CN216532420U - Immersed liquid cooling device and liquid cooling system - Google Patents

Abstract

Embodiments of the present disclosure relate to an immersion liquid cooling device and a liquid cooling system. This immersed liquid cooling device includes: the cooling device comprises a machine cabinet and a cooling device, wherein the machine cabinet comprises a cooling groove and a mounting groove integrated on the outer wall of the cooling groove, the cooling groove is used for accommodating electronic equipment to be cooled and first cooling liquid, the mounting groove is used for accommodating the first cooling liquid, and the cooling groove is in fluid communication with the mounting groove through a through hole; and the heat exchange module is suitable for being inserted into the mounting groove and comprises a cooling liquid circulation pipeline, a heat exchanger and a cooling liquid driving device, the cooling liquid circulation pipeline is communicated with the heat exchanger in a fluid mode and used for providing second cooling liquid for the heat exchanger, the heat exchanger is used for cooling first cooling liquid outside the heat exchanger by utilizing the second cooling liquid inside the heat exchanger, and the cooling liquid driving device is used for enabling the first cooling liquid to circulate between the mounting groove and the cooling groove.

Description

Immersed liquid cooling device and liquid cooling system

Technical Field

Embodiments of the present disclosure relate generally to the field of electronic device cooling technology, and more particularly, to an immersion liquid cooling apparatus and a liquid cooling system including the same.

Background

With the development of the integration of 5G, cloud computing, big data, artificial intelligence and other new-generation information communication technologies and the entity economy, a data center is gradually expanding from a service part enterprise to a service whole society and becomes a new infrastructure.

This new infrastructure places higher demands on the heat dissipation solution and overall energy efficiency of the heat dissipation center. On one hand, with the advent of the big data era, data is growing beyond imagination, and the power consumption of IT equipment is required to be doubled for processing, storing and transmitting mass data, so that the heat dissipation of a chip becomes a huge challenge. Conventional cooling solutions have been difficult to meet the need for efficient heat dissipation in electronic information devices. Meanwhile, the state, the place and the industry continue to develop energy policies, and higher requirements are put forward on energy-saving indexes of data centers.

The traditional data center machine room generally adopts a room-level air conditioner and a cooling mode of underfloor air supply. This mode construction cost is low, and the computer lab is with high use rate for solve 3 ~ 5 kW's single rack and generate heat. However, with the large application of rack-mounted and blade-type servers in a computer room, the number of devices, power density and heating density in a single cabinet are all significantly improved. The traditional machine room level air conditioner can not solve the heat dissipation problem of IT equipment, and a row level air conditioner and a back plate air conditioner are produced at the same time. The novel air conditioner tail end is closer to a heat source, the problems of local hot spots and high heating density can be solved, the power consumption of a fan is reduced through short-distance cold quantity transmission, and energy conservation is achieved. Regardless of the room-level air conditioner, the row-level air conditioner and the back-panel air conditioner, the air is cooled first, and then the cooled air is subjected to heat exchange with the CPU of the server to reduce the temperature. Because the heat exchange efficiency and the heat flux density of air are very low, the air cooling server has the problems of high cooling energy consumption, large noise, low equipment density and the like.

In order to solve the problem of heat dissipation of ultra-high power density IT equipment, a data center begins to adopt a liquid cooling technology, and uses working fluid as a medium for intermediate heat transmission to transfer heat from a heating area to a remote place for cooling. The cooling efficiency of the liquid cooling technology is obviously higher than that of air cooling heat dissipation, the heat dissipation problem of the high-density server can be effectively solved, the energy consumption of a cooling system is reduced, and noise is reduced.

In the current data center using liquid cooling schemes, a conventional immersion liquid cooling system is generally formed by equipping one or more sets of cold liquid distribution units (CDUs) to a large cabinet (usually about 3 meters in length). The cold liquid distribution unit is arranged on the left side and the right side of the cabinet. The inventors of the present application have found that there are a number of problems with such conventional immersion liquid cooling systems.

First, the cabinet of the conventional immersion liquid cooling system is bulky and difficult to operate and maintain. When the maintenance is carried out, an operator can only stand at the front part of the cabinet, but cannot stand at the left side and the right side of the cabinet for maintenance, and certain difficulty is brought to the operation. For example, in the current submerged liquid cooling industry, the system for server submerged heat dissipation basically adopts a horizontal cabinet with a length of about 2-3 meters, which causes many difficulties in implementation, operation and maintenance.

Second, conventional submerged liquid cooling systems are required to carry one or more sets of cooling liquid distribution units, which makes the overall system relatively complex.

Third, conventional immersion liquid cooling systems have poor adaptability to IT equipment. In a conventional immersion type liquid cooling system, when IT equipment with different heights is assembled, a cabinet with the same height is required. When the height of the IT equipment to be assembled is lower than the height of the cabinet, the servers therein need to share more cooling fluid, which is more costly.

Fourth, a single system of a conventional immersion type liquid cooling system requires large capacity of the carried IT equipment, and when some small-scale IT systems are required, waste of equipment and liquid to a certain extent is caused.

Accordingly, there is a need for an improved data center liquid cooling scheme.

SUMMERY OF THE UTILITY MODEL

It is an object of the present disclosure to provide an immersion liquid cooling apparatus and a liquid cooling system including the same to at least partially solve the above-mentioned problems in the prior art.

According to a first aspect of the present disclosure, there is provided an immersion liquid cooling apparatus comprising: a cabinet including a cooling tank for containing an electronic device to be cooled and a first cooling liquid, and a mounting groove integrated on an outer wall of the cooling tank for containing the first cooling liquid, the cooling tank and the mounting groove being in fluid communication via a through hole; and a heat exchange module adapted to be inserted into the mounting groove, the heat exchange module including a coolant circulation line in fluid communication with the heat exchanger for supplying a second coolant to the heat exchanger, the heat exchanger for cooling the first coolant outside thereof with the second coolant inside thereof, and a coolant driving device for circulating the first coolant between the mounting groove and the cooling groove.

According to the immersed liquid cooling device disclosed by the embodiment of the disclosure, the cabinet is small in size and small in overall weight, and the problem of difficulty in deployment is solved. The operator can maintain each side of the liquid cooling device, and can easily maintain the components of the internal electronic equipment. In addition, because rack and heat exchange module are integrated together, therefore entire system need not additionally carry on cold liquid distribution unit again and use, and is very nimble convenient.

In some embodiments, the through holes include a first set of through holes and a second set of through holes, wherein the cooling liquid driving device is adjacent to the first set of through holes in a state where the heat exchange module is inserted into the mounting groove, for driving the first cooling liquid in the mounting groove into the cooling groove and flowing the first cooling liquid in the cooling groove into the mounting groove via the second set of through holes. In such an embodiment, by arranging the coolant driving means adjacent to the first set of through holes, a fast circulation of the first coolant between the mounting groove and the cooling groove can be achieved.

In some embodiments, the first set of through holes is disposed proximate a bottom side of the mounting slot and the second set of through holes is disposed proximate a top side of the mounting slot. In such an embodiment, most of the first cooling liquid in the mounting groove can circularly flow into the cooling groove, so that the heat dissipation performance of the liquid cooling device is improved.

In some embodiments, the heat exchanger module is inserted into the mounting groove, the cooling liquid driving device is close to the bottom side of the mounting groove, and the heat exchanger is located above and adjacent to the cooling liquid driving device. In such an embodiment, the cooling liquid driving device is arranged adjacent to the heat exchanger, so that the first cooling liquid cooled by the heat exchanger can be timely conveyed to the cooling tank, and the heat dissipation performance of the liquid cooling device is further improved.

In some embodiments, the cooling liquid driving apparatus includes a plurality of circulation pumps, wherein each of the plurality of circulation pumps is respectively adjacent to a corresponding through hole of the first set of through holes in a state where the heat exchange module is inserted into the installation groove. In such an embodiment, the plurality of circulation pumps respectively drive the first cooling liquid into the corresponding through holes, and the circulation speed of the first cooling liquid between the mounting groove and the cooling groove can be further increased.

In some embodiments, the cabinet further includes an outer frame disposed around the cooling bath and the mounting groove, and a top cover rotatably connected to the outer frame and switchable between a closed state closing the cooling bath and an open state opening the cooling bath. In such an embodiment, by closing the first cooling tank with the top cover, leakage of the first cooling liquid in the cooling tank can be reduced, and external contaminants can be prevented from entering the cooling tank.

In some embodiments, the top cover includes a bezel and a transparent portion surrounded by the bezel. In such an embodiment, the electronic equipment in the cooling tank can be observed through the transparent part, and the operation state of the components of the electronic equipment can be known in time.

In some embodiments, a side of the top cover facing the cooling channel is provided with a first sealing ring, wherein the top cover and the cooling channel are sealed by the first sealing ring when the top cover is in the closed state. In such an embodiment, the first sealing ring can improve the sealing performance between the top cover and the cooling tank, and further reduce the leakage of the first cooling liquid in the cooling tank.

In some embodiments, the cabinet further comprises a hydraulic drive connected between the outer frame and the top cover for driving the top cover to switch between the closed state and the open state. In such an embodiment, the top cover can be conveniently opened or closed using a hydraulic drive.

In some embodiments, the hydraulic drive arrangement includes a pair of hydraulic rams, one of the pair of hydraulic rams being connected between the first side of the top cover and the outer frame, the other of the pair of hydraulic rams being connected between the second side of the top cover and the outer frame, the first and second sides of the top cover being opposite sides. In such an embodiment, the state switching of the top cover can be quickly and reliably realized by the pair of oppositely arranged hydraulic rods.

In some embodiments, the immersion liquid cooling apparatus further comprises an elevation support disposed below and supporting the cooling bath. In such an embodiment, the user can be according to the actual degree of depth needs collocation of electronic equipment have different liquid cooling device of joining in marriage high support, can save the use amount of first coolant liquid by a wide margin, can the helping hand realize carbon neutralization.

In some embodiments, the heat exchange module further comprises a plurality of liquid occupying blocks, wherein the plurality of liquid occupying blocks are at least partially submersible in the first cooling liquid in the mounting groove with the heat exchange module inserted into the mounting groove. In such an embodiment, under the condition that the heat exchange module is inserted into the mounting groove, the occupied liquid block can discharge the volume of the first cooling liquid, so that the consumption of the first cooling liquid required in the cabinet can be reduced, and the overall cost is reduced.

In some embodiments, the plurality of liquid occupying blocks are disposed near a top side of the mounting groove in a state where the heat exchange module is inserted into the mounting groove.

In some embodiments, a channel through which the first cooling liquid flows is provided between adjacent liquid occupying blocks in the plurality of liquid occupying blocks. In such embodiments, the first cooling fluid may flow through the channels between the liquid-occupying blocks, thereby forming a stable fluid path.

In some embodiments, the heat exchange module further comprises a support part, wherein the support part is located outside the mounting groove in a state that the heat exchange module is inserted into the mounting groove. In such an embodiment, the cabinet can reliably support the heat exchange module through the supporting portion, and the supporting portion can prevent leakage of the first cooling liquid in the mounting groove.

In some embodiments, a side of the support portion facing the mounting groove is provided with a second sealing ring, wherein the support portion and the mounting groove are sealed by the second sealing ring when the heat exchange module is inserted into the mounting groove. In such an embodiment, the second sealing ring can improve the sealing performance between the supporting part and the mounting groove, and further reduce the leakage of the first cooling liquid in the mounting groove.

In some embodiments, the height of the cabinet is in the range of 1000mm to 1100mm, the width of the cabinet is in the range of 750mm to 850mm, and the length of the cabinet is in the range of 500mm to 800 mm. In such an embodiment, where the height and width of the cabinet are substantially the same as the height and width of a conventional cabinet, the length of the cabinet is significantly reduced compared to the length of the conventional cabinet, and the volume of the cabinet is thus also significantly reduced.

In some embodiments, the first cooling liquid comprises a fluorinated liquid or a mineral oil, and/or the second cooling liquid comprises deionized water.

In some embodiments, the electronic device comprises a server or a switch.

According to a second aspect of the present disclosure, there is provided a liquid cooling system comprising a plurality of submerged liquid cooling devices arranged side by side, wherein each submerged liquid cooling device of the plurality of submerged liquid cooling devices is any one of the submerged liquid cooling devices according to the first aspect of the present disclosure.

This summary is provided to introduce a selection of concepts in a simplified form that are further described below in the detailed description. This summary is not intended to identify key features or essential features of the disclosure, nor is it intended to limit the scope of the disclosure.

Drawings

The above and other objects, features and advantages of the embodiments of the present disclosure will become readily apparent from the following detailed description read in conjunction with the accompanying drawings. Several embodiments of the present disclosure are illustrated by way of example, and not by way of limitation, in the figures of the accompanying drawings and in which:

fig. 1 and 2 show schematic structural views of an immersion liquid cooling apparatus according to one embodiment of the present disclosure, wherein in fig. 1 the top cover is in a closed state, and in fig. 2 the top cover is in an open state;

FIG. 3 is a schematic diagram of the submerged liquid cooling apparatus shown in FIG. 1, with the heat exchange module in a withdrawn state;

FIG. 4 is a schematic diagram of the immersion liquid cooling apparatus of FIG. 1 viewed from another perspective;

FIG. 5 illustrates a top view of the submerged liquid cooling apparatus shown in FIG. 2, with the top cover not shown to show the first cooling liquid in the cooling bath;

FIG. 6 shows a top view of the submerged liquid cooling apparatus shown in FIG. 2, wherein the top cover and heat exchange module are not shown to show the first cooling liquid in the cooling bath and mounting bath;

FIG. 7 illustrates a schematic structural view of an outer wall of a cooling bath for an integrated mounting bath according to one embodiment of the present disclosure;

FIG. 8 shows a schematic structural diagram of a heat exchange module according to one embodiment of the present disclosure;

FIG. 9 shows a schematic flow path of a first cooling liquid;

fig. 10-12 show different arrangements of electronics in an immersion liquid cooling apparatus according to embodiments of the present disclosure; and

fig. 13 shows a schematic structural diagram of a liquid cooling system according to an embodiment of the present disclosure.

Detailed Description

Preferred embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While the preferred embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

The term "include" and variations thereof as used herein is meant to be inclusive in an open-ended manner, i.e., "including but not limited to". Unless specifically stated otherwise, the term "or" means "and/or". The term "based on" means "based at least in part on". The terms "one example embodiment" and "one embodiment" mean "at least one example embodiment". The term "another embodiment" means "at least one additional embodiment". The terms "first," "second," and the like may refer to different or the same object.

As described above, conventional submerged liquid cooling systems suffer from various problems, such as difficult operation and maintenance, complex overall architecture, poor adaptability, and waste of cooling liquid. The embodiment of the disclosure provides an immersed liquid cooling device with a heat exchanger integrated inside and a liquid cooling system comprising the immersed liquid cooling device, so that the operation and maintenance difficulty is reduced, the complexity of the structure is reduced, the adaptability is enhanced, and the cooling liquid is saved. Hereinafter, the principle of the present disclosure will be described with reference to fig. 1 to 13.

Fig. 1 and 2 show schematic structural views of an immersion liquid cooling apparatus 100 according to one embodiment of the present disclosure, wherein the top cover 24 is in a closed state in fig. 1 and the top cover 24 is in an open state in fig. 2. Fig. 3 shows a schematic diagram of the submerged liquid cooling device 100 shown in fig. 1, wherein the heat exchange module 3 is in a drawn-out state. Fig. 4 shows a schematic view of the immersion liquid cooling apparatus 100 of fig. 1 from another perspective. In fig. 1, reference numeral X denotes a length direction of the immersion liquid cooling apparatus 100, reference numeral Y denotes a width direction of the immersion liquid cooling apparatus 100, and reference numeral Z denotes a height direction of the immersion liquid cooling apparatus 100.

As shown in fig. 1-4, in general, the immersion liquid cooling apparatus 100 described herein includes a cabinet 2 and a heat exchange module 3. The cabinet 2 includes an outer frame 23, a cooling bath 21, a mounting groove 22 integrated on an outer wall 211 of the cooling bath 21, and a top cover 24. The cooling tank 21 is for accommodating the electronic apparatus 4 to be cooled and the first cooling liquid 5 (see fig. 5 and 6). The mounting groove 22 is used for accommodating the heat exchange module 3 and the first cooling liquid 5 (see fig. 6). The cooling groove 21 is in fluid communication with the mounting groove 22 via the through-hole 6 (see fig. 7). The heat exchange module 3 is adapted to be inserted into the mounting groove 22.

As shown in fig. 1 to 4, the outer frame 23 generally surrounds the cooling channel 21 and the mounting channel 22 to provide mechanical support to the cooling channel 21 and the mounting channel 22 to some extent. The cooling groove 21 and the mounting groove 22 may be mounted on the outer frame 23 by welding or other means. In some embodiments, the outer frame 23 may be formed from profiled square steel by welding. In other embodiments, the outer frame 23 may be formed by other processes or by other materials, and embodiments of the present disclosure are not limited in this respect.

In some embodiments, the cooling channel 21 and the mounting channel 22 may be welded using stainless steel plates. In other embodiments, the cooling groove 21 and the mounting groove 22 may be formed by other processes or by using other materials, and the embodiments of the present disclosure are not limited in this respect.

As shown in fig. 1 and 2, the top cover 24 is rotatably connected to the outer frame 23 and is capable of switching between a closed state closing the cooling bath 21 and an open state opening the cooling bath 21. The cover 24 is shown in a closed state in fig. 1, while the cover 24 is shown in an open state in fig. 2. The top cover 24 can reduce leakage of the first cooling liquid 5 in the cooling tank 21 in the closed state, and can prevent external contaminants from entering the cooling tank 21. With the top cover 24 in the open state, an operator can perform installation or maintenance of the electronic equipment 4 in the cooling tank 21 and inject the first cooling liquid 5 into the cooling tank 21.

In some embodiments, the first cooling liquid 5 comprises a fluorinated liquid or a mineral oil. In other embodiments, the first cooling liquid 5 may also be of other types, and embodiments of the present disclosure are not strictly limited in this respect.

In some embodiments, the top cover 24 may be opened more than 90 degrees relative to the outer frame 23. At the maximum opening angle, a stopper (not shown) may be provided to limit the position of the top cover 24.

In some embodiments, the top cover 24 may be connected to one side of the outer frame 23 by a hinge. In other embodiments, the top cover 24 may be connected to the outer frame 23 by other means, such as by shaft hole fitting, etc., and embodiments of the present disclosure are not limited in this respect.

In some embodiments, as shown in fig. 1 and 2, the top cover 24 includes a bezel 241 and a transparent portion 242 surrounded by the bezel 241. The bezel 241 is connected to the outer frame 23 and is rotatable with respect to the outer frame 23. The frame 241 may be made of aluminum alloy or other types of metal or non-metal materials. The transparent portion 242 may be made of a transparent Polycarbonate (PC) material or other types of transparent materials. By providing the transparent portion 242, even when the top cover 24 is in the closed state, the operator can observe the electronic device 4 in the cooling bath 21 through the transparent portion 242 and know the operation state of the components of the electronic device 4 in time.

In some embodiments, the side of the top cover 24 facing the cooling channel 21 is provided with a first sealing ring (not shown). When the top cover 24 is in the closed state, the top cover 24 and the cooling bath 21 are sealed by a first gasket. The first sealing ring may for example comprise EPDM rubber or another type of sealing material. The first sealing ring can improve the sealing performance between the top cover 24 and the cooling tank 21, and further reduce the leakage of the first cooling liquid 5 in the cooling tank 24.

In some embodiments, to enable opening and closing of the top cover 24, the cabinet 2 further includes a hydraulic drive device (not shown). A hydraulic drive is connected between the outer frame 23 and the top cover 24 for driving the top cover 24 to switch between the closed state and the open state. The opening and closing of the top cover 24 can be conveniently achieved by a hydraulic drive.

In some embodiments, the hydraulic drive includes a pair of hydraulic levers (not shown). One of a pair of hydraulic rods is connected between the first side 243 of the top cover 24 and the respective side of the outer frame 23. The other of the pair of hydraulic rams is connected between the second side 244 of the top cover 24 and the respective side of the outer frame 23. The first side 243 and the second side 244 of the top cover 24 are opposite sides. The state switching of the top cover 24 can be realized quickly and reliably by the pair of oppositely arranged hydraulic rods.

It should be understood that in other embodiments, the top cover 24 may be switched between the closed state and the open state in other ways, and embodiments of the present disclosure are not limited in this respect.

In some embodiments, a handle (not shown) may also be provided on the side of the top cover 24 facing away from the cooling channel 21. With this arrangement, an operator can open and close the top cover 24 by grasping the handle.

Furthermore, in the embodiment according to the present disclosure, since the heat exchange module 3 is adapted to be inserted into the mounting groove 22 and be extracted from the mounting groove 22, an operator can conveniently use different heat exchange modules 3 according to different heat dissipation requirements of the electronic device 4.

As mentioned hereinbefore, both the cooling channel 21 and the mounting channel 22 are used for containing the first cooling liquid 5. In the cooling tank 21, the first cooling liquid 5 may immerse the electronic equipment 4 for cooling the electronic equipment 4. In the installation groove 22, the heat exchange module 3 may be at least partially submerged by the first cooling liquid 5. The heat exchange module 3 may be connected with an external cooling device (e.g. a cooling tower) to receive the second cooling liquid provided by the external cooling device. The temperature of the second cooling liquid in the heat exchange module 3 is lower than the temperature of the first cooling liquid 5 in the mounting groove 22, so that the first cooling liquid 5 in the mounting groove 22 can be cooled.

In some embodiments, the second cooling liquid in the heat exchange module 3 may include deionized water. In other embodiments, the second cooling fluid may also be of other types, and embodiments of the present disclosure are not limited in this respect.

An exemplary structure of the heat exchange module 3 will be described below with reference to fig. 8. As shown in fig. 8, the heat exchange module 3 includes a coolant circulation line 31, a heat exchanger 32, and a coolant drive device 33. The cooling liquid circulation line 31 is in fluid communication with the heat exchanger 32 for circulating the second cooling liquid between the heat exchanger 32 and an external cooling device, such as a cooling tower. With this arrangement, the second coolant having a lower temperature can be supplied to the heat exchanger 32. The heat exchanger 32 is used for cooling the first cooling liquid 5 outside thereof with the second cooling liquid inside thereof. The coolant drive device 33 is for circulating the first coolant 5 between the mounting groove 22 and the cooling groove 21. In this way, the low-temperature first cooling liquid 5 that enters the cooling tank 21 from the mounting groove 22 can absorb heat from the electronic device 4, and the first cooling liquid 5 that has absorbed heat and warmed up can enter the mounting groove 22 from the cooling tank 21 via the through hole 6 and be cooled down again by the heat exchanger 32 in the mounting groove 22 for the next cycle.

As shown in conjunction with fig. 1 to 8, in the case where the heat exchange module 3 is inserted into the installation groove 22, the heat exchanger 32 and the coolant driving device 33 may be submerged by the first coolant 5. Since the second cooling liquid received via the cooling liquid circulation line 31 is present in the heat exchanger 32, the first cooling liquid 5 in the mounting groove 22 can be cooled down by the second cooling liquid.

In some embodiments, the cooling fluid circulation line 31 may include two sets of feed and return lines. Through such a redundant design, in the case that a set of liquid inlet and liquid return pipelines has problems, the other set of liquid inlet and liquid return pipelines can still operate normally, so that the reliability of the system can be improved.

In some embodiments, the heat exchanger 32 may comprise a plate heat exchanger. In other embodiments, heat exchanger 32 may comprise other types of heat exchangers, and embodiments of the present disclosure are not limited in this respect.

In some embodiments, a dense micro-cavity structure may be disposed inside the heat exchanger 32, so as to increase the contact area between the second cooling liquid and the heat exchanger 32, and improve the heat exchange efficiency of the heat exchanger 32.

In some embodiments, the heat exchanger 32 may be made of a stainless steel material. In other embodiments, the heat exchanger 32 may be made of other types of materials having higher thermal conductivities, and embodiments of the disclosure are not limited in this respect.

Fig. 7 shows an exemplary arrangement of through-holes 6 on the outer wall 211 of the cooling slot 21. In some embodiments, as shown in fig. 7, the vias 6 include a first set of vias 61 and a second set of vias 62. As shown in fig. 1 to 4 and fig. 7 and 8 in combination, in the case where the heat exchange module 3 is inserted into the mounting groove 22, the coolant driving device 33 will be close to the first set of through holes 61 for driving the first coolant 5 in the mounting groove 22 into the cooling groove 21 via the first set of through holes 61 and flowing the first coolant 5 in the cooling groove 21 into the mounting groove 22 via the second set of through holes 62.

In some embodiments, as shown in fig. 7, each through-hole of the first set of through-holes 61 may be oval in shape. It should be understood that in other embodiments, each through-hole of the first set of through-holes 61 may be other shapes, such as circular, rectangular, square, bar, etc., and embodiments of the present disclosure are not strictly limited in this respect.

Similarly, as shown in fig. 7, each through-hole of the second set of through-holes 62 may be oval in shape. In other embodiments, each via in the second set of vias 62 may be other shapes, such as circular, rectangular, square, strip, etc., and embodiments of the present disclosure are not limited in this respect.

In some embodiments, as shown in FIG. 7, a first set of through holes 61 is provided near the bottom side of the mounting slot 22 and a second set of through holes 62 is provided near the top side of the mounting slot 22. With this arrangement, it is possible to make most of the first cooling liquid 5 in the mounting groove 22 participate in the circulation of the cooling liquid between the cooling groove 21 and the mounting groove 22.

In some embodiments, as shown in fig. 1 to 4 and 8 in combination, in the case where the heat exchange module 3 is inserted into the installation groove 22, the cooling liquid driving device 33 is close to the bottom side of the installation groove 22, and the heat exchanger 32 is located above the cooling liquid driving device 33 and is disposed adjacent to the cooling liquid driving device 33. By arranging the cooling liquid driving device 33 adjacent to the heat exchanger 32, the first cooling liquid 5 cooled by the heat exchanger 32 can be timely conveyed to the cooling tank 21, and the heat radiation performance of the liquid cooling device 100 is further improved.

In some embodiments, as shown in fig. 8, the coolant driving device 33 includes a plurality of circulation pumps, wherein each circulation pump will be respectively close to a corresponding through hole of the first set of through holes 61 in a case where the heat exchange module 3 is inserted into the installation groove 22. With this arrangement, the plurality of circulation pumps can drive the first cooling liquid 5 into the respective through holes, respectively, and the circulation speed of the first cooling liquid 5 between the mounting groove 22 and the cooling groove 21 can be further increased.

In some embodiments, an additional circulation pump may be provided near each through hole of the first set of through holes 61. With this redundant design, the circulation stability of the first cooling liquid 5 between the mounting groove 21 and the cooling groove 22 can be improved.

In other embodiments, the coolant drive device 33 may also include other types of drive units or take other arrangements, and embodiments of the present disclosure are not limited in this respect.

In some embodiments, as shown in fig. 8, the heat exchange module 3 further includes a plurality of liquid occupying blocks 34. In a case where the heat exchange module 3 is inserted into the installation groove 22, the plurality of liquid occupying blocks 34 can be at least partially immersed in the first cooling liquid 5 in the installation groove 22. In this way, the liquid occupying block 34 can drain the volume of the first cooling liquid 5 in the mounting groove 22, so that the liquid level of the first cooling liquid 5 in the mounting groove 22 is raised, the amount of the first cooling liquid 5 required in the cabinet 2 is reduced, and the overall cost is reduced.

In some embodiments, as shown in fig. 1 to 4 and 8, in the case where the heat exchange module 3 is inserted into the installation groove 22, the plurality of liquid occupying blocks 34 will be disposed near the top side of the installation groove 22. In other embodiments, the liquid occupying block 34 may be disposed at other positions, and the embodiments of the present disclosure are not limited in this respect.

In some embodiments, as shown in fig. 8, a channel 35 through which the first cooling liquid 5 flows is provided between adjacent liquid occupying blocks 34 of the plurality of liquid occupying blocks 34. The first cooling liquid 5 can flow through the channels 35 between the liquid slugs 34, thereby forming a stable fluid path.

As shown in fig. 1 to 4 and 8, in some embodiments, the heat exchange module 3 includes a support part 36 at the top. The support portion 36 is located outside the mounting groove 22 and supported by the outer frame 23 in a state where the heat exchange module 3 is inserted into the mounting groove 22. In this way, the entire weight of the heat exchange module 3 can be reliably supported on the outer frame 23.

In some embodiments, a side of the support portion 36 facing the mounting groove 22 is provided with a second sealing ring (not shown). In the state where the heat exchange module 3 is inserted into the mounting groove 22, the space between the support portion 36 and the mounting groove 22 is sealed by the second seal ring. The second sealing ring can improve the sealing performance between the supporting part 36 and the mounting groove 22, and further reduce the leakage of the first cooling liquid 5 in the mounting groove 22.

As shown in fig. 1 to 4 and 8, in some embodiments, a pair of handles 37 are provided on the support portion 36. By grasping the handle 37, the operator can easily operate the heat exchange module 3, such as extracting the heat exchange module 3 from the mounting groove 22 or inserting the heat exchange module 3 into the mounting groove 22.

Returning to fig. 1-4, in some embodiments, the immersion liquid cooling apparatus 100 further includes an elevation support 7, the elevation support 7 being disposed below the cooling bath 21 and supporting the cooling bath 21. With the arrangement, a user can match the liquid cooling device with different height-matching brackets 7 according to the actual depth requirement of the electronic equipment 4, so that the usage amount of the first cooling liquid 5 can be greatly saved, and the carbon neutralization can be realized by assistance. In some cases, the elevated support 7 may also support the mounting slot 22.

Fig. 9 shows a schematic flow path of the first cooling liquid 5, indicated by arrows. As shown in fig. 9, in the case where the heat exchange module 3 is inserted into the installation groove 22, the heat exchanger 32 and the coolant driving device 33 may be submerged by the first coolant 5. Since the second cooling liquid received via the cooling liquid circulation line 31 is present in the heat exchanger 32, the first cooling liquid 5 in the mounting groove 22 can be cooled down by the second cooling liquid. The cooling liquid driving device 33 then drives the first cooling liquid 5 in the mounting groove 22 into the cooling groove 21 via the first set of through holes 61 and flows through the electronic apparatus 4 from bottom to top, thereby cooling the electronic apparatus. Subsequently, the first cooling liquid 5 in the cooling tank 21 after absorbing heat from the electronic equipment 4 flows into the mounting groove 22 via the second group of through holes 62. The first cooling liquid 5 again travels from top to bottom in the installation trough 22 and is cooled down via the heat exchanger 32 for the next cycle.

In some embodiments, as shown in fig. 9, the second cooling liquid in the heat exchanger 32 may flow in the left-right direction, and the first cooling liquid 5 in the installation groove 22 may flow up and down in the vertical direction, so that heat exchange in the form of cross flow is formed, and the heat exchange efficiency of the heat exchanger 32 is enhanced.

In some embodiments, the electronic device 4 comprises a server or a switch. In other embodiments, the electronic device 4 may also be of other types, and embodiments of the present disclosure are not strictly limited in this respect.

Fig. 10-12 illustrate different arrangements of electronic equipment 4 in an immersion liquid cooling apparatus 100 according to embodiments of the disclosure. As shown in fig. 10, the electronic device 4 includes both a computing type server and a storage type server. As shown in fig. 11, the electronic apparatus 4 mainly includes a storage type server. As shown in fig. 12, the electronic device 4 mainly includes a computing server. In some embodiments, the cabinet 2 of the immersion liquid cooling apparatus 100 shown in fig. 10-12 may be, for example, 8U in size. In other embodiments, the size of cabinet 2 may be greater than or less than 8U, and embodiments of the present disclosure are not limited in this respect.

As shown in fig. 1, in the case where the height in the height direction Z and the width in the width direction Y of the cabinet 2 according to the embodiment of the present disclosure are substantially the same as those of the conventional cabinet, the length of the cabinet 2 in the length direction X is only about one sixth of the length of the conventional cabinet. For example, where the height of the cabinet is in the range of 1000mm to 1100mm (e.g., about 1050mm) and the width of the cabinet is in the range of 750mm to 850mm (e.g., about 800mm), the length of a conventional cabinet is typically around 3 meters, whereas the length of the cabinet 2 in the embodiment of the present disclosure is only 500mm, which is a significant reduction in size. In the embodiment according to the present disclosure, the length of the cabinet 2 in the length direction X may be adjusted according to the number of the electronic devices 4 provided therein, and is preferably kept in a range of 500mm to 800 mm.

Fig. 10 to 12 also show a conductive terminal 8 for connecting the electronic device 4, so as to supply power to the electronic device 4 and perform signal/data transmission, etc.

As shown in connection with fig. 10-12, because the size of the cabinet 2 is small compared to conventional liquid cooling solutions, an operator may stand on either side of the cabinet 2 to operate the electronic equipment 4 in the cabinet 2.

In the embodiment according to the present disclosure, through the design of integrating the cabinet 2 and the heat exchange module 3, and the heat dissipation exchange is completed through the liquid-liquid heat exchange inside the whole system, the new architecture of the immersion liquid-cooling data center can be greatly simplified.

Fig. 13 shows a schematic structural diagram of a liquid cooling system 900 according to an embodiment of the disclosure. As shown in fig. 13, the liquid cooling system 900 includes a plurality of immersed liquid cooling devices 100 arranged side by side. Each of the plurality of immersion liquid cooling devices 100 may be any of the immersion liquid cooling devices 100 described in conjunction with fig. 1-12.

No matter in the small, medium or large data center deployment, the user can set the number of the immersion liquid cooling devices 100 according to the business needs, thereby forming business systems of different scales, and bringing a more flexible and efficient immersion liquid cooling system deployment mode for the data center. This also solves the problem of excessive single-fault losses due to the large number of IT devices in a single cabinet. For example, in some usage scenarios of edge computing, the small-sized immersion type liquid cooling apparatus 100 can be deployed in a small amount independently, which brings more application scenarios of miniaturization and flexible deployment.

In addition, when large-scale cluster deployment is performed, the immersed liquid cooling device 100 can be arranged in the data center machine room in advance by presetting the cabinet 2 and the heat exchange module 3 in the data center in advance, and the cooling liquid circulation pipeline 31 is connected with the primary side cooling liquid supply system (such as a cooling tower) and is debugged. Subsequently, when there is a business demand, the user can purchase the IT equipment again, deploy the IT equipment into the cooling tank 21 of the cabinet 2, and finally add the first cooling liquid 5 into the cooling tank, thereby completing the deployment of the whole system. In this way, the deployment time of the data center can be greatly reduced.

An embodiment of the present disclosure further provides a data center deployed in a large-scale cluster, including: a plurality of submerged liquid cooling devices 100, which are pre-arranged in a data center room, wherein each submerged liquid cooling device 100 is not provided with an electronic device 4 and is not injected with a first cooling liquid 5; and a primary side cooling liquid supply system (e.g., a cooling tower) connected to the cooling liquid circulation line 31 in the heat exchange module 3 of each of the submerged liquid-cooling apparatuses 100 through a liquid delivery line. With this arrangement, the immersion type liquid cooling device 100 and the primary side cooling liquid supply system can be connected and debugged in advance, facilitating rapid large-scale cluster deployment.

In an embodiment according to the present disclosure, the cooling tank 21 of the cabinet 2 in the immersion liquid cooling apparatus 100 may be designed to have different sizes, e.g., different depths, for accommodating IT equipment of different sizes, e.g., 4U, 8U, etc., where U represents a height unit of the IT equipment, 1U-1.75-4.445 cm, 4U-7-17.78 cm, and 8U-14-35.56 cm. Accordingly, the elevated brackets 7 may have different dimensions, so that the same set of outer frames 23 may accommodate different cooling channels 21. In some embodiments, the height-adjustable support 7 may also be a height-adjustable support.

For example, the depth of a general computing server is 600mm, the depth of a storage server is 800mm, and the depth of the cooling groove 21 can be adjusted by the cabinet 2 through the height-matching bracket 7 at the bottom; by designing the cooling tanks 21 with different depths, the usage amount of the cooling liquid by the IT equipment in the liquid cooling system 900 can be reduced by about 5-33%.

The embodiment of the disclosure provides a liquid cooling system design with an internal integrated heat exchanger, which efficiently realizes self-circulation cooling of IT equipment such as servers and switches arranged in the liquid cooling system design, reduces investment and overall operation cost of a data center, enables the overall power supply use efficiency (PUE) of the data center to be controllable below 1.1, and can realize carbon neutralization by assistance.

Having described embodiments of the present disclosure, the foregoing description is intended to be exemplary, not exhaustive, and not limited to the disclosed embodiments. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is chosen in order to best explain the principles of the embodiments, the practical application, or improvements made to the technology in the marketplace, or to enable others of ordinary skill in the art to understand the embodiments disclosed herein.

Claims (20)

1. An immersion liquid cooling apparatus (100), comprising:

a cabinet (2), the cabinet (2) comprising a cooling tank (21) and a mounting groove (22) integrated on an outer wall (211) of the cooling tank (21), the cooling tank (21) being for accommodating an electronic device (4) to be cooled and a first cooling liquid (5), the mounting groove (22) being for accommodating the first cooling liquid (5), the cooling tank (21) and the mounting groove (22) being in fluid communication via a through hole (6); and

-a heat exchange module (3) adapted to be inserted into the mounting groove (22), the heat exchange module (3) comprising a cooling liquid circulation line (31), a heat exchanger (32), and a cooling liquid drive means (33), the cooling liquid circulation line (31) being in fluid communication with the heat exchanger (32) for providing a second cooling liquid to the heat exchanger (32), the heat exchanger (32) being adapted to cool the first cooling liquid (5) outside thereof with the second cooling liquid inside thereof, the cooling liquid drive means (33) being adapted to circulate the first cooling liquid (5) between the mounting groove (22) and the cooling groove (21).

2. The immersion liquid cooling device (100) according to claim 1, wherein the through holes (6) comprise a first set of through holes (61) and a second set of through holes (62), wherein the cooling liquid driving device (33) is close to the first set of through holes (61) in a case where the heat exchange module (3) is inserted into the mounting groove (22) for driving the first cooling liquid (5) in the mounting groove (22) into the cooling tank (21) and flowing the first cooling liquid (5) in the cooling tank (21) into the mounting groove (22) via the second set of through holes (62).

3. The immersion liquid cooling device (100) of claim 2, wherein the first set of through holes (61) is disposed proximate a bottom side of the mounting slot (22) and the second set of through holes (62) is disposed proximate a top side of the mounting slot (22).

4. The immersion liquid cooling device (100) of claim 3, wherein the cooling liquid drive (33) is proximate to a bottom side of the mounting slot (22) with the heat exchange module (3) inserted into the mounting slot (22), and the heat exchanger (32) is located above the cooling liquid drive (33) and adjacent to the cooling liquid drive (33).

5. The immersion liquid cooling device (100) of claim 2, wherein the coolant drive (33) comprises a plurality of circulation pumps, wherein each circulation pump of the plurality of circulation pumps is respectively adjacent to a respective through hole of the first set of through holes (61) with the heat exchange module (3) inserted into the mounting groove (22).

6. The immersion liquid cooling device (100) of claim 1, wherein the cabinet (2) further comprises an outer frame (23) and a top cover (24), the outer frame (23) being disposed around the cooling tank (21) and the mounting groove (22), the top cover (24) being rotatably connected to the outer frame (23) and being switchable between a closed state closing the cooling tank (21) and an open state opening the cooling tank (21).

7. The immersion liquid cooling device (100) of claim 6, wherein the top cover (24) includes a frame (241) and a transparent portion (242) surrounded by the frame (241).

8. The immersion liquid cooling device (100) of claim 6, wherein a side of the top cover (24) facing the cooling tank (21) is provided with a first sealing ring, wherein the top cover (24) is sealed from the cooling tank (21) by the first sealing ring when the top cover (24) is in the closed state.

9. The immersion liquid cooling device (100) of claim 6, wherein the cabinet (2) further comprises a hydraulic drive connected between the outer frame (23) and the top cover (24) for driving the top cover (24) to switch between the closed state and the open state.

10. The immersion liquid cooling device (100) of claim 9, wherein the hydraulic drive includes a pair of hydraulic rods, one of the pair of hydraulic rods being connected between the first side (243) of the top cover (24) and the outer frame (23), the other of the pair of hydraulic rods being connected between the second side (244) of the top cover (24) and the outer frame (23), the first side (243) and the second side (244) of the top cover (24) being opposite sides.

11. The immersion liquid cooling device (100) of claim 6, wherein the immersion liquid cooling device (100) further comprises a standoff (7), the standoff (7) being disposed below the cooling bath (21) and supporting the cooling bath (21).

12. The immersed liquid cooling device (100) according to claim 1, wherein the heat exchange module (3) further comprises a plurality of liquid occupying blocks (34), wherein the plurality of liquid occupying blocks (34) are at least partially immersible in the first cooling liquid (5) in the mounting groove (22) with the heat exchange module (3) inserted into the mounting groove (22).

13. The immersion liquid cooling device (100) of claim 12, wherein the plurality of liquid occupying blocks (34) are disposed proximate a top side of the mounting slot (22) with the heat exchange module (3) inserted into the mounting slot (22).

14. The submerged liquid cooling device (100) of claim 12, characterized in that a passage (35) for the first cooling liquid (5) is provided between adjacent liquid-occupying blocks (34) of the plurality of liquid-occupying blocks (34).

15. The submerged liquid cooling device (100) of claim 1, characterized in that the heat exchange module (3) further comprises a support portion (36), wherein the support portion (36) is located outside the mounting slot (22) when the heat exchange module (3) is inserted into the mounting slot (22).

16. The immersion liquid cooling device (100) according to claim 15, wherein a side of the support portion (36) facing the mounting groove (22) is provided with a second sealing ring, wherein the support portion (36) and the mounting groove (22) are sealed by the second sealing ring in a state where the heat exchange module (3) is inserted into the mounting groove (22).

17. The immersion liquid cooling apparatus (100) of claim 1, wherein the height of the cabinet is in a range of 1000mm to 1100mm, the width of the cabinet is in a range of 750mm to 850mm, and the length of the cabinet is in a range of 500mm to 800 mm.

18. The immersion liquid cooling device (100) of claim 1, wherein the first cooling liquid (5) comprises a fluorinated liquid or a mineral oil and/or the second cooling liquid comprises deionized water.

19. The immersion liquid cooling apparatus (100) of claim 1, wherein the electronic device (4) comprises a server or a switch.

20. A liquid cooling system (900) comprising a plurality of submerged liquid cooling devices (100) arranged side by side, wherein each submerged liquid cooling device (100) of the plurality of submerged liquid cooling devices (100) is a submerged liquid cooling device (100) according to any of claims 1 to 19.

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