CN220021065U - Wafer support loading attachment - Google Patents
Wafer support loading attachment Download PDFInfo
- Publication number
- CN220021065U CN220021065U CN202223573993.0U CN202223573993U CN220021065U CN 220021065 U CN220021065 U CN 220021065U CN 202223573993 U CN202223573993 U CN 202223573993U CN 220021065 U CN220021065 U CN 220021065U
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- plate
- lifting
- wafer
- module
- pushing
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- 239000000463 material Substances 0.000 claims abstract description 45
- 210000000078 claw Anatomy 0.000 claims abstract description 30
- 230000001360 synchronised effect Effects 0.000 claims description 8
- 230000006698 induction Effects 0.000 claims description 5
- 230000002787 reinforcement Effects 0.000 claims description 2
- 238000009434 installation Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000003014 reinforcing effect Effects 0.000 description 3
- 239000003292 glue Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The utility model discloses a wafer support feeding device which comprises a lifting module, a material box drawer module fixedly connected with the top of the lifting module, and a material claw module arranged above the material box drawer module and used for grabbing a wafer support. The wafer support in the material box drawer module is lifted through the lifting die, the wafer support is grabbed through the material claw module and pushed onto the wafer processing platform, and the feeding stability is improved.
Description
Technical Field
The utility model relates to the technical field of die bonders, in particular to a wafer bracket feeding device.
Background
The die bonder is key equipment in an LED back-end packaging production line, and the die bonding process is as follows: the dispensing mechanism dispenses glue at a die bonding station of the bracket, the thimble aligns to the center of the chip, the thimble jacks up the chip on the blue film, then the LED chip is taken out from the blue film of the crystal ring by the die bonding arm, and then the LED chip is transferred to the die bonding station with the glue dispensed, so that die bonding is completed.
However, the conventional die bonder is generally used for feeding by a manual feeding or a mechanical arm, so that the efficiency of the manual feeding is low, the mechanical arm is used for feeding and the die is easy to shake, and the die is easy to drop.
Disclosure of Invention
In order to solve the technical problems, the utility model aims to provide a wafer bracket feeding device which improves feeding stability.
In view of the above, the embodiment of the utility model provides a wafer support feeding device, which comprises a lifting module, a material box drawer module fixedly connected with the top of the lifting module, and a material claw module arranged above the material box drawer module and used for grabbing a wafer support.
Further, the lifting module comprises a mounting vertical plate, a lifting power mechanism is fixedly arranged on the mounting vertical plate, the lifting power mechanism is fixedly connected with the side face of the lifting plate, a linear guide rail is arranged on the back face of the lifting plate, and the linear guide rail is arranged on the mounting vertical plate; the lifting power mechanism drives the lifting plate to linearly reciprocate up and down.
Further, the top surface of the lifting jacking plate is provided with a jacking supporting plate for jacking the wafer bracket.
Further, a lifting induction piece is arranged on one side, close to the lifting supporting plate, of the lifting supporting plate, a photoelectric sensor is fixedly arranged at the position, close to the top, of the mounting vertical plate, and the photoelectric sensor is used for sensing the lifting position of the lifting induction piece.
Further, fixed limit is arranged above the photoelectric sensor, a movable limit block is arranged at the upper end part of the lifting plate, and the movable limit block is abutted against the fixed limit block and used for limiting the linear movement position of the lifting plate.
Further, the lifting power mechanism comprises a driving motor arranged at the lower end of the installation vertical plate, a small belt wheel is arranged on an output shaft of the driving motor, another small belt wheel is arranged at the upper end part of the installation vertical plate, a belt is sleeved on the small belt wheel, a synchronous rack is arranged on the belt, and the synchronous rack and the lifting plate are fixedly connected with one side of the lifting induction piece.
Further, the material box drawer module comprises a bracket material box bottom plate and two groups of material box guide rails arranged on the bracket material box bottom plate, and a drawer plate is arranged on a sliding block of the material box guide rails; the middle position of the support magazine bottom plate and be equipped with can hold the first logical groove of wafer support, the middle position of drawer plate is equipped with the second and leads to the groove, first logical groove with the second leads to the groove alignment.
Further, four corner positions of the drawer plate are fixedly connected with a support positioning strip respectively, two support positioning strips positioned on the short sides of the drawer plate are fixed on a size adjusting block, and the size adjusting block is in sliding connection with the drawer plate along the long side direction of the drawer plate.
Further, the material claw module is fixedly connected with the bracket material box bottom plate through a support reinforcing plate;
the material claw module comprises a top mounting plate, wherein a claw assembly used for grabbing the wafer support and a pushing sheet assembly used for pushing the wafer support to the wafer processing table are arranged at the bottom of the top mounting plate, and the pushing sheet assembly is arranged beside the claw assembly.
Further, the hook claw assembly comprises two first push guide rails which are arranged at the bottom of the top mounting plate and are arranged in parallel, the two first push guide rails are connected with a first driving mechanism arranged at the top of the top mounting plate, and a hook claw is respectively arranged on the sliding blocks of the two first push guide rails; two sides of the two hook claws are respectively provided with a bracket guide block; the pushing sheet assembly comprises a second driving mechanism arranged at the bottom of the top mounting plate, the output end of the second driving mechanism is connected with a sliding block of a second pushing guide rail, an L-shaped pushing sheet is fixedly connected to the sliding block of the second pushing guide rail and used for pushing the wafer support falling on the support guide block onto the wafer processing table.
The utility model has the beneficial effects that: the embodiment of the utility model provides a wafer support feeding device, which comprises a lifting module, a material box drawer module fixedly connected with the top of the lifting module, and a material claw module arranged above the material box drawer module and used for grabbing a wafer support. The wafer support in the material box drawer module is lifted through the lifting die, the wafer support is grabbed through the material claw module and pushed onto the wafer processing platform, and the feeding stability is improved.
Drawings
In order to more clearly illustrate the embodiments of the utility model or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the utility model, and that other drawings can be obtained from these drawings without inventive faculty for a person skilled in the art.
Fig. 1 is a schematic diagram of an overall structure of a wafer carrier feeding device according to an embodiment of the present utility model;
FIG. 2 is an exploded view of a lifting module of a wafer carrier loading apparatus according to an embodiment of the present utility model;
fig. 3 is a schematic diagram of the overall structure of a magazine drawer module of a wafer carrier loading device according to an embodiment of the present utility model;
fig. 4 is an exploded view of a magazine drawer module of a wafer carrier loading apparatus according to an embodiment of the present utility model;
FIG. 5 is an exploded view of a claw module of a wafer carrier loading apparatus according to an embodiment of the present utility model;
fig. 6 is a schematic diagram of the overall structure of a claw module of a wafer carrier feeding device according to an embodiment of the present utility model.
In the figure: 1. a lifting module; 10. installing a vertical plate; 11. a lifting power mechanism; 110. a driving motor; 111. a small belt wheel; 112. a belt; 113. a synchronous rack; 12. lifting the lifting plate; 120. jacking the supporting plate; 121. lifting the induction piece; 122. a photoelectric sensor; 123. fixing a limiting block; 124. moving a limiting block; 13. a linear guide rail;
2. a magazine drawer module; 20. a bracket material box bottom plate; 201. a first through groove; 21. a magazine rail; 22. a drawer plate; 220. a second through slot; 23. a bracket positioning strip; 24. a size adjustment block;
3. a claw module; 4. a pillar reinforcement plate; 30. a top mounting plate; 31. a finger assembly; 310. a first push rail; 311. a first driving mechanism; 312. a claw; 313. a bracket guide block; 32. a pushing sheet assembly; 320. a second push rail; 321. a second driving mechanism; 322. l-shaped pushing sheets.
Detailed Description
The embodiment of the utility model provides a wafer bracket feeding device, which improves feeding stability.
In order to make the objects, features and advantages of the present utility model more comprehensible, the technical solutions in the embodiments of the present utility model are described in detail below with reference to the accompanying drawings, and it is apparent that the embodiments described below are only some embodiments of the present utility model, but not all embodiments of the present utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
The technical scheme of the utility model is further described below by the specific embodiments with reference to the accompanying drawings.
Examples:
referring to fig. 1, fig. 1 is a wafer carrier feeding device according to an embodiment of the present utility model, as shown in fig. 1-6, the wafer carrier feeding device includes a lifting module 1, a magazine drawer module 2 fixedly connected to the top of the lifting module 1, and a gripper module 3 disposed above the magazine drawer module 2 and used for gripping a wafer carrier.
Specifically, snatch the wafer support through material claw module 3 to push up solid brilliant platform and process, through the institutional advancement of material claw module, improve and get material stability.
Further, the lifting module 1 comprises a mounting vertical plate 10, a lifting power mechanism 11 is fixedly mounted on the mounting vertical plate 10, the lifting power mechanism 11 is fixedly connected with the side face of a lifting plate 12, a linear guide rail 13 is arranged on the back face of the lifting plate 12, and the linear guide rail 13 is mounted on the mounting vertical plate 10; the lifting power mechanism 11 drives the lifting plate 12 to linearly reciprocate up and down.
Specifically, the lifting and lifting plate 12 is driven to move along the linear guide rail 13 by the lifting and lifting power mechanism 11, and the lifting and lifting power mechanism 11 is driven by a motor, a cylinder or a hydraulic drive.
Further, a lifting supporting plate 120 for lifting the wafer support is provided on the top surface of the lifting plate 12.
Specifically, the carrier plate 120 is lifted up by the lift plate 12, and the wafer carrier is sent to a designated position.
Further, a lifting sensing piece 121 is disposed on a side of the lifting plate 12 close to the lifting supporting plate 120, a photoelectric sensor 122 is fixedly mounted at a position of the mounting vertical plate 10 close to the top, and the photoelectric sensor 122 is used for sensing a lifting position of the lifting sensing piece 121.
Specifically, the jacking position of the pallet 120 is defined by the cooperation of the sensing piece 121 and the photosensor 122.
Further, a fixed stopper 123 is disposed above the photoelectric sensor 122, a movable stopper 124 is disposed at an upper end of the lifting jack-up plate 12, and the movable stopper 124 abuts against the fixed stopper 123 to limit the linear movement position of the lifting jack-up plate 12.
Specifically, the linear movement position of the jacking plate 12 is defined by the fixed stopper 123 and the movable positioning block 124
Further, the lifting power mechanism 11 includes a driving motor 110 installed at the lower end of the installation riser 10, a small belt pulley 111 is installed on an output shaft of the driving motor 110, another small belt pulley 111 is installed on the upper end of the installation riser 10, a belt 112 is sleeved on the two small belt pulleys 111, a synchronous rack 113 is arranged on the belt 112, and the synchronous rack 113 is fixedly connected with one side of the lifting plate 12 away from the lifting sensing piece 121.
Specifically, the small belt pulley 111 drives the synchronous rack 113 to move up and down, so as to drive the lifting and lifting plate 12 to move up and down, and limit the lifting and lifting sensing piece 121 and the fixed limiting block 123.
Further, the cartridge drawer module 2 includes a support cartridge bottom plate 20, two sets of cartridge guide rails 21 disposed on the support cartridge bottom plate 20, and a drawer plate 22 is disposed on a slider of the cartridge guide rails 21; the middle position of the bottom plate 20 of the support material box is provided with a first through groove 201 which can accommodate the wafer support, the middle position of the drawer plate 22 is provided with a second through groove 220, and the first through groove 201 and the second through groove 220 are aligned.
Specifically, the second through slot 220 is aligned with the first through slot 201 of the support material box bottom plate 20 in the middle of the material box drawer module 2, and the lifting plate 12 lifts the wafer support to reach the designated position through the first through slot 201 and the second through slot 220.
Preferably, a bracket positioning bar 23 is fixedly connected to each of the four corners of the drawer plate 22, and two bracket positioning bars 23 located at the short sides of the drawer plate 22 are fixed on a size adjusting block 24, and the size adjusting block 24 and the drawer plate 22 are slidably connected along the long side direction thereof.
Further, the claw module 3 is fixedly connected with the bracket material box bottom plate 20 through a support reinforcing plate 4; specifically, the bracket magazine base plate 20 and the claw module 3 are connected by two pillar reinforcing plates 4.
The material claw module 3 comprises a top mounting plate 30, wherein a claw assembly 31 for grabbing the wafer support and a pushing sheet assembly 32 for pushing the wafer support to a wafer processing table are arranged at the bottom of the top mounting plate 30, and the pushing sheet assembly 32 is arranged beside the claw assembly 31.
Specifically, the hook component 31 is used for grabbing a wafer support, and the pushing piece component 32 is used for pushing the wafer support onto the die bonding platform.
Preferably, the hook assembly 31 includes two parallel first push rails 31 disposed at the bottom of the top mounting plate 30, the two first push rails 310 are connected to a first driving mechanism 311 disposed at the top of the top mounting plate 30, and a hook 312 is disposed on each of the sliders of the two first push rails 310; two sides of the two hooks 312 are respectively provided with a bracket guide block 313; the pushing piece assembly 32 includes a second driving mechanism 321 disposed at the bottom of the top mounting plate 30, an output end of the second driving mechanism 321 is connected to a sliding block of the second pushing rail 320, an L-shaped pushing piece 322 is fixedly connected to the sliding block of the second pushing rail 320, and the L-shaped pushing piece 322 is used for pushing the wafer support falling on the support guiding block 313 onto the wafer processing table.
In summary, the embodiment of the utility model provides a wafer support feeding device, which comprises a lifting module, a material box drawer module fixedly connected with the top of the lifting module, and a material claw module arranged above the material box drawer module and used for grabbing a wafer support. The wafer support in the material box drawer module is lifted through the lifting die, the wafer support is grabbed through the material claw module and pushed onto the wafer processing platform, and the feeding stability is improved.
The above embodiments are only for illustrating the technical solution of the present utility model, and not for limiting the same; although the utility model has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present utility model.
Claims (8)
1. The wafer bracket feeding device is characterized by comprising a lifting module (1), a material box drawer module (2) fixedly connected with the top of the lifting module (1), and a material claw module (3) arranged above the material box drawer module (2) and used for grabbing a wafer bracket;
the lifting module (1) comprises a mounting vertical plate (10), a lifting power mechanism (11) is fixedly arranged on the mounting vertical plate (10), the lifting power mechanism (11) is fixedly connected with the side face of a lifting plate (12), a linear guide rail (13) is arranged on the back face of the lifting plate (12), and the linear guide rail (13) is arranged on the mounting vertical plate (10); the lifting power mechanism (11) drives the lifting plate (12) to linearly reciprocate up and down; the material box drawer module (2) comprises a bracket material box bottom plate (20) and two groups of material box guide rails (21) arranged on the bracket material box bottom plate (20), and drawer plates (22) are arranged on sliding blocks of the material box guide rails (21); the middle position of the bracket material box bottom plate (20) and the first through groove (201) capable of accommodating the wafer bracket are arranged, the middle position of the drawer plate (22) is provided with a second through groove (220), and the first through groove (201) and the second through groove (220) are aligned; the material claw module (3) comprises a top mounting plate (30), a claw assembly (31) used for grabbing the wafer support and a pushing sheet assembly (32) used for pushing the wafer support to the wafer processing table are arranged at the bottom of the top mounting plate (30), and the pushing sheet assembly (32) is arranged beside the claw assembly (31).
2. Wafer carrier loading apparatus according to claim 1, characterized in that the top surface of the lifting and lifting plate (12) is provided with a lifting support plate (120) for lifting up the wafer carrier.
3. The wafer carrier feeding device according to claim 2, wherein a lifting sensing piece (121) is arranged on one side of the lifting plate (12) close to the lifting supporting plate (120), a photoelectric sensor (122) is fixedly arranged at a position of the mounting vertical plate (10) close to the top, and the photoelectric sensor (122) is used for sensing a lifting position of the lifting sensing piece (121).
4. A wafer carrier feeding device according to claim 3, wherein a fixed limiting block (123) is arranged above the photoelectric sensor (122), a movable limiting block (124) is arranged at the upper end part of the lifting plate (12), and the movable limiting block (124) is abutted against the fixed limiting block (123) and used for limiting the linear movement position of the lifting plate (12).
5. A wafer support feeding device according to claim 3, wherein the lifting power mechanism (11) comprises a driving motor (110) arranged at the lower end of the mounting vertical plate (10), a small belt wheel (111) is arranged on an output shaft of the driving motor (110), another small belt wheel (111) is arranged at the upper end part of the mounting vertical plate (10), a belt (112) is sleeved on the two small belt wheels (111), a synchronous rack (113) is arranged on the belt (112), and the synchronous rack (113) is fixedly connected with one side, far away from the lifting induction piece (121), of the lifting jacking plate (12).
6. Wafer support feeding device according to claim 1, characterized in that four corners of the drawer plate (22) are fixedly connected with a support positioning strip (23), two support positioning strips (23) located on the short sides of the drawer plate (22) are fixed on a size adjusting block (24), and the size adjusting block (24) and the drawer plate (22) are slidingly connected along the long side direction of the drawer plate.
7. Wafer carrier loading attachment according to claim 1, characterized in that the gripper modules (3) are fixedly connected to the carrier magazine base plate (20) via a support reinforcement plate (4).
8. The wafer carrier loading device according to claim 7, wherein the hook assembly (31) comprises two first pushing rails (310) arranged at the bottom of the top mounting plate (30) in parallel, the two first pushing rails (310) are connected with a first driving mechanism (311) arranged at the top of the top mounting plate (30), and a hook (312) is respectively arranged on the sliding blocks of the two first pushing rails (310); two sides of the two hook claws (312) are respectively provided with a bracket guide block (313); the pushing sheet assembly (32) comprises a second driving mechanism (321) arranged at the bottom of the top mounting plate (30), an output end of the second driving mechanism (321) is connected with a sliding block of a second pushing guide rail (320), an L-shaped pushing sheet (322) is fixedly connected to the sliding block of the second pushing guide rail (320), and the L-shaped pushing sheet (322) is used for pushing the wafer support falling on the support guide block (313) onto a wafer processing table.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223573993.0U CN220021065U (en) | 2022-12-30 | 2022-12-30 | Wafer support loading attachment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223573993.0U CN220021065U (en) | 2022-12-30 | 2022-12-30 | Wafer support loading attachment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220021065U true CN220021065U (en) | 2023-11-14 |
Family
ID=88692071
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223573993.0U Active CN220021065U (en) | 2022-12-30 | 2022-12-30 | Wafer support loading attachment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220021065U (en) |
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2022
- 2022-12-30 CN CN202223573993.0U patent/CN220021065U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |