more heat to be able to resist the higher instantaneous thermal shock of the circuit board 10.
Example 3
As shown in fig. 6, this embodiment differs from embodiment 1 in that: a gap is left between the heat conductive pipe 40 and the circuit board 10, the phase change material 50 is plate-shaped, one side of the phase change material 50 is attached to the circuit board 10, and the other side of the phase change material 50 is attached to the outer side wall of the heat conductive pipe 40, in which case the phase change material 50 is attached to a part of the outer side wall of the heat conductive pipe 40. When the pipe diameter of the heat conduction pipe 40 of the present embodiment is the same as the pipe diameter of the heat conduction pipe 40 of embodiment 2, the bonding area between the phase change material 50 and the heat conduction pipe 40 of the present embodiment is smaller than the bonding area between the phase change material 50 and the heat conduction pipe 40 of embodiment 2, and although the bonding area between the phase change material 50 and the heat conduction pipe 40 of the present embodiment is smaller, the volume of the phase change material 50 in the present embodiment is smaller, and the relative material cost is lower.
Example 4
As shown in fig. 7, this embodiment differs from embodiment 1 in that: the phase change material 50 is substantially tubular, the cross-sectional edge of the inner wall of the tubular phase change material 50 matches and fits with the cross-sectional outer edge of the heat conductive tube 40, while the cross-sectional edge of the outer wall of the tubular phase change material 50 may be irregular, the inner side wall of the phase change material 50 fits with the outer side wall of the heat conductive tube 40, and the outer side wall of the phase change material 50 fits with the circuit board 10. The structure of the phase change material 50 can maximize the contact area with the heat conduction pipe 40, and the phase change material 50 does not need to completely fill the accommodating cavity 30 at this time, and the phase change material 50 can block the heat conduction pipe 40 and the circuit board 10.
Example 5
In order to solve the same technical problems, the present utility model further provides a display module, which includes a light emitting element 60 and the phase-change heat dissipation structure as described above, wherein the light emitting element 60 is disposed on the front surface of the circuit board 10, the back surface of the circuit board 10 is covered with an opening, the heat generated by the light emitting material is transferred to the circuit board 10, and the heat generated by the circuit board 10 and the heat generated by the light emitting material are transferred to the heat conducting tube 40 through the phase-change material 50, so as to realize heat dissipation of the light emitting element 60 and the circuit board 10.
When the number of the display modules is plural, the plural display modules can be spliced together to form a larger display device, in this case, the housings 20 of the plural display modules are connected to a bracket, and the joints 41 of the adjacent two display modules are connected to communicate the heat pipes 40 of the two display modules, thereby communicating the heat pipes 40 of the plural display modules, and communicating the joints 41 of the display modules located at the head end or the tail end to the water cooling machine, so as to realize water cooling of the plural display modules by the plural water cooling machines.
The foregoing description is only illustrative of the present utility model and is not intended to limit the scope of the utility model, and all equivalent structures or equivalent processes or direct or indirect application in other related technical fields are included in the scope of the present utility model.
Claims (10)
1. The phase-change heat dissipation structure is characterized by comprising a circuit board and a hollow shell; the shell is provided with an opening, the circuit board is covered on the opening, a containing cavity is formed between the circuit board and the shell, a heat conducting pipe is arranged in the containing cavity, a phase change material for isolating the circuit board and the heat conducting pipe is arranged between the circuit board and the heat conducting pipe, and the phase change material is respectively attached to part or all of the outer side walls of the circuit board and the heat conducting pipe.
2. The phase-change heat dissipation structure of claim 1, wherein the receiving cavity is filled with the phase-change material.
3. The phase-change heat dissipation structure as defined in claim 1, wherein a gap is left between the heat conduction pipe and the circuit board, the phase-change material is plate-shaped, one side of the phase-change material is attached to the circuit board, and the other side of the phase-change material is attached to the outer side wall of the heat conduction pipe.
4. The phase-change heat dissipation structure of claim 1, wherein the phase-change material is tubular, an inner side wall of the phase-change material is attached to an outer side wall of the heat conducting tube, and an outer side wall of the phase-change material is attached to the circuit board.
5. The phase-change heat dissipation structure as defined in claim 1, wherein the end of the heat pipe is provided with a joint penetrating outside the housing.
6. The phase-change heat dissipation structure as defined in claim 1, wherein a plurality of said heat conduction pipes are provided in a plurality, and a plurality of said heat conduction pipes are disposed in parallel with each other.
7. The phase-change heat dissipation structure of claim 1, wherein the circuit board is provided with a plurality of driving chips, and the phase-change material is attached to the driving chips.
8. The phase-change heat dissipation structure of claim 1, wherein the phase-change material is paraffin.
9. The phase-change heat dissipation structure as defined in claim 1, wherein the housing comprises a bottom plate and a plurality of side plates, the plurality of side plates are connected end to end and are arranged at edges of the bottom plate, and the side plates and the bottom plate are arranged vertically or obliquely.
10. A display module, comprising a light emitting element and the phase change heat dissipation structure according to any one of claims 1 to 9, wherein the light emitting element is disposed on the front surface of the circuit board, and the back surface of the circuit board is covered on the opening.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321617755.7U CN220023477U (en) | 2023-06-25 | 2023-06-25 | Phase-change heat dissipation structure and display module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321617755.7U CN220023477U (en) | 2023-06-25 | 2023-06-25 | Phase-change heat dissipation structure and display module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220023477U true CN220023477U (en) | 2023-11-14 |
Family
ID=88678433
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321617755.7U Active CN220023477U (en) | 2023-06-25 | 2023-06-25 | Phase-change heat dissipation structure and display module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220023477U (en) |
-
2023
- 2023-06-25 CN CN202321617755.7U patent/CN220023477U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |