CN220023179U - Multilayer flexible circuit board with blind hole structure - Google Patents
Multilayer flexible circuit board with blind hole structure Download PDFInfo
- Publication number
- CN220023179U CN220023179U CN202321663260.8U CN202321663260U CN220023179U CN 220023179 U CN220023179 U CN 220023179U CN 202321663260 U CN202321663260 U CN 202321663260U CN 220023179 U CN220023179 U CN 220023179U
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- China
- Prior art keywords
- hole
- layer
- flexible circuit
- circuit board
- multilayer flexible
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- 238000002955 isolation Methods 0.000 claims abstract description 14
- 239000000758 substrate Substances 0.000 claims abstract description 13
- 238000009713 electroplating Methods 0.000 abstract description 22
- 239000007788 liquid Substances 0.000 abstract description 13
- 230000009286 beneficial effect Effects 0.000 abstract description 3
- 230000000694 effects Effects 0.000 description 7
- 238000009423 ventilation Methods 0.000 description 5
- 238000005187 foaming Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000007767 bonding agent Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The utility model provides a blind hole structure multilayer flexible circuit board, which relates to the technical field of multilayer flexible circuit boards and comprises a substrate, wherein an isolation layer is arranged on the upper surface of the substrate, a signal layer is arranged on the upper surface of the isolation layer, a stratum layer is arranged on the upper surface of the signal layer, a via hole layer is arranged on the lower surface of the substrate, a first conductive layer is arranged on the lower surface of the via hole layer, a second conductive layer is arranged on the lower surface of the first conductive layer, a first through hole is formed in the upper surface of the substrate, and a second through hole is formed in the upper surface of the via hole layer. In the utility model, when the multi-layer flexible circuit board is electroplated, the whole blind hole is in a conical shape with a larger opening at the bottom, and when the electroplating is performed, the larger opening and the inclined plane entering the blind hole are beneficial to circulation of electroplating liquid, so that the problem that the electroplating liquid cannot enter the blind hole can be avoided, and the processing yield of the flexible circuit board is improved.
Description
Technical Field
The utility model relates to the technical field of multilayer flexible circuit boards, in particular to a blind hole structure multilayer flexible circuit board.
Background
The multi-layer flexible circuit board is a flexible printed circuit board with multi-layer circuits, which consists of multi-layer flexible base materials and conductive layers, and the circuits of all layers are connected together through a bonding agent, a copper-clad layer, a bonding pad and other connection modes.
In the prior art, when the multilayer flexible circuit board is subjected to electroplating treatment in the processing process, the depth of the blind holes of the multilayer flexible circuit board formed by stacking the layers is large, the aperture is small, and due to the surface tension of liquid, electroplating liquid is not easy to enter the fine blind holes, so that the electroplating liquid flows smoothly, and the processing yield of the multilayer flexible circuit board is influenced.
Disclosure of Invention
The utility model aims to solve the problems that in the prior art, when a multilayer flexible circuit board is subjected to electroplating treatment in the processing process, the blind holes of the multilayer flexible circuit board formed by stacking multiple layers are large in depth and small in aperture, and electroplating liquid is not easy to enter the small blind holes due to the surface tension of the liquid, so that the electroplating liquid flows smoothly, and the processing yield of the multilayer flexible circuit board is affected.
In order to achieve the above purpose, the present utility model adopts the following technical scheme: the utility model provides a blind hole structure multilayer flexible line way board, includes the base plate, the base plate upper surface is provided with the isolation layer, the isolation layer upper surface is provided with the signal layer, the signal layer upper surface is provided with the stratum, the base plate lower surface is provided with the via hole layer, via hole layer lower surface is provided with first conducting layer, first conducting layer lower surface is provided with the second conducting layer, first through-hole has been seted up to the base plate upper surface, the second through-hole has been seted up to via hole layer upper surface, the third through-hole has been seted up to first conducting layer upper surface, the fourth through-hole has been seted up to second conducting layer upper surface.
Preferably, through grooves are symmetrically formed in the outer surface of the isolation layer, and the two through grooves are communicated with the first through hole.
Preferably, the cross sections of the first through hole, the second through hole, the third through hole and the fourth through hole are all in conical arrangement.
Preferably, the first through hole, the second through hole, the third through hole and the fourth through hole are communicated.
Preferably, the first through hole, the second through hole, the third through hole and the fourth through hole are communicated to form a conical blind hole with a narrow cross section and a wide bottom.
Compared with the prior art, the utility model has the advantages and positive effects that,
1. in the utility model, when the multi-layer flexible circuit board is electroplated, the whole blind hole is in a conical shape with a larger opening at the bottom, and when the electroplating is performed, the larger opening and the inclined plane entering the blind hole are beneficial to circulation of electroplating liquid, so that the problem that the electroplating liquid cannot enter the blind hole can be avoided, and the processing yield of the flexible circuit board is improved.
2. According to the utility model, during electroplating, the ventilation effect can be achieved by arranging the through groove, so that the influence of foaming on the electroplating solution generated at the bottom of the blind hole is avoided, and the processing yield of the flexible circuit board is further improved.
Drawings
Fig. 1 is a perspective view of a blind hole structure multi-layer flexible circuit board according to the present utility model;
fig. 2 is an exploded view of a blind hole structure multilayer flexible circuit board according to the present utility model;
fig. 3 is a bottom view of a blind hole structure multi-layer flexible circuit board according to the present utility model;
fig. 4 is a front view of a blind hole structure multi-layer flexible circuit board according to the present utility model.
Legend description: 1. a substrate; 2. an isolation layer; 3. a signal layer; 4. a formation; 5. a via layer; 6. a first conductive layer; 7. a second conductive layer; 8. a through groove; 9. a first through hole; 10. a second through hole; 11. a third through hole; 12. and a fourth through hole.
Detailed Description
In order that the above objects, features and advantages of the utility model will be more clearly understood, a further description of the utility model will be rendered by reference to the appended drawings and examples. It should be noted that, without conflict, the embodiments of the present utility model and features in the embodiments may be combined with each other.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present utility model, however, the present utility model may be practiced otherwise than as described herein, and therefore the present utility model is not limited to the specific embodiments of the disclosure that follow.
In embodiment 1, as shown in fig. 1-4, the utility model provides a multilayer flexible circuit board with a blind hole structure, which comprises a substrate 1, wherein an isolation layer 2 is arranged on the upper surface of the substrate 1, a signal layer 3 is arranged on the upper surface of the isolation layer 2, a stratum 4 is arranged on the upper surface of the signal layer 3, a via hole layer 5 is arranged on the lower surface of the substrate 1, a first conductive layer 6 is arranged on the lower surface of the via hole layer 5, a second conductive layer 7 is arranged on the lower surface of the first conductive layer 6, a first through hole 9 is arranged on the upper surface of the substrate 1, a second through hole 10 is arranged on the upper surface of the via hole 5, a third through hole 11 is arranged on the upper surface of the first conductive layer 6, a fourth through hole 12 is arranged on the upper surface of the second conductive layer 7, cross sections of the first through hole 9, the second through hole 10, the third through hole 11 and the fourth through hole 12 are all in conical shapes, the first through hole 9, the second through hole 10, the third through hole 11 and the fourth through hole 12 are in communication, and form a conical blind hole with a cross section, and the upper width is formed by communication of the first through hole 9, the second through hole 10 and the fourth through hole 12.
The effect that its whole embodiment 1 reaches is, after isolation layer 2, signal layer 3, stratum 4, via hole layer 5, first conducting layer 6 and second conducting layer 7 accomplish around base plate 1 and connect and constitute multilayer flexible line way board, by first through-hole 9, second through-hole 10, third through-hole 11 and fourth through-hole 12 intercommunication formation blind hole, when electroplating multilayer flexible line way board, because the blind hole is whole for the great toper shape of bottom opening, when electroplating, the circulation of plating solution is favorable to on the inclined plane after great opening and entering blind hole to can avoid the unable inside problem of entering the blind hole of plating solution, promote the yields of flexible line way board processing.
In embodiment 2, as shown in fig. 1-4, through grooves 8 are symmetrically formed on the outer surface of the isolation layer 2, and the two through grooves 8 are communicated with the first through hole 9.
The effect that its whole embodiment 2 reached is, at flexible circuit board during operation, can play ventilation radiating effect through the setting of logical groove 8, and when electroplating, the setting of logical groove 8 can play ventilation effect, avoids producing the further of foaming influence plating solution in the bottom of blind hole, has further promoted the yields of flexible circuit board processing.
Working principle: after the isolation layer 2, the signal layer 3, the stratum 4, the via hole layer 5, the first conducting layer 6 and the second conducting layer 7 are connected around the substrate 1 to form a multi-layer flexible circuit board, the first through hole 9, the second through hole 10, the third through hole 11 and the fourth through hole 12 are communicated to form a blind hole, when the multi-layer flexible circuit board is electroplated, as the whole blind hole is in a conical shape with a larger bottom opening, when electroplating is carried out, the larger opening and the inclined plane after entering the blind hole are beneficial to circulation of electroplating liquid, so that the problem that electroplating liquid cannot enter the blind hole can be avoided, the processing yield of the flexible circuit board is improved, the ventilation and heat dissipation effects can be achieved through the arrangement of the through groove 8 when the flexible circuit board works, the ventilation effect can be achieved through the arrangement of the through groove 8 when electroplating is carried out, further foaming affecting the electroplating liquid at the bottom of the blind hole is avoided, and the processing yield of the flexible circuit board is further improved.
The present utility model is not limited to the above-mentioned embodiments, and any equivalent embodiments which can be changed or modified by the technical content disclosed above can be applied to other fields, but any simple modification, equivalent changes and modification made to the above-mentioned embodiments according to the technical substance of the present utility model will still fall within the protection scope of the technical solution of the present utility model.
Claims (5)
1. The utility model provides a blind hole structure multilayer flexible line way board, includes base plate (1), its characterized in that: the novel solar cell is characterized in that an isolation layer (2) is arranged on the upper surface of the substrate (1), a signal layer (3) is arranged on the upper surface of the isolation layer (2), a stratum (4) is arranged on the upper surface of the signal layer (3), a via hole layer (5) is arranged on the lower surface of the substrate (1), a first conductive layer (6) is arranged on the lower surface of the via hole layer (5), a second conductive layer (7) is arranged on the lower surface of the first conductive layer (6), a first through hole (9) is formed in the upper surface of the substrate (1), a second through hole (10) is formed in the upper surface of the via hole layer (5), a third through hole (11) is formed in the upper surface of the first conductive layer (6), and a fourth through hole (12) is formed in the upper surface of the second conductive layer (7).
2. The blind via structure multilayer flexible circuit board according to claim 1, wherein: the isolation layer (2) surface symmetry has seted up logical groove (8), and two logical groove (8) all are the intercommunication setting with first through-hole (9).
3. The blind via structure multilayer flexible circuit board according to claim 1, wherein: the cross sections of the first through hole (9), the second through hole (10), the third through hole (11) and the fourth through hole (12) are all in conical arrangement.
4. The blind via structure multilayer flexible circuit board according to claim 1, wherein: the first through hole (9), the second through hole (10), the third through hole (11) and the fourth through hole (12) are communicated.
5. The blind via structure multilayer flexible circuit board according to claim 1, wherein: the first through hole (9), the second through hole (10), the third through hole (11) and the fourth through hole (12) are communicated to form a conical blind hole with a narrow cross section and a wide bottom.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321663260.8U CN220023179U (en) | 2023-06-28 | 2023-06-28 | Multilayer flexible circuit board with blind hole structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321663260.8U CN220023179U (en) | 2023-06-28 | 2023-06-28 | Multilayer flexible circuit board with blind hole structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220023179U true CN220023179U (en) | 2023-11-14 |
Family
ID=88688069
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321663260.8U Active CN220023179U (en) | 2023-06-28 | 2023-06-28 | Multilayer flexible circuit board with blind hole structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220023179U (en) |
-
2023
- 2023-06-28 CN CN202321663260.8U patent/CN220023179U/en active Active
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